A flushing and moisturizing mechanism, a transfer interactive device and a chemical mechanical polishing system

Abstract

The present application discloses a flushing and moisturizing mechanism, a transfer and interaction device, and a chemical mechanical polishing system. The flushing and moisturizing mechanism includes: a bottom flushing and moisturizing component, the bottom flushing and moisturizing component includes a first mounting part, a first bottom nozzle, a second bottom nozzle, and a third bottom nozzle, the first bottom nozzle, the second bottom nozzle, and the third bottom nozzle are all arranged on the first mounting part, the first bottom nozzle is used to spray liquid toward the air film at the bottom of the polishing head, the second bottom nozzle is used to spray the liquid toward the retaining ring at the bottom of the polishing head, and the third bottom nozzle is used to spray the liquid toward the gap area between the air film and the retaining ring. The present application helps to prevent the polishing liquid at the bottom of the polishing head from scratching the wafer after crystallization by flushing and moisturizing the air film, the retaining ring, and the gap area between the two.

Description

Technical Field

[0001] The present application relates to the technical field of chemical mechanical polishing equipment, and in particular to a flushing and moisturizing mechanism, a transfer interaction device and a chemical mechanical polishing system. Background Art

[0002] Chemical Mechanical Polishing (CMP) is a global surface flattening technology. Specifically, the wafer is usually adsorbed on the bottom of the polishing head, wherein the bottom of the polishing head is usually provided with an air film and a retaining ring arranged on the circumferential outside of the air film. During polishing, the polishing head presses the wafer against the polishing pad, and the surface of the wafer can be flattened through the relative movement between the wafer and the polishing pad in the polishing liquid.

[0003] However, during the above-mentioned polishing process, the polishing liquid can easily splash onto or directly contact the polishing head, and the non-flowing polishing liquid can easily crystallize into high-hardness solid particles, causing scratches on the wafer surface. Therefore, if the residual polishing liquid on the surface of the polishing head cannot be removed in time, it will cause the loss of the wafer, thereby increasing costs. Utility Model Content

[0004] In view of the above-mentioned deficiencies in the related art, the present application provides a flushing and moisturizing mechanism, a transfer interaction device and a chemical mechanical polishing system to solve the problem in the related art that solid particles formed by crystallization of the polishing liquid easily scratch the surface of the wafer.

[0005] In order to solve the above technical problems, in a first aspect, the present application provides a flushing and moisturizing mechanism, which comprises:

[0006] A bottom flushing and moisturizing assembly, the bottom flushing and moisturizing assembly includes a first mounting member, a first bottom nozzle, a second bottom nozzle and a third bottom nozzle, the first bottom nozzle, the second bottom nozzle and the third bottom nozzle are all arranged on the first mounting member, the first bottom nozzle is used to spray liquid toward the air film at the bottom of the polishing head, the second bottom nozzle is used to spray the liquid toward the retaining ring at the bottom of the polishing head, and the third bottom nozzle is used to spray the liquid toward the gap area between the air film and the retaining ring.

[0007] In a possible implementation of the first aspect, the second bottom nozzle is an inclined nozzle having an inclined nozzle for spraying the liquid, the inclined nozzle is arranged toward the outside of the first mounting member, and the inclined nozzle is arranged to be inclined upward.

[0008] In a possible implementation manner of the first aspect, the third bottom nozzle is the inclined nozzle.

[0009] In a possible implementation of the first aspect, the third bottom nozzle has a first nozzle for spraying the liquid, the first nozzle is oriented in a first direction, there is a first angle between the first direction and the horizontal direction, and the first angle is in the range of 50°-80°.

[0010] In a possible implementation of the first aspect, the second bottom nozzle has a second nozzle for spraying the liquid, the second nozzle is oriented in a second direction, a second angle is formed between the second direction and the horizontal direction, and the second angle is within a range of 35°-50°.

[0011] In a possible implementation of the first aspect, a mounting bevel is provided on the first mounting member, and the inclined nozzle is provided on the mounting bevel;

[0012] The orientation of the inclined nozzle is perpendicular to the installation slope, and the angle between the installation slope and the horizontal plane is an acute angle.

[0013] In a possible implementation of the first aspect, a plurality of the inclined nozzles are arranged in an array on the first mounting member;

[0014] A plurality of mounting bosses are also arranged on the first mounting member, each of the mounting bosses is provided with the mounting inclined surface, and the plurality of inclined nozzles are arranged one by one on the plurality of mounting bosses.

[0015] In a possible implementation of the first aspect, a plurality of the first bottom nozzles, the second bottom nozzles, and the third bottom nozzles are arranged in an array on the first mounting member;

[0016] The first mounting member includes a circular ring structure portion, a cross-shaped structure portion arranged radially inwardly of the circular ring structure portion and connected to the circular ring structure portion, a plurality of the first bottom nozzles are evenly arranged on the cross-shaped structure portion, and a plurality of the second bottom nozzles and a plurality of the third bottom nozzles are evenly distributed on the circular ring structure portion along the circumferential direction of the circular ring structure portion.

[0017] In a possible implementation of the first aspect, the second bottom nozzle and the third bottom nozzle are arranged interlaced with each other on the annular structure; or,

[0018] A plurality of the first bottom nozzles are also arranged on the circular ring structure portion, and the plurality of the first bottom nozzles, the plurality of the second bottom nozzles and the plurality of the third bottom nozzles are evenly distributed on the circular ring structure portion along the circumferential direction of the circular ring structure portion, and the first bottom nozzles, the second bottom nozzles and the third bottom nozzles are arranged interlaced with each other on the circular ring structure portion.

