Plate surface temperature equalization device

Abstract

The utility model discloses a plate surface temperature equalization device including a hot pressing plate and an electric heating tube, wherein the hot pressing plate is provided with an electric heating chamber and a liquid heating chamber, wherein the electric heating chamber is provided in the middle of the hot pressing plate, wherein the liquid heating chamber is arranged in the hot pressing plate around the outside of the electric heating chamber, wherein the liquid heating chamber is filled with a heating liquid, and wherein the electric heating tube is installed in the electric heating chamber for transferring heat to the heating liquid in the liquid heating chamber. The heat generated by the electric heating tube in the electric heating chamber can be radiated to the outside through the heating liquid in the liquid heating chamber, and after the heat passes through the heating liquid, the heating liquid is heated more evenly because the heat conduction efficiency in the liquid is lower than that in the solid, and the liquid has fluidity. The utility model has a simple structure, is easy to implement, and has a low cost of use, which can improve efficiency.

Description

Technical Field

[0001] The utility model belongs to the technical field of hot pressing equipment, and in particular relates to a plate surface temperature equalizing device. Background Art

[0002] Particleboard, also known as particle board, particle board, bagasse board, and chipboard, is a man-made board made of wood or other wood fiber materials, which is glued together under heat and pressure after applying adhesive.

[0003] The quality of particleboard is closely related to pressure and temperature. In the heating process, because particleboard products are large flat plates, uneven heating will lead to regional differences in the material, resulting in different forms of deformation after the board is formed, such as different warping and bending, etc., and thus it is necessary to ensure uniform heating over a large area.

[0004] At present, the hot pressing plate used in the particleboard processing process is usually heated by steam or electricity. During the steam heating process, the irregular discharge of condensed water causes the steam pipe to be blocked, which is prone to uneven heating and causes differences in the heating of the hot pressing plate. The electric heating method uses multiple heating tubes arranged side by side for heating. There are gaps in the arrangement of the heating tubes, which can also cause uneven heating on the hot pressing plate.

[0005] Based on this, the applicant considered designing a plate surface temperature equalization device. Utility Model Content

[0006] In view of the above-mentioned deficiencies in the prior art, the technical problem to be solved by the present invention is: how to provide a plate surface temperature equalization device.

[0007] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0008] The plate surface temperature equalization device comprises a hot pressing plate and an electric heating tube, wherein the hot pressing plate is provided with an electric heating chamber and a liquid heating chamber, wherein the electric heating chamber is provided in the middle of the hot pressing plate, and the liquid heating chamber is arranged in the hot pressing plate around the outside of the electric heating chamber, wherein the liquid heating chamber is filled with a heating liquid, and the electric heating tube is installed in the electric heating chamber for transferring heat to the heating liquid in the liquid heating chamber.

[0009] Compared with the prior art, the plate surface temperature equalization device of the utility model has the following advantages:

[0010] By setting up the electric heating chamber and the liquid heating chamber, the heat generated by the electric heating tube in the electric heating chamber can be radiated to the outside through the heating liquid in the liquid heating chamber. After the heat passes through the heating liquid, the heat conduction efficiency in the liquid is lower than that in the solid, and the liquid has fluidity, so the heating liquid is heated more evenly.

[0011] The above-mentioned board surface temperature equalization device has the advantages of simple structure and easy implementation. It is suitable for installation and use in the existing particle board hot pressing process, and the cost of use is low, which can improve the efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the structure of the utility model;

[0013] Figure 2 for Figure 1 A schematic diagram of the structure of the state in which the middle hot pressing plate applies downward pressure;

[0014] Figure 3 for Figure 1 Cross-section view of AA.

[0015] Description of Reference Numerals

[0016] 100 hot platen, 110 electric heating chamber, 120 liquid heating chamber

[0017] 200 electric heating tube

[0018] 310 motor, 320 guide vane, 330 liquid inlet, 340 liquid outlet

[0019] 400 hydraulic push rod

[0020] 500 belt transmission platform

[0021] 610 support platform, 620 spring DETAILED DESCRIPTION

[0022] The utility model is further described in detail below in conjunction with the accompanying drawings.

[0023] When implementing: Figure 1-Figure 3 As shown, the plate surface temperature equalization device includes a hot pressing plate 100 and an electric heating tube 200. The hot pressing plate 100 is provided with an electric heating chamber 110 and a liquid heating chamber 120. The electric heating chamber 110 is opened in the middle of the hot pressing plate 100. The liquid heating chamber 120 is arranged in the hot pressing plate 100 around the outside of the electric heating chamber 110. The liquid heating chamber 120 is filled with heating liquid. The electric heating tube 200 is installed in the electric heating chamber 110 for transferring heat to the heating liquid in the liquid heating chamber 120.

[0024] Compared with the prior art, the plate surface temperature equalization device of the utility model has the following advantages:

[0025] By setting up the electric heating chamber 110 and the liquid heating chamber 120, the heat generated by the electric heating tube 200 in the electric heating chamber 110 can be radiated to the outside through the heating liquid in the liquid heating chamber 120. After the heat passes through the heating liquid, the heat conduction efficiency in the liquid is lower than that in the solid, and the liquid has fluidity, so the heating liquid is heated more evenly.

[0026] The above-mentioned board surface temperature equalization device has the advantages of simple structure and easy implementation. It is suitable for installation and use in the existing particle board hot pressing process, and the cost of use is low, which can improve the efficiency.

[0027] In this embodiment, a flow guiding mechanism is also included. The flow guiding mechanism is installed in the liquid heating chamber 120 and is used to make the heating liquid in the liquid heating chamber 120 flow.

