SiC slide glass disc

Abstract

The utility model provides a SiC slide glass disc which comprises a slide glass disc body, the upper surface of the slide glass disc body is recessed to form a plurality of slide glass grooves, one side of each slide glass groove close to the center of the slide glass disc body is provided with a flat edge, the side of each slide glass groove provided with the flat edge is provided with a plurality of support columns used for abutting against wafers, and a slide glass table used for bearing the wafers is arranged in each slide glass groove. A first rotating assembly is fixedly connected to the slide holder, the SiC slide tray further comprises a second rotating assembly located on the edge of the slide tray body, the first rotating assembly and the second rotating assembly are connected through a transmission mechanism, and the second rotating assembly is rotated so that the transmission mechanism can drive the first rotating assembly to rotate together with the slide holder in a limited mode. According to the utility model, a gap can be reserved between the wafer and the wafer carrying groove, so that the wafer is prevented from being cracked due to thermal expansion; the transmission mechanism drives the first rotating assembly to rotate, so that the slide holder is inclined, and the height of the outer edge of the slide holder is changed to cope with the deposition reflection mapping principle.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chip production and manufacturing, in particular to a SiC chip carrier plate. Background Art

[0002] During the PECVD coating process, a SiC (high temperature resistant) wafer carrier is required to transport the wafers into the machine chamber for operation.

[0003] Conventional SiC carriers have the following defects, as shown in the following figure:

[0004] 1. When there is a gap at the edge of the current SiC carrier, the edge film thickness is relatively large due to the deposition reaction mapping principle, but if there is no gap, the source will expand and crack due to heat;

[0005] 2. It is necessary to manually use a suction pen to pick up the film and place it on the carrier. This operation requires high production skills. Utility Model Content

[0006] In view of the deficiencies in the prior art, the utility model aims to provide a SiC wafer carrier, aiming to solve the problem that when there is a gap at the edge of the current SiC wafer carrier in the prior art, due to the deposition reaction mapping principle, the edge film thickness is relatively large, but if there is no gap, the wafer source will expand and crack due to heat; it is necessary to manually use a suction pen to pick up the wafer source and place it on the carrier, and the operation requires high technical problems in production techniques.

[0007] In order to achieve the above purpose, the utility model is implemented through the following technical solutions:

[0008] A SiC wafer carrier, comprising a wafer carrier body, the upper surface of the wafer carrier body being recessed to form a plurality of wafer carrier slots, the wafer carrier slots having a flat edge on one side close to the center of the wafer carrier body, a plurality of support columns for abutting against wafers being arranged on the side of the wafer carrier slots having a flat edge, a wafer carrier table for carrying the wafers being arranged in the wafer carrier slots, a first rotating assembly being fixedly connected to the wafer carrier table, the SiC wafer carrier also comprising a second rotating assembly located at the edge of the wafer carrier body, the first rotating assembly and the second rotating assembly being connected by a transmission mechanism, the second rotating assembly being rotated so that the transmission mechanism drives the first rotating assembly together with the wafer carrier table to rotate limitedly.

[0009] According to one aspect of the above technical solution, the first rotating assembly includes a fixed block fixedly connected to the flat edge of the wafer carrier, and a first rotating shaft fixedly connected to the fixed block, and the first rotating shaft is rotatably connected to the inside of the wafer carrier body.

[0010] According to one aspect of the above technical solution, the second rotating assembly includes a second rotating shaft and a missing gear located on the second rotating shaft. The edge of the wafer carrier body is provided with a placement groove, and the second rotating shaft is located in the placement groove.

[0011] According to one aspect of the above technical solution, the transmission mechanism includes a third rotating shaft located inside the wafer carrier body, an intermediate gear located on the third rotating shaft, and a synchronous belt structure connecting the first rotating shaft and the third rotating shaft, and the intermediate gear is meshed with the missing gear.

[0012] According to one aspect of the above technical solution, a locking assembly is also fixedly connected to the second rotating shaft, and the locking assembly is located at the axis of the second rotating shaft. The locking assembly includes a locking structure located at either end of the second rotating shaft, and an elastic member connecting the locking structure and the second rotating shaft. A locking groove is provided in the placement groove corresponding to the shape of the locking structure, and the locking structure is located in the locking groove to stop the second rotating shaft from rotating.

[0013] According to one aspect of the above technical solution, a lever is fixedly connected to the locking structure, and the lever is pulled to move the locking structure along the axial direction of the second rotating shaft.

[0014] According to one aspect of the above technical solution, a bearing seat is provided on the second rotating shaft, and the bearing seat is fixedly connected to the wafer carrier body.

