A device for improving the distortion of semiconductor lead frame

Abstract

The utility model relates to the field of semiconductor lead frames, and specifically to a device for improving the distortion correction of semiconductor lead frames. A pressing component comprises a placement seat and a lower pressing plate. The lower pressing plate can be vertically movably arranged above the placement seat through a movable column. The bottom surface of the lower pressing plate and the top surface of the placement seat are both installed with magnetic blocks. A pressing die is connected to the bottom of the lower pressing plate through the magnetic block. A mounting die matching the pressing die is installed above the placement seat through the magnetic block. Compared with the prior art, the beneficial effect of the present application is that for a lead frame product in a stamping die, a pressing die and a mounting die are arranged in the pressing component. When a pressing movement is performed, the pressing die and the mounting die are stamped against each other to straighten the pins. After the pins are straightened, the inclined pins can be manually corrected by a correction pliers to improve the distortion of the pins. At the same time, a magnetic plate is used for connection, so that the pressing die and the mounting die can be easily replaced to achieve the effect of rapid adjustment and adaptation.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor lead frames, in particular to a device for improving the distortion of semiconductor lead frames. Background Art

[0002] With the development of information technology, the demand for metal lead frames in integrated circuit chips is increasing, and the shapes are becoming more subtle and high-precision. There are two ways to produce lead frames: etching and stamping. Although etching can achieve very fine precision, it cannot achieve high production efficiency and low production costs. With the rapid decline in the prices of IC chips represented by computer memory bars and CPUs, the use of stamping to form metal lead frames for IC chips is an important way to reduce the price of IC chips and improve production efficiency.

[0003] The pin width of some existing chip metal lead frames is relatively small. After punching, the pins are easily twisted and do not meet the specifications. In the prior art, the conventional method for correcting the pins of such punched lead frames is to add correction bumps to each pin to correct the distortion of the pins. However, there are many correction points, complex processing, and poor consistency, which seriously affects the smooth progress of the subsequent chip production process, cannot meet the increasingly tense demand, and also restricts the further development of information technology. Utility Model Content

[0004] The purpose of the utility model is to solve the above defects and provide a device for improving the distortion correction of semiconductor lead frames.

[0005] The purpose of the utility model is achieved in the following way: an improved semiconductor lead frame distortion correction device, including a pressing component and a correction component, the correction component is arranged around the pressing component, the pressing component includes a placement seat and a lower pressing plate, the lower pressing plate is vertically movably arranged above the placement seat through a movable column, the bottom surface of the lower pressing plate and the top surface of the placement seat are both installed with magnetic blocks, a pressing mold is connected to the bottom of the lower pressing plate through the magnetic block, and a mounting mold matching the pressing mold is installed above the placement seat through the magnetic block, the correction component includes a correction clamp and a mounting block, the correction clamp is movably arranged around the mounting mold and is flush with the top surface of the mounting mold.

[0006] In the above description, as a further solution, a fixed base is installed on the bottom surface of the placement seat, and surrounding blocks are provided on all four sides of the fixed base. A slot is provided on the top of the surrounding block, and the mounting block is connected to the surrounding block through a tenon matching the slot, and a protrusion is provided on the bottom surface of the mounting block near the tenon.

[0007] In the above description, as a further solution, the correction clamp is movably arranged between the mounting block and the surrounding block, a correction socket is arranged at one end of the correction clamp close to the placement seat, the end of the correction socket adopts an angled structure, and a control position is arranged at one end of the correction clamp away from the inclined socket, and the control position is a semicircular structure. The semicircular control position can fit the fingers of the staff and provide better comfort.

[0008] In the above description, as a further solution, a fixing plate is provided on the top of the movable column, and the four corners of the fixing plate are fixedly connected to the movable column.

[0009] In the above description, as a further solution, a pushing cylinder is installed on the top surface of the fixed plate, and the push rod of the pushing cylinder passes through the fixed plate and is connected to the top surface of the lower pressure plate. An avoidance hole matching the push rod is provided in the middle of the top surface of the fixed plate.