[0028] In this way, the flow guiding mechanism can more quickly impart fluidity to the heating liquid in the liquid heating chamber 120, so that the heat transferred to the heating liquid is more uniform.

[0029] In this embodiment, the flow guide mechanism includes a motor 310 and a flow guide vane 320 . The motor 310 is mounted on the outer wall of the liquid heating chamber 120 . The flow guide vane 320 is disposed in the liquid heating chamber 120 and is transmission-connected to the motor 310 .

[0030] During implementation, the rotating shaft of the motor 310 extends into the liquid heating chamber 120 , and the guide vane 320 is transmission-connected to the rotating shaft of the motor 310 .

[0031] In this way, the guide vanes 320 are driven by the motor 310 to impart fluidity to the heated liquid, which has a simple structure, low cost and good flow effect.

[0032] In this embodiment, a liquid inlet 330 and a liquid outlet 340 are provided on the hot pressing plate 100, and both the liquid inlet 330 and the liquid outlet 340 are connected to the liquid heating chamber 120. The liquid inlet 330 is arranged at the top of the hot pressing plate 100, and the liquid outlet 340 is arranged at the bottom of the hot pressing plate 100.

[0033] During implementation, one end of the liquid inlet 330 is connected to the liquid heating chamber 120, and the other end is connected to the outside world at the top of the hot pressing plate 100; one end of the liquid outlet 340 is connected to the liquid heating chamber 120, and the other end is connected to the outside world at the bottom of the hot pressing plate 100.

[0034] In this way, the heating liquid in the liquid heating chamber 120 can be added and replaced through the liquid inlet 330 and the liquid outlet 340 .

[0035] In this embodiment, solenoid valves are disposed at both the liquid inlet 330 and the liquid outlet 340 .

[0036] In this way, the flow rate at the liquid inlet 330 and the liquid outlet 340 can be controlled by the solenoid valve, with a simple structure and good control effect.

[0037] In this embodiment, a hydraulic push rod 400 is disposed on the top of the hot pressing plate 100 .

[0038] In this way, the hot pressing plate 100 can be raised and lowered by the hydraulic push rod 400, the lifting structure is relatively simple, and the lifting effect is good.

[0039] In this embodiment, a belt transmission platform 500 is further included. The belt transmission platform 500 is installed below the hot pressing plate 100 to bear the pressure applied by the hot pressing plate 100 .

[0040] During implementation, the particleboard is placed on the belt conveying platform 500 , and the hot pressing plate 100 can extrude the particleboard together with the belt conveying platform 500 .

[0041] In this way, the belt transmission platform 500 can transmit the particle board while supporting the hot pressing plate 100 to apply downward pressure.

[0042] In this embodiment, a support platform 610 and a spring 620 are also included. The support platform 610 is installed below the hot pressing plate 100, and the spring 620 is arranged between the support platform 610 and the hot pressing plate 100. One end of the spring 620 is connected to the support platform 610, and the other end is connected to the hot pressing plate 100.

[0043] During implementation, the spring 620 is in a compressed state.

[0044] In this way, the spring 620 can reduce the impact force when the hot pressing plate 100 applies downward pressure to the particle board, and can also further enhance the restoring force of the hot pressing plate 100 after the hot pressing plate 100 applies downward pressure to the particle board.

[0045] The above are only preferred implementations of the present invention. It should be pointed out that a number of modifications and improved technical solutions made by those skilled in the art without departing from the technical solution should also be deemed to fall within the scope of protection required by the claims.

Claims

1. Plate surface temperature equalization device, characterized by: It comprises a hot pressing plate and an electric heating tube, wherein the hot pressing plate is provided with an electric heating chamber and a liquid heating chamber, wherein the electric heating chamber is provided in the middle of the hot pressing plate, wherein the liquid heating chamber is arranged in the hot pressing plate around the outside of the electric heating chamber, wherein the liquid heating chamber is filled with a heating liquid, wherein the electric heating tube is installed in the electric heating chamber for transferring heat to the heating liquid in the liquid heating chamber; It also includes a flow guiding mechanism, which is installed in the liquid heat chamber and is used to make the heating liquid in the liquid heat chamber flow; The flow guide mechanism includes a motor and flow guide vanes. The motor is mounted on the outer wall of the liquid-heat chamber. The flow guide vanes are arranged in the liquid-heat chamber and are drivingly connected to the motor.

2. The plate surface temperature equalization device according to claim 1, characterized in that: The hot pressing plate is provided with a liquid inlet and a liquid outlet, both of which are communicated with the liquid heating chamber, the liquid inlet is arranged on the top of the hot pressing plate, and the liquid outlet is arranged on the bottom of the hot pressing plate.

3. The plate surface temperature equalization device according to claim 2, characterized in that: The liquid inlet and the liquid outlet are both provided with electromagnetic valves.

4. The plate surface temperature equalizing device according to any one of claims 1 to 3, characterized in that: A hydraulic push rod is arranged on the top of the hot pressing plate.

5. The plate surface temperature equalization device according to any one of claims 1 to 3, characterized in that: It also includes a belt transmission platform, which is installed under the hot pressing plate and is used to bear the pressure applied by the hot pressing plate.

6. The plate surface temperature equalization device according to any one of claims 1 to 3, characterized in that: It also includes a support platform and a spring, wherein the support platform is installed below the hot pressing plate, the spring is arranged between the support platform and the hot pressing plate, one end of the spring is connected to the support platform, and the other end is connected to the hot pressing plate.

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