[0019] In a possible implementation of the first aspect, a liquid channel is provided in the first mounting member, and each of the first bottom nozzles, each of the second bottom nozzles, and each of the third bottom nozzles is in communication with the liquid channel;

[0020] The first mounting member is also provided with a plurality of liquid supply connectors, which are used to be connected to a water supply system to transport the liquid into the liquid channel; the plurality of liquid supply connectors are evenly spaced around the central axis of the annular structure.

[0021] In a possible implementation of the first aspect, the first bottom nozzle is a solid cone nozzle; and / or,

[0022] The second bottom nozzle is a fan-shaped nozzle; and / or,

[0023] The third bottom nozzle is a fan-shaped nozzle.

[0024] In a possible implementation of the first aspect, the flushing and moisturizing mechanism also includes an outer contour flushing and moisturizing component independently of the bottom flushing and moisturizing component, the outer contour flushing and moisturizing component includes a second mounting member and a first outer contour nozzle, the first outer contour nozzle is arranged on the second mounting member, the first outer contour nozzle is used to spray the liquid toward a connecting structure connected to the gap area, and the connecting structure is arranged on the top of the polishing head.

[0025] In a possible implementation of the first aspect, the outer contour flushing and moisturizing assembly further includes a second outer contour nozzle, the second outer contour nozzle is disposed on the second mounting member, and the second outer contour nozzle is used to spray the liquid toward the side of the polishing head; and / or,

[0026] The outer contour flushing and moisturizing assembly also includes a third outer contour nozzle, which is arranged on the second mounting member and is used to spray the liquid toward the connecting portion connecting the top and the side.

[0027] In a second aspect, the present application further provides a transfer interaction device, the transfer interaction device comprising:

[0028] A storage mechanism, the storage mechanism is used to store items to be transferred;

[0029] In any one of the flushing and moisturizing mechanisms of the first aspect, the bottom flushing and moisturizing component in the flushing and moisturizing mechanism is arranged on the storage mechanism.

[0030] In a third aspect, the present application further provides a chemical mechanical polishing system, the chemical mechanical polishing system comprising:

[0031] The transfer interaction device according to any one of the second aspects;

[0032] A processing device, wherein the processing device is used to process the parts to be transferred;

[0033] A transfer device, wherein the transfer device is used to transfer the object to be transferred on the transfer interaction device, or the transfer device is used to transfer the object to be transferred to the transfer interaction device.

[0034] Compared with the related art, this application has at least the following beneficial effects:

[0035] In the present application, since the bottom flushing and moisturizing component includes a first bottom nozzle, a second bottom nozzle and a third bottom nozzle, and since the first bottom nozzle is used to spray liquid toward the air film at the bottom of the polishing head, the second bottom nozzle is used to spray liquid toward the retaining ring at the bottom of the polishing head, and the third bottom nozzle is used to spray liquid toward the gap area between the air film and the retaining ring, when using the flushing and moisturizing mechanism in the present application, liquid is sprayed toward the corresponding air film, retaining ring and the gap area between the air film and the retaining ring through the first bottom nozzle, the second bottom nozzle and the third bottom nozzle, respectively, which can not only flush away the polishing liquid in the air film, the retaining ring and the gap area, but also the sprayed liquid can moisturize the air film, the retaining ring and the gap area; in this way, flushing and moisturizing can help avoid crystallization of the polishing liquid in the air film, the retaining ring and the gap area, that is, it is helpful to avoid crystallization of the polishing liquid at the bottom of the polishing head, and since the wafer is adsorbed on the bottom of the polishing head, it is also helpful to avoid solid particles formed by crystallization of the polishing liquid scratching the surface of the wafer, thereby helping to avoid wafer loss and reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0037] Figure 1 A three-dimensional diagram of a bottom flushing and moisturizing assembly provided in an embodiment of the present application;

[0038] Figure 2 A three-dimensional diagram of an outer contour flushing and moisturizing component provided in an embodiment of the present application;

[0039] Figure 3 A schematic diagram of the flushing and moisturizing mechanism provided in an embodiment of the present application for flushing and moisturizing a polishing head;

[0040] Figure 4 A schematic diagram of a transfer interaction device provided in an embodiment of the present application;

[0041] Figure 5 A schematic diagram of a chemical mechanical polishing system provided in an embodiment of the present application.

[0042] Description of reference numerals:

[0043] 1-first mounting member; 11-mounting inclined surface; 12-mounting boss; 13-circular structure portion; 14-cross structure portion; 15-liquid channel;

[0044] 2- first bottom nozzle;

[0045] 3- Second bottom nozzle;

[0046] 4-third bottom nozzle;

[0047] 5-polishing head; 51-air film; 52-retaining ring;

[0048] 6-Liquid supply connector;

[0049] 7- second mounting member;

[0050] 8-first outer contour nozzle;

[0051] 9-second outer contour nozzle;

[0052] 10- third outer contour nozzle;

[0053] 100-rinsing and moisturizing mechanism;

[0054] 1000-Transfer interactive device. DETAILED DESCRIPTION

[0055] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0056] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0057] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to specific circumstances.

[0058] In addition, the terms "installed", "set", "provided with", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0059] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, "plurality" means two or more.

