A plating structure for ceramic circuit board
By directly portraying the electroplating pattern and filling the photoresist layer with a thickness greater than 400μm, the problem of difficult control of the dry film thickness during the electroplating process of ceramic circuit board is solved, and the electroplating efficiency and flatness of the dam shape are improved.
Patent Information
- Application Number
- CN202420246302.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-01
- Publication Date
- 2025-04-08
- Estimated Expiration
- 2034-02-01
AI Technical Summary
During the electroplating process of ceramic circuit boards, the dry film needs to be pressed multiple times to achieve the required thickness, resulting in low electroplating efficiency and uneven appearance of the dam.
Using an anti-plating plate with a thickness of more than 400μm, the electroplating pattern is directly portrayed on its surface, and the photoresist layer is filled in the glue groove of the anti-plating plate, eliminating the dry film production process and improving the electroplating efficiency and the flatness of the dam appearance.
By directly using anti-plating plates with a thickness greater than 400μm, multiple dry film pressing steps are eliminated, the electroplating efficiency of the ceramic circuit board is significantly improved, and the appearance of the finished electroplating layer dam is smoother.
Smart Images
Figure CN222736377U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of ceramic circuit boards, and in particular to an electroplating structure for ceramic circuit boards. Background Art
[0002] Ceramic circuit board, also known as ceramic circuit board, ceramic substrate or ceramic copper clad board, is a PCD board with the same electrical interconnection as a circuit board and good electrical performance formed after covering copper foil on a ceramic substrate, drilling, etching circuits, and surface treatment. It is used in various fields of various industries.
[0003] Ceramics are usually insulating materials, and electroplating can form a layer of more conductive metal on its surface to improve overall conductivity. Through electroplating, wires, connectors or other conductive components can be made on the surface of ceramics for the manufacture of electronic devices.
[0004] In the related art, before electroplating ceramics, it is necessary to prepare a dry film first. The dry film is a photosensitive adhesive film covering the surface of the ceramic substrate, which usually contains a photosensitizer for photolithography. In the process of preparing the dry film, it is necessary to apply a photosensitive adhesive and perform an exposure and development step to form the desired photosensitive pattern.
[0005] When electroplating a ceramic circuit board, a dry film needs to be covered on the ceramic substrate. The dry film covers the ceramic substrate and resists plating, while the uncovered areas form grooves that can be electroplated. Therefore, during electroplating, metal is deposited in the grooves to form the required electroplating layer.
[0006] With respect to the above-mentioned related technologies, the height of the electroplating layer dam is between 380 microns and 420 microns, and the dry film thickness is between 25μm and 75μm. Therefore, in the process of making the dry film, the dry film needs to be pressed multiple times to ensure that the thickness of the dry film can reach the required height, which leads to low efficiency of electroplating of ceramic circuit boards and the outer shape of the dam has multiple steps. Utility Model Content
[0007] The technical problem to be solved by the utility model is to provide an electroplating structure for a ceramic circuit board, which solves the technical problem that in the process of making a dry film, the dry film needs to be pressed multiple times to ensure that the thickness of the dry film can reach the required height, which leads to low efficiency of electroplating of the ceramic circuit board and the appearance of the manufactured dam has multiple steps.
[0008] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0009] A plating structure for a ceramic circuit board comprises a ceramic substrate, a plating resist plate is arranged on one side of the ceramic substrate, a glue groove is opened on the side of the plating resist plate close to the ceramic substrate, a photoresist layer is filled in the glue groove of the plating resist plate, and a groove is formed on the inner side of the plating resist plate; the thickness of the plating resist plate is greater than 400 μm.
[0010] Through the above technical solution, the pattern to be electroplated is first engraved on the anti-plating plate to form a groove on the ceramic substrate, and then a photoresist layer is coated in the glue groove of the anti-plating plate, and then the ceramic substrate is pasted on the ceramic substrate through the photoresist layer to form a groove on the ceramic substrate. Since the anti-plating plate with a thickness greater than 400μm is directly used, the preparation of the dry film is omitted, and there is no need to press the dry film multiple times, thereby improving the electroplating efficiency of the ceramic substrate and making the appearance of the electroplating layer dam of the finished product smooth.
