A chip centralized transport protection device

Abstract

The present application relates to the field of centralized chip transportation, and discloses a chip centralized transportation protection device. In the present application, it includes a chip protection device outer box and a chip placement box cover, the outer surface of the chip box placement plate is provided with a plurality of chip box placement grooves, an inner edge of the chip box placement groove is fixedly connected to a chip box placement groove side plate, the surface of the chip box placement groove side plate is provided with a slide groove, the outer surface of the slide groove is slidably connected to a movable plate, the upper end surface of the chip box placement groove is placed with a chip placement box body, the chip placement box cover is slid from the right side of the chip placement box body to the left to the inside of the chip placement box body, the chip protection device outer box cover is flipped through the hinge, and the magnetic suction sheet is fixedly connected to the magnetic suction buckle at the opposite position. During the movement of the entire device, the chip is well protected, and the chips are prevented from colliding with each other as much as possible, and the chip box can be fixed accordingly according to the size of the chip, which increases the convenience during use.

Description

Technical Field

[0001] The present application belongs to the technical field of centralized chip transportation, and specifically relates to a centralized chip transportation protection device. Background Art

[0002] First, with the rapid development of electronic technology and the continuous advancement of integrated circuit technology, chips, as the core components of electronic devices, are increasingly widely used in various fields. However, due to their highly sophisticated and complex characteristics, chips are extremely susceptible to interference and damage from external environmental factors such as vibration, impact, static electricity, etc. during manufacturing, testing and transportation. Therefore, ensuring the safety and stability of chips during transportation has become an urgent problem to be solved. Secondly, traditional chip transportation methods often have many shortcomings, such as imperfect protection measures and inconvenient operation, which make it difficult to meet the needs of modern chip transportation. Against this background, the centralized chip transportation protection device came into being. Its design aims to provide a more comprehensive, efficient and convenient protection solution to meet the safety and efficiency requirements of chip transportation.

[0003] For example, publication number: CN220430911U discloses a chip transfer device, including a device body and a telescopic mechanism arranged inside the device body, the telescopic mechanism includes a lifting assembly and a sliding assembly: the lifting assembly includes a first threaded rod, a first threaded slider and a fixed groove, by arranging a rotating rod, when the VDMOS chip is transferred through the transfer device, in order to improve the convenience of taking the VDMOS chip and improve the convenience of the device automatically delivering the VDMOS chip, when the VDMOS chip needs to be taken, the first knob can be rotated through the rotation of the first threaded rod to drive the first threaded slider to slide along the inner wall of the fixed groove, and the sliding of the first threaded slider drives the placement plate to slide along the outer wall of the device body through the rotation of the rotating rod, thereby realizing a control operation to improve the convenience of taking and unloading the VDMOS chip when the VDMOS chip is transferred through the transfer device.

[0004] However, if the operator does not operate the chip centralized transfer protection device properly during the movement, the chips may collide with each other, causing damage to the chips. Different types of chips have different sizes, making it impossible to fix them relatively well. Utility Model Content

[0005] The purpose of this application is to provide a chip centralized transport protection device to solve the problem that if the operator improperly operates the chip during movement, the chips may collide with each other, thereby causing damage to the chips, and different types of chips have different sizes, making it impossible to relatively fix them well.

[0006] The technical solutions adopted in this application are as follows:

[0007] A chip centralized transport protection device comprises a chip protection device outer box and a chip placement box cover, wherein the inner side of the chip protection device outer box is fixedly connected to an inner support fixing box, a chip box placement plate is placed inside the inner support fixing box, a plurality of chip box placement grooves are provided on the outer surface of the chip box placement plate, an inner edge of the chip box placement groove is fixedly connected to a chip box placement groove side plate, a slide groove is provided on the surface of the chip box placement groove side plate, a movable plate is slidably connected to the outer surface of the slide groove, the lower end of the movable plate is slidably connected to the chip box placement groove, a chip placement box body is placed on the upper end surface of the chip box placement groove, and the chip placement box cover passes through one side of the chip placement box body and is slidably connected to the inside of the chip placement box body.