[0060] As described in the background technology of the present application, in the related technology, Chemical Mechanical Polishing (CMP) is a global surface flattening technology. Specifically, the wafer is usually adsorbed on the bottom of the polishing head, wherein the bottom of the polishing head is usually provided with an air film and a retaining ring arranged on the circumferential outside of the air film; during polishing, the polishing head presses the wafer against the polishing pad, and the surface of the wafer can be flattened through the relative movement between the wafer and the polishing pad in the polishing liquid.

[0061] However, during the above-mentioned polishing process, the polishing liquid can easily splash onto or directly contact the polishing head, and the non-flowing polishing liquid can easily crystallize into high-hardness solid particles, causing scratches on the wafer surface. Therefore, if the residual polishing liquid on the surface of the polishing head cannot be removed in time, it will cause the loss of the wafer, thereby increasing costs.

[0062] Embodiment 1

[0063] In view of the above-mentioned problems, the present application provides a flushing and moisturizing mechanism to solve the problem in the related art that solid particles formed by crystallization of the polishing liquid easily scratch the surface of the wafer.

[0064] The technical solution of the present application will be further described below in conjunction with specific embodiments and drawings:

[0065] like Figure 1As shown, the flushing and moisturizing mechanism 100 includes a bottom flushing and moisturizing assembly, which includes a first mounting member 1, a first bottom nozzle 2, a second bottom nozzle 3 and a third bottom nozzle 4. The first bottom nozzle 2, the second bottom nozzle 3 and the third bottom nozzle 4 are arranged on the first mounting member 1. Figure 3 As shown, the first bottom nozzle 2 is used to spray liquid toward the air film 51 at the bottom of the polishing head 5, the second bottom nozzle 3 is used to spray liquid toward the retaining ring 52 at the bottom of the polishing head 5, and the third bottom nozzle 4 is used to spray liquid toward the gap area between the air film 51 and the retaining ring 52.

[0066] In the present application, since the bottom flushing and moisturizing assembly includes a first bottom nozzle 2, a second bottom nozzle 3 and a third bottom nozzle 4, and since the first bottom nozzle 2 is used to spray liquid toward the air film 51 at the bottom of the polishing head 5, the second bottom nozzle 3 is used to spray liquid toward the retaining ring 52 at the bottom of the polishing head 5, and the third bottom nozzle 4 is used to spray liquid toward the gap area between the air film 51 and the retaining ring 52, when the flushing and moisturizing mechanism 100 in the present application is used, the first bottom nozzle 2, the second bottom nozzle 3 and the third bottom nozzle 4 are respectively directed toward the corresponding air film 51, the retaining ring 52 and the air film 51 and the retaining ring Liquid is sprayed in the gap area between 52, which can not only wash away the polishing liquid in the air film 51, the retaining ring 52 and the gap area, but also the sprayed liquid can moisturize the air film 51, the retaining ring 52 and the gap area; by flushing and moisturizing, it is helpful to avoid the polishing liquid from crystallizing in the air film 51, the retaining ring 52 and the gap area, that is, it is helpful to avoid the polishing liquid from crystallizing at the bottom of the polishing head 5, and because the wafer is adsorbed on the bottom of the polishing head 5, it is also helpful to avoid the solid particles formed by the crystallization of the polishing liquid to scratch the surface of the wafer, which is beneficial to avoid the loss of the wafer and reduce the cost.

[0067] Regarding the gap area between the air film 51 and the retaining ring 52 , it needs to be explained that the gap area includes the outer edge of the air film 51 and the inner edge of the retaining ring 52 . Of course, the gap area may also include other structures of the polishing head 5 between the air film 51 and the retaining ring 52 .

[0068] For the second bottom nozzle 3, further, as Figure 1 and Figure 3 As shown, the second bottom nozzle 3 is an inclined nozzle having an inclined nozzle opening for spraying liquid, the inclined nozzle opening is arranged toward the outside of the first mounting member 1, and the inclined nozzle opening is arranged inclined upward.

[0069] Since the inclined nozzle is arranged toward the outside of the first mounting member 1 and is inclined upward, the inclined nozzle can spray liquid upward toward the outside of the first mounting member 1. In this way, the inclined nozzle does not need to be installed directly below its spraying object, and the first mounting member 1 does not need to extend outward to directly below the spraying object of the inclined nozzle. This is conducive to reducing the size of the first mounting member 1, and is conducive to realizing the miniaturized design of the first mounting member, and is conducive to facilitating the setting and installation of the first mounting member 1.

[0070] For the third bottom nozzle 4, further, as Figure 1 and Figure 3 As shown, the third bottom nozzle 4 is the above-mentioned inclined nozzle.

[0071] The third bottom nozzle 4 is set as an inclined nozzle, which has the same effect as the second bottom nozzle 3 used as an inclined nozzle. The first mounting member 1 does not need to extend outward to directly below the spraying object of the third bottom nozzle 4. Since the spraying object of the second bottom nozzle 3 is the retaining ring 52, and the spraying object of the third bottom nozzle 4 is the gap area between the air film 51 and the retaining ring 52, the spraying object of the third bottom nozzle 4 is located on the inner side of the spraying object of the second bottom nozzle 3. Therefore, on the basis of the second bottom nozzle 3 being used as an inclined nozzle, setting the third bottom nozzle 4 as an inclined nozzle is beneficial to further reduce the size of the first mounting member 1, thereby further facilitating the setting and installation of the first mounting member 1.

[0072] For the third bottom nozzle 4 as an inclined nozzle, further, the third bottom nozzle 4 has a first nozzle (not marked in the figure) for spraying liquid, the first nozzle is oriented in a first direction, and there is a first angle between the first direction and the horizontal direction, and the first angle is in the range of 50°-80°.