[0015] According to one aspect of the above technical solution, a scale mark is provided on the second rotating shaft, and the scale mark is used to reflect the rotation angle of the carrier stage.

[0016] Compared with the prior art, the beneficial effects of the utility model are:

[0017] By arranging a flat edge on one side of the wafer carrier slot close to the center of the wafer carrier plate body, and arranging a plurality of support columns for abutting against the wafer on one side of the wafer carrier slot having the flat edge, it is only necessary to place the wafer in the wafer carrier slot, and clamp the wafer by the side wall of the wafer carrier slot and the support columns together, without having to place the wafer seamlessly into the wafer carrier slot that is consistent with the size of the wafer, and while not affecting the fixing effect of the wafer, a gap can be left between the wafer and the wafer carrier slot to prevent the wafer from cracking due to thermal expansion;

[0018] At the same time, a wafer stage for carrying the wafer is arranged in the wafer slot, and the second rotating assembly is rotated to drive the first rotating assembly to rotate through the transmission mechanism, so that the wafer stage is tilted, so that the outer edge of the wafer stage can change the height, so as to cope with the deposition reflection mapping principle and prevent the edge film thickness of the wafer from being too large;

[0019] When loading the wafer, the second rotating component is also rotated to drive the first rotating component to rotate through the transmission mechanism, so that the wafer stage is parallel to the horizontal plane, which facilitates wafer loading and prevents the wafer from sliding along the inclined surface of the wafer stage when the wafer stage is in a tilted state. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the structure of the SiC wafer carrier in the embodiment of the utility model;

[0021] Figure 2 for Figure 1 A schematic diagram of the structure at the placement slot;

[0022] Figure 3 It is a schematic structural diagram of the first rotating assembly, the second rotating assembly and the transmission mechanism in the embodiment of the utility model at a first viewing angle;

[0023] Figure 4 It is a schematic structural diagram of the first rotating assembly, the second rotating assembly and the transmission mechanism in the embodiment of the utility model at a second viewing angle;

[0024] Description of main component symbols:

[0025] Carrier plate body 10 Slide holder 20 Flat Edge 21 Slide stage 30 Support column 40 Placement slot 50 The second rotating component 70 Locking slot 51 First rotation axis 61 Fixed block 62 Second rotation axis 71 Missing gear 72 Scale mark 73 Locking structure 74 Elastic parts 75 Lever 76 Bearing seat 77 The third rotation axis 81 Intermediate gear 82 Synchronous belt structure 83

[0026] The following specific implementation manner will further illustrate the present utility model in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0027] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0028] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0030] See also Figures 1 to 4 , shown is a SiC wafer carrier in an embodiment of the utility model, including a wafer carrier body 10, the upper surface of the wafer carrier body 10 is recessed to form a plurality of wafer carrier grooves 20, the wafer carrier groove 20 has a flat edge 21 on a side close to the center of the wafer carrier body 10, and a plurality of support columns 40 for abutting against the wafer are provided on the side of the wafer carrier groove 20 having the flat edge 21, a wafer carrier table 30 for carrying the wafer is provided in the wafer carrier groove 20, a first rotating component is fixedly connected to the wafer carrier table 30, the SiC wafer carrier also includes a second rotating component 70 located at the edge of the wafer carrier body 10, the first rotating component and the second rotating component 70 are connected by a transmission mechanism, and the second rotating component 70 is rotated so that the transmission mechanism drives the first rotating component together with the wafer carrier table 30 to rotate limitedly.

[0031] Specifically, in this embodiment, the overall specification of the wafer carrier plate body 10 is expanded from a 6-inch plate in the prior art to an 8-inch plate. (The 8-inch periphery exceeds the machine reaction area but is actually still in the discharge reaction, and there is no obvious difference in the edge ion concentration). There are four wafer carrier slots 20 arranged in an array on the upper surface of the wafer carrier plate body 10, and the support pillars 40 corresponding to each wafer carrier slot 20 enclose a rectangle.

[0032] It can be understood that the utility model provides a flat edge 21 on one side of the wafer carrier slot 20 close to the center of the wafer carrier plate body 10, and provides a plurality of support columns 40 for abutting against the wafer on one side of the wafer carrier slot 20 having the flat edge 21. It is only necessary to place the wafer in the wafer carrier slot 20 and clamp the wafer together with the side wall of the wafer carrier slot 20 and the support columns 40. It is not necessary to place the wafer seamlessly into the wafer carrier slot 20 that is consistent with the size of the wafer. While not affecting the fixing effect of the wafer, a gap can be left between the wafer and the wafer carrier slot 20 to prevent the wafer from being thermally expanded and causing cracking.

