A grinding ceramic PCB sheet with fast heat dissipation

Abstract

The utility model relates to the technical field of grinding ceramic PCB thin plates, and specifically is a grinding ceramic PCB thin plate with fast heat dissipation. The utility model comprises a ceramic PCB board body and a heat dissipation component, the heat dissipation component comprises a heat conducting plate, two pairs of heat conducting plates are arranged on the upper surface of the ceramic PCB board body, the upper surfaces of the two pairs of heat conducting plates are fixedly provided with heat conducting copper seats, the outer surfaces of the two pairs of heat conducting copper seats are provided with heat conducting blocks, and a pair of heat conducting pipes are fixedly provided between each pair of heat conducting blocks. The utility model cooperates the heat conducting copper seats, the heat conducting blocks and the heat conducting pipes, and dissipates the heat of the ceramic PCB board body through heat dissipation metal pipes, has fast heat dissipation, good heat dissipation effect, prevents damage to the circuit inside the ceramic PCB board body, improves the service life of the ceramic PCB board body, and improves the quality of electronic equipment. The two pairs of heat conducting plates are fixed on the upper surface of the ceramic PCB board body by fixing bolts, so as to facilitate installation and removal of heat dissipation materials according to needs.

Description

Technical Field

[0001] The utility model relates to the technical field of grinding ceramic PCB thin plates, in particular to a grinding ceramic PCB thin plate with fast heat dissipation. Background Art

[0002] Ceramic circuit boards are thermally conductive organic ceramic circuit boards with a thermal conductivity of 9-20W / mk prepared at a temperature below 250°C using thermally conductive ceramic powder and an organic adhesive.

[0003] In the prior art, a ceramic PCB board, such as that proposed in patent application number “CN201621148518.0”, includes a substrate and a PCB body arranged on the substrate, and a ceramic body is arranged between the substrate and the PCB body.

[0004] However, in the above patent, the high temperature inside the PCB board cannot be conducted away, resulting in a short service life of the PCB board, resulting in low quality of the electronic equipment, and the heat dissipation material is fixed on the upper surface of the ceramic PCB board body, which is inconvenient to install and remove the heat dissipation material according to needs, and it is not convenient to maintain when damaged. Utility Model Content

[0005] The utility model aims to provide a grinding ceramic PCB thin plate with fast heat dissipation to solve the problems raised in the above background technology.

[0006] The purpose of the utility model can be achieved through the following technical solutions:

[0007] A grinding ceramic PCB thin plate with fast heat dissipation comprises a ceramic PCB board body and a heat dissipation component. The heat dissipation component comprises a heat conducting plate. Two pairs of heat conducting plates are arranged on the upper surface of the ceramic PCB board body.

[0008] The upper surfaces of the two pairs of heat-conducting plates are fixedly provided with heat-conducting copper seats, the outer surfaces of the two pairs of heat-conducting copper seats are provided with heat-conducting blocks, a pair of heat-conducting pipes are fixedly provided between each pair of heat-conducting blocks, and the outer surfaces of the two pairs of heat-conducting pipes are provided with heat-dissipating metal pipes, and the ceramic PCB board body is cooled by the heat-dissipating metal pipes.

[0009] Preferably, one end of the two pairs of thermally conductive copper seats is provided with a connecting block, one end of the two pairs of thermally conductive blocks is provided with a placement hole, and the two pairs of connecting blocks are respectively arranged inside the two pairs of placement holes.

[0010] Preferably, sliding blocks are provided on both sides of the two pairs of heat-conducting copper seats, sliding grooves are provided on the inner sides of the two pairs of heat-conducting blocks, and the two pairs of sliding blocks are slidably arranged inside the two pairs of sliding grooves respectively.

[0011] Preferably, four fixing bolts are provided on the upper surfaces of the two pairs of heat conducting plates, and the lower ends of the fixing bolts are respectively arranged inside the ceramic PCB board body.

[0012] Preferably, a plurality of solder joints are arranged on the upper surface of the ceramic PCB body, and a wiring groove is opened on the upper surface of the ceramic PCB body.

[0013] Preferably, heat dissipation metal plates are fixedly arranged at the four corners of the ceramic PCB board body, and the four heat dissipation metal plates are all in the shape of rectangular blocks.