[0073] Such arrangement, while ensuring that the third bottom nozzle 4 can flush the gap area, not only enables the third bottom nozzle 4 to have sufficient flushing coverage area and flushing force, but also helps the liquid to form a more ideal flow trajectory after being sprayed, thereby improving the flushing effect on the gap area.

[0074] In the embodiment of the present application, depending on the distance between the third bottom nozzle 4 and the gap area, the first angle may be 50°, 80° or any angle within the range of 50°-80°, and the embodiment of the present application does not specifically limit this.

[0075] For the second bottom nozzle 3 as an inclined nozzle, further, the second bottom nozzle 3 has a second nozzle (not marked in the figure) for spraying liquid, the second nozzle is oriented in a second direction, and there is a second angle between the second direction and the horizontal direction, and the second angle is in the range of 35°-50°.

[0076] Similar to the third bottom nozzle 4 , such a configuration, while ensuring that the second bottom nozzle 3 can flush the retaining ring 52 , not only enables the second bottom nozzle 3 to have sufficient flushing coverage area and flushing force, but also helps the liquid to form a more ideal flow trajectory after being sprayed, thereby improving the flushing effect on the retaining ring 52 .

[0077] In the embodiment of the present application, depending on the distance between the second bottom nozzle 3 and the retaining ring 52, the second angle may be 35°, 50° or any angle within the range of 35°-50°, and the embodiment of the present application does not specifically limit this.

[0078] For the installation inclined surface 11 where the second bottom nozzle 3 and the third bottom nozzle 4 are installed, since the second angle between the direction of the nozzle of the second bottom nozzle 3 and the horizontal direction is 35°-50°, and the first angle between the direction of the nozzle of the third bottom nozzle 4 and the horizontal direction is 50°-80°, the first angle is greater than the second angle. Since the directions of the nozzles of the second bottom nozzle 3 and the third bottom nozzle 4 are both perpendicular to the corresponding installation inclined surface 11, Figure 1 As shown, for the installation inclined surface 11 provided for the third bottom nozzle 4, the angle between it and the horizontal plane is smaller than the angle between the installation inclined surface 11 corresponding to the second bottom nozzle 3 and the horizontal plane.

[0079] For the first bottom nozzle 2, in a preferred embodiment, as Figure 1 and Figure 3 As shown, the nozzle of the first bottom nozzle 2 is vertically arranged upwards. Such an arrangement is conducive to ensuring that the first bottom nozzle 2 can flush away the polishing liquid on the air film 51 with a greater flushing force, thereby ensuring the flushing effect of the first bottom nozzle 2.

[0080] For the first bottom nozzle 2, the second bottom nozzle 3 and the third bottom nozzle 4, further, the first bottom nozzle 2 is a solid cone nozzle; and / or, the second bottom nozzle 3 is a fan-shaped nozzle; and / or, the third bottom nozzle 4 is a fan-shaped nozzle.

[0081] For the first bottom nozzle 2, since the first bottom nozzle 2 with the nozzle vertically facing upward has a smaller flushing coverage area, while the area of ​​the air film 51 is larger, and because the solid cone nozzle can have the largest flushing coverage area under the same water flow and pressure, using a solid cone nozzle as the first bottom nozzle 2 can ensure that the first bottom nozzle 2 has a larger flushing force while also ensuring that the first bottom nozzle 2 has a larger flushing coverage area.

[0082] For the second bottom nozzle 3, since the retaining ring 52 has a small area and is in direct contact with the polishing liquid, it is very easy to crystallize. Since the fan-shaped nozzle not only has a smaller flushing coverage area, but also has a greater flushing force under the same flow rate and water pressure, the fan-shaped nozzle is used as the second bottom nozzle 3. On the basis of ensuring that the flushing range of the second bottom nozzle 3 can cover the retaining ring 52, the second bottom nozzle 3 can flush away the polishing liquid on the retaining ring 52 with a greater flushing force.

[0083] For the third bottom nozzle 4, since the polishing liquid is easily accumulated in the gap area and is not easy to clean and rinse, a fan-shaped nozzle is used as the third bottom nozzle 4. On the basis of ensuring that the flushing range of the third bottom nozzle 4 can cover the gap area, it is also beneficial for the third bottom nozzle 4 to rinse the polishing liquid in the gap area with a greater flushing force.

[0084] In a preferred embodiment, the first bottom nozzle 2 is a solid conical nozzle, and the second bottom nozzle 3 and the third bottom nozzle 4 are fan-shaped nozzles. Such an arrangement is not only conducive to making the flushing range of the bottom flushing and moisturizing component cover the entire bottom of the polishing head 5, but also conducive to making the bottom flushing and moisturizing component flush the entire bottom of the polishing head 5.

[0085] In other embodiments, without considering the specific flushing coverage area and flushing strength, the first bottom nozzle 2, the second bottom nozzle 3 and the third bottom nozzle 4 can also be any one of a square nozzle, a column nozzle and an elliptical nozzle. It can be seen that without considering the specific flushing coverage area and flushing strength, the types of the first bottom nozzle 2, the second bottom nozzle 3 and the third bottom nozzle 4 are more flexible to choose, and can be selected according to actual use requirements.

[0086] For the above-mentioned inclined nozzle, further, as Figure 1 As shown, a mounting bevel 11 is provided on the first mounting member 1, and the inclined nozzle is provided on the mounting bevel 11; the direction of the inclined nozzle is perpendicular to the mounting bevel 11, and the angle between the mounting bevel 11 and the horizontal plane is an acute angle.

