A positioning tool for silicon wafer processing

Abstract

The utility model relates to the technical field of silicon wafer processing, and discloses a positioning tool for silicon wafer processing, wherein a long strip-shaped support seat is distributed laterally on the top of the positioning platform, and a plurality of arc-shaped fixed clamps are evenly distributed from left to right on the top of the support seat, and a plurality of arc-shaped movable clamps are correspondingly distributed between adjacent arc-shaped fixed clamps, and the lower edges of a plurality of silicon wafers are correspondingly clamped between adjacent arc-shaped fixed clamps and arc-shaped movable clamps, and a multi-station synchronous clamping drive mechanism is installed inside the positioning platform to synchronously drive a plurality of arc-shaped movable clamps to synchronously move left and right for clamping and releasing operations, and pillars are installed at the four corner ends of the top of the positioning platform, and upper end pressing and positioning members for synchronously pressing and positioning the upper edges of a plurality of silicon wafers are installed between the four pillars. The positioning tool for silicon wafer processing realizes high-precision synchronous clamping and positioning of a plurality of silicon wafers through its sophisticated design and efficient working principle, thereby improving the efficiency and precision of silicon wafer processing.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer processing, in particular to a positioning tool for silicon wafer processing. Background Art

[0002] As a key material in semiconductor manufacturing, the processing accuracy of silicon wafers directly affects the performance and quality of the final product. In the processing of silicon wafers, accurate positioning and stable clamping are key factors to ensure processing accuracy. With the rapid development of the semiconductor industry, the precision requirements for silicon wafer processing are getting higher and higher, which requires that the positioning tooling for silicon wafer processing must have the characteristics of high precision, high stability and high efficiency.

[0003] However, the existing positioning tooling for silicon wafer processing has some shortcomings in practical applications:

[0004] Insufficient clamping accuracy: Traditional silicon wafer positioning tooling often uses a single clamping method and is unable to accurately clamp multiple silicon wafers synchronously, resulting in uneven clamping force and affecting processing accuracy.

[0005] Inconvenient clamping adjustment: The existing tooling is not flexible enough in adjusting the clamping parts, and it is difficult to adapt to silicon wafers of different sizes and shapes, which limits the versatility of the tooling.

[0006] Instability: Some tooling has defects in the clamping design on the upper edge of the silicon wafer, which cannot provide uniform and stable clamping force, and is prone to displacement or vibration during the processing, affecting the processing quality. Utility Model Content

[0007] 1. Technical issues to be resolved

[0008] In view of the deficiencies in the prior art, the utility model provides a positioning tool for silicon wafer processing to solve the above problems.

[0009] (II) Technical solution

[0010] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a positioning tool for silicon wafer processing, including a positioning table, a long strip-shaped supporting seat is horizontally distributed on the top of the positioning table, a plurality of arc-shaped fixed clamps are evenly distributed on the top of the supporting seat from left to right, and a plurality of arc-shaped movable clamps are correspondingly distributed between adjacent arc-shaped fixed clamps, and the lower edges of a plurality of silicon wafers are correspondingly clamped between the adjacent arc-shaped fixed clamps and the arc-shaped movable clamps, a multi-station synchronous clamping drive mechanism is installed inside the positioning table for synchronously driving the plurality of arc-shaped movable clamps to move left and right synchronously for clamping and releasing operations, the four corner ends of the top of the positioning table are installed with pillars, and upper end clamping positioning members for synchronously pressing and positioning the upper edges of a plurality of silicon wafers are installed between the four pillars.

[0011] Preferably, the multi-station synchronous clamping drive mechanism specifically includes the following structure:

[0012] Two driving screws are arranged in parallel in the front and rear directions, and the driving screws on the front and rear sides are correspondingly threadedly connected to the front and rear ends of each arc-shaped movable clamping member;

[0013] A synchronous driving mechanism is installed on the right end surface of the positioning platform to synchronously drive the front and rear driving screws to rotate.

