Device for continuous and uniform magnetron sputtering coating on surface of powder

Abstract

The utility model discloses a continuous and uniform magnetron sputtering coating device for a powder surface. The continuous and uniform magnetron sputtering coating device comprises a feeding disc, the linear feeding groove is connected with the feeding disc; the first linear vibration base is arranged at the lower end of the linear feeding groove; the vibrating disc is connected with the linear feeding groove, and paddles are arranged in the vibrating disc; the circular piezoelectric vibration base is arranged at the lower end of the vibration disc; the linear discharging groove is connected with the vibration disc; the second linear vibration base is arranged at the lower end of the linear discharging groove; and the material storage box is connected with the linear discharging groove. The method has the advantages that the application of the magnetron sputtering technology in powder surface deposition coating is effectively expanded, and the high-performance modified coating can be obtained.

Description

Technical Field

[0001] The utility model relates to the technical field of mechanical manufacturing and powder surface modification devices, in particular to a device for continuous and uniform magnetron sputtering coating of powder surfaces. Background Art

[0002] At present, powder is a material that exists in the form of particles and is widely used in additive manufacturing, material preparation and other fields. Magnetron sputtering technology is a method of preparing thin films or coatings by applying a certain external electric field between the target and the substrate to further accelerate the charged ions therebetween, which can effectively bombard the target, so that the atoms or molecules on the surface of the target are deposited on the surface of the material. Magnetron sputtering has the advantages of simple operation, fast film formation rate, easy control of composition, low preparation temperature and high vacuum, and is an effective method for preparing high-purity thin films or coatings. At present, magnetron sputtering technology has been widely used in the preparation of nanomaterials, biomedical materials, optical coatings, semiconductor materials, magnetic materials, etc. In the magnetron sputtering process, the composition, morphology and structure of the film / coating can be controlled by adjusting factors such as gas pressure, power supply power, target material, substrate bias, etc. In recent years, the use of magnetron sputtering technology to deposit coatings on the surface of powders has become an important method to improve the performance of powders. Compared with liquid phase coating technology, the coating prepared on the powder surface using magnetron sputtering technology has the advantages of high purity and flexible and controllable composition, but how to improve the uniformity of the coating on the powder surface is an important challenge it faces. Since powder materials usually have a large specific surface area and a strong tendency to agglomerate to reduce the surface energy of the system, the coating will not be evenly coated on its surface during the coating process. In addition, the vapor deposited particles in magnetron sputtering technology usually have strong directionality. When they leave the target material and deposit on the powder surface, they will form a shadow effect due to the obstruction of the surrounding powder particles, resulting in no material deposition on the surface of some particles. Therefore, the core issue of magnetron sputtering coating of powders is how to achieve uniform dispersion and continuous tumbling of the powder during the coating process.

[0003] In the prior art, magnetron sputtering coating of powders usually uses a material tray that is vibrated by a simple electromagnet, or uses a drum-type powder to tumble in a barrel, or uses blades for stirring. The powder oscillates or rolls up and down in a disordered manner during the coating process, which cannot guarantee the uniformity of the powder coating and is prone to cause dust to diffuse into the vacuum furnace chamber, damaging the vacuum system. In the process of magnetron sputtering coating, precise control of film thickness is another key to ensure the stability of coating quality. Generally, the film thickness test is carried out after the coating is completed. It is difficult to monitor the film thickness more accurately in situ during the coating process.

[0004] In summary, there are the following technical problems:

[0005] How to achieve uniform dispersion and continuous tumbling of powder during coating process;

[0006] The disordered up and down oscillation or rolling of the powder during the coating process cannot guarantee the uniformity of the powder coating, and it is easy to cause dust to diffuse into the vacuum furnace chamber and damage the vacuum system.

[0007] The film thickness test is carried out after the coating is completed. It is difficult to accurately monitor the film thickness in situ during the coating process. Utility Model Content

[0008] The main purpose of the utility model is to provide a device for continuous and uniform magnetron sputtering coating on the surface of powders, so as to solve the problem in the prior art of how to achieve uniform dispersion and continuous rolling of powders during the coating process; the disordered up and down oscillation or rolling of powders during the coating process cannot guarantee the uniformity of powder coating, and it is easy to cause dust to disperse into the vacuum furnace chamber and damage the vacuum system. The film thickness test is carried out after the coating is completed. It is a difficult technical problem to accurately monitor the film thickness in situ during the coating process.

