Wafer conveying device and film forming equipment

Abstract

The utility model discloses a wafer conveying device and film forming equipment, and the wafer conveying device comprises a conveying arm, the head end of which is used for supporting a wafer tray. And the mechanical arm is connected with the tail end of the conveying arm and is used for driving the conveying arm to move so as to convey the wafer tray. And the dustproof cover is arranged above the conveying arm so as to prevent the impurity particles from falling on the wafer. One end of the dust cover is fixed to the conveying wall through the supporting part, and the supporting part is arranged close to the tail end of the conveying arm. When the wafer conveying device is used for conveying wafers, if impurity particles on the valve can fall off, the impurity particles can fall on the dustproof cover, the probability that the impurity particles fall on the wafers is reduced, and the yield of the wafers is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, in particular to a wafer conveying device and a film forming device. Background Art

[0002] When performing deposition processing on a wafer, it is generally necessary to first place the wafer in a tray, and then place the entire tray into a film forming device, such as a vapor deposition device, to perform deposition processing on the wafer; after the deposition processing is completed, the entire tray must be removed from the vapor deposition device, and then the wafer must be removed from the tray and stored. The process of transferring the entire tray to or from the vapor deposition device includes: opening the valve on the film forming device, opening the film transfer port of the film forming device, transferring the entire tray to the film forming device through the film transfer port, or taking the tray out of the film forming device through the film transfer port. Since the position of the valve is prone to the formation of deposits (coating), when the tray with the wafer passes through this valve, impurity particles (particles) will fall on the wafer, affecting the yield rate of the wafer. Utility Model Content

[0003] The utility model aims to provide a wafer conveying device and a film forming device to solve the problem that during the wafer conveying process, foreign particles on the valve will fall onto the wafer surface and affect the yield rate of the wafer.

[0004] In order to solve the above problems, the utility model is implemented through the following technical solutions:

[0005] A wafer conveying device comprises: a conveying arm, the head end of which is used to hold up a wafer tray; a mechanical arm connected to the end of the conveying arm and used to drive the conveying arm to move so as to convey the wafer tray; a dust cover arranged above the conveying arm to prevent foreign particles from falling on the wafer; and a support part, one end of the dust cover is fixed to the conveying arm through the support part, and the support part is arranged near the end of the conveying arm.

[0006] Optionally, the conveying arm includes a fork tine and a connecting plate; one end of the connecting plate is connected to the fork tine, and the other end is connected to the robot arm. The fork tine is used to hold up the wafer tray. One end of the dust cover is fixed to the fork tine through the supporting part, and the supporting part is arranged close to the connecting plate.

[0007] Optionally, the fork teeth include a base fixed to the connecting plate, and fingers extending from both sides of the base away from the connecting plate. The base and the two fingers form a limiting cavity of the wafer tray, and the two fingers are used to clamp and support the wafer tray.

[0008] Optionally, it also includes: a fixing member for fixing the support portion to the fork tine.

[0009] Optionally, support platforms are provided below both sides of the dust cover away from one end of the conveying arm, and the support platforms are fixed to the finger portion to maintain the height of the wafer tray placement space between the dust cover and the finger portion.

[0010] Optionally, the support portion is located on the base and is arranged close to one side edge of the limiting cavity.

[0011] Optionally, the support portion is integrated with the dust cover.

[0012] Optionally, the dust cover is made of ceramic or quartz.

[0013] Optionally, the support platform extends in the length direction of the finger portion, so that the length of the support platform parallel to the length direction is greater than the length perpendicular to the length direction.

[0014] Optionally, the support platform extends to the support portion to form a semi-closed support structure.

[0015] Optionally, a shielding portion is downwardly extended from one end of the dust cover away from the supporting portion, and an extending distance of the shielding portion does not exceed a vertical distance between the finger portion and the dust cover.

[0016] Optionally, the dust cover has a thickness of 0.5 mm to 1.5 mm.

[0017] Optionally, the edge of the dust cover is flush with the outer edge of the finger and the wafer tray.

[0018] Optionally, a recess is provided on a side of the base close to the finger.

[0019] Optionally, the support portion is configured to be prismatic or grid-shaped.

[0020] On the other hand, the utility model also provides a film forming equipment, including: a process chamber, a valve, and a wafer transfer chamber connected to the process chamber through the valve; a wafer conveying device as described above, which is arranged in the wafer transfer chamber and is used to take out the wafer tray in the process chamber, or to transfer the wafer tray in the wafer transfer chamber into the process chamber when the valve is opened.

