Auxiliary heat dissipation device for computer

Abstract

The utility model relates to the technical field of computer-aided heat dissipation, and specifically is an auxiliary heat dissipation device for computers, comprising: a support plate, wherein the bottom of the support plate is fixedly connected with two support blocks in number and symmetrically distributed, and the top of the support plate is provided with a ventilation slot; a heat dissipation component, wherein the heat dissipation component is arranged between the two support blocks; wherein the heat dissipation component comprises a mounting shell slidably connected between the two support plates; the mutual cooperation between the support plate and the support blocks can realize the placement of computer cases of different types, the position of the heat dissipation component can be adjusted through a sliding rod, and the heat dissipation holes opened at the bottom of different computer cases can be adapted, and the airflow after active cooling can be introduced into the interior of the case through the mutual cooperation of semiconductor cooling sheets, fans, condensing sheets, air inlet holes, through holes, air inlet holes and ventilation slots, thereby achieving a good heat dissipation effect inside the case and providing a good working environment for components inside the case.

Description

Technical Field

[0001] The utility model relates to the technical field of computer-assisted heat dissipation, in particular to an auxiliary heat dissipation device for a computer. Background Art

[0002] The computer case is a part of computer accessories. Its main function is to place and fix various computer accessories, and play a supporting and protective role. When the computer is in use, it often freezes and freezes due to excessive temperature, which brings great inconvenience to people. Therefore, the heat dissipation problem of the case has always been an important issue that computer users are more concerned about.

[0003] After searching, a Chinese patent discloses an auxiliary heat dissipation device for computers (publication number CN215576515U). This patented technology divides a through hole into an air inlet and an air outlet, and connects the two through an air flow channel. The air flow flows along the air flow channel to take away the high temperature on the inner wall surface of the installation box, thereby improving the heat dissipation effect. However, the computer chassis range that the device is compatible with is relatively small. Therefore, a person skilled in the art provides an auxiliary heat dissipation device for computers to solve the problems raised in the above background technology. Utility Model Content

[0004] The purpose of the utility model is to provide an auxiliary heat dissipation device for a computer in order to solve the above problems, thereby improving the problem that the computer chassis range of the existing structure is small.

[0005] The utility model achieves the above-mentioned purpose through the following technical scheme, an auxiliary heat dissipation device for a computer, comprising: a support plate, the bottom of the support plate is fixedly connected with two symmetrically distributed support blocks, and the top of the support plate is provided with a ventilation slot; a heat dissipation component, the heat dissipation component is arranged between the two support blocks; wherein the heat dissipation component includes a mounting shell slidably connected between the two support plates, a sliding rod is arranged on one side of the mounting shell, the other end of the sliding rod passes through the adjacent support block, and a baffle is embedded in the mounting shell.

[0006] Preferably, the inner bottom wall of the mounting shell is provided with a semiconductor cooling fin, the hot surface of the semiconductor cooling fin is fixedly connected with evenly distributed heat dissipation blocks, and the other end of the heat dissipation block passes through the mounting shell.

[0007] Preferably, the cold surface of the semiconductor refrigeration plate is fixedly connected with condensing plates which are evenly distributed and located below the baffle, a cooling cavity is formed between two of the condensing plates, and the surface of the mounting shell is provided with air inlet holes which are connected with adjacent cooling cavities.

[0008] Preferably, two groups of through holes are opened on the surface of the condensing plate, the two groups of through holes are symmetrically distributed, and the number of through holes in each group is not less than three.

[0009] Preferably, a mounting box is embedded in the surface of the baffle, the top surface of the mounting box is flush with the top surface of the baffle, and evenly distributed exhaust slots are provided on the top of the mounting box.

[0010] Preferably, a fan is arranged inside the installation box, and evenly distributed air inlet holes are opened on both sides of the installation box.

[0011] Preferably, the opening height of the air inlet hole is lower than the setting height of the fan, and the installation box is connected to the adjacent cooling cavity through the air inlet hole.