[0033] At the same time, a wafer stage 30 for carrying the wafer is arranged in the wafer carrier slot 20, and the wafer stage 30 is tilted by rotating the second rotating assembly 70 and driving the first rotating assembly to rotate through the transmission mechanism, so that the outer edge of the wafer stage 30 can change the height to cope with the deposition reflection mapping principle and prevent the edge film thickness of the wafer from being too large;

[0034] When loading the wafer, the second rotating component 70 is also rotated to drive the first rotating component to rotate through the transmission mechanism, so that the wafer stage 30 is parallel to the horizontal plane, which facilitates wafer loading and prevents the wafer from sliding along the inclined surface of the wafer stage 30 when the wafer stage 30 is in an inclined state for loading.

[0035] Specifically, the first rotating assembly includes a fixed block 62 fixedly connected to the flat edge 21 of the wafer carrier 30 , and a first rotating shaft 61 fixedly connected to the fixed block 62 , and the first rotating shaft 61 is rotatably connected to the inside of the wafer carrier body 10 .

[0036] It can be understood that the wafer carrier body 10 includes a surface layer and an inner layer, and the fixed block 62 and the first rotating shaft 61 are both located in the inner layer. The rotation of the first rotating shaft 61 will drive the fixed block 62 together with the wafer stage 30 to rotate around the first rotating shaft 61. It should be noted that a corresponding arc for the wafer stage 30 to rotate is provided in the wafer slot 20, so that the wafer stage 30 can rotate close to the wafer slot 20.

[0037] Specifically, the second rotating assembly 70 includes a second rotating shaft 71 and a missing gear 72 located on the second rotating shaft 71. The edge of the wafer carrier body 10 is provided with a placement groove 50, and the second rotating shaft 71 is located in the placement groove 50; the transmission mechanism includes a third rotating shaft 81 located inside the wafer carrier body 10, an intermediate gear 82 located on the third rotating shaft 81, and a synchronous belt structure 83 connecting the first rotating shaft 61 and the third rotating shaft 81, and the intermediate gear 82 is meshed with the missing gear 72.

[0038] It can be understood that when the tilt angle of the wafer stage 30 needs to be adjusted, the second rotating shaft 71 is rotated to drive the missing gear 72 thereon to rotate, and the rotation of the missing gear 72 drives the intermediate gear 82 together with the third rotating shaft 81 to rotate. The rotation of the third rotating shaft 81 drives the first rotating shaft 61 to rotate through the synchronous belt structure 83, thereby causing the wafer stage 30 to tilt at a certain angle. This design structure allows the operator to more conveniently adjust the tilt angle of the wafer stage 30.

[0039] Preferably, a scale mark 73 is provided on the second rotating shaft 71 , and the scale mark 73 is used to reflect the rotation angle of the carrier stage 30 .

[0040] It can be understood that, through the scale mark 73 on the second rotating shaft 71, the inclination angle of the wafer stage 30 at this time can be known, and the inclination of the wafer stage 30 can be adjusted more accurately.

[0041] Specifically, a locking assembly is also fixedly connected to the second rotating shaft 71, and the locking assembly is located at the axis of the second rotating shaft 71. The locking assembly includes a locking structure 74 located at either end of the second rotating shaft 71, and an elastic member 75 connecting the locking structure 74 and the second rotating shaft 71. A locking groove 51 is provided in the placement groove 50 corresponding to the shape of the locking structure 74, and the locking structure 74 is located in the locking groove 51 to stop the second rotating shaft 71 from rotating.

[0042] It can be understood that since the wafer stage 30 and the wafer have weight, a locking assembly needs to be provided at the second rotating shaft 71 to limit the resetting of the wafer stage 30. The specific operation is that before the inclination of the wafer stage 30 needs to be adjusted, the locking structure 74 is pulled in the direction of the second rotating shaft 71 to compress the elastic member 75, and then the second rotating shaft 71 and the locking structure 74 are rotated together. When the wafer stage 30 reaches the target position, the locking structure 74 is released and the locking structure 74 is inserted into the locking groove 51. When the locking structure 74 is located in the locking groove 51, the elastic member 75 is still in a compressed state, thereby limiting the rotation of the locking structure 74. The locking structure 74 cannot rotate, so that the second rotating shaft 71 cannot rotate either. Preferably, a friction leather can also be provided on the locking structure 74 to increase the friction between the locking structure 74 and the locking groove 51, thereby further limiting the rotation of the locking structure 74.