[0010] In the above description, as a further solution, a positioning column for positioning is provided on one side of the magnetic block, a fixed groove matching the positioning column is provided on the side of the pressing mold and the installation mold close to the magnetic block, and a storage groove is provided on the opposite side of the placement seat and the lower pressure plate.

[0011] The beneficial effects produced by the utility model are as follows: Compared with the prior art, the beneficial effects of the present application are that for the lead frame product in the stamping die, by means of the pressing die and the mounting die arranged in the pressing assembly, during the pressing movement, the pressing die and the mounting die stamp against each other, and the pin area is flattened by a plane to straighten the pins. After the pins are straightened, the inclined pins can be manually corrected by correction pliers to improve the pin distortion. At the same time, a magnetic suction plate is used for connection, which makes it easy to replace the pressing die and the mounting die, thereby achieving the effect of quick adjustment and adaptation. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a three-dimensional structural schematic diagram of a device for improving the distortion of a semiconductor lead frame according to the utility model;

[0013] Figure 2 This is a schematic diagram of the structure decomposition of a device for improving the distortion correction of a semiconductor lead frame according to the utility model;

[0014] In the figure: 1-placing seat, 2-lower pressure plate, 3-magnetic block, 4-pressing mold, 5-installing mold, 6-correction clamp, 7-installing block, 8-fixed base, 9-enclosing block, 10-card slot, 11-correction socket, 12-control position, 13-fixed plate, 14-pushing cylinder, 15-positioning column, 16-storage slot. DETAILED DESCRIPTION

[0015] In order to facilitate the understanding of those skilled in the art, the present invention is further described below in conjunction with the embodiments and drawings, and the contents mentioned in the implementation manner are not intended to limit the present invention. The present invention is described in detail below in conjunction with the drawings.

[0016] See also Figure 1-2 The invention discloses a device for improving the distortion correction of a semiconductor lead frame, which specifically implements the invention. The device comprises a pressing component and a correction component. The correction component is arranged around the pressing component. The pressing component comprises a placing seat 1 and a lower pressing plate 2. The lower pressing plate 2 is arranged vertically and movably above the placing seat 1 through a movable column. A magnetic block 3 is installed on the bottom surface of the lower pressing plate 2 and the top surface of the placing seat 1. A pressing mold 4 is connected to the bottom of the lower pressing plate 2 through the magnetic block 3. A mounting mold 5 matching the pressing mold 4 is installed above the placing seat 1 through the magnetic block 3. The correction component comprises a correction clamp 6 and a mounting block 7. The correction clamp 6 is movably arranged around the mounting mold 5 and is flush with the top surface of the mounting mold 5.

[0017] A fixed base 8 is installed on the bottom surface of the placement seat 1, and surrounding blocks 9 are arranged on all four sides of the fixed base 8. A slot 10 is arranged on the top of the surrounding block 9. The mounting block 7 is connected to the surrounding block 9 by a tenon matching the slot 10, and a protrusion is arranged on the bottom surface of the mounting block 7 near the tenon.

[0018] The correction clamp 6 is movably arranged between the mounting block 7 and the surrounding block 9. A correction socket 11 is provided at one end of the correction clamp 6 close to the placement seat 1. The end of the correction socket 11 adopts an angled structure. A control position 12 is provided at one end of the correction clamp 6 away from the inclined socket. The control position 12 is a semicircular structure.

[0019] A fixing plate 13 is provided on the top of the movable column, and the four corners of the fixing plate 13 are fixedly connected to the movable column.

[0020] A push cylinder 14 is installed on the top surface of the fixed plate 13, and a push rod of the push cylinder 14 passes through the fixed plate 13 and is connected to the top surface of the lower pressing plate 2. A avoidance hole matching the push rod is provided in the middle of the top surface of the fixed plate 13.

[0021] One side of the magnetic block 3 is provided with a positioning column 15 for positioning, the pressing mold 4 and the installation mold 5 are provided with a fixed point groove matching the positioning column 15 on the side close to the magnetic block 3, and the placement seat 1 and the lower pressing plate 2 are provided with a storage groove 16 on the opposite side.