[0009] In order to achieve the above object, according to one aspect of the utility model, a device for continuous and uniform magnetron sputtering coating of a powder surface is provided, comprising:

[0010] Feed tray;

[0011] A linear feed trough connected to the feed tray;

[0012] A first linear vibration base, the first linear vibration base is arranged at the lower end of the linear feed trough;

[0013] A vibrating plate, the vibrating plate is connected to the linear feed trough, and the vibrating plate is provided with a paddle;

[0014] A circular piezoelectric vibration base, wherein the circular piezoelectric vibration base is arranged at the lower end of the vibration plate;

[0015] A linear discharge chute connected to the vibrating plate; and

[0016] A second linear vibration base, the second linear vibration base is arranged at the lower end of the linear discharge chute;

[0017] A material storage box is connected to the linear material discharge chute.

[0018] Preferably, it also includes a feed baffle, which is arranged between the linear feed trough and the vibration plate.

[0019] Preferably, it also includes a discharge baffle, which is arranged between the linear discharge chute and the vibration plate.

[0020] Preferably, a first lifting controller is provided at the lower end of the feed baffle.

[0021] Preferably, a second lifting controller is provided at the lower end of the discharge plate.

[0022] Preferably, the feed tray, the linear feed trough, the vibration tray and the linear discharge trough are on the same plane.

[0023] Preferably, the upper part of the blade is configured as a mesh structure, and the lower part is configured as a plate structure.

[0024] Preferably, a driven bevel gear is provided at the end of the blade, the driven bevel gear is connected to the driving bevel gear, and the driving bevel gear is connected to the motor through a transmission shaft.

[0025] Preferably, the feed tray is connected to a linear feed trough, the linear feed trough is connected to a vibration tray, the vibration tray is connected to a linear discharge trough, and the linear discharge trough is connected to a storage box.

[0026] Preferably, an optical film thickness instrument is provided on the vibration plate.

[0027] The application of the technical solution of the utility model has the following technical effects:

[0028] It can effectively disperse the powder during the powder coating process by magnetron sputtering technology, prevent powder agglomeration, and enable the powder to be orderly arranged, tumbled, and circulated back and forth under magnetron sputtering conditions. At the same time, an optical film thickness meter is used to monitor the film thickness in situ during the coating process. For the detection of the film thickness on the powder surface, the surface of the powder is flattened by the paddle, which can achieve accurate measurement of the coating thickness, ensure the uniformity and controllability of the film thickness on the powder surface, and effectively expand the application of magnetron sputtering technology in depositing coatings on the powder surface, and help to obtain high-performance modified coatings. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The drawings constituting part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0030] Figure 1 A schematic structural diagram of a device for continuous and uniform magnetron sputtering coating of a powder surface according to the utility model is shown;

[0031] Figure 2 Shows Figure 1 A front view of a device for continuous and uniform magnetron sputtering coating of a powder surface;

[0032] Figure 3 Shows Figure 1 View of the blade structure of the device for continuous and uniform magnetron sputtering coating of the powder surface.

[0033] The above drawings include the following reference numerals:

[0034] Feed tray 1; first linear vibration base 2; linear feed trough 3; first lifting controller 4; feed baffle 5; circular piezoelectric vibration base 6; vibration plate 7; second lifting controller 8; discharge baffle 9; second linear vibration base 10; linear discharge trough 11; storage box 12; paddle 13; optical film thickness meter 14; active bevel gear 15; driven bevel gear 16; transmission shaft 17; lifting platform 18. DETAILED DESCRIPTION

[0035] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present utility model will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0036] like Figures 1 to 3 As shown, an embodiment of the utility model provides a device for continuous and uniform magnetron sputtering coating of a powder surface, comprising: a feed tray 1; a linear feed trough 3, which is connected to the feed tray 1; a first linear vibration base 2, which is arranged at the lower end of the linear feed trough 3; a vibration disk 7, which is connected to the linear feed trough 3, and a paddle 13 is provided in the vibration disk 7; a circular piezoelectric vibration base 6, which is arranged at the lower end of the vibration disk 7; a linear discharge trough 11, which is connected to the vibration disk 7; and a second linear vibration base 10, which is arranged at the lower end of the linear discharge trough 11; a storage box 12, which is connected to the linear discharge trough 11.