[0021] The utility model has at least one of the following technical effects:

[0022] During the wafer transfer process, impurity particles on the valve will fall onto the dust cover, reducing the chance of falling onto the wafer and improving the wafer yield rate. This solves the problem in the prior art that impurity particles on the valve fall onto the wafer surface, contaminating the wafer and thus reducing the wafer yield rate.

[0023] The provision of the support portion can prevent the wafer conveying device from forming a gas passage along the extending direction of the conveying arm, thereby preventing the airflow carrying particulate matter from flowing into the conveying arm and causing contamination.

[0024] The arrangement of the support platform can maintain the height of the wafer tray placement space between the dust cover and the finger portion, making it easy to take and place the wafer.

[0025] The support part is arranged close to one side edge of the limiting cavity, thereby reducing the weight of the dust cover and the support part, increasing the service life of the wafer conveying device and the convenience of transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic diagram of the three-dimensional structure of a wafer conveying device provided in one embodiment of the utility model;

[0027] Figure 2 A front view of a wafer conveying device provided by an embodiment of the utility model;

[0028] Figure 3 A schematic diagram of the three-dimensional structure of a wafer conveying device provided by another embodiment of the utility model;

[0029] Figure 4 A schematic structural diagram of a film forming device provided in one embodiment of the utility model. DETAILED DESCRIPTION

[0030] The following is a further detailed description of a wafer conveying device and a film forming device proposed in the utility model in combination with the specific implementation methods. According to the following description, the advantages and features of the utility model will be clearer. It should be noted that the drawings are in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the implementation method of the utility model. In order to make the purpose, features and advantages of the utility model more obvious and easy to understand, please refer to the drawings. It should be noted that the structure, proportion, size, etc. illustrated in the drawings of this specification are only used to match the content disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the utility model, so it has no technical substantive significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effect that the utility model can produce and the purpose that can be achieved, should still fall within the scope of the technical content disclosed in the utility model.

[0031] like Figure 1 As shown, this embodiment provides a wafer conveying device, including: a conveying arm 100, the front end of which is used to hold up the wafer tray. Figure 1 ), which is connected to the end of the conveying arm 100 and is used to drive the conveying arm 100 to move to transfer the wafer tray.

[0032] The dust cover 200 is arranged above the conveying arm 100 to prevent foreign particles from falling on the wafer ( Figure 1 Although not shown in the figure, it is understandable that the wafer is placed on a wafer tray. A support portion 201, one end of the dust cover 200 is fixed to the conveying arm 100 through the support portion 201, and the support portion 201 is arranged near the end of the conveying arm 100.

[0033] Therefore, when the wafer conveying device of this embodiment is used for wafer conveying, if the foreign particles on the valve fall, they will fall on the dust cover, reducing the probability of falling on the wafer, thereby improving the wafer yield rate. In addition, the arrangement of the support portion 201 can prevent the wafer conveying device from forming a gas passage along the extension direction of the conveying arm 100, thereby preventing the airflow carrying particles from rushing into the gap between the conveying arm 100 and the dust cover 200 to cause wafer contamination.

[0034] Please continue to refer to Figure 1 As shown, in this embodiment, the conveying arm 100 includes a fork tine 110 and a connecting plate 120; one end of the connecting plate 120 is connected to the fork tine 110, and the other end is connected to the mechanical arm ( Figure 1 The fork tine 110 is used to hold up the wafer tray. One end of the dust cover 200 is fixed to the fork tine 110 through the support portion 201, and the support portion 201 is arranged close to the connecting plate 120. The dust cover 200 can cover most of the fork tine 110 and the entire wafer tray area, further reducing the probability of foreign particles falling onto the wafer.

[0035] Please continue to refer to Figure 1 As shown, in this embodiment, the fork 110 includes a base 102 that is fixed to the connecting plate 120, and fingers 101 extending from both sides of the base 102 away from the connecting plate 120. The base 102 and the two fingers 101 form a limiting cavity 103 of the wafer tray, and the two fingers 101 are used to clamp and support the wafer tray.

[0036] In this embodiment or some other embodiments, the edge of the dust cover 200 is flush with the outer edge of the finger 101 and the wafer tray, so that the dust cover 200 can ensure full coverage of the wafer tray area without occupying too much space, which is convenient for its transportation in various process chambers.

[0037] Please continue to refer to Figure 1 As shown, this embodiment further includes: a fixing member 202 for fixing the support portion 201 to the fork tine 110 .