[0087] With such arrangement, for the inclined nozzle, the inclination of the inclined nozzle direction can be achieved simply by tilting the inclined nozzle, without tilting the inclined nozzle from the structure of the inclined nozzle, which is beneficial to simplify the structure of the inclined nozzle and facilitate the processing of the inclined nozzle.

[0088] Further, in a preferred embodiment, a plurality of inclined nozzles are arranged in an array on the first mounting member 1, such as Figure 1As shown, a plurality of mounting bosses 12 are further provided on the first mounting member 1 , each mounting boss 12 is provided with a mounting inclined surface 11 , and a plurality of inclined nozzles are arranged one by one on the plurality of mounting bosses 12 .

[0089] With such arrangement, the first mounting member 1 can have a smaller thickness at the portion where the mounting boss 12 is not provided, thereby facilitating the reduction of the weight of the first mounting member 1 and further facilitating the lightweight design of the first mounting member 1 .

[0090] Of course, in other embodiments, without considering the lightweight design of the first mounting member 1, the first mounting member 1 may be provided with an integral mounting bevel, and each inclined nozzle is provided on the mounting bevel. Such a configuration is, to a certain extent, conducive to simplifying the structure of the first mounting member 1, and further conducive to facilitating the processing of the first mounting member 1.

[0091] For the structure of the first mounting member 1, further, as Figure 1 As shown, a plurality of first bottom nozzles 2 , second bottom nozzles 3 and third bottom nozzles 4 are arranged in an array on the first mounting member 1 .

[0092] like Figure 1 As shown, the first mounting member 1 includes a circular ring structure portion 13, a cross-shaped structure portion 14 arranged radially inside the circular ring structure portion 13 and connected to the circular ring structure portion 13, a plurality of first bottom nozzles 2 are evenly arranged on the cross-shaped structure portion 14, and a plurality of second bottom nozzles 3 and a plurality of third bottom nozzles 4 are evenly distributed on the circular ring structure portion 13 along the circumferential direction of the circular ring structure portion 13.

[0093] Such arrangement of the first mounting member 1 can provide the first mounting member 1 with a hollow structure. This is beneficial, on the one hand, to reducing the weight of the first mounting member 1, thereby facilitating a lightweight design of the first mounting member 1, and further facilitating a lightweight design of the bottom flushing and moisturizing component; on the other hand, it allows the liquid after flushing the polishing head 5 to drip downward through the hollow structure of the first mounting member 1, thereby facilitating the collection of the liquid and preventing the liquid from flowing out.

[0094] Multiple first bottom nozzles 2 are evenly arranged on the cross-shaped structure portion 14, and multiple second bottom nozzles 3 and multiple third bottom nozzles 4 are evenly distributed on the circular structure portion 13 along the circumferential direction of the circular structure portion 13. Such an arrangement is conducive to the bottom flushing and moisturizing component to evenly flush and moisturize the bottom of the polishing head 5.

[0095] Furthermore, if Figure 1As shown, the second bottom nozzle 3 and the third bottom nozzle 4 are arranged on the circular ring structure portion 13 in an interlaced manner; or, the circular ring structure portion 13 is also provided with a plurality of first bottom nozzles 2, and the plurality of first bottom nozzles 2, the plurality of second bottom nozzles 3 and the plurality of third bottom nozzles 4 are uniformly distributed on the circular ring structure portion 13 along the circumferential direction of the circular ring structure portion 13, and the first bottom nozzle 2, the second bottom nozzle 3 and the third bottom nozzle 4 are arranged on the circular ring structure portion 13 in an interlaced manner.

[0096] The second bottom nozzle 3 and the third bottom nozzle 4 are arranged interlaced with each other on the annular structure 13 , so that the second bottom nozzle 3 and the third bottom nozzle 4 can be evenly distributed, which is also conducive to uniformly flushing and moisturizing the retaining ring 52 and the gap area.

[0097] A plurality of first bottom nozzles 2 are arranged on the circular ring structure portion 13. In this case, when the nozzle of the first bottom nozzle 2 is vertically facing upward, since the first bottom nozzle 2 needs to be located directly below the air film 51, the circular ring structure portion 13 also needs to be located directly below the air film 51 to a certain extent. The circular ring structure portion 13 is located at the outermost side of the first mounting member 1. Therefore, the entire first mounting member 1 can have a smaller size, thereby making it easier to set up and install the first mounting member 1.

[0098] Multiple first bottom nozzles 2, multiple second bottom nozzles 3 and multiple third bottom nozzles 4 are evenly distributed on the circular structure portion 13 along the circumferential direction of the circular structure portion 13, and the first bottom nozzles 2, the second bottom nozzles 3 and the third bottom nozzles 4 are arranged on the circular structure portion 13 in an interlaced manner. In this way, based on the uniform arrangement of multiple first bottom nozzles 2 on the cross-shaped structure portion 14, the bottom flushing and moisturizing component is conducive to more evenly flushing and moisturizing the bottom of the polishing head 5.

[0099] Regarding the number of the first bottom nozzle 2, the second bottom nozzle 3 and the third bottom nozzle 4, in the embodiment of the present application, the number of the first bottom nozzle 2, the second bottom nozzle 3 and the third bottom nozzle 4 can be three, four or more. The number of the first bottom nozzle 2, the second bottom nozzle 3 and the third bottom nozzle 4 is relatively flexible. Specifically, it needs to be determined according to the flushing coverage area of ​​the first bottom nozzle 2, the second bottom nozzle 3 and the third bottom nozzle 4. The embodiment of the present application does not make any specific limitation on this.