[0008] By adopting the above technical solution, the operator puts the prepared chip into the chip placement box, slides the chip placement box cover from the right side of the chip placement box to the left to the inside of the chip placement box, and after completion, places the chip placement box on the surface of the chip box placement slot, and according to the size of the chip placement box, slides the movable plate from right to left through the surface of the slide slot to the edge of one side of the chip placement box for relative fixation, slides the shockproof plate from top to bottom through the shockproof plate buckle connected to it, and slides it to the inside of the shockproof plate slot. After placement, flip the outer box cover of the chip protection device through the hinge to fix the magnetic suction sheet and the magnetic suction buckle relative to each other. During the movement of the entire device, the chip is well protected, and the chips are prevented from colliding with each other as much as possible, and the chip box can be fixed accordingly according to the size of the chip. The chip centralized transportation protection device can provide all-round protection, effectively preventing the chip from being affected by adverse factors such as physical damage, vibration, impact and static electricity during transportation, ensuring that the chip always remains stable during the entire transportation process, and avoiding performance degradation or damage caused by external factors.

[0009] In a preferred embodiment, a hinge is fixedly connected to the edge of the outer surface of one side of the chip protection device outer box, the outer ring of the hinge is fixedly connected to the chip protection device outer box cover, and the inner surface of the chip protection device outer box cover is fixedly connected to a magnetic sheet corresponding to the magnetic buckle.

[0010] By adopting the above technical solution, the magnetic sheet and the magnetic buckle produce an adsorption effect, making them relatively fixed, thereby increasing the overall stability.

[0011] In a preferred embodiment, a magnetic buckle is fixedly mounted on an outer surface of one side of the chip protection device outer box.

[0012] By adopting the above technical solution, the magnetic buckle does not require a complicated buckling mechanism, and the connection can be achieved by simply bringing them close together. This design greatly simplifies the operation process and improves the use efficiency of the transfer device.

[0013] In a preferred embodiment, shockproof plate slots are provided on both side outer surfaces of the inner support fixing box, the inner side surfaces of the shockproof plate slots are slidably connected with shockproof plate buckles, and the upper ends of the shockproof plate buckles are fixedly connected with shockproof plates.

[0014] By adopting the above technical solution, the shockproof plate has good impact resistance and vibration resistance and can adapt to various complex transportation environments.

[0015] In a preferred embodiment, a chip protection device outer box cover is hingedly connected to an edge of one end of the chip protection device outer box, and a chip protection device outer box cover handle is fixedly mounted on the outer surface of the chip protection device outer box cover.

[0016] By adopting the above technical solution, the chip protection device outer box cover handle enables the operator to control the transfer device more firmly and try to prevent slipping or falling during the movement. This not only protects the chip from potential physical damage, but also ensures the safety of the operator.

[0017] In a preferred embodiment, a chip is placed inside the chip placement box.

[0018] By adopting the above technical solution, the chip placement box protects the chip, preventing the chip from being damaged as much as possible and also preventing the possibility of the chip falling as much as possible.

[0019] In a preferred embodiment, a rubber support frame is provided inside the inner support fixing box.

[0020] By adopting the above technical solution, the inner support fixing box supports the outer box of the chip protection device, and tries to prevent extrusion and collision during transportation.

[0021] In a preferred embodiment, sponge particles are arranged inside the chip box placement plate.

[0022] By adopting the above technical solution, static electricity may pose a threat to the chip, and the sponge particles have certain static dissipation properties, which can reduce the generation and accumulation of static electricity and further protect the chip from static damage.

[0023] In summary, due to the adoption of the above technical solution, the beneficial effects of this application are:

[0024] In the present application, the operator places the prepared chip into the chip placement box, slides the chip placement box cover from the right side of the chip placement box to the left to the inside of the chip placement box, and after completion, places the chip placement box on the surface of the chip box placement slot, and according to the size of the chip placement box, slides the movable plate from right to left through the surface of the slide slot to one side edge of the chip placement box for relative fixation, slides the shockproof plate from top to bottom through the shockproof plate buckle connected to it to the inside of the shockproof plate slot, and after placement, flips the outer box cover of the chip protection device through the hinge to fix the magnetic suction sheet and the magnetic suction buckle relative to each other. During the movement of the entire device, the chip is well protected, and the chips are prevented from colliding with each other as much as possible. The chip box can be relatively fixed according to the size of the chip, which increases the convenience during use. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of the overall structure of the chip centralized transport protection device in this application from the first perspective;

[0026] Figure 2 This is a schematic diagram of the overall structure of the chip centralized transport protection device in this application from a second perspective;

[0027] Figure 3 This is a schematic diagram of the structure of the chip centralized transport protection device in this application;

[0028] Figure 4 This is a schematic diagram of the structure of the chip centralized transport protection device in the present application from the first perspective;

[0029] Figure 5 This is a schematic diagram of the structure of the chip centralized transport protection device in the present application from the second viewing angle;

[0030] Figure 6 This is a schematic diagram of the expanded structure of the chip box in this application;

[0031] Figure 7 For this application Figure 5 Enlarged view of point A in .

