A cutting mechanism for high thermal conductivity silicon nitride ceramic substrate

By using diamond-made cutting knives and cooling components in the silicon nitride ceramic substrate cutting mechanism, the problem of high temperature damage is solved, and efficient cooling of the cutting knives and extended service life is achieved.

CN222727018UActive Publication Date: 2025-04-08SHANDONG DECI SEMICONDUCTOR NEW MATERIALS CO LTD
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Patent Information

Application Number
CN202520307387.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-25
Publication Date
2025-04-08
Estimated Expiration
2035-02-25

AI Technical Summary

Technical Problem

The existing silicon nitride ceramic substrate cutting mechanism lacks a cooling mechanism during cutting, which causes the cutting knife to be distorted and deformed due to high temperature and damage.

Method used

A highly thermally conductive silicon nitride ceramic substrate cutting mechanism is designed, using a diamond cutting knife, and cooling components are provided on one side of the frame, including a cooling box, a mini water pump and a spray head, which cools down on the surface of the cutting knife by spraying coolant.

Benefits of technology

Through the combination of a cutting knife with high thermal conductivity and cooling components, uniform cooling of the cutting knife surface is achieved, avoiding the distortion and deformation of the cutting knife due to high temperature, and extending the service life of the cutting knife.

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Abstract

The utility model relates to the technical field of silicon nitride ceramic substrate processing, and discloses a high thermal conductivity silicon nitride ceramic substrate cutting mechanism, including a frame and a cutter disc, the outer periphery of the cutter disc is rotatably connected with a cutting knife, the cutting knife is made of diamond material, one side of the frame is fixedly connected with a driving motor, the interior of the frame is provided with a driving system, the top of the frame is fixedly connected with a hand handle, one side of the frame is fixedly connected with a cooling component, the surface of the cutter disc is detachably connected with a cleaning component, the cooling component includes a cooling box fixedly connected to one side of the frame, and the top of the cooling box is threadedly connected with a box cover. In the utility model, the cutting knife made of diamond has high hardness, high thermal stability and good wear resistance, making it more suitable for cutting operations of silicon nitride ceramic substrates, and the surface of the cutting knife is evenly cooled by the setting of the cooling component.
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Description

Technical Field

[0001] The utility model relates to the technical field of silicon nitride ceramic substrate processing, in particular to a high thermal conductivity silicon nitride ceramic substrate cutting mechanism. Background Art

[0002] Silicon nitride ceramic substrates have high strength, high fracture toughness and good thermal shock resistance, and are widely used in high-temperature, high-speed, and highly corrosive medium working environments. The hardness and toughness of silicon nitride ceramic substrates also make their cutting difficult, requiring special cutting equipment and tools;

[0003] Most cutting equipment in the prior art uses complex sensors and control systems to measure the size of the silicon nitride ceramic to be cut, and then cuts the silicon nitride ceramic substrate with a handheld cutting knife to complete the cutting of the silicon nitride ceramic substrate.

[0004] However, the existing silicon nitride ceramic substrate cutting mechanism has no cooling mechanism when cutting the silicon nitride ceramic substrate, and the cutting blade will be twisted and deformed due to the high temperature generated during cutting, resulting in damage to the cutting blade. Therefore, a high thermal conductivity silicon nitride ceramic substrate cutting mechanism is proposed to solve the above problem. Utility Model Content

[0005] In order to make up for the above shortcomings, the utility model provides a high thermal conductivity silicon nitride ceramic substrate cutting mechanism, which aims to improve the problem that the existing silicon nitride ceramic substrate cutting mechanism in the prior art has no cooling mechanism when cutting the silicon nitride ceramic substrate, and its cutting knife will be twisted and deformed due to the high temperature generated during cutting, resulting in damage to the cutting knife.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a high thermal conductivity silicon nitride ceramic substrate cutting mechanism, comprising a frame and a knife disc, the outer periphery of the knife disc is rotatably connected with a cutting knife, the knife disc and the cutting knife have high thermal conductivity, the cutting knife is made of diamond material, one side of the frame is fixedly connected with a driving motor, the interior of the frame is provided with a driving system, the top of the frame is fixedly connected with a hand-held handle, one side of the frame is provided with a cooling component, the surface of the knife disc is provided with a cleaning component, the cooling component comprises a cooling box fixedly connected to one side of the frame, the top of the cooling box is threadedly connected with a box cover, the bottom of the cooling box is sealed and fixedly connected with a connecting piece, the other end of the connecting piece is fixedly connected with a cooling pipe, a micro water pump is provided inside the cooling box, the surface of the cooling pipe is sleeved with a connecting frame, and the other end of the cooling pipe is fixedly connected with a spray head;