[0100] For the first mounting member 1, further, as Figure 3 As shown, a liquid channel 15 is provided in the first mounting member 1 , and each first bottom nozzle 2 , each second bottom nozzle 3 , and each third bottom nozzle 4 are connected to the liquid channel 15 .

[0101] like Figure 3As shown, the first mounting member 1 is also provided with a plurality of liquid supply connectors 6, which are used to be connected to a water supply system (not shown in the figure) to transport liquid into the liquid channel 15, and the plurality of liquid supply connectors 6 are evenly spaced around the central axis of the annular structure portion 13.

[0102] With such an arrangement, liquid can be delivered to each nozzle through the liquid supply connector 6 and the liquid channel 15. Each nozzle does not need to be directly connected to the water supply system through a pipeline, which is beneficial to avoid the pipeline occupying space and to optimize the water supply path layout of each nozzle, thereby making the bottom flushing and moisturizing component more concise and beautiful.

[0103] The plurality of liquid supply connectors 6 are evenly spaced around the central axis of the annular structure 13 , so that the nozzles are evenly distributed on the first mounting member 1 , which is conducive to quickly and evenly delivering liquid to the nozzles.

[0104] Regarding the number of liquid supply connectors 6, in the embodiment of the present application, two, three or more liquid supply connectors 6 can be provided. The number of liquid supply connectors 6 is relatively flexible. Specifically, it can be set according to actual usage requirements. The embodiment of the present application does not make specific limitations on this.

[0105] Of course, without considering the rapid delivery of liquid to each nozzle, the liquid supply connector 6 can be provided with only one. In this way, to a certain extent, it is conducive to reducing costs.

[0106] For the flushing and moisturizing mechanism 100, further, as Figure 2 and Figure 3 As shown, the flushing and moisturizing mechanism 100 also includes an outer contour flushing and moisturizing component independently arranged from the bottom flushing and moisturizing component, the outer contour flushing and moisturizing component includes a second mounting member 7 and a first outer contour nozzle 8, the first outer contour nozzle 8 is arranged on the second mounting member 7, the first outer contour nozzle 8 is used to spray liquid toward a connecting structure connected to the above-mentioned gap area, and the connecting structure is arranged on the top of the polishing head 5.

[0107] Since polishing liquid is also stored in the connecting structure at the top of the polishing head 5, in order to prevent the polishing liquid in the connecting structure from flowing to the gap area and crystallizing, the polishing liquid in the connecting structure can be flushed to the gap area through the first outer contour nozzle 8, and the polishing liquid flowing to the gap area can also be completely flushed away through the third bottom nozzle 4. Therefore, the first outer contour nozzle 8 is helpful to further prevent the polishing liquid from crystallizing at the bottom of the polishing head 5, and further helps to further prevent the solid particles formed by the crystallization from scratching the surface of the wafer.

[0108] Regarding the above-mentioned connecting structure, it needs to be explained that, in the present embodiment, the connecting structure includes an annular groove arranged on the top of the polishing head 5, and a connecting hole connecting the annular groove and the above-mentioned gap area. In other embodiments, the connecting structure can also be other structures, and the embodiments of the present application do not make specific limitations on this.

[0109] Furthermore, if Figure 2 and Figure 3 As shown, the outer contour flushing and moisturizing assembly also includes a second outer contour nozzle 9, which is arranged on the second mounting member 7, and the second outer contour nozzle 9 is used to spray liquid toward the side of the polishing head 5; and / or, the outer contour flushing and moisturizing assembly also includes a third outer contour nozzle 10, which is arranged on the second mounting member 7, and the third outer contour nozzle is used to spray liquid toward the connection part connecting the top and the side of the polishing head 5.

[0110] Since there will be polishing liquid on the sides and connecting parts of the polishing head 5, the flushing and moisturizing of the second outer contour nozzle 9 and the third outer contour nozzle 10 can, to a certain extent, prevent solid particles formed by crystallization from falling on the sides and connecting parts, thereby further preventing solid particles from scratching the surface of the wafer.

[0111] In a preferred embodiment, Figure 2 and Figure 3 As shown, the second mounting part 7 is provided with a second outer contour nozzle 9 and a third outer contour nozzle 10, so as to simultaneously rinse and moisturize the side and connecting part of the polishing head 5, which can further prevent solid particles formed by crystallization from falling on the side and connecting part to a certain extent, and further prevent the solid particles from scratching the surface of the wafer.

[0112] The second mounting member 7 is similar to the first mounting member 1. A liquid channel connected to each nozzle and a liquid joint connected to the liquid channel are also provided in the second mounting member 7. The beneficial effects of the liquid channel and the liquid joint provided on the second mounting member 7 are the same as those of the first mounting member 1, and will not be described again here.

[0113] For the first outer contour nozzle 8, the second outer contour nozzle 9 and the third outer contour nozzle 10, in order to be able to rinse out the polishing liquid in the connecting structure and the polishing liquid on the side and connecting parts of the polishing head 5, in a preferred embodiment, fan-shaped nozzles with greater flushing force are selected as the first outer contour nozzle 8, the second outer contour nozzle 9 and the third outer contour nozzle 10.

[0114] Of course, in other embodiments, without considering the flushing force, the first outer contour nozzle 8, the second outer contour nozzle 9 and the third outer contour nozzle 10 can be any one of a solid cone nozzle, a square nozzle, a column flow nozzle and an elliptical nozzle. In this case, the types of the first outer contour nozzle 8, the second outer contour nozzle 9 and the third outer contour nozzle 10 are more flexible, and can be selected according to actual use requirements.