[0037] The utility model includes a feed tray 1, a first linear vibration base 2, a linear feed trough 3, a first lifting controller 4, a feed baffle 5, a circular piezoelectric vibration base 6, a vibration tray 7, a second lifting controller 8, a discharge baffle 9, a second linear vibration base 10, a linear discharge trough 11, a storage box 12, a paddle 13, an optical film thickness meter 14, an active bevel gear 15, a driven bevel gear 16, a transmission shaft 17 and a lifting platform 18.

[0038] In this embodiment, the feed tray 1, the linear feed trough 3, the vibration tray 7 and the linear discharge trough 11 are on the same plane to realize the continuous conveying of the powder. The feed tray 1 is connected to the linear feed trough 3, the linear feed trough 3 is connected to the vibration tray 7, the vibration tray 7 is connected to the linear discharge trough 11, and the linear discharge trough 11 is connected to the storage box 12. The linear feed trough 3 is connected to the feed tray 1; the first linear vibration base 2 is set at the lower end of the linear feed trough 3; the first linear vibration base 2 and the linear feed trough 3 are fixed by screws. The powder moves continuously under the action of the powder linear vibrator, and rotates, vibrates and rolls under the action of the circular vibrator to ensure the continuous and uniform coating of the powder surface. The method has the characteristics of continuous movement of powder, rotation, vibration and rolling, and continuous and uniform coating, which meets the scientific research and industrial needs of magnetron sputtering uniform coating on the powder surface. The vibration tray 7 is connected to the linear feed trough 3, and the vibration tray 7 is provided with a paddle 13; the upper half of the paddle 13 is set as a mesh structure, and the lower half is set as a plate structure. A driven bevel gear 16 is provided at the end of the paddle 13, and the driven bevel gear 16 is connected to the driving bevel gear 15, and the driving bevel gear 15 is connected to the motor through the transmission shaft 17. An optical film thickness meter 14 is provided on the vibration disk 7. The motor drives the transmission shaft 17 to rotate, driving the driving bevel gear 15 at the end of the paddle 13 to rotate, further rotating the driven bevel gear 16, thereby driving the paddle 13 to flip. Working principle of the paddle 13: the two paddles 13 have a half screen structure and the other half is a flat plate structure. The screen mesh can be adjusted by replacing the paddle 13; the powder enters the vibration disk 7, and during the magnetron sputtering process, the rotating structure is used to stir the screen part of the paddle 13 at the bottom, and the powder can pass through the screen to stir the powder, and the powder can also be prevented from agglomerating; when the film thickness needs to be detected, the rotating structure is used to make the flat plate part of the paddle 13 at the bottom, so that the powder is flattened in the vibration disk 7 for easy detection of the film thickness. In summary, the paddle 13 is more conducive to the dispersion of the powder on the one hand, and can cooperate with the optical film thickness meter 14 to detect the film thickness of the leveled powder on the other hand, because only using vibration stirring cannot accurately measure the thickness of the powder surface. At present, the conventional film thickness detection of the magnetron sputtering process is to detect the surface of the block.

[0039] In this embodiment, a circular piezoelectric vibration base 6 is provided at the lower end of the vibration disk 7. In the device, the circular piezoelectric vibration base 6 and the vibration disk 7 are fixed by screws. A linear discharge trough 11, the linear discharge trough 11 is connected to the vibration disk 7; a second linear vibration base 10, the second linear vibration base 10 is provided at the lower end of the linear discharge trough 11; the second linear vibration base 10 and the linear discharge trough 11 are fixed by screws. A storage box 12 is connected to the linear discharge trough 11. It also includes a feed baffle 5, the feed baffle 5 is provided between the linear feed trough 3 and the vibration disk 7. It also includes a discharge baffle 9, the discharge baffle 9 is provided between the linear discharge trough 11 and the vibration disk 7. A first lifting controller 4 is provided at the lower end of the feed baffle 5. A second lifting controller 8 is provided at the lower end of the discharge plate. The first lifting controller 4 and the feed baffle 5 are connected by a round rod, and the discharge baffle 9 forms a good sealing effect with the vibration disk 7 in the closed state. The second lifting controller 8 and the discharging baffle 9 are connected by a round rod, and the discharging baffle 9 forms a good sealing effect with the vibration plate 7 in a closed state.

[0040] Specifically, the utility model aims to solve the problem of uneven surface coating thickness in the process of magnetron sputtering coating on the powder surface. The utility model includes a linear vibration base, a vibration plate, a frequency modulation vibration controller, etc. The linear vibration base and the circular vibration base are used to make the powder move along the device in a circular manner, and the powder in the vibration plate 7 generates a rotating tumbling reciprocating vibration, which can effectively improve the uniformity of the coating on the powder surface and control the thickness of the coating.