[0032] Markings in the figure: 1. Chip protection device outer box; 2. Hinge; 3. Chip protection device outer box cover; 4. Magnetic buckle; 5. Magnetic sheet; 6. Shockproof plate; 7. Chip protection device outer box cover handle; 8. Shockproof plate buckle; 9. Inner support fixing box; 10. Chip box placement plate; 11. Chip placement box body; 12. Chip placement box cover; 13. Shockproof plate slot; 14. Chip box placement slot; 15. Chip box placement slot side plate; 16. Slide slot; 17. Moving plate; 18. Chip. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in combination with the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0034] Example:

[0035] Reference Figure 1-7 ,

[0036] A chip centralized transport protection device comprises a chip protection device outer box 1 and a chip placement box cover 12, wherein an inner support fixing box 9 is fixedly connected to the inner side of the chip protection device outer box 1, a chip box placement plate 10 is placed inside the inner support fixing box 9, a plurality of chip box placement grooves 14 are provided on the outer surface of the chip box placement plate 10, a chip box placement groove side plate 15 is fixedly connected to an inner edge of the chip box placement groove 14, a slide groove 16 is provided on the surface of the chip box placement groove side plate 15, a movable plate 17 is slidably connected to the outer surface of the slide groove 16, a lower end of the movable plate 17 is slidably connected to the chip box placement groove 14, a chip placement box body 11 is placed on the upper end surface of the chip box placement groove 14, and a chip placement box cover 12 passes through one side of the chip placement box body 11 and is slidably connected to the inside of the chip placement box body 11.

[0037] The operator places the prepared chip 18 into the chip placement box 11, slides the chip placement box cover 12 from the right side of the chip placement box 11 to the left into the chip placement box 11, and after completion, places the chip placement box 11 on the surface of the chip box placement groove 14, and according to the size of the chip placement box 11, slides the movable plate 17 from right to left through the surface of the slide groove 16 to one side edge of the chip placement box 11 for relative fixation, slides the shockproof plate 6 from top to bottom through the shockproof plate buckle 8 connected thereto to the inside of the shockproof plate slot 13, and after placement, flips the outer box cover 3 of the chip protection device through the hinge 2, and fixes the magnetic suction sheet 5 and the magnetic suction buckle 4 at the opposite position. During the movement, the entire device protects the chips very well, prevents the chips from colliding with each other as much as possible, and can fix the chip boxes accordingly according to the chip size. The centralized chip transportation protection device can provide all-round protection, effectively preventing the chips from being affected by adverse factors such as physical damage, vibration, impact and static electricity during transportation, ensuring that the chips always remain stable during the entire transportation process, avoiding performance degradation or damage caused by external factors.

[0038] Reference Figure 1 ,

[0039] A hinge 2 is fixedly connected to the edge of the outer surface of one side of the chip protection device outer box 1, and the outer ring of the hinge 2 is fixedly connected to the chip protection device outer box cover 3. A magnetic sheet 5 is fixedly connected to the inner surface of the chip protection device outer box cover 3 corresponding to the magnetic buckle 4. The magnetic sheet 5 and the magnetic buckle 4 produce an adsorption effect, making them relatively fixed, thereby increasing the overall stability.

[0040] Reference Figure 1 Figure 2 ,

[0041] A magnetic buckle 4 is fixedly installed on the outer surface of one side of the chip protection device outer box 1. The magnetic buckle 4 does not require a complicated buckling mechanism and can be connected simply by approaching it. This design greatly simplifies the operation process and improves the use efficiency of the transfer device.

[0042] Reference Figure 3 and Figure 4 ,

[0043] Shockproof plate slots 13 are provided on the outer surfaces of both sides of the inner support fixing box 9, and the inner surfaces of the shockproof plate slots 13 are slidably connected with shockproof plate buckles 8, and the upper ends of the shockproof plate buckles 8 are fixedly connected with shockproof plates 6. The shockproof plates 6 have good impact and vibration resistance and can adapt to various complex transportation environments.

[0044] Reference Figure 1 and Figure 2 ,

[0045] The chip protection device outer box 1 is hinged at one end with a chip protection device outer box cover 3, and a chip protection device outer box cover handle 7 is fixedly mounted on the outer surface of the chip protection device outer box cover 3. The chip protection device outer box cover handle 7 enables the operator to more firmly control the transfer device and try to prevent it from slipping or falling during the movement. This not only protects the chip from potential physical damage, but also ensures the safety of the operator.