[0012] The beneficial effects of the utility model are as follows: the mutual cooperation of the support plate and the support block can realize the placement of computer cases of different types, the position of the heat dissipation component can be adjusted through the sliding rod, and the heat dissipation holes opened on the bottom of different chassis can be adapted, and the airflow after active cooling can be introduced into the interior of the chassis through the mutual cooperation of the semiconductor cooling plate, the fan, the condensing plate, the air inlet hole, the through hole, the air inlet hole and the ventilation slot, so as to achieve a good heat dissipation effect inside the chassis and provide a good working environment for the internal devices of the chassis. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a structural schematic diagram of the utility model;

[0014] Figure 2 This is a schematic diagram of the connection between the chassis and the support plate of the utility model;

[0015] Figure 3 It is a partial cross-sectional schematic diagram of the utility model;

[0016] Figure 4 It is a structural schematic diagram of the heat dissipation component of the utility model.

[0017] In the figure: 1. support plate; 101. support block; 102. ventilation slot; 2. heat dissipation assembly; 201. mounting shell; 202. baffle; 203. semiconductor cooling plate; 204. heat dissipation block; 205. condensing plate; 206. sliding rod; 207. through hole; 208. mounting box; 209. fan; 210. air inlet. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] When implementing: Figure 1-4 As shown, an auxiliary heat dissipation device for a computer comprises: a support plate 1, the bottom of the support plate 1 is fixedly connected with two support blocks 101 which are symmetrically distributed, and the top of the support plate 1 is provided with a ventilation slot 102; a heat dissipation component 2, the heat dissipation component 2 is arranged between the two support blocks 101; wherein the heat dissipation component 2 comprises a mounting shell 201 which is slidably connected between the two support plates 1, a slide bar 206 is arranged on one side of the mounting shell 201, the other end of the slide bar 206 passes through the adjacent support block 101, and a baffle 202 is embedded and installed in the mounting shell 201;

[0020] The computer case is placed above the support plate 1. The setting of the support block 101 can increase the space between the bottom of the computer case and the ground, increase the area of ​​air flow, and thus improve the heat dissipation effect. The position of the mounting shell 201 can be adjusted by the slide bar 206, and the position of the heat dissipation component 2 can be adjusted according to the position of the heat dissipation holes at the bottom of different cases to adapt it to the case, so as to improve the heat dissipation and cooling effect inside the computer case.

[0021] like Figure 1 , Figure 3 and Figure 4 As shown, the inner bottom wall of the mounting shell 201 is provided with a semiconductor cooling sheet 203, the hot surface of the semiconductor cooling sheet 203 is fixedly connected with evenly distributed heat sinks 204, the other end of the heat sink 204 passes through the mounting shell 201, the cold surface of the semiconductor cooling sheet 203 is fixedly connected with evenly distributed condensing sheets 205 located below the baffle 202, a cooling cavity is formed between the two condensing sheets 205, the surface of the mounting shell 201 is provided with air inlet holes connected with adjacent cooling cavities, the surface of the condensing sheet 205 is provided with two groups of through holes 207, the two groups of through holes 207 are symmetrically distributed, and the number of through holes 207 in each group is not less than three.

[0022] By starting the semiconductor cooling sheet 203, the airflow introduced into the cooling chamber through the air inlet hole can be cooled by the condensing sheet 205, and the heat generated by the hot surface of the semiconductor cooling sheet 203 can be dissipated to the outside through the heat dissipation block 204;

[0023] like Figure 1 , Figure 3 and Figure 4As shown, a mounting box 208 is embedded and installed on the surface of the baffle 202, the top surface of the mounting box 208 is flush with the top surface of the baffle 202, and evenly distributed exhaust slots are opened on the top of the mounting box 208, a fan 209 is arranged inside the mounting box 208, and evenly distributed air inlet holes 210 are opened on both sides of the mounting box 208, the opening height of the air inlet holes 210 is lower than the setting height of the fan 209, and the mounting box 208 is connected to the adjacent cooling cavity through the air inlet holes 210;

[0024] By starting the fan 209, the air flow can be introduced into the interior of the placed chassis through the exhaust slots and the ventilation slots 102, thereby improving the heat dissipation effect. At the same time, due to the connection between the air inlet hole 210 and the cooling chamber, the external air flow can be actively guided through the air inlet hole into the interior of the cooling chamber under the action of the fan 209, and pass through multiple cooling chambers in turn under the action of the through hole 207 until it is introduced into the interior of the installation box 208 through the air inlet hole 210. In this process, the contact time between the air flow and the condensation sheet 205 can be increased, thereby improving the cooling effect.