[0041] Specifically, the utility model realizes the effective dispersion of powders in the powder coating process by magnetron sputtering technology, prevents powder agglomeration, and enables the powders to be orderly arranged, tumbled, and circulated under magnetron sputtering conditions, while using an optical film thickness meter 14 to monitor the film thickness in situ during the coating process. In order to detect the film thickness on the powder surface, the utility model uses the designed paddle 13 to flatten the surface of the powder, which can achieve accurate measurement of the coating thickness and ensure the uniformity and controllability of the film thickness on the powder surface. Therefore, the utility model can effectively expand the application of magnetron sputtering technology in depositing coatings on powder surfaces, and help to obtain high-performance modified coatings.

[0042] In this embodiment, the surface of the SiC ceramic powder on which the Cu coating is deposited is continuously and uniformly magnetron sputtered. First, SiC ceramic powder (325 mesh) is added to the feed disk 1, and then the controller is used to start the linear vibration base with a vibration frequency of 200Hz; at the same time, the lifting controller controls the connecting rod to descend to control the feed baffle 5 to descend so that the powder enters the vibration disk 7; after 60s, the controller closes the linear vibration base, and at the same time, the lifting controller controls the connecting rod to rise to control the feed baffle 5 to rise and block the feed inlet; then the circular piezoelectric vibration base 6 is started with a vibration frequency of 200Hz, and the powder rotates and vibrates in the vibration disk 7, and at the same time, the paddle 13 is adjusted so that the end without the screen faces downward, and the paddle 13 is adjusted to rise to a height of 5mm. After the powder in the vibration disk 7 rotates and vibrates for 60s, the optical film thickness meter 14 is turned on to detect and calibrate the film thickness on the surface of the powder to zero; Then adjust the blade 13 so that the end with the screen is facing downward, and lower the blade 13 to fit the vibration disk 7; at this time, the magnetron sputtering work can be started, and the magnetron sputtering high village Cu target material above starts sputtering; use AC power, sputtering power 400W; and set PLC control every 3 minutes, adjust the blade 13 so that the end without the screen is facing downward, and adjust the blade 13 to rise to a height of 5mm. After the powder in the vibration disk 7 rotates and vibrates for 60s, the optical film thickness meter 14 detects the film thickness on the surface of the powder again and records the coating thickness at this time; then adjust the blade 13 so that the end with the screen is facing downward, and lower the blade 13 to fit the vibration disk 7; this cycle is repeated, and when the film thickness on the surface of the powder reaches 5um, the equipment stops sputtering. After sputtering is completed, the controller starts the linear vibration base with a vibration frequency of 200Hz. At the same time, the lifting controller controls the connection rod to descend to control the feed baffle 5 to descend so that the powder enters the linear discharge trough 1111 and moves into the storage box 12. By repeating this cycle, continuous and uniform magnetron sputtering copper plating on the surface of SiC ceramic powder can be achieved.

[0043] Working principle:

[0044] The powder is first added to the feed plate 1, and then the controller is used to start the linear vibration base. At the same time, the first lifting controller 4 controls the connecting rod to descend to control the feed baffle 5 to descend so that the powder enters the vibration plate 7; after a period of time, the controller closes the linear vibration base, and at the same time, the first lifting controller 4 controls the connecting rod to rise to control the feed baffle 5 to rise and block the feed port; then the circular piezoelectric vibration base 6 is started, and the powder rotates and vibrates in the vibration plate 7, and at the same time, the paddle 13 is adjusted so that the end without the screen faces downward, and the paddle 13 is adjusted to rise to a certain height, and the hydraulic system of the lifting platform 18 raises the table top, and the table top is connected to the transmission shaft 17 of the paddle 13, so that the transmission shaft 17 drives the paddle 13 to rise, and the transmission shaft 17 is connected to the motor, and the motor is set on the table top, wherein the lifting platform 18 can adopt a lifting structure that can be lifted and lowered in the prior art. After the powder in the vibration disk 7 rotates and vibrates for a period of time, the optical film thickness meter 14 is turned on to detect and calibrate the film thickness on the powder surface to zero; then the blade 13 is adjusted so that the end with the screen faces downward, and the blade 13 is lowered to fit the vibration disk 7; at this time, the magnetron sputtering work can be started, and the magnetron sputtering target directly above begins to sputter; and the PLC control is set to drive the transmission shaft 17 to rotate at regular intervals, driving the active bevel gear 15 at the end of the blade 13, and further rotating the driven bevel gear 16, thereby driving the blade 13 to flip.