[0115] In a preferred embodiment, the liquid sprayed by each nozzle is deionized water. Since deionized water contains almost no ions and impurities, it can more effectively remove the polishing liquid, debris and other pollutants remaining on the surface of the polishing head, thereby ensuring the cleanliness of the surface.

[0116] In other embodiments, the liquid may also be distilled water, ethanol, acetone or a special polishing head cleaning agent, etc. The type of the liquid can be selected flexibly, and can be selected according to actual use requirements.

[0117] Embodiment 2

[0118] The present application also provides a transfer interaction device 1000, such as Figure 4 As shown, the transfer interaction device 1000 includes a storage mechanism (not shown in the figure) and a flushing and moisturizing mechanism 100, wherein the storage mechanism is used to store the items to be transferred, and the flushing and moisturizing mechanism 100 has the same structure as any of the flushing and moisturizing mechanisms 100 in the above-mentioned embodiments, and can bring the same or similar beneficial effects. For details, please refer to the description in the above-mentioned embodiments, and this embodiment will not be repeated here. In addition, the bottom flushing and moisturizing component in the flushing and moisturizing mechanism 100 is arranged in the storage mechanism, and the outer contour flushing and moisturizing component in the flushing and moisturizing mechanism 100 is arranged on the main structure outside the storage mechanism.

[0119] In the present application, when the transfer interaction device 1000 is used to transfer wafers, the transfer object is a wafer; liquid is sprayed toward the corresponding air film 51, the retaining ring 52 and the gap area between the air film 51 and the retaining ring 52 through the first bottom nozzle 2, the second bottom nozzle 3 and the third bottom nozzle 4 respectively, which can not only wash away the polishing liquid in the air film 51, the retaining ring 52 and the gap area, but also the sprayed liquid can moisturize the air film 51, the retaining ring 52 and the gap area; in this way, through flushing and moisturizing, it is helpful to avoid crystallization of the polishing liquid in the air film 51, the retaining ring 52 and the gap area, that is, it is helpful to avoid crystallization of the polishing liquid at the bottom of the polishing head 5, and because the wafer is adsorbed on the bottom of the polishing head 5, it is also helpful to avoid solid particles formed by crystallization of the polishing liquid to scratch the surface of the wafer, which is beneficial to avoid loss of wafers and reduce costs.

[0120] Regarding the object to be transferred, in other embodiments, the object to be transferred may also be any other object, and the embodiments of the present application do not specifically limit this.

[0121] Regarding the above-mentioned storage mechanism, in the embodiment of the present application, the specific structural setting of the storage mechanism is relatively flexible, and the embodiment of the present application does not make any specific limitation on this.

[0122] Embodiment 3

[0123] The present application also provides a chemical mechanical polishing system, such as Figure 5 As shown, the chemical mechanical polishing system includes a transfer interaction device 1000 and a transfer device (not shown in the figure), wherein the transfer device is used to transfer the objects to be transferred on the transfer interaction device 1000, or the transfer device is used to transfer the objects to be transferred to the transfer interaction device 1000; the transfer interaction device 1000 has the same structure as any one of the transfer interaction devices 1000 in the above-mentioned embodiments, and can bring the same or similar beneficial effects. For details, please refer to the description in the above-mentioned embodiments, and this embodiment will not be repeated here.

[0124] In the present application, liquid is sprayed toward the corresponding air film 51, the retaining ring 52 and the gap area between the air film 51 and the retaining ring 52 through the first bottom nozzle 2, the second bottom nozzle 3 and the third bottom nozzle 4 respectively, which can not only wash away the polishing liquid in the air film 51, the retaining ring 52 and the gap area, but also the sprayed liquid can moisturize the air film 51, the retaining ring 52 and the gap area; by flushing and moisturizing, it is helpful to avoid crystallization of the polishing liquid in the air film 51, the retaining ring 52 and the gap area, that is, it is helpful to avoid crystallization of the polishing liquid at the bottom of the polishing head 5, and because the wafer is adsorbed on the bottom of the polishing head 5, it is also helpful to avoid solid particles formed by crystallization of the polishing liquid to scratch the surface of the wafer, which is beneficial to avoid loss of wafers and reduce costs.

[0125] In addition, the chemical mechanical polishing system also includes a front-end module, a polishing module and a cleaning module, wherein the front-end module is used to detect unpolished wafers, the polishing module is used to polish unpolished wafers, the cleaning module is used to clean polished wafers, the front-end module is also used to check in polished wafers after cleaning, and the transfer device is used to transfer wafers between the front-end module, the polishing module and the cleaning module.

[0126] As for the transfer device, in the embodiment of the present application, the transfer device can be a six-axis manipulator, a cylindrical coordinate manipulator or a horizontal multi-joint manipulator, etc. The type of the transfer device can be selected flexibly, and can be selected according to actual usage requirements.

[0127] Regarding the front-end module, polishing module and cleaning module, in the embodiments of the present application, the structural arrangement of the front-end module, polishing module and cleaning module is relatively flexible, and the embodiments of the present application do not make specific limitations on this.