[0011] Furthermore, a protective film is provided on a side of the anti-plating plate close to the ceramic substrate, and the protective film is adhered to a side of the anti-plating plate close to the glue groove, so that the glue groove remains exposed.
[0012] Through the above technical solution, the protective film is adhered to the side of the anti-plating board close to the glue groove, and the glue groove is in an exposed state, thereby improving the convenience of filling the glue groove with a photoresist layer.
[0013] Furthermore, a limiting plate is provided on the peripheral side of the anti-plating plate, one side of the limiting plate is connected to the anti-plating plate, and the other side extends toward a side close to the ceramic substrate.
[0014] Through the above technical solution, when the anti-plating plate is connected to the ceramic substrate, the limiting plate limits the anti-plating plate, thereby improving the accuracy of the position of the anti-plating plate on the ceramic substrate.
[0015] Furthermore, a liquid inlet hole is provided on the anti-plating plate, and a plurality of the liquid inlet holes are provided at intervals on the anti-plating plate, and one end of the plurality of the liquid inlet holes are connected to the glue groove.
[0016] Through the above technical solution, when the anti-plating plate is removed from the ceramic substrate, the soaking liquid enters the adhesive layer from the liquid inlet hole, thereby improving the convenience of separating the anti-plating plate from the ceramic substrate.
[0017] Furthermore, a guiding inclined surface is formed on a side of the anti-plating plate away from the ceramic substrate, and the guiding inclined surface is inclined toward the inner side close to the liquid inlet hole.
[0018] Through the above technical solution, the guiding inclined surface guides the immersed liquid so that the liquid can enter the liquid inlet hole.
[0019] Furthermore, a limiting surface is formed on one side of the ceramic substrate close to the groove, and the limiting surface limits the electroplating range of the groove.
[0020] Through the above technical solution, the limiting surface limits the electroplating layer dam of the groove, so that the surface of the electroplating layer dam is smoother.
[0021] Furthermore, a photoresist film is provided on one side of the ceramic substrate close to the limiting surface, and the photoresist film is connected to the one side of the ceramic substrate close to the limiting surface.
[0022] Through the above technical solution, the anti-plating plate is in contact with the electroplating layer dam through the photoresist film, so that when the anti-plating plate is removed from the ceramic substrate, the electroplating layer dam will not be damaged.
[0023] In summary, the present application includes at least one of the following beneficial technical effects of the electroplating structure for ceramic circuit boards:
[0024] When in use, firstly, the pattern to be electroplated is engraved on the anti-plating plate to form grooves on the ceramic substrate, then a photoresist layer is coated in the glue groove of the anti-plating plate, and then the ceramic substrate is pasted on the ceramic substrate through the photoresist layer to form grooves on the ceramic substrate. Since the anti-plating plate with a thickness greater than 400μm is directly used, the preparation of the dry film is omitted, and there is no need to press the dry film multiple times, thereby improving the electroplating efficiency of the ceramic substrate and making the appearance of the electroplating layer dam of the finished product smooth. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 This embodiment mainly embodies the overall structural schematic diagram of an electroplating structure for a ceramic circuit board;
[0026] Figure 2 It is a schematic diagram of the protective film structure mainly embodied in this embodiment.
[0027] Figure numerals: 1, ceramic substrate; 2, anti-plating plate; 21, groove; 22, glue groove; 23, photoresist layer; 24, protective film; 25, limiting plate; 26, limiting surface; 261, photoresist film; 27, liquid inlet hole; 271, guide slope. DETAILED DESCRIPTION
[0028] In order to make the technical means, creative features, objectives and effects of the present invention easier to understand, the present invention is further described below in conjunction with specific embodiments.
[0029] The following is combined with Figure 1-2 This application is described in further detail.
[0030] The embodiment of the present application discloses an electroplating structure for a ceramic circuit board.
[0031] Reference Figure 1 , an electroplating structure for a ceramic circuit board, comprising a ceramic substrate 1, a resist plate 2 is provided on one side of the ceramic substrate 1, before use, a pattern to be electroplated is engraved on the resist plate 2, and then a groove 21 for electroplating is formed. In addition, a glue groove 22 is formed on the side of the resist plate 2 close to the ceramic substrate 1, and the glue groove 22 of the resist plate 2 is filled with a photoresist layer 23, and when in use, the resist plate 2 is connected to the ceramic substrate 1 through the photoresist layer 23.