[0014] Beneficial effects of the utility model:

[0015] The utility model discloses a heat dissipation component comprising a heat conducting plate, a heat conducting copper seat, a heat conducting block, a heat conducting pipe and a heat dissipation metal pipe. The heat conducting copper seat, the heat conducting block and the heat conducting pipe cooperate with each other, and the heat dissipation metal pipe is used to dissipate heat from a ceramic PCB board body. The heat dissipation is fast and has a good heat dissipation effect. The circuit inside the ceramic PCB board body is prevented from being damaged, the service life of the ceramic PCB board body is increased, and the quality of the electronic equipment is improved. Two pairs of heat conducting plates are fixed to the upper surface of the ceramic PCB board body by fixing bolts, so that the heat dissipation material can be easily installed and disassembled according to the demand. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or the prior art, the drawings required for use in the embodiments or the prior art description are briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the structure of the heat conducting plate and heat conducting block of the utility model;

[0019] Figure 3 This is a schematic diagram of the structure of the heat-conducting copper seat and the connecting block of the utility model;

[0020] Figure 4 It is a schematic diagram of the placement hole and the sliding groove structure of the utility model.

[0021] The reference numerals in the figures are as follows:

[0022] 1. Ceramic PCB board body; 2. Heat conduction plate; 3. Heat conduction copper seat; 4. Heat conduction block; 5. Heat conduction pipe; 6. Connection block; 7. Placement hole; 8. Sliding block; 9. Sliding groove; 10. Heat dissipation metal pipe; 11. Fixing bolt; 12. Solder point; 13. Wiring groove; 14. Heat dissipation metal plate. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] A grinding ceramic PCB thin plate with fast heat dissipation comprises a ceramic PCB board body 1 and a heat dissipation component. The heat dissipation component comprises a heat conducting plate 2. Two pairs of heat conducting plates 2 are arranged on the upper surface of the ceramic PCB board body 1.

[0025] A thermal copper seat 3 is fixedly provided on the upper surface of the two pairs of thermal conductive plates 2, a thermal block 4 is provided on the outer surface of the two pairs of thermal conductive copper seats 3, a pair of thermal pipes 5 is fixedly provided between each pair of thermal conductive blocks 4, and a heat dissipation metal pipe 10 is provided on the outer surface of the two pairs of thermal conductive pipes 5, and the ceramic PCB board body 1 is cooled by the heat dissipation metal pipe 10.

[0026] like Figure 1 , Figure 2 , Figure 3 and Figure 4 Two pairs of heat conducting plates 2 are arranged on the upper surface of the ceramic PCB body 1, heat is conducted through the two pairs of heat conducting plates 2, two pairs of heat conducting copper seats 3 and two pairs of heat conducting pipes 5, and the ceramic PCB body 1 is cooled through the heat dissipation metal pipe 10.

[0027] One end of the two pairs of heat-conducting copper seats 3 is provided with a connecting block 6 , one end of the two pairs of heat-conducting blocks 4 is provided with a placement hole 7 , and the two pairs of connecting blocks 6 are respectively arranged inside the two pairs of placement holes 7 .

[0028] like Figure 3 and Figure 4 , the two pairs of heat-conducting blocks 4 are respectively arranged on the outer surfaces of the two pairs of heat-conducting copper seats 3 , so that the connecting blocks 6 are respectively arranged inside the placement holes 7 to control the positions of the two pairs of heat-conducting blocks 4 .

[0029] Sliding blocks 8 are arranged on both sides of the two pairs of heat-conducting copper seats 3 , sliding grooves 9 are opened on the inner sides of the two pairs of heat-conducting blocks 4 , and the two pairs of sliding blocks 8 are slidably arranged inside the two pairs of sliding grooves 9 .

[0030] like Figure 3 and Figure 4 , so that the two pairs of sliding blocks 8 slide inside the two pairs of sliding grooves 9 respectively, to assist in connecting the two pairs of thermally conductive copper seats 3 and the two pairs of thermally conductive blocks 4.

[0031] Four fixing bolts 11 are disposed on the upper surfaces of the two pairs of heat conducting plates 2 , and the lower ends of the fixing bolts 11 are respectively disposed inside the ceramic PCB body 1 .

[0032] like Figure 1 and Figure 2 The two pairs of heat conducting plates 2 are arranged on the upper surface of the ceramic PCB body 1 by four fixing bolts 11 .

[0033] A plurality of solder joints 12 are arranged on the upper surface of the ceramic PCB body 1 , and a wiring groove 13 is opened on the upper surface of the ceramic PCB body 1 .

[0034] like Figure 1 , a plurality of solder joints 12 are arranged on the upper surface of the ceramic PCB body 1 , and connecting wires are arranged through wiring grooves 13 .

[0035] Heat dissipation metal plates 14 are fixedly arranged at the four corners of the ceramic PCB body 1 , and the four heat dissipation metal plates 14 are all in a rectangular block shape.