[0128] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A flushing and moisturizing mechanism, characterized in that: include: A bottom flushing and moisturizing assembly, the bottom flushing and moisturizing assembly includes a first mounting member, a first bottom nozzle, a second bottom nozzle and a third bottom nozzle, the first bottom nozzle, the second bottom nozzle and the third bottom nozzle are all arranged on the first mounting member, the first bottom nozzle is used to spray liquid toward the air film at the bottom of the polishing head, the second bottom nozzle is used to spray the liquid toward the retaining ring at the bottom of the polishing head, and the third bottom nozzle is used to spray the liquid toward the gap area between the air film and the retaining ring.

2. The flushing and moisturizing mechanism according to claim 1, characterized in that: The second bottom nozzle is an inclined nozzle having an inclined nozzle opening for spraying the liquid, the inclined nozzle opening is arranged toward the outside of the first mounting member, and the inclined nozzle opening is arranged to be inclined upward.

3. The flushing and moisturizing mechanism according to claim 2, characterized in that: The third bottom nozzle is the inclined nozzle.

4. The flushing and moisturizing mechanism according to claim 3, characterized in that: The third bottom nozzle has a first nozzle for spraying the liquid, the first nozzle is oriented in a first direction, a first angle is formed between the first direction and a horizontal direction, and the first angle is within a range of 50°-80°.

5. The flushing and moisturizing mechanism according to any one of claims 2 to 4, characterized in that: The second bottom nozzle has a second nozzle opening for spraying the liquid, the second nozzle opening is oriented in a second direction, a second angle is formed between the second direction and the horizontal direction, and the second angle is within a range of 35°-50°.

6. The flushing and moisturizing mechanism according to any one of claims 2 to 4, characterized in that: The first mounting member is provided with a mounting inclined surface, and the inclined nozzle is arranged on the mounting inclined surface; The orientation of the inclined nozzle is perpendicular to the installation slope, and the angle between the installation slope and the horizontal plane is an acute angle.

7. The flushing and moisturizing mechanism according to claim 6, characterized in that: The inclined nozzles are arranged in a plurality in an array on the first mounting member; A plurality of mounting bosses are also arranged on the first mounting member, each of the mounting bosses is provided with the mounting inclined surface, and the plurality of inclined nozzles are arranged one by one on the plurality of mounting bosses.

8. The flushing and moisturizing mechanism according to any one of claims 2 to 4, characterized in that: The first bottom nozzle, the second bottom nozzle and the third bottom nozzle are each arranged in a plurality in an array on the first mounting member; The first mounting member includes a circular ring structure portion, a cross-shaped structure portion arranged radially inwardly of the circular ring structure portion and connected to the circular ring structure portion, a plurality of the first bottom nozzles are evenly arranged on the cross-shaped structure portion, and a plurality of the second bottom nozzles and a plurality of the third bottom nozzles are evenly distributed on the circular ring structure portion along the circumferential direction of the circular ring structure portion.

9. The flushing and moisturizing mechanism according to claim 8, characterized in that: The second bottom nozzle and the third bottom nozzle are arranged interlaced with each other on the annular structure; or, A plurality of the first bottom nozzles are also arranged on the circular ring structure portion, and the plurality of the first bottom nozzles, the plurality of the second bottom nozzles and the plurality of the third bottom nozzles are evenly distributed on the circular ring structure portion along the circumferential direction of the circular ring structure portion, and the first bottom nozzles, the second bottom nozzles and the third bottom nozzles are arranged interlaced with each other on the circular ring structure portion.

10. The flushing and moisturizing mechanism according to claim 8, characterized in that: A liquid channel is provided in the first mounting member, and each of the first bottom nozzles, each of the second bottom nozzles and each of the third bottom nozzles are in communication with the liquid channel; The first mounting member is also provided with a plurality of liquid supply connectors, which are used to be connected to a water supply system to transport the liquid into the liquid channel; the plurality of liquid supply connectors are evenly spaced around the central axis of the annular structure.

11. The flushing and moisturizing mechanism according to any one of claims 1 to 4, characterized in that: The first bottom nozzle is a solid cone nozzle; and / or, The second bottom nozzle is a fan-shaped nozzle; and / or, The third bottom nozzle is a fan-shaped nozzle.

12. The flushing and moisturizing mechanism according to any one of claims 1 to 4, characterized in that: The flushing and moisturizing mechanism also includes an outer contour flushing and moisturizing component independently arranged from the bottom flushing and moisturizing component, the outer contour flushing and moisturizing component includes a second mounting member and a first outer contour nozzle, the first outer contour nozzle is arranged on the second mounting member, the first outer contour nozzle is used to spray the liquid toward a connecting structure connected to the gap area, and the connecting structure is arranged on the top of the polishing head.

13. The flushing and moisturizing mechanism according to claim 12, characterized in that: The outer contour flushing and moisturizing assembly further comprises a second outer contour nozzle, the second outer contour nozzle is arranged on the second mounting member, and the second outer contour nozzle is used to spray the liquid toward the side of the polishing head; and / or, The outer contour flushing and moisturizing assembly also includes a third outer contour nozzle, which is arranged on the second mounting member and is used to spray the liquid toward the connecting portion connecting the top and the side.

14. A transfer interaction device, characterized in that: include: A storage mechanism, the storage mechanism is used to store items to be transferred; The flushing and moisturizing mechanism according to any one of claims 1 to 13, wherein the bottom flushing and moisturizing component in the flushing and moisturizing mechanism is arranged on the storage mechanism.

15. A chemical mechanical polishing system, characterized in that: include: The transfer interaction device as claimed in claim 14; A transfer device, wherein the transfer device is used to transfer the object to be transferred on the transfer interaction device, or the transfer device is used to transfer the object to be transferred to the transfer interaction device.

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