[0032] The ceramic substrate 1 is in the shape of a flat plate as a whole, and the anti-plating plate 2 is arranged parallel to and spaced from the ceramic substrate 1. When the electroplating pattern is being depicted, the groove 21 penetrates the anti-plating plate 2. In addition, the glue groove 22 is provided on the side of the anti-plating plate 2 close to the ceramic substrate 1, and the glue groove 22 is spaced from the groove 21, thereby preventing excess electroplating material from entering the glue groove 22 during the electroplating process.
[0033] Reference Figure 2 The photoresist layer 23 is filled in the glue groove 22 of the anti-plating board 2. When the photoresist layer 23 is filled, when there is excess photoresist layer 23 overflowing to the outside of the glue groove 22, a gap will be formed between the anti-plating board 2 and the ceramic substrate 1, thereby affecting the electroplating effect. Therefore, a protective film 24 is provided on the side of the anti-plating board 2 close to the glue groove 22. The protective film 24 is attached to the anti-plating board 2, and the protective film 24 avoids the glue groove 22, so that the glue groove 22 is always kept in an exposed state. When in use, the photoresist layer 23 is directly filled into the glue groove 22. When part of the photoresist layer 23 overflows onto the surface of the protective film 24, the protective film 24 is directly peeled off from the anti-plating board 2. During the peeling process of the protective film 24, the photoresist overflowing from the glue groove 22 will be peeled off from the anti-plating board 2 along with the protective film 24, thereby allowing the photoresist layer 23 to be evenly filled in the glue groove 22 to prevent a gap from being generated between the anti-plating board 2 and the ceramic substrate 1.
[0034] When electroplating the ceramic substrate 1, the anti-plating plate 2 needs to be connected to the ceramic substrate 1. In order to improve the convenience of connecting the anti-plating plate 2 to the ceramic substrate 1. Therefore, a limiting plate 25 is provided on the anti-plating plate 2. The limiting plate 25 is located on the peripheral side of the anti-plating plate 2, and one end of the limiting plate 25 is connected to the anti-plating plate 2, and the other end extends to the side close to the ceramic substrate 1. When in use, the anti-plating plate 2 is connected to the ceramic substrate 1 through the limiting plate 25, so that the accuracy of the position of the anti-plating plate 2 connected to the ceramic substrate 1 is improved.
[0035] During electroplating, in order to make the side of the electroplating layer dam smoother, a limiting surface 26 is formed on one side of the anti-plating plate 2 close to the groove 21 , and the limiting surfaces 26 on both sides of the groove 21 are arranged in parallel and spaced apart.
[0036] Since the required height of the electroplating layer dam is 400μm, the thickness of the anti-plating board 2 is greater than 400μm. Preferably, the thickness of the anti-plating board 2 is 420 microns, so that the thickness of the anti-plating board 2 can be suitable for the production of the electroplating layer dam with a height less than 420 microns.
[0037] After the electroplating is completed, the anti-plating plate 2 needs to be removed from the ceramic substrate 1. Therefore, the ceramic substrate 1 needs to be placed in the soaking liquid for soaking. After the photoresist is softened and dissolved, the anti-plating plate 2 is removed. Since the photoresist layer 23 is in the glue groove 22, in order to allow the photoresist layer 23 to fully contact with the soaking liquid, a liquid inlet hole 27 is provided on the anti-plating plate 2. Several liquid inlet holes 27 are evenly spaced on the anti-plating plate 2, and one end of the several liquid inlet holes 27 is connected to the glue groove 22. In addition, a guide slope 271 is formed on the side of the anti-plating plate 2 that is away from the ceramic substrate 1 in the thickness direction. The guide slope 271 corresponds to the liquid inlet hole 27, and the guide slope 271 is inclined downward toward the inner side of the liquid inlet hole 27. In this way, the soaking liquid can hear the liquid inlet hole 27 and contact with the photoresist layer 23 in the glue groove 22, so that the anti-plating plate 2 can be removed from the ceramic substrate 1.