[0014] Preferably, the synchronous drive mechanism specifically includes the following structure:

[0015] A drive motor installed inside the right end of the positioning platform;

[0016] A drive sprocket connected to the output end of the drive motor;

[0017] A driving shaft connected to the right ends of the driving screw rods at the front and rear sides respectively;

[0018] Transmission sprockets connected to the right ends of the drive shafts at the front and rear ends respectively;

[0019] A transmission chain belt is sleeved between the two transmission sprockets and the drive sprocket.

[0020] Preferably, the transmission ratio between the driving sprocket and the transmission sprocket is set to 1:2.

[0021] Preferably, the upper end pressing and positioning member specifically includes the following structure:

[0022] A sliding sleeve correspondingly slidably sleeved on the four pillars;

[0023] The four corner ends are fixed to the fixing frames on the inner side walls of the four sliding sleeves;

[0024] The upper edge pressing rollers of the silicon wafer are installed between the left and right frames of the fixed frame and are distributed in parallel in the transverse direction;

[0025] A corresponding limiting screw is installed on each of the sliding sleeves, and one end of the inner side of each limiting screw is pressed tightly against the outer cylindrical surface of the corresponding support.

[0026] Preferably, the top surface of the support seat is provided with a laterally distributed arc-shaped groove.

[0027] Compared with the prior art, the utility model provides a positioning tool for silicon wafer processing, which has the following beneficial effects:

[0028] High-precision synchronous clamping and positioning: This silicon wafer processing positioning fixture can simultaneously perform precise clamping and positioning operations on multiple silicon wafers through a multi-station synchronous clamping drive mechanism. The drive motor efficiently transmits power to the drive screw through the drive sprocket and transmission chain belt, realizing the synchronous movement of all arc-shaped moving clamps, ensuring uniform clamping force at the lower edge of each silicon wafer, and improving processing accuracy.

[0029] Flexible clamping adjustment: The design of the arc-shaped movable clamp allows it to move left and right on the support seat. It can be adjusted according to the size and shape of the silicon wafer to achieve clamping of silicon wafers of different specifications, thus improving the versatility and flexibility of the tooling.

[0030] Stable top clamping: The upper clamping positioning piece can stably and evenly clamp the upper edge of the silicon wafer through the cooperation of the sliding sleeve and the limiting screw, ensuring the stability of the silicon wafer during processing and reducing processing errors caused by vibration or displacement.

[0031] This silicon wafer processing positioning fixture achieves high-precision synchronous clamping and positioning of multiple silicon wafers through its sophisticated design and efficient working principle, greatly improving the efficiency and accuracy of silicon wafer processing. Its flexible clamping adjustment mechanism and stable top clamping design ensure the stability and consistency of the silicon wafer during processing, providing solid technical support for high-quality silicon wafer processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic diagram of the structure of the utility model;

[0033] Figure 2 This is a schematic diagram of explosion separation of the utility model;

[0034] Figure 3 It is a structural schematic diagram of the support seat of the utility model;

[0035] Figure 4 This is a schematic diagram of the distribution of the arc-shaped movable clamping member and the multi-station synchronous clamping drive mechanism of the utility model;

[0036] Figure 5 It is a structural schematic diagram of the synchronous drive mechanism of the utility model;

[0037] Figure 6 It is a structural schematic diagram of the upper end pressing and positioning member of the utility model.

[0038] Among them: 1. Positioning table; 2. Support seat; 3. Arc-shaped fixed clamping piece; 4. Arc-shaped movable clamping piece; 5. Multi-station synchronous clamping drive mechanism; 6. Support column; 7. Upper end clamping positioning piece;

[0039] 51. driving screw rod; 52. synchronous driving mechanism;

[0040] 521, driving motor; 522, driving sprocket; 523, transmission sprocket; 524, transmission chain belt; 525, driving shaft;

[0041] 71. Fixed frame; 72. Silicon wafer upper edge pressing roller; 73. Sliding sleeve; 74. Limiting screw. DETAILED DESCRIPTION