[0022] The use process of the utility model is as follows: first, a pressing die 4, a mounting die 5 and a correction clamp 6 matching the semiconductor lead frame chip with bent pins are found, and after the mounting die 5 and the pressing die 4 are connected and installed with the magnetic suction block 3 through the positioning column 15, the correction clamp 6 is placed on the top of the surrounding edge through the mounting block 7, and the chip is placed in the storage groove 16 on the top surface of the mounting die 5, and the pushing cylinder 14 is started, and the pushing cylinder 14 pushes the lower pressing plate 2 to drive the pressing die 4 to flatten the pins of the chip. After the pressing is completed, the pushing cylinder 14 is lifted up to drive the lower pressing plate 2 and the pressing die 4 to move upward. After the upward movement, the pins are observed to check whether they are tilted or twisted. After the observation is completed, the pins can be straightened by the correction clamp 6;

[0023] Correction process: After aligning the correction socket 11 of the correction pliers 6 with the pin, engage the correction socket 11 with the pin, straighten the inclined pin, and then push the correction pliers 6 toward the direction of the pin. After pushing, the pin can be straightened to achieve the correction effect of the pin.

[0024] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.

[0025] In addition, in the description of the embodiments of the present utility model, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances. In the description of the present utility model, it should be noted that the orientation or position relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0026] Finally, it should be noted that the above embodiments are only specific implementation methods of the utility model, which are used to illustrate the technical solution of the utility model, rather than to limit it. The protection scope of the utility model is not limited thereto. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art should understand that any technician familiar with the technical field can still modify the technical solution recorded in the above embodiments within the technical scope disclosed by the utility model, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solution deviate from the spirit and scope of the technical solution of the embodiment of the utility model, and should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model shall be based on the protection scope of the claims.

Claims

1. A device for improving the distortion of a semiconductor lead frame, comprising a pressing component and a correction component, wherein the correction component is arranged around the pressing component, and is characterized in that: The pressing assembly includes a placement seat and a lower pressing plate. The lower pressing plate is vertically movably arranged above the placement seat through a movable column. Magnetic blocks are installed on the bottom surface of the lower pressing plate and the top surface of the placement seat. A pressing mold is connected to the bottom of the lower pressing plate through the magnetic block. A mounting mold matching the pressing mold is installed above the placement seat through the magnetic block. The correction assembly includes a correction clamp and a mounting block. The correction clamp is movably arranged around the mounting mold and is flush with the top surface of the mounting mold.

2. The device for improving the distortion of semiconductor lead frame according to claim 1, characterized in that: A fixed base is installed on the bottom surface of the placement seat, and surrounding blocks are arranged around the fixed base. A slot is arranged on the top of the surrounding block. The mounting block is connected to the surrounding block through a tenon matching the slot, and a protrusion is arranged on the bottom surface of the mounting block near the tenon.

3. The device for improving the distortion of semiconductor lead frame according to claim 2, characterized in that: The correction clamp is movably arranged between the mounting block and the surrounding block. A correction socket is arranged at one end of the correction clamp close to the placement seat. The end of the correction socket adopts an oblique structure. A control position is arranged at one end of the correction clamp away from the inclined socket. The control position has a semicircular structure.

4. The device for improving the distortion of semiconductor lead frame according to claim 1, characterized in that: A fixing plate is provided on the top of the movable column, and four corners of the fixing plate are fixedly connected to the movable column.

5. The device for improving the distortion of semiconductor lead frame according to claim 4, characterized in that: A push cylinder is installed on the top surface of the fixed plate, a push rod of the push cylinder passes through the fixed plate and is connected to the top surface of the lower pressure plate, and a avoidance hole matching the push rod is provided in the middle of the top surface of the fixed plate.

6. The device for improving the distortion of semiconductor lead frame according to claim 1, characterized in that: One side of the magnetic block is provided with a positioning column for positioning, the pressing mold and the installation mold are provided with a fixed point groove matching the positioning column on the side close to the magnetic block, and the placement seat and the lower pressing plate are provided with a storage groove on the side opposite to the lower pressing plate.

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