Electronic devices

Abstract

An electronic device provided in an embodiment of the present application includes a shell body, a decorative piece and a heat sink disposed on the shell body; wherein the shell body has an opening, the decorative piece covers the opening and is sealed and connected to the opening; the opening has an arc-shaped hole wall extending along a first direction, the first direction being the thickness direction of the electronic device; at least a portion of the heat sink is attached to a side of the arc-shaped hole wall facing the inside of the electronic device. The electronic device of the present application is provided with a heat sink at the opening on its shell body, and at least a portion of the heat sink is disposed within the thickness space of the opening, which can save the space occupied by the heat sink in the electronic device, thereby reserving layout space for other types of electronic devices, which helps to improve the performance of the electronic device.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to an electronic device. Background Art

[0002] The performance of current electronic devices is getting higher and higher, and the power consumption of corresponding electronic devices is increasing rapidly, making the heating of electronic devices more and more serious. Therefore, a heat dissipation structure needs to be set in the electronic devices to solve the heating problem.

[0003] Currently, due to the limited internal space of electronic equipment, how to set up a heat dissipation structure within the limited space is an urgent problem to be solved. Utility Model Content

[0004] In order to solve the above problems, an embodiment of the present application provides an electronic device.

[0005] An electronic device provided in an embodiment of the present application includes a shell body, a decorative component arranged on the shell body, and a heat sink; wherein the shell body has an opening, the decorative component covers the opening and is sealed to the opening; the opening has an arc-shaped hole wall extending along a first direction, and the first direction is the thickness direction of the electronic device; at least a portion of the heat sink is attached to a side of the arc-shaped hole wall facing the interior of the electronic device.

[0006] The electronic device in the above scheme has a heat sink disposed at the opening on its shell body, and at least a portion of the heat sink is disposed within the thickness space of the opening, which can save the space occupied by the heat sink within the electronic device, thereby reserving layout space for other types of electronic devices, which helps to improve the performance of the electronic device.

[0007] In some embodiments of the present application, the decorative component is a camera back cover.

[0008] It can be understood that the opening is generally provided with a functional component, and the decorative piece can be used as an appearance decoration of the functional component to protect the functional component and enhance the appearance of the electronic device. In other embodiments, the decorative piece can also be a fingerprint recognition key.

[0009] In some embodiments of the present application, the heat sink includes a first material layer, a second material layer, and a third material layer stacked in sequence, wherein the first material layer is attached to a side of the arc-shaped hole wall facing the interior of the electronic device.

[0010] It can be understood that the heat sink can be composed of multiple layers of stacked materials, each material layer can be a different material layer or the same material layer, and at least one material layer is a thermally conductive material to achieve the heat dissipation function of the heat sink.

[0011] In some embodiments of the present application, the first material layer is an adhesive material, the second material layer is a thermally conductive material, and the third material layer is an insulating material.

[0012] In some embodiments of the present application, the orthographic projection area of ​​the first material layer on the first plane and the orthographic projection area of ​​the third material layer on the first plane are both larger than the orthographic projection area of ​​the second material layer on the first plane, and the edge of the first material layer is aligned with the edge of the third material layer; wherein the first plane is the plane where the length direction and the width direction of the electronic device are located.

[0013] It can be understood that the heat sink can include three material layers. The middle material layer, that is, the second material layer, can be made of thermally conductive material, and can be wrapped by the first material layer and the third material layer on both sides to avoid exposure of the thermally conductive material, causing wear or leakage, and affecting the heat dissipation effect of the heat sink.

[0014] In some embodiments of the present application, at least a portion of the edge of the heat sink is provided with a notch.

[0015] It can be understood that the heat sink is arranged along the arc-shaped hole wall of the opening. Therefore, providing a notch at its edge can avoid stress concentration and edge extrusion or warping, thereby improving the fit between the heat sink and the shell and ensuring the contact area between the two to ensure the heat dissipation effect.

[0016] In some embodiments of the present application, the notch is disposed at an edge of the first material layer and an edge of the third material layer.