[0007] As a further description of the above technical solution: the cleaning assembly includes a first fixing frame and a second fixing frame respectively arranged on the two side surfaces of the cutter disc, the surfaces of the first fixing frame and the second fixing frame are both provided with threaded holes, the inner threads of the threaded holes are connected with bolts, the other ends of the bolts are threadedly connected with nuts, one end of the bottom of the first fixing frame is fixedly connected with a connecting block, the inner ring surfaces of the first fixing frame and the second fixing frame are fixedly connected with cleaning brushes, the bottom surface of the second fixing frame is provided with a connecting groove, and the surface of the cutter disc is provided with a connecting hole;

[0008] As a further description of the above technical solution: the cutter disc is located at the front side of the frame, one end of the cutter disc is located inside the frame and connected to the drive system;

[0009] As a further description of the above technical solution: the cooling box is filled with coolant, and the water outlet of the micro water pump is fixedly connected to one end of the cooling pipe;

[0010] As a further description of the above technical solution: the other end of the connecting frame is fixedly connected to the surface of the frame, and the spray heads are symmetrically arranged on both sides of the cutter disc;

[0011] As a further description of the above technical solution: the first fixing frame and the second fixing frame are in an arc shape, and the bolt is threadedly connected inside the threaded hole;

[0012] As a further description of the above technical solution: the connection block is slidably connected inside the connection groove, and the bolt is threadedly connected to the connection hole;

[0013] As a further description of the above technical solution: the cleaning brush is a flexible water-absorbent brush, and one end of the cleaning brush is in contact with the surface of the cutting knife.

[0014] The utility model has the following beneficial effects:

[0015] 1. In the utility model, the cutting knife is made of diamond, so that the cutting knife has high hardness, high thermal stability and good wear resistance, making it more suitable for cutting silicon nitride ceramic substrates. By setting the cooling component, the surface of the cutting knife is evenly cooled, avoiding the high temperature generated by the cutting knife when cutting the silicon nitride ceramic substrate.

[0016] 2. In the utility model, by providing a cleaning component, when the cutting knife moves on the surface of the knife disc, the cleaning brush will continuously clean the surface of the cutting knife, and part of the coolant sprayed by the spray head will stay on the surface of the cleaning brush. Therefore, while the cleaning brush cleans the surface of the cutting knife, it can also continuously cool the cutting knife, thereby indirectly increasing the service life of the cutting knife. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A three-dimensional schematic diagram of a high thermal conductivity silicon nitride ceramic substrate cutting mechanism proposed by the utility model;

[0018] Figure 2 This is a schematic structural diagram of a cooling assembly of a high thermal conductivity silicon nitride ceramic substrate cutting mechanism proposed by the utility model;

[0019] Figure 3 This is a schematic structural diagram of a cleaning component of a high thermal conductivity silicon nitride ceramic substrate cutting mechanism proposed by the utility model;

[0020] Figure 4 The utility model is a schematic diagram of the structure of a cutter disc of a high thermal conductivity silicon nitride ceramic substrate cutting mechanism.

[0021] Legend:

[0022] 1. Frame; 2. Cutter disc; 3. Cutting knife; 4. Drive motor; 5. Drive system; 6. Handle; 7. Cooling assembly; 71. Cooling box; 72. Box cover; 73. Connector; 74. Cooling pipe; 75. Micro water pump; 76. Connecting frame; 77. Sprinkler head; 8. Cleaning assembly; 81. First fixing frame; 82. Second fixing frame; 83. Threaded hole; 84. Bolt; 85. Nut; 86. Connecting block; 87. Cleaning brush; 88. Connecting groove; 89. Connecting hole. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Reference Figure 1 - Figure 4, the utility model provides an embodiment: a high thermal conductivity silicon nitride ceramic substrate cutting mechanism, including a frame 1 and a cutter disc 2, the outer periphery of the cutter disc 2 is rotatably connected with a cutting knife 3, the cutter disc 2 and the cutting knife 3 have high thermal conductivity, the cutting knife 3 is made of diamond material, the cutting knife 3 is connected to the driving motor 4 through a driving system 5, the cutting knife 3 made of diamond has high hardness, high thermal stability and good wear resistance, and is suitable for cutting silicon nitride ceramics, the cutting blade of the cutting knife 3 adopts polycrystalline diamond or chemical vapor deposition diamond coating to improve its hardness and wear resistance, one side of the frame 1 is fixedly connected with the driving motor 4, the inside of the frame 1 is provided with a driving system 5, the top of the frame 1 is fixedly connected with a hand handle 6, one side of the frame 1 is provided with a cooling assembly 7, the surface of the cutter disc 2 is provided with a cleaning assembly 8, the cooling assembly 7 includes a cooling box 71 fixedly connected to one side of the frame 1, the top of the cooling box 71 is threadedly connected with a box cover 72, and the bottom of the cooling box 71 is sealed A connector 73 is fixedly connected, and the other end of the connector 73 is fixedly connected to a cooling pipe 74. A micro water pump 75 is arranged inside the cooling box 71. A connecting frame 76 is provided on the surface of the cooling pipe 74. A spray head 77 is fixedly connected to the other end of the cooling pipe 74. The cutter disc 2 is located at the front side of the frame 1, and one end of the cutter disc 2 is located inside the frame 1 and is connected to the drive system 5. The cooling box 71 is filled with coolant. The water outlet of the micro water pump 75 is fixedly connected to one end of the cooling pipe 74, and the other end of the connecting frame 76 is fixedly connected to the surface of the frame 1. The spray heads 77 are symmetrically arranged on both sides of the cutter disc 2. The cutting knife 3 is made of diamond, so that the cutting knife 3 has high hardness, high thermal stability and good wear resistance, making it more suitable for cutting silicon nitride ceramic substrates. Through the setting of the cooling component 7, the surface of the cutting knife 3 is evenly cooled, and the high temperature generated when the cutting knife 3 is cutting the silicon nitride ceramic substrate is avoided. Distortion and deformation of the cutting knife 3 is avoided.

[0025] Reference Figure 1 - Figure 4The cleaning assembly 8 includes a first fixing frame 81 and a second fixing frame 82 respectively arranged on the two side surfaces of the cutter disc 2. The surfaces of the first fixing frame 81 and the second fixing frame 82 are both provided with threaded holes 83. The inner thread of the threaded hole 83 is connected with a bolt 84. The other end of the bolt 84 is threadedly connected with a nut 85. A connecting block 86 is fixedly connected to one end of the bottom of the first fixing frame 81. A cleaning brush 87 is fixedly connected to the inner ring surface of the first fixing frame 81 and the second fixing frame 82. A connecting groove 88 is provided on the bottom surface of the second fixing frame 82. A connecting hole 89 is provided on the surface of the cutter disc 2. The first fixing frame 81 and the second fixing frame 82 are arc-shaped. The bolt 84 The threaded connection is inside the threaded hole 83, the connecting block 86 is slidably connected inside the connecting groove 88, the bolt 84 is threadedly connected to the connecting hole 89, and the cleaning brush 87 is a flexible water-absorbing brush. One end of the cleaning brush 87 contacts the surface of the cutting knife 3. Through the provided cleaning component 8, when the cutting knife 3 moves on the surface of the knife disc 2, the cleaning brush 87 will continuously clean the surface of the cutting knife 3, and part of the coolant sprayed by the spray head 77 will stay on the surface of the cleaning brush 87. Therefore, while the cleaning brush 87 cleans the surface of the cutting knife 3, it can also continuously cool the cutting knife 3, thereby indirectly improving the service life of the cutting knife 3.

[0026] Working principle: When in use, first open the box cover 72, pour the coolant into the cooling box 71, and then tighten the box cover 72. At this time, start the drive motor 4 and the micro water pump 75. The drive motor 4 drives the cutting knife 3 on the surface of the cutter disc 2 according to the drive system 5, so that the cutting knife 3 cuts the silicon nitride ceramic substrate. The cutting knife 3 is made of diamond, so the cutting knife 3 has high hardness, high thermal stability and good wear resistance, making it more suitable for cutting silicon nitride ceramic substrates. The blade of the knife 3 is coated with poly-gold diamond or chemical vapor deposition diamond, thereby improving the hardness and wear resistance of the cutting knife 3. At the same time, the micro-water pump 75 extracts the coolant from the inside of the cooling box 71, and transports the coolant to the spray head 77 through the cooling pipe 74. The coolant is sprayed from the spray head 77, so that the coolant is directly sprayed on the surface of the cutting knife 3, thereby achieving the effect of uniformly cooling the surface of the cutting knife 3, and avoiding the high temperature generated by the cutting knife 3 when cutting the silicon nitride ceramic substrate. The cutting blade 3 is twisted and deformed. The hardness and wear resistance of the cutting blade 3 are improved by setting the cutting blade 3 of diamond material. When cutting the silicon nitride ceramic substrate, the cleaning component 8 is set so that when the cutting blade 3 moves on the surface of the knife disc 2, the cleaning brush 87 will continuously clean the surface of the cutting blade 3. Since the cleaning brush 87 is made of flexible and water-absorbent material, part of the coolant sprayed by the spray head 77 will stay on the surface of the cleaning brush 87. Therefore, while the cleaning brush 87 cleans the surface of the cutting blade 3, it can also continuously cool the cutting blade 3, thereby indirectly improving the service life of the cutting blade 3. When the cleaning brush 87 needs to be replaced, first tighten the bolt 84 and remove the bolt 84 from the inside of the threaded hole 83 and the connecting hole 89. At this time, the first fixing frame 81 is lifted to drive the connecting block 86 to slide out of the inside of the connecting groove 88. At this time, the cleaning brush 87 can be taken out, which is convenient for replacing the cleaning brush 87. The above operation is reversed to complete the installation of the cleaning brush 87.