[0045] Adjust the paddle 13 so that the end without the screen faces downward, and adjust the paddle 13 to rise to a certain height. After the powder in the vibration disk 7 rotates and vibrates for a period of time, the optical film thickness meter 14 detects the film thickness on the powder surface again and records the coating thickness at this time; then adjust the paddle 13 so that the end with the screen faces downward, and lower the paddle 13 to fit the vibration disk 7; repeat this cycle, and when the film thickness on the powder surface reaches the specified requirement, the equipment stops sputtering. After sputtering is completed, the controller starts the linear vibration base, and at the same time, the second lifting controller 8 controls the connection rod to descend to control the feed baffle 5 to descend so that the powder enters the linear discharge trough 11 and moves into the storage box 12. Repeat this cycle to achieve continuous and uniform magnetron sputtering coating on the powder surface.

[0046] From the above description, it can be seen that the above embodiments of the utility model achieve the following technical effects:

[0047] The invention has the function of effectively dispersing the powder in the process of powder coating by magnetron sputtering technology, preventing powder agglomeration, and enabling the powder to be orderly arranged, tumbled and circulated back and forth under the working condition of magnetron sputtering, and at the same time using the optical film thickness meter 14 to monitor the film thickness in situ during the coating process. For the detection of the film thickness on the powder surface, the surface of the powder is flattened by the paddle 13, which can realize the accurate measurement of the coating thickness, ensure the uniformity and controllability of the film thickness on the powder surface, and effectively expand the application of magnetron sputtering technology in depositing coatings on the powder surface, and help to obtain the technical effect of high-performance modified coatings.

[0048] The above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. For those skilled in the art, the utility model may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A device for continuous and uniform magnetron sputtering coating of powder surface, characterized in that: include: Feed tray; A linear feed trough connected to the feed tray; A first linear vibration base, the first linear vibration base is arranged at the lower end of the linear feed trough; A vibrating plate, the vibrating plate is connected to the linear feed trough, and the vibrating plate is provided with a paddle; A circular piezoelectric vibration base, wherein the circular piezoelectric vibration base is arranged at the lower end of the vibration plate; A linear discharge chute connected to the vibrating plate; and A second linear vibration base, the second linear vibration base is arranged at the lower end of the linear discharge chute; A material storage box is connected to the linear material discharge chute.

2. The device for continuous and uniform magnetron sputtering coating of powder surface according to claim 1, characterized in that: It also includes a feed baffle, which is arranged between the linear feed trough and the vibration plate.

3. The device for continuous and uniform magnetron sputtering coating of powder surface according to claim 1, characterized in that: It also includes a discharge baffle, which is arranged between the linear discharge chute and the vibration plate.

4. The device for continuous and uniform magnetron sputtering coating of powder surface as claimed in claim 2, characterized in that: A first lifting controller is arranged at the lower end of the feed baffle.

5. The device for continuous and uniform magnetron sputtering coating of powder surface as claimed in claim 3, characterized in that: A second lifting controller is provided at the lower end of the discharging baffle.

6. The device for continuous and uniform magnetron sputtering coating of powder surface as claimed in claim 1, characterized in that: The feed tray, the linear feed trough, the vibration tray and the linear discharge trough are located on the same plane.

7. The device for continuous and uniform magnetron sputtering coating of powder surface as claimed in claim 1, characterized in that: The upper part of the blade is configured as a mesh structure, and the lower part is configured as a plate structure.

8. The device for continuous and uniform magnetron sputtering coating of powder surface as claimed in claim 1, characterized in that: A driven bevel gear is provided at the end of the blade, the driven bevel gear is connected to the driving bevel gear, and the driving bevel gear is connected to the motor through a transmission shaft.

9. The device for continuous and uniform magnetron sputtering coating of powder surface as claimed in claim 1, characterized in that: The feed tray is communicated with a linear feed trough, the linear feed trough is communicated with a vibration tray, the vibration tray is communicated with a linear discharge trough, and the linear discharge trough is communicated with a storage box.

10. The device for continuous and uniform magnetron sputtering coating of powder surface according to claim 1, characterized in that: An optical film thickness instrument is arranged on the vibration plate.

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