[0017] It can be understood that the second material layer does not need to be provided with a gap, so that the heat conduction area can be guaranteed as much as possible and the heat dissipation effect can be improved.

[0018] In some embodiments of the present application, a plurality of notches are provided on an edge of the first material layer and / or an edge of the third material layer, and the plurality of notches are provided continuously or discontinuously.

[0019] In some embodiments of the present application, the shape of the notch includes any one of the following: semicircular, rectangular, triangular, and trapezoidal.

[0020] In some embodiments of the present application, the arc-shaped hole wall includes a first port and a second port arranged along a first direction, the first port is closer to the interior of the electronic device than the second port, the first port and the second port have the same shape, and the orthographic projection area of ​​the first port on the first plane is larger than the orthographic projection area of ​​the second port on the first plane; wherein the first plane is the plane where the length direction and the width direction of the electronic device are located.

[0021] The orthographic projection area of ​​the first port on the first plane is larger than the orthographic projection area of ​​the second port on the first plane. It can also be understood that the caliber of the first port is larger than the caliber of the second port, so that the opening is shaped like a crater.

[0022] In some embodiments of the present application, the heat sink is disposed around the first port, or the heat sink is only partially disposed around a portion of the first port.

[0023] It is understandable that the shape and area of ​​the heat sink can be adaptively adjusted according to actual application requirements. For example, the heat sink is annular and arranged around the port of the opening, so that heat dissipation in a larger range can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a three-dimensional schematic diagram of a mobile phone 01 provided in an embodiment of the present application;

[0025] Figure 2 is a side view of a mobile phone 01 provided in an embodiment of the present application;

[0026] Figure 3 The embodiment of this application provides Figure 1 The enlarged schematic diagram of the dotted box in the middle;

[0027] Figure 4A is a side view of the opening 1a provided in the embodiment of the present application;

[0028] Figure 4B is another side view of the opening 1a provided in the embodiment of the present application;

[0029] Figure 5 The embodiment of this application provides Figure 1 Schematic diagram of the split structure in the middle dotted frame;

[0030] Figure 6 The embodiment of this application provides Figure 1 The middle dotted box is an enlarged schematic diagram from another viewing angle;

[0031] Figure 7 is a schematic diagram of the shape of the heat sink 2 provided in an embodiment of the present application;

[0032] Figure 8 is a schematic diagram of another shape of the heat sink 2 provided in an embodiment of the present application;

[0033] Fig. 9A is a schematic diagram of the layer structure of the heat sink 2 provided in an embodiment of the present application;

[0034] Fig. 9B is a schematic diagram of another layer structure of the heat sink 2 provided in an embodiment of the present application;

[0035] Description of reference numerals:

[0036] 01, mobile phone; 1, shell; 1a, opening; 11, arc-shaped hole wall; 11a, first port; 11b, second port; 2, heat sink; 2-1, side; 2a, notch; 21, first material layer; 22, second material layer; 23, third material layer. DETAILED DESCRIPTION

[0037] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below in conjunction with the accompanying drawings.

[0038] The illustrative embodiments of the present application include, but are not limited to, an electronic device. The electronic device includes a heat dissipation structure, such as a heat sink mentioned in the embodiments of the present application, which can transfer heat generated by a heat source inside the electronic device to the outside of the electronic device, thereby preventing the internal temperature from being too high and causing the performance of the electronic device to deteriorate.

[0039] It can be understood that the electronic devices provided in this application include but are not limited to mobile phones, tablet computers, e-book readers, televisions, laptop computers, personal digital assistants (PDA), personal computers (PC), notebooks, vehicle-mounted devices, wearable devices, and any other electronic devices that require heat dissipation, and this application does not make specific limitations on this.

[0040] Furthermore, the present application does not limit the form of the electronic device. For example, the electronic device may be a straight-screen electronic device or a foldable electronic device. The foldable electronic device may include a two-fold structure or a three-fold structure.