[0038] The fixing member 202 may be two screws, which are arranged at intervals on the support portion 201 to fix the dust cover 200 on the fork tine 110. However, the present invention is not limited thereto, as long as the dust cover can be fixed and can adapt to the working environment.

[0039] Combination Figure 1 and Figure 2 As shown, support platforms 203 are provided below both sides of the dust cover 200 away from one end of the conveying arm 100 , and the support platforms 203 are fixed to the finger portion 101 to maintain a wafer tray placement space height H between the dust cover 200 and the finger portion 101 .

[0040] The support portion 201 and the two support platforms 203 form a stable triangular support point to support the dust cover 200 and define a space height H. The height of the support portion 201 and the height of the support platform 203 can be the same or different.

[0041] Preferably, there may be multiple support platforms 203 , which are respectively arranged on the corresponding fingers 101 , or may be arranged at intervals along the length direction of the fingers 101 to stably support the spatial height of the dust cover 200 that can fork the wafer tray.

[0042] Alternatively, please continue to refer to Figure 1 As shown, the support platform 203 extends in the length direction of the finger portion 101, so that the length of the support platform 203 parallel to the length direction is greater than the length perpendicular to the length direction.

[0043] Please continue to refer to Figure 1 As shown, in this embodiment or some other embodiments, the support platform 203 extends in the length direction of the finger portion 101, so that the length of the support platform 203 parallel to the length direction is greater than the length perpendicular to the length direction, so that the support platform supports the dust cover more stably.

[0044] In particular, the support platform 203 can be extended to the support portion 201 to form a semi-enclosed support structure. Thus, when the finger 101 carries the wafer tray, a narrow semi-airtight space is formed between the dust cover 200 and the wafer tray, with a relatively stable internal air pressure, making it difficult for the airflow along the length direction of the finger 101 to flow into the space, thereby reducing the possibility of particulate matter floating in the gas contaminating the wafer.

[0045] Please continue to refer to Figure 1 As shown, the support portion 201 is located on the base 102 and is disposed close to one side edge of the limiting cavity 103. This can reduce the area of ​​the dust cover 200, thereby reducing its weight, increasing the service life of the wafer conveying device and the convenience of transmission.

[0046] Please continue to refer to Figure 1 As shown, a concave portion 104 is provided on one side of the base 102 close to the finger portion 101. The provision of the concave portion 104 further reduces the weight of the fork tine 110 and reduces the transmission resistance.

[0047] Please continue to refer to Figure 1 As shown, the support portion 201 is configured in a prism or grid shape, thereby further reducing the weight of the dust cover 200, reducing the transmission resistance, and increasing the service life of the wafer conveying device.

[0048] In this embodiment or some other embodiments, the support portion 201 and the dust cover 200 are integrated into one.

[0049] In this embodiment or some other embodiments, the dust cover 200 is made of ceramic or quartz material. Preferably, the dust cover 200 is made of transparent quartz material, so that the transmission status of the wafer or wafer tray can be easily observed.

[0050] In this embodiment, the thickness of the dust cover 200 is 0.5 mm to 1.5 mm. Preferably, the thickness of the dust cover 200 is 1 mm. In this way, the rigidity of the dust cover 200 can be ensured and the weight of the dust cover 200 can be reduced as much as possible. Of course, if the dust cover 200 is made of different materials, the material properties can have different thicknesses under the technical guidance of taking into account both rigidity and weight reduction.

[0051] In this embodiment or some other embodiments, as Figure 3 As shown, the end of the dust cover 200 away from the support portion 201 extends downward with a shielding portion 204, and the shielding portion 204 extends no more than the vertical distance between the finger portion 101 and the dust cover 200. Thus, the film taking end of the dust cover 200 has a downward extending shielding portion 204 to shield and block the gas inflow port.

[0052] Preferably, please continue to refer to Figure 3 As shown, the shielding portion 204 is in an arc shape, and its arc length ranges between the two support platforms 203. Therefore, the wafer taking end of the dust cover 200 has a downward extending shielding portion 204 that is substantially consistent with the outline of the wafer tray to improve the effect of shielding and blocking the gas inflow port.

[0053] The arrangement of the shielding portion and the supporting portion can prevent a gas inlet from being formed from the upper front end of the wafer tray to the upper front end of the finger portion, thereby preventing an airflow carrying particles from rushing into the wafer tray and causing particle contamination.