[0043] Furthermore, a lever 76 is fixedly connected to the locking structure 74 , and the locking structure 74 is moved along the axial direction of the second rotating shaft 71 by pulling the lever 76 .

[0044] It can be understood that the locking structure 74 can be driven to move more conveniently by the lever 76 .

[0045] Furthermore, a bearing seat 77 is provided on the second rotating shaft 71 , and the bearing seat 77 is fixedly connected to the wafer carrier body 10 .

[0046] It can be understood that the bearing seat 77 is connected to the carrier plate body 10, and then the second rotating shaft 71 is arranged in the bearing seat 77, so that the second rotating shaft 71 rotates on the bearing seat 77.

[0047] In summary, the SiC wafer carrier in the above embodiment of the utility model, by providing a flat edge on one side of the wafer carrier slot close to the center of the wafer carrier plate body, and providing a plurality of support columns for abutting against the wafer on the side of the wafer carrier slot with the flat edge, only needs to place the wafer in the wafer carrier slot, and clamp the wafer by the side wall of the wafer carrier slot and the support columns, without having to seamlessly place the wafer in the wafer carrier slot that is consistent with the size of the wafer, while not affecting the wafer fixing effect, a gap can be left between the wafer and the wafer carrier slot to prevent the wafer from cracking due to thermal expansion;

[0048] At the same time, a wafer stage for carrying the wafer is arranged in the wafer slot, and the second rotating assembly is rotated to drive the first rotating assembly to rotate through the transmission mechanism, so that the wafer stage is tilted, so that the outer edge of the wafer stage can change the height, so as to cope with the deposition reflection mapping principle and prevent the edge film thickness of the wafer from being too large;

[0049] When loading the wafer, the second rotating component is also rotated to drive the first rotating component to rotate through the transmission mechanism, so that the wafer stage is parallel to the horizontal plane, which facilitates wafer loading and prevents the wafer from sliding along the inclined surface of the wafer stage when the wafer stage is in a tilted state.

[0050] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0051] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A SiC wafer carrier, characterized in that: It includes a wafer carrier plate body, the upper surface of which is recessed to form a plurality of wafer carrier grooves, the wafer carrier grooves having a flat edge on one side close to the center of the wafer carrier plate body, a plurality of support columns for abutting against wafers are arranged on the side of the wafer carrier grooves having a flat edge, a wafer carrier table for carrying the wafers is arranged in the wafer carrier grooves, a first rotating component is fixedly connected to the wafer carrier table, the SiC wafer carrier plate also includes a second rotating component located at the edge of the wafer carrier plate body, the first rotating component and the second rotating component are connected by a transmission mechanism, and the second rotating component is rotated so that the transmission mechanism drives the first rotating component and the wafer carrier table to rotate limitedly.

2. The SiC wafer carrier according to claim 1, characterized in that: The first rotating assembly includes a fixed block fixedly connected to the flat edge of the wafer carrier, and a first rotating shaft fixedly connected to the fixed block, and the first rotating shaft is rotatably connected to the inside of the wafer carrier body.

3. The SiC wafer carrier according to claim 2, characterized in that: The second rotating assembly includes a second rotating shaft and a missing gear located on the second rotating shaft. The edge of the wafer carrier body is provided with a placement groove, and the second rotating shaft is located in the placement groove.

4. The SiC wafer carrier according to claim 3, characterized in that: The transmission mechanism includes a third rotating shaft located inside the wafer carrier body, an intermediate gear located on the third rotating shaft, and a synchronous belt structure connecting the first rotating shaft and the third rotating shaft, and the intermediate gear is meshed with the missing gear.

5. The SiC wafer carrier according to claim 3, characterized in that: A locking assembly is also fixedly connected to the second rotating shaft, and the locking assembly is located at the axis of the second rotating shaft. The locking assembly includes a locking structure located at either end of the second rotating shaft, and an elastic member connecting the locking structure and the second rotating shaft. A locking groove is provided in the placement groove corresponding to the shape of the locking structure, and the locking structure is located in the locking groove to stop the second rotating shaft from rotating.

6. The SiC carrier plate according to claim 5, characterized in that: The locking structure is fixedly connected with a lever, and the locking structure is moved along the axial direction of the second rotating shaft by pulling the lever.

7. The SiC wafer carrier according to claim 3, characterized in that: A bearing seat is provided on the second rotating shaft, and the bearing seat is fixedly connected to the wafer carrier body.

8. The SiC wafer carrier according to claim 3, characterized in that: The second rotating shaft is provided with a scale mark, and the scale mark is used to reflect the rotation angle of the carrier stage.

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