[0041] It is also understood that the heat source may include various electronic devices in the electronic device and connectors between the electronic devices. The electronic devices include, but are not limited to, any one of a multimedia application processor (MAP), a radio frequency amplifier (RFA), a power amplifier (PA), a power management IC (PMIC), a chip (e.g., a system on chip (SOC)), a central processing unit (CPU), a battery, and circuit boards (e.g., motherboards) integrating the above electronic devices.

[0042] For ease of description, the following text will take the electronic device as a straight-screen mobile phone and the heat source as a motherboard as an example to describe the technical solution of the present application.

[0043] See also Figure 1-Figure 3 , Figure 1 is a three-dimensional schematic diagram of a mobile phone 01 provided in an embodiment of the present application, Figure 2 This is a side view of mobile phone 01. Figure 3 yes Figure 1 Enlarged schematic diagram of the dotted box in the middle.

[0044] The mobile phone 01 includes a housing 1 and a heat sink 2. Figure 1 As shown, the shell 1 can enclose the accommodating cavity of the mobile phone 01 alone or together with other shells. The accommodating cavity is used to place various electronic devices and motherboards of the mobile phone 01 to realize the basic functions of the mobile phone 01, such as communication, display, audio and video playback, etc. The heat sink 2 is mainly used to dissipate heat from various electronic devices and motherboards to ensure that the basic functions of the mobile phone 01 can operate normally. It should be noted that the heat sink 2 is located inside the mobile phone 01, that is, it is set on the side of the shell 1 facing the negative direction of the Z axis. The user can Figure 1 The heat sink 2 cannot actually be observed when looking at the mobile phone 01, so the structure of the heat sink 2 is indicated by a dotted line.

[0045] Continue to refer to Figure 1 The housing 1 is provided with an opening 1a, and the opening 1a is used to set the functional components of the mobile phone 01 (not shown). Moreover, the functional components constitute the appearance of the mobile phone 01, that is, the user can observe the functional components set at the opening 1a. In this embodiment, the functional components may include a camera module. In other embodiments, the functional components may include a fingerprint recognition module.

[0046] In this embodiment, a heat sink 2 is provided at the edge of the opening 1a. Figure 2As shown, the opening 1a has an arc-shaped hole wall 11 extending along a first direction, wherein the first direction is the thickness direction of the mobile phone 01 (Z-axis direction shown in various figures herein). Figure 3 As shown, at least part of the heat sink 2 is attached to the side of the arc hole wall 11 facing the inside of the mobile phone 01, and at least part of the edge of the heat sink 2 is provided with a notch 2a, which faces the inside of the mobile phone 01, that is, the negative direction of the Z axis.

[0047] The arc-shaped hole wall 11 is mainly used to fix functional components. For example, a camera module is embedded in the opening 1a, and then fixedly connected with the arc-shaped hole wall 11 to realize the assembly of the camera module to the housing 1.

[0048] Since the arc-shaped hole wall 11 of the opening 1a extends along the Z-axis direction, the opening 1a has a certain thickness in the Z-axis direction. The present application sets the heat sink 2 in the thickness space of the opening 1a along the Z-axis direction, reuses the thickness of the opening 1a, and does not need to occupy other space inside the mobile phone 01, which facilitates the position layout of various other electronic components inside the mobile phone 01.

[0049] In some embodiments, a notch 2a is provided at the edge of the heat sink 2, and the notch 2a can improve the fit between the heat sink 2 and the arc-shaped hole wall 11, so that the heat sink 2 can transfer the heat inside the mobile phone 01 to the shell 1 as quickly as possible, and release the heat to the outside of the mobile phone 01 through the shell 1.

[0050] The housing 1 and the heat sink 2 in the mobile phone 01 will be further described below in conjunction with the accompanying drawings.

[0051] In this embodiment, the shell 1 is taken as the back cover of the mobile phone 01. In other embodiments, the shell 1 may also include a front cover of the mobile phone 01. The front cover is the shell part facing the user when the user holds the mobile phone 01, and the back cover is the shell part facing away from the user when the user holds the mobile phone 01. The front cover and the back cover may be an integrally formed structure or a detachable and assembleable structure, which is not limited in this application.