[0036] like Figure 1 Four heat dissipation metal plates 14 are arranged at the four corners of the ceramic PCB body 1 to assist the ceramic PCB body 1 in dissipating heat and protect the four corners of the ceramic PCB body 1 .

[0037] The working principle of the grinding ceramic PCB thin plate with fast heat dissipation provided by the utility model is as follows:

[0038] Four heat dissipation metal plates 14 are arranged at the four corners of the ceramic PCB body 1, and two pairs of heat-conducting copper seats 3 are slidably arranged inside the two pairs of sliding grooves 9 inside the two pairs of heat-conducting blocks 4, so that the connecting blocks 6 are respectively arranged inside the placement holes 7, and the positions of the two pairs of heat-conducting blocks 4 and the two pairs of heat-conducting pipes 5 are fixed. The two pairs of heat-conducting plates 2 are fixed to the upper surface of the ceramic PCB body 1 by four fixing bolts 11, and the ceramic PCB body 1 is cooled by the heat dissipation metal pipes 10.

[0039] Compared with the related art, the fast heat dissipation grinding ceramic PCB thin plate provided by the utility model has the following beneficial effects:

[0040] In the utility model, since the heat dissipation component includes a heat conducting plate 2, a heat conducting copper seat 3, a heat conducting block 4, a heat conducting pipe 5 and a heat dissipation metal pipe 10, the heat conducting copper seat 3, the heat conducting block 4 and the heat conducting pipe 5 cooperate, and the heat dissipation metal pipe 10 is used to dissipate heat on a ceramic PCB board body 1, so that the heat dissipation is fast and the heat dissipation effect is good, and damage to the circuit inside the ceramic PCB board body 1 is prevented, the service life of the ceramic PCB board body 1 is increased, and the quality of the electronic equipment is improved. Two pairs of heat conducting plates 2 are fixed to the upper surface of the ceramic PCB board body 1 by fixing bolts 11, so that the heat dissipation material can be easily installed and disassembled according to the demand.

[0041] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, and these changes and improvements fall within the scope of the utility model to be protected.

Claims

1. A grinding ceramic PCB thin plate with fast heat dissipation, comprising a ceramic PCB body (1) and a heat dissipation component, characterized in that: The heat dissipation assembly comprises heat conducting plates (2), wherein two pairs of heat conducting plates (2) are arranged on the upper surface of the ceramic PCB body (1); A heat-conducting copper seat (3) is fixedly provided on the upper surfaces of the two pairs of heat-conducting plates (2), a heat-conducting block (4) is provided on the outer surfaces of the two pairs of heat-conducting copper seats (3), a pair of heat-conducting pipes (5) is fixedly provided between each pair of heat-conducting blocks (4), and a heat-dissipating metal pipe (10) is provided on the outer surfaces of the two pairs of heat-conducting pipes (5), and the heat-dissipating metal pipe (10) is used to dissipate heat from the ceramic PCB board body (1).

2. The grinding ceramic PCB sheet with fast heat dissipation according to claim 1, characterized in that: One end of the two pairs of heat-conducting copper seats (3) is provided with a connecting block (6), one end of the two pairs of heat-conducting blocks (4) is provided with a placement hole (7), and the two pairs of connecting blocks (6) are respectively arranged inside the two pairs of placement holes (7).

3. The grinding ceramic PCB sheet with fast heat dissipation according to claim 2, characterized in that: Sliding blocks (8) are arranged on both sides of the two pairs of heat-conducting copper seats (3), sliding grooves (9) are arranged on the inner sides of the two pairs of heat-conducting blocks (4), and the two pairs of sliding blocks (8) are respectively slidably arranged inside the two pairs of sliding grooves (9).

4. The grinding ceramic PCB sheet with fast heat dissipation according to claim 1, characterized in that: Four fixing bolts (11) are arranged on the upper surfaces of the two pairs of heat conducting plates (2), and the lower ends of the fixing bolts (11) are respectively arranged inside the ceramic PCB board body (1).

5. The abrasive ceramic PCB sheet with fast heat dissipation according to claim 1, characterized in that: The upper surface of the ceramic PCB body (1) is provided with a plurality of solder joints (12), and the upper surface of the ceramic PCB body (1) is provided with a wiring groove (13).

6. The abrasive ceramic PCB sheet with fast heat dissipation according to claim 1, characterized in that: Heat dissipation metal plates (14) are fixedly arranged at the four corners of the ceramic PCB body (1), and the four heat dissipation metal plates (14) are all in the shape of rectangular blocks.

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