[0042] The utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. In the absence of conflict, the embodiments in this application and the features in the embodiments can be combined with each other. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0043] It should be noted that if the utility model embodiments involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0044] In addition, "multiple" means more than two. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0045] See also Figure 1-6 , a positioning tool for silicon wafer processing:

[0046] The positioning platform 1 is the foundation of the entire tooling. A long strip-shaped support seat 2 is designed on the top. The top surface of the support seat 2 is provided with a laterally distributed arc-shaped groove. This design is intended to provide a stable bottom support surface for the vertical placement of several silicon wafers. At the same time, the arc-shaped groove can adapt to the curvature of the silicon wafer to ensure the precise positioning of the silicon wafer during processing. There are several arc-shaped fixed clamps 3 evenly distributed from left to right on the top of the support seat 2. These clamps are fixed and used to provide basic positioning support. There are arc-shaped movable clamps 4 distributed between adjacent arc-shaped fixed clamps 3. These movable clamps can be moved left and right as needed to achieve the clamping or loosening of the lower edge of each silicon wafer.

[0047] The multi-station synchronous clamping drive mechanism 5 is a key component for achieving the clamping and loosening of silicon wafers. It includes two driving screws 51 that are horizontally distributed in parallel in front and back, and these screws are connected to the front and rear ends of each arc-shaped movable clamping member 4 through threads, so that the rotation of the screws can drive the movement of the clamping member. A synchronous driving mechanism 52 is installed on the right end surface of the positioning platform 1, which is used to synchronously drive the front and rear driving screws 51 to rotate, thereby realizing the left and right sliding operation of all arc-shaped movable clamping members 4, and then cooperating with each arc-shaped fixed clamping member 3 to perform the clamping and loosening operation on the lower edge of each silicon wafer.

[0048] The synchronous drive mechanism 52 includes a drive motor 521 installed inside the right end of the positioning platform 1, and a drive sprocket 522 is connected to the output end thereof. The drive sprocket 522 is connected to two drive sprockets 523 through a transmission chain belt 524, and the two drive sprockets 523 are respectively connected to the drive shaft 525 connected to the right ends of the drive screw 51 on the front and rear sides. This design ensures that the rotation of the drive motor 521 can be transmitted to the drive screw 51 through the sprocket and the chain belt, so as to achieve precise control of the arc-shaped moving clamping member 4. The transmission ratio between the drive sprocket 522 and the transmission sprocket 523 is set to 1:2, which means that for every rotation of the drive motor 521, the drive screw 51 will rotate two circles, thereby achieving a faster clamping operation.

[0049] The upper end clamping and positioning member 7 is used to clamp and position the upper edge of the silicon wafer to ensure the stability of the silicon wafer during processing. The component includes four sliding sleeves 73, which can slide up and down along the pillar 6. The four corner ends are fixed to the fixed frame 71 on the inner wall of the sliding sleeve 73, and the silicon wafer upper edge clamping rollers 72 are installed between the left and right frames of the fixed frame 71. These rollers can apply uniform pressure to the upper edge of the silicon wafer. A limiting screw 74 is also installed on each sliding sleeve 73, and the inner end of the limiting screw 72 is pressed against the outer cylindrical surface of the corresponding pillar 6. In this way, the position of the sliding sleeve 73 can be fixed by adjusting the limiting screw 74 to ensure that the clamping force on the upper edge of the silicon wafer is always consistent.

[0050] How it works

[0051] The silicon wafer is placed in the arc-shaped groove of the support seat 2 on the positioning platform 1, and it is ensured that the lower edge of each silicon wafer is correspondingly distributed between the adjacent arc-shaped fixed clamping members 3 and the arc-shaped movable clamping members 4.

[0052] The driving motor 521 in the synchronous driving mechanism 52 is started, and the power is transmitted to the two driving sprockets 523 through the driving sprocket 522 and the driving chain belt 524, thereby driving the driving screw rods 51 on the front and rear sides to rotate.

[0053] The rotation of the driving screw 51 drives the arc-shaped movable clamping member 4 to move leftward on the supporting seat 2 through the threaded connection, and cooperates with a plurality of arc-shaped fixed clamping members 3 to realize the clamping operation on the lower edge of the silicon wafer.