[0052] As mentioned above, the opening 1a on the housing 1 is used to assemble functional components, and the functional components may include a camera module. When the housing 1 is a rear cover, the functional components may include a rear camera module.

[0053] It can be understood that the rear camera module includes a camera and a camera back cover, wherein the camera back cover is a part of the housing 1, which is not only used to protect the camera, but also serves as a decorative piece of the mobile phone 01. Therefore, in this embodiment, the housing 1 may include a housing body and a camera back cover, and the opening 1a is provided on the housing body, and the camera back cover is covered on the opening 1a and is sealed and connected to the opening 1a.

[0054] In other embodiments, the opening 1a can also be used to assemble a fingerprint recognition module. Accordingly, the fingerprint recognition module includes a fingerprint recognition key, which is not only used to collect the user's fingerprint, but also used as a decorative part of the mobile phone 01. Therefore, in other embodiments, the housing 1 may include a housing body and a fingerprint recognition key, and the opening 1a is provided on the housing body, and the fingerprint recognition key cover is provided on the opening 1a and is sealed and connected to the opening 1a.

[0055] Combine the following Figure 2 , Figure 4A and Figure 4B The structure of the opening 1a is introduced. It should be noted that, in this embodiment, the opening 1a is raised along the positive direction of the Z axis compared to the plane portion of the housing 1. In other embodiments, the opening 1a may also be raised along the negative direction of the Z axis compared to the plane portion of the housing 1.

[0056] like Figure 2 As shown, the arc-shaped hole wall 11 includes a first port 11a and a second port 11b arranged along the Z-axis direction. The first port 11a is closer to the inside of the mobile phone 01 than the second port 11b, and the first port 11a and the second port 11b have the same shape.

[0057] It can be understood that the shapes of the first port 11a and the second port 11b are the same as the shapes of the opening 1a. The shapes of the opening 1a include but are not limited to regular shapes or irregular shapes such as circle, ellipse, square, etc. This embodiment only takes a circle as an example.

[0058] In this embodiment, the opening 1 a has an arc-shaped hole wall 11 , so the aperture of the opening 1 a gradually changes along the Z-axis direction.

[0059] For example, Figure 2 As shown, the aperture of the opening 1a can gradually decrease from the first port 11a to the second port 11b along the Z-axis direction. In other words, the arc-shaped hole wall 11 is convex relative to the plane portion of the shell 1 along the Z-axis direction, so that the opening 1a is crater-shaped. Accordingly, the orthographic projection area of ​​the first port 11a on the first plane is larger than the orthographic projection area of ​​the second port 11b on the first plane. The first plane is the plane where the length direction (Y-axis direction shown in each figure) and the width direction (X-axis direction shown in each figure) of the mobile phone 01 are located.

[0060] For example, in other embodiments, Figure 4A As shown, the aperture of the opening 1a may gradually increase from the first port 11a to the second port 11b along the Z-axis direction. Accordingly, the orthographic projection area of ​​the first port 11a on the first plane is smaller than the orthographic projection area of ​​the second port 11b on the first plane.

[0061] For example, in other embodiments, Figure 4BAs shown, the aperture of the opening 1a may gradually decrease and then gradually increase from the first port 11a to the second port 11b along the Z-axis direction. Accordingly, the orthographic projection area of ​​the first port 11a on the first plane is equal to the orthographic projection area of ​​the second port 11b on the first plane.

[0062] It should be noted that, according to actual design requirements, the structure of the arc-shaped hole wall 11 of the opening 1a can be adapted to the structure of the functional component embedded therein, and the present application does not limit this.

[0063] Combine the following Figure 3 , Figure 5 , Figure 6 The structure of the heat sink 2 is described. Figure 5 yes Figure 3 Schematic diagram of the split body. Figure 6 yes Figure 1 An enlarged view of the dotted box in the middle from another perspective.

[0064] like Figure 3 and Figure 5 As shown, in this embodiment, part of the heat sink 2 is attached to the arc-shaped hole wall 11 , and part of it is attached to other parts of the housing 1 connected to the arc-shaped hole wall 11 .