[0027] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A high thermal conductivity silicon nitride ceramic substrate cutting mechanism, comprising a frame (1) and a cutter disc (2), characterized in that: The outer periphery of the cutter disc (2) is rotatably connected to a cutting knife (3); the cutter disc (2) and the cutting knife (3) have high thermal conductivity; the cutting knife (3) is made of diamond; a drive motor (4) is fixedly connected to one side of the frame (1); a drive system (5) is provided inside the frame (1); a hand-held handle (6) is fixedly connected to the top of the frame (1); a cooling component (7) is provided on one side of the frame (1); and a cleaning component (8) is provided on the surface of the cutter disc (2); The cooling assembly (7) comprises a cooling box (71) fixedly connected to one side of the frame (1); the top of the cooling box (71) is threadedly connected to a box cover (72); the bottom of the cooling box (71) is sealed and fixedly connected to a connecting piece (73); the other end of the connecting piece (73) is fixedly connected to a cooling pipe (74); a micro water pump (75) is arranged inside the cooling box (71); a connecting frame (76) is sleeved on the surface of the cooling pipe (74); and the other end of the cooling pipe (74) is fixedly connected to a spray head (77).

2. The high thermal conductivity silicon nitride ceramic substrate cutting mechanism according to claim 1, characterized in that: The cleaning assembly (8) comprises a first fixing frame (81) and a second fixing frame (82) respectively arranged on the two side surfaces of the cutter disc (2); the surfaces of the first fixing frame (81) and the second fixing frame (82) are both provided with threaded holes (83); the inner part of the threaded hole (83) is threadedly connected with a bolt (84); the other end of the bolt (84) is threadedly connected with a nut (85); a connecting block (86) is fixedly connected to one end of the bottom of the first fixing frame (81); cleaning brushes (87) are fixedly connected to the inner ring surfaces of the first fixing frame (81) and the second fixing frame (82); a connecting groove (88) is provided on the bottom surface of the second fixing frame (82); and a connecting hole (89) is provided on the surface of the cutter disc (2).

3. The high thermal conductivity silicon nitride ceramic substrate cutting mechanism according to claim 1, characterized in that: The cutter disc (2) is located at the front side of the frame (1); one end of the cutter disc (2) is located inside the frame (1) and is connected to the drive system (5).

4. The high thermal conductivity silicon nitride ceramic substrate cutting mechanism according to claim 1, characterized in that: The cooling box (71) is filled with cooling liquid, and the water outlet of the micro water pump (75) is fixedly connected to one end of the cooling pipe (74).

5. The high thermal conductivity silicon nitride ceramic substrate cutting mechanism according to claim 1, characterized in that: The other end of the connecting frame (76) is fixedly connected to the surface of the frame (1), and the spray heads (77) are symmetrically arranged on both sides of the cutter disc (2).

6. The high thermal conductivity silicon nitride ceramic substrate cutting mechanism according to claim 2, characterized in that: The first fixing frame (81) and the second fixing frame (82) are in an arc shape, and the bolt (84) is threadedly connected inside the threaded hole (83).

7. The high thermal conductivity silicon nitride ceramic substrate cutting mechanism according to claim 2, characterized in that: The connection block (86) is slidably connected inside the connection groove (88), and the bolt (84) is threadedly connected to the connection hole (89).

8. The high thermal conductivity silicon nitride ceramic substrate cutting mechanism according to claim 2, characterized in that: The cleaning brush (87) is a flexible water-absorbent brush, and one end of the cleaning brush (87) is in contact with the surface of the cutting knife (3).