[0046] Reference Figure 6 ,

[0047] A chip 18 is placed inside the chip placement box 11 , and the chip placement box 11 protects the chip 18 , preventing the chip from being damaged as much as possible and also preventing the possibility of the chip falling as much as possible.

[0048] Reference Figure 3 and Figure 4 ,

[0049] A rubber support frame is arranged inside the inner support fixing box 9, and the inner support fixing box 9 supports the chip protection device outer box 1 to prevent extrusion and collision during transportation as much as possible.

[0050] Reference Figure 3 and Figure 5 ,

[0051] Sponge particles are arranged inside the chip box placement plate 10. Static electricity may pose a threat to the chip, and the sponge particles have a certain static dissipation performance, which can reduce the generation and accumulation of static electricity and further protect the chip from static electricity damage.

[0052] The implementation principle of the embodiment of the chip centralized transport protection device of the present application is:

[0053] The operator puts the prepared chip 18 into the chip placement box 11, slides the chip placement box cover 12 from the right side of the chip placement box 11 to the left to the inside of the chip placement box 11, and after completion, places the chip placement box 11 on the surface of the chip box placement groove 14, and according to the size of the chip placement box 11, slides the movable plate 17 from right to left through the surface of the slide groove 16 to one side edge of the chip placement box 11 to be relatively fixed, and slides the shockproof plate 6 from top to bottom through the shockproof plate buckle 8 connected to it to the inside of the shockproof plate slot 13. After placement, flip the outer box cover 3 of the chip protection device through the hinge 2 to fix the magnetic sheet 5 and the magnetic buckle 4 at the opposite position. During the movement of the entire device, the chip is well protected, and the chips are prevented from colliding with each other as much as possible, and the chip box can be fixed accordingly according to the size of the chip.

[0054] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A chip centralized transport protection device, comprising a chip protection device outer box (1) and a chip placement box cover (12), characterized in that: The inner side of the chip protection device outer box (1) is fixedly connected to an inner support fixing box (9), a chip box placement plate (10) is placed inside the inner support fixing box (9), a plurality of chip box placement grooves (14) are provided on the outer surface of the chip box placement plate (10), an inner edge of the chip box placement groove (14) is fixedly connected to a chip box placement groove side plate (15), a slide groove (16) is provided on the surface of the chip box placement groove side plate (15), a movable plate (17) is slidably connected to the outer surface of the slide groove (16), the lower end of the movable plate (17) is slidably connected to the chip box placement groove (14), a chip placement box body (11) is placed on the upper end surface of the chip box placement groove (14), and the chip placement box cover (12) passes through one side of the chip placement box body (11) and is slidably connected to the inside of the chip placement box body (11).

2. A chip centralized transport protection device as claimed in claim 1, characterized in that: A hinge (2) is fixedly connected to the edge of the outer surface of one side of the chip protection device outer box (1); the outer ring of the hinge (2) is fixedly connected to the chip protection device outer box cover (3); and a magnetic attraction sheet (5) is fixedly connected to the inner surface of the chip protection device outer box cover (3) at a position corresponding to the magnetic attraction buckle (4).

3. The chip centralized transport protection device according to claim 1, characterized in that: A magnetic buckle (4) is fixedly mounted on one outer surface of the chip protection device outer box (1).

4. The chip centralized transport protection device according to claim 1, characterized in that: The outer surfaces of both sides of the inner support fixing box (9) are provided with anti-vibration plate slots (13), the inner surfaces of the anti-vibration plate slots (13) are slidably connected with anti-vibration plate buckles (8), and the upper ends of the anti-vibration plate buckles (8) are fixedly connected with the anti-vibration plate (6).

5. The chip centralized transport protection device according to claim 1, characterized in that: One end edge of the chip protection device outer box (1) is hingedly connected to a chip protection device outer box cover (3), and a chip protection device outer box cover handle (7) is fixedly mounted on the outer surface of the chip protection device outer box cover (3).

6. The chip centralized transport protection device according to claim 1, characterized in that: A chip (18) is placed inside the chip placement box (11).

7. The chip centralized transport protection device according to claim 1, characterized in that: A rubber support frame is arranged inside the inner support fixing box (9).

8. The chip centralized transport protection device according to claim 1, characterized in that: Sponge particles are arranged inside the chip box placement plate (10).

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