[0065] In some embodiments, inside the mobile phone 01, the heat sink 2 corresponds to the position of the heat source in the Z-axis direction. For example, the orthographic projection area of ​​the heat sink 2 on the first plane covers the orthographic projection area of ​​the heat source on the first plane. Thus, the heat sink 2 can directly absorb the heat from the heat source and quickly conduct the heat to the housing 1 to achieve heat dissipation. Therefore, the proportion of the heat sink 2 attached to the arc-shaped hole wall 11 can be determined according to the actual position of the heat source, and this application does not limit this.

[0066] Alternatively, if the orthographic projection area of ​​the heat sink 2 on the first plane does not overlap with the orthographic projection area of ​​the heat source on the first plane, the heat source can be connected to the heat sink 2 through other heat conductive sheets, and the heat from the heat source is transferred to the heat sink 2 through the heat conductive sheets, and then transferred from the heat sink 2 to the housing 1 for heat dissipation.

[0067] like Figure 1 and Figure 6 As shown, in this embodiment, the shape of the heat sink 2 is roughly a right-angled trapezoid, and the heat sink 2 is arranged in a partial area around the opening 1a, for example, Figure 1 The lower right area of ​​the opening 1a is shown. In other embodiments, the shape of the heat sink 2 can be an isosceles trapezoid, a rectangle, a triangle or other regular or irregular shapes.

[0068] In other embodiments, Figure 7As shown, the heat sink 2 is in a ring shape, so that the heat sink 2 can be arranged around the opening 1a. The ring shape includes but is not limited to a circular ring shape, a square ring shape or a rectangular ring shape.

[0069] Continue reading Figure 6 Since the opening 1a is circular in shape, one side edge 2-1 of the heat sink 2 is arc-shaped.

[0070] Combination Figure 3 As shown, the side edge 2 - 1 is attached to the arc-shaped hole wall 11 , and a notch 2 a is provided on the side edge 2 - 1 .

[0071] In this embodiment, the side 2-1 may be provided with a plurality of notches 2a, and the plurality of notches 2a are provided intermittently. The shape of the notches 2a includes any of the following: semicircular, rectangular, triangular, and trapezoidal. A semicircular shape is used as an example in the figure.

[0072] In other embodiments, Figure 8 As shown, the shape of the notch 2a can be multiple, and the multiple notches 2a can be arranged continuously. Figure 8 In the figure, the notch 2a is taken as a triangle as an example, and the side 2-1 may be sawtooth-shaped.

[0073] Since the side edge 2-1 is fitted along the circular edge of the opening 1a, stress concentration is likely to occur on the side edge 2-1, causing edge extrusion or warping. Providing the notch 2a can reduce stress concentration, improve the fit between the heat sink 2 and the housing 1, and ensure the contact area between the two to ensure the heat dissipation effect.

[0074] like Figure 6 As shown, the heat sink 2 includes a first material layer 21, a second material layer 22 and a third material layer 23 which are stacked in sequence.

[0075] The first material layer 21 is an adhesive material, and is used to be attached to the side of the arc hole wall 11 facing the inside of the mobile phone 01. Exemplarily, the adhesive material may include but is not limited to acrylic acid, hot melt adhesive, rubber and other adhesive and heat-resistant materials.

[0076] The second material layer 22 is a heat-conducting material, and the heat-conducting material includes, but is not limited to, metal, graphite, and other materials with heat conductivity. Moreover, the heat-conducting material can be in powder form or in sheet form.

[0077] The third material layer 23 is an insulating material. Exemplarily, the insulating material includes but is not limited to Mylar, silicone and other heat-insulating materials.

[0078] like Fig. 9A and Fig. 9BAs shown, in this embodiment, the orthographic projection area of ​​the first material layer 21 on the first plane and the orthographic projection area of ​​the third material layer 23 on the first plane are both greater than the orthographic projection area of ​​the second material layer 22 on the first plane.

[0079] And, if Fig. 9A As shown, if the heat-conducting material of the second material layer 22 is in sheet form, such as a metal plate, the edge of the first material layer 21 and the edge of the third material layer 23 do not need to be attached.