[0038] In the process of removing the anti-plating board 2 from the ceramic substrate 1, since the electroplating layer dam contacts the limiting surface 26 on the side of the ceramic substrate 1, the electroplating layer dam is easily damaged in the process of removing the anti-plating board 2 from the ceramic substrate 1. Therefore, a photoresist film 261 is provided on the limiting surface 26 of the anti-plating board 2. Through the contact between the photoresist film 261 and the electroplating layer dam, on the one hand, the side of the electroplating layer dam can be made flat, and on the other hand, when the anti-plating board 2 is in the soaking liquid, the photoresist film 261 will also soften and dissolve with the soaking of the soaking liquid, so that the electroplating layer dam will not be damaged in the process of removing the anti-plating board 2.
[0039] During the manufacturing process of the photoresist film 261, when the groove 21 is being carved, the width of the groove 21 is 5 microns larger than the required width of the electroplating layer dam, and then the groove 21 on the anti-plating plate 2 is filled with photoresist, and after the photoresist solidifies, the anti-plating plate 2 is carved again, and the carving width at this time is the required width of the electroplating layer dam. After the carving is completed, the photoresist film 261 on the limiting surface 26 can be obtained.
[0040] The implementation principle of the electroplating structure for ceramic circuit boards in the embodiment of the present application is as follows: when in use, grooves 21 are carved on the surface of the anti-plating plate 2, and then a photoresist film 261 is made on the limiting surface 26 of the anti-plating plate 2, and then the photoresist is filled in the glue groove 22, and then the protective film 24 is peeled off from the anti-plating plate 2, and finally the anti-plating plate 2 is connected to the ceramic substrate 1 through the photoresist film 261. After the electroplating is completed, the ceramic substrate 1 connected to the anti-plating plate 2 is placed in the immersion liquid, and after the photoresist layer 23 and the photoresist film 261 are softened and dissolved, the anti-plating plate 2 is removed from the ceramic substrate 1.
[0041] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.
Claims
1. An electroplating structure for a ceramic circuit board, comprising a ceramic substrate (1), characterized in that: A plating-resistant plate (2) is provided on one side of the ceramic substrate (1); a glue groove (22) is provided on the side of the plating-resistant plate (2) close to the ceramic substrate (1); a photoresist layer (23) is filled in the glue groove (22) of the plating-resistant plate (2); and a groove (21) is formed on the inner side of the plating-resistant plate (2); the thickness of the plating-resistant plate (2) is greater than 400 μm.
2. The electroplating structure for a ceramic circuit board according to claim 1, characterized in that: A protective film (24) is provided on the side of the anti-plating plate (2) close to the ceramic substrate (1), and the protective film (24) is adhered to the side of the anti-plating plate (2) close to the glue groove (22), so that the glue groove (22) remains exposed.
3. The electroplating structure for a ceramic circuit board according to claim 1, characterized in that: A limiting plate (25) is arranged on the circumferential side of the anti-plating plate (2), one side of the limiting plate (25) is connected to the anti-plating plate (2), and the other side extends toward a side close to the ceramic substrate (1).
4. The electroplating structure for a ceramic circuit board according to claim 1, characterized in that: The anti-plating plate (2) is provided with a liquid inlet hole (27), and a plurality of the liquid inlet holes (27) are provided at intervals on the anti-plating plate (2), and one end of each of the plurality of liquid inlet holes (27) is connected to the glue groove (22).
5. The electroplating structure for a ceramic circuit board according to claim 4, characterized in that: A guiding inclined surface (271) is formed on the side of the anti-plating plate (2) facing away from the ceramic substrate (1), and the guiding inclined surface (271) is inclined toward the inner side close to the liquid inlet hole (27).
6. The electroplating structure for a ceramic circuit board according to claim 1, characterized in that: A limiting surface (26) is formed on one side of the ceramic substrate (1) close to the groove (21), and the limiting surface (26) limits the electroplating range of the groove (21).
7. The electroplating structure for a ceramic circuit board according to claim 6, characterized in that: A photoresist film (261) is provided on one side of the ceramic substrate (1) close to the limiting surface (26), and the photoresist film (261) is connected to the side of the ceramic substrate (1) close to the limiting surface (26).