[0054] On the other hand, Figure 4 As shown, the utility model also provides a film forming equipment, including: a process chamber 10, a valve 30, and a wafer transfer chamber 20 connected to the process chamber 10 through the valve 30; a wafer conveying device 40 as described above, which is arranged in the wafer transfer chamber 20, and when the valve 30 is opened, it is used to take out the wafer tray in the process chamber 10, or to transfer the wafer tray in the wafer transfer chamber 20 into the process chamber 10.

[0055] When the wafer conveying device of this embodiment is used for wafer conveying, if foreign particles on the valve 30 fall off, they will fall on the dust cover, reducing the probability of falling on the wafer and improving the yield rate of the wafer.

[0056] It can be understood that the conveying arm 100 of the present invention can directly pick up the wafer tray, or can pick up and place the wafer tray by picking up the tray ring 300. The tray ring 300 can be a subcomponent in the wafer conveying device, or can be an accessory of the wafer tray.

[0057] It should be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0058] In the description of the present invention, it should be understood that the terms "center", "height", "thickness", "up", "down", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0059] In the description of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0060] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0061] Although the content of the utility model has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the utility model. After reading the above content, various modifications and substitutions of the utility model will be obvious to those skilled in the art. Therefore, the protection scope of the utility model should be limited by the attached claims.

Claims

1. A wafer conveying device, characterized in that: include: A conveying arm, the front end of which is used to hold up the wafer tray; A mechanical arm connected to a distal end of the conveying arm and used to drive the conveying arm to move so as to transfer the wafer tray; A dust cover is arranged above the conveying arm to prevent foreign particles from falling on the wafer; A support portion, one end of the dust cover is fixed to the conveying arm through the support portion, and the support portion is arranged close to the end of the conveying arm.

2. The wafer conveying device according to claim 1, characterized in that: The conveying arm comprises fork teeth and a connecting plate; One end of the connecting plate is connected to the fork tine, and the other end is connected to the mechanical arm; The fork tines are used to hold up the wafer tray; One end of the dust cover is fixed on the fork tine through the supporting portion, and the supporting portion is arranged close to the connecting plate.

3. The wafer conveying device according to claim 2, characterized in that: The fork teeth include a base fixed with the connecting plate, and fingers extending from both sides of the base in a direction away from the connecting plate. The base and the two fingers form a limiting cavity of the wafer tray, and the two fingers are used to clamp and support the wafer tray.

4. The wafer conveying device according to claim 2, characterized in that: Also includes: A fixing member is used for fixing the support portion to the fork tine.

5. The wafer conveying device according to claim 3, characterized in that: Support platforms are arranged below both sides of the dust cover away from one end of the conveying arm, and the support platforms are fixed to the finger portion to maintain the height of the wafer tray placement space between the dust cover and the finger portion.

6. The wafer conveying device according to claim 3, characterized in that: The support portion is located on the base and is disposed close to an edge of one side of the limiting cavity.

7. The wafer conveying device according to claim 1, characterized in that: The support portion is integrated with the dust cover.

8. The wafer conveying device according to claim 1, characterized in that: The dust cover is made of ceramic or quartz.

9. The wafer conveying device according to claim 5, characterized in that: The support platform extends in the length direction of the finger portion, so that the length of the support platform parallel to the length direction is greater than the length of the support platform perpendicular to the length direction.

10. The wafer conveying device according to claim 9, characterized in that: The support platform extends to the support portion to form a semi-enclosed support structure.

11. The wafer conveying device according to claim 5, characterized in that: A shielding portion is downwardly extended from one end of the dust cover away from the supporting portion, and the shielding portion extends no further than a vertical distance between the finger portion and the dust cover.

12. The wafer conveying device according to claim 1, characterized in that: The thickness of the dust cover is 0.5 mm to 1.5 mm.

13. The wafer conveying device according to claim 3, characterized in that: The edges of the dust cover are flush with the outer edges of the fingers and the wafer tray.

14. The wafer conveying device according to claim 6, characterized in that: A concave portion is provided on a side of the base portion close to the finger portion.

15. The wafer conveying device according to claim 1, wherein: The support portion is configured in a prism shape or a grid shape.

16. A film forming device, characterized in that: include: A process chamber, a valve, and a film transmission chamber connected to the process chamber through the valve; The wafer conveying device as described in any one of claims 1 to 15 is arranged in the wafer transfer chamber, and when the valve is opened, it is used to take out the wafer tray in the process chamber, or to transfer the wafer tray in the wafer transfer chamber into the process chamber.

Images