[0080] like Fig. 9B As shown, if the thermally conductive material of the second material layer 22 is in powder form, such as graphite powder, the edge of the first material layer 21 is arranged in close contact with the edge of the third material layer 23, so that the first material layer 21 and the third material layer 23 can wrap the second material layer 22 to prevent leakage of the powdered thermally conductive material.

[0081] In this embodiment, the first material layer 21 and the third material layer 23 have the same shape and size. Accordingly, the notch 2a can be provided at the edge of the first material layer 21 and the edge of the third material layer 23 .

[0082] In other embodiments, the orthographic projection area of ​​the third material layer 23 on the first plane may be smaller than the orthographic projection area of ​​the first material layer 21 on the first plane, and accordingly, the notch 2a may be only provided at the edge of the first material layer 21 .

[0083] Alternatively, the orthographic projection area of ​​the first material layer 21 on the first plane is smaller than the orthographic projection area of ​​the third material layer 23 on the first plane, and accordingly, the notch 2a may be provided only at the edge of the third material layer 21. In this case, the edge of the third material layer 21 close to the first material layer 21 may be attached to the housing 1 by an adhesive material, thereby ensuring the fit between the heat sink 2 and the housing 1 as a whole.

[0084] It should be noted that, in the examples and description of the present application, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or equipment. In the absence of further restrictions, the elements defined by the statement "comprise one" do not exclude the presence of other identical elements in the process, method, article or equipment including the elements.

[0085] Although the present application has been illustrated and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the scope of the present application.

Claims

1. An electronic device, characterized in that: It comprises a shell body, a decorative piece and a heat sink (2) arranged on the shell body; wherein: The shell body has an opening (1a), and the decorative cover is arranged on the opening (1a) and is sealed and connected to the opening (1a); The opening (1a) has an arc-shaped hole wall (11) extending along a first direction, wherein the first direction is a thickness direction of the electronic device; At least a portion of the heat sink (2) is attached to a side of the arc-shaped hole wall (11) facing the interior of the electronic device.

2. The electronic device according to claim 1, characterized in that: The decorative piece is a camera rear cover.

3. The electronic device according to claim 1 or 2, characterized in that: The heat sink (2) comprises a first material layer, a second material layer and a third material layer stacked in sequence, wherein: The first material layer is attached to a side of the arc-shaped hole wall (11) facing the interior of the electronic device.

4. The electronic device according to claim 3, characterized in that: The first material layer is an adhesive material, the second material layer is a heat conductive material, and the third material layer is an insulating material.

5. The electronic device according to claim 4, characterized in that: The orthographic projection area of ​​the first material layer on the first plane and the orthographic projection area of ​​the third material layer on the first plane are both larger than the orthographic projection area of ​​the second material layer on the first plane, and, The edge of the first material layer is bonded to the edge of the third material layer; The first plane is a plane where the length direction and the width direction of the electronic device are located.

6. The electronic device according to claim 3, characterized in that: At least part of the edge of the heat sink (2) is provided with a notch (2a).

7. The electronic device according to claim 6, characterized in that: The notch (2a) is arranged at the edge of the first material layer and the edge of the third material layer.

8. The electronic device according to claim 7, characterized in that: The edge of the first material layer and / or the edge of the third material layer is provided with a plurality of the notches (2a), and The plurality of notches (2a) are arranged continuously or discontinuously.

9. The electronic device according to claim 7 or 8, characterized in that: The shape of the notch (2a) includes any one of the following: semicircular, rectangular, triangular, and trapezoidal.

10. The electronic device according to claim 1, characterized in that: The arc-shaped hole wall (11) comprises a first port and a second port arranged along the first direction, the first port is closer to the interior of the electronic device than the second port, the first port and the second port have the same shape, and, The orthographic projection area of ​​the first port on the first plane is larger than the orthographic projection area of ​​the second port on the first plane; The first plane is a plane where the length direction and the width direction of the electronic device are located.

11. The electronic device according to claim 10, characterized in that: The heat sink (2) is arranged around the first port, or, The heat sink (2) is only partially provided around the first port.

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