[0025] When the utility model is in use, the computer case is placed above the support plate 1. The setting of the support block 101 can increase the space between the bottom of the computer case and the ground, increase the area of ​​air flow, and thus improve the heat dissipation effect. The position of the mounting shell 201 can be adjusted by the slide bar 206, and the position of the heat dissipation component 2 can be adjusted according to the position of the heat dissipation holes at the bottom of different cases to adapt it to the case, so as to improve the heat dissipation and cooling effect inside the computer case. By starting the fan 209, the airflow can be introduced into the placed case through the exhaust slots and the ventilation slots 102, thereby improving the heat dissipation effect. At the same time, due to the connection between the air inlet hole 210 and the cooling cavity, the external airflow can be actively guided through the air inlet hole into the interior of the cooling cavity under the action of the fan 209, and pass through multiple cooling cavities in turn under the action of the through hole 207 until it is introduced into the interior of the mounting box 208 through the air inlet hole 210. In this process, the contact time between the airflow and the condensing sheet 205 can be increased, thereby improving the cooling effect.

[0026] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. An auxiliary heat dissipation device for a computer, characterized in that: include: A support plate (1), wherein two symmetrically distributed support blocks (101) are fixedly connected to the bottom of the support plate (1), and a ventilation slot (102) is provided on the top of the support plate (1); A heat dissipation component (2), the heat dissipation component (2) being arranged between the two support blocks (101); The heat dissipation assembly (2) comprises a mounting shell (201) slidably connected between the two support plates (1); a sliding rod (206) is provided on one side of the mounting shell (201); the other end of the sliding rod (206) passes through the adjacent support block (101); and a baffle (202) is embedded in the mounting shell (201).

2. The auxiliary heat dissipation device for a computer according to claim 1, characterized in that: The inner bottom wall of the installation shell (201) is provided with a semiconductor cooling plate (203), the hot surface of the semiconductor cooling plate (203) is fixedly connected with evenly distributed heat dissipation blocks (204), and the other end of the heat dissipation block (204) passes through the installation shell (201).

3. The auxiliary heat dissipation device for a computer according to claim 2, characterized in that: The cold surface of the semiconductor cooling plate (203) is fixedly connected to condensing plates (205) which are evenly distributed and located below the baffle (202), a cooling cavity is formed between the two condensing plates (205), and the surface of the mounting shell (201) is provided with an air inlet hole which is connected to the adjacent cooling cavity.

4. The auxiliary heat dissipation device for a computer according to claim 3, characterized in that: The surface of the condensing sheet (205) is provided with two groups of through holes (207), the two groups of through holes (207) are symmetrically distributed, and the number of through holes (207) in each group is not less than three.

5. The auxiliary heat dissipation device for a computer according to claim 4, characterized in that: A mounting box (208) is embedded and mounted on the surface of the baffle (202); the top surface of the mounting box (208) is flush with the top surface of the baffle (202), and evenly distributed exhaust slots are provided on the top of the mounting box (208).

6. The auxiliary heat dissipation device for a computer according to claim 5, characterized in that: A fan (209) is disposed inside the installation box (208), and evenly distributed air inlet holes (210) are provided on both sides of the installation box (208).

7. The auxiliary heat dissipation device for a computer according to claim 6, characterized in that: The opening height of the air inlet hole (210) is lower than the setting height of the fan (209), and the installation box (208) is connected to the adjacent cooling cavity through the air inlet hole (210).

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