[0054] The upper end pressing positioning member 7 is operated to slide up and down along the support 6 through the sliding sleeve 73 to adjust the position of the fixing frame 71 so that the pressing roller 72 at the upper edge of the silicon wafer applies uniform pressure to the upper edge of the silicon wafer.

[0055] By adjusting the limiting screw 74 on the sliding sleeve 73, the upper end pressing and positioning member 7 is limited.

[0056] After the silicon wafer is accurately clamped and positioned, subsequent processing operations are carried out.

[0057] After the processing is completed, the upper end clamping positioning member 7 is adjusted to release the pressure on the upper edge of the silicon wafer, and the synchronous driving mechanism 52 is reversely operated to make the arc-shaped movable clamping member 4 release the lower edge of the silicon wafer, and the silicon wafer can be taken out.

[0058] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

[0059] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0060] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A positioning tool for silicon wafer processing, comprising a positioning table (1), characterized in that: A long strip-shaped support seat (2) is distributed transversely on the top of the positioning platform (1); a plurality of arc-shaped fixed clamping members (3) are evenly distributed on the top of the support seat (2) from left to right; a plurality of arc-shaped movable clamping members (4) are correspondingly distributed between adjacent arc-shaped fixed clamping members (3); the lower edges of a plurality of silicon wafers are correspondingly clamped between the adjacent arc-shaped fixed clamping members (3) and the arc-shaped movable clamping members (4); a multi-station synchronous clamping drive mechanism (5) is installed inside the positioning platform (1) for synchronously driving the plurality of arc-shaped movable clamping members (4) to move synchronously left and right for clamping and releasing operations; pillars (6) are installed at the four corner ends of the top of the positioning platform (1); and upper end clamping positioning members (7) are installed between the four pillars (6) for synchronously clamping and positioning the upper edges of a plurality of silicon wafers.

2. A positioning tool for silicon wafer processing according to claim 1, characterized in that: The multi-station synchronous clamping drive mechanism (5) specifically comprises the following structure: Two driving screw rods (51) are arranged in parallel and transversely in front and rear directions, and the driving screw rods (51) on the front and rear sides are correspondingly threadedly connected to the front and rear ends of each arc-shaped movable clamping member (4); A synchronous driving mechanism (52) is installed on the right end surface of the positioning platform (1) and is used to synchronously drive the front and rear driving screw rods (51) to rotate.

3. A positioning tool for silicon wafer processing according to claim 2, characterized in that: The synchronous drive mechanism (52) specifically comprises the following structure: A driving motor (521) installed inside the right end of the positioning platform (1); A driving sprocket (522) connected to the output end of the driving motor (521); A driving shaft (525) connected to the right ends of the driving screw rods (51) at the front and rear sides respectively; Transmission sprockets (523) respectively connected to the right ends of the drive shafts (525) at the front and rear ends; A transmission chain belt (524) is sleeved between the two transmission sprockets (523) and the driving sprocket (522).

4. A positioning tool for silicon wafer processing according to claim 3, characterized in that: The transmission ratio between the driving sprocket (522) and the transmission sprocket (523) is set to 1:

2.

5. The positioning tool for silicon wafer processing according to claim 1, characterized in that: The upper end pressing and positioning member (7) specifically comprises the following structure: A sliding sleeve (73) correspondingly slidably sleeved on the four pillars (6); The four corner ends are fixed to the fixing frame (71) on the inner side walls of the four sliding sleeves (73); Silicon wafer upper edge pressing rollers (72) installed between left and right frames of the fixed frame (71) and distributed in parallel in the transverse direction; A corresponding limiting screw (74) is installed on each of the sliding sleeves (73), and one inner end of each limiting screw (74) is pressed tightly against the outer cylindrical surface of the corresponding support (6).

6. The positioning tool for silicon wafer processing according to claim 1, characterized in that: The top surface of the support seat (2) is provided with a laterally distributed arc-shaped groove.

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