Cleaning table and cleaning device

Abstract

The utility model discloses a cleaning table and a cleaning device, and belongs to the technical field of wafer processing, the cleaning table comprises a first bearing assembly, a second bearing assembly and a driving assembly; the first bearing assembly comprises a first carrying seat, a porous ceramic seat mounted on the first carrying seat and a plurality of clamping devices; the multiple clamping devices are arranged on the first carrying base in the circumferential direction of the porous ceramic base at intervals. The second bearing assembly comprises a second bearing base and a plurality of suction cups installed on the second bearing base. The plurality of suckers are arranged at intervals; the driving assembly is provided with a transmission part used for driving the first carrying base or the second carrying base to rotate, and the first carrying base and the second carrying base are detachably installed on the transmission part. The cleaning table can adapt to different types of wafers, and the universality of the cleaning table is high.

Description

Technical Field

[0001] The utility model relates to the field of chip processing technology, in particular to a cleaning table and a cleaning device. Background Art

[0002] In the field of semiconductor manufacturing, it is often necessary to temporarily bond an ultra-thin wafer to a carrier to enhance its structural strength and facilitate subsequent process flow. For temporarily bonded wafers, after completing the relevant processes, debonding work is required to release the connection between the wafer and the carrier. The core of debonding is to remove the bonding glue between the wafer and the carrier through laser technology. In order to keep the wafer surface clean, the debonded wafer needs to be cleaned to remove the residual bonding glue on the wafer surface to facilitate the subsequent process flow.

[0003] Currently, the types of wafers commonly used in the semiconductor field mainly include Frame ultra-thin wafers, flat wafers and warped wafers. There are significant differences in the surface structures and sensitivities to adsorption force of different types of wafers. The cleaning process requires the wafer to rotate at high speed while ensuring stable operation. Therefore, strict requirements are placed on the structure of the wafer cleaning table.

[0004] Most of the existing wafer cleaning stations can only adapt to the process requirements of a single type of wafer. The cleaning station has a small scope of application. Different types of wafers need to be configured with different types of wafer cleaning stations, which is costly. Utility Model Content

[0005] The purpose of the embodiments of the utility model is to provide a cleaning table and a cleaning device, which can be adapted to different types of wafers, and the cleaning table and the cleaning device are highly versatile.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] In one aspect, a cleaning station is provided, comprising:

[0008] The first bearing assembly comprises a first carrier, a porous ceramic seat mounted on the first carrier, and a plurality of clamps; the plurality of clamps are arranged on the first carrier at intervals along the circumference of the porous ceramic seat;

[0009] The second bearing assembly comprises a second carrier and a plurality of suction cups mounted on the second carrier; the plurality of suction cups are arranged at intervals;

[0010] as well as

[0011] The driving assembly has a transmission part for driving the first carrier or the second carrier to rotate; the cleaning table has a first use state in which the first carrier is detachably mounted on the transmission part and a second use state in which the second carrier is detachably mounted on the transmission part.

[0012] Optionally, a plurality of the clamps are arranged at intervals along the circumference of the rotation axis of the first carrier;

[0013] Each of the clamps includes a positioning block, a positioning shaft arranged on the positioning block, and a clamping block; the clamping block has a clamping portion, a mounting portion, and a centrifugal portion arranged in sequence along a direction away from the rotation axis of the first carrier, the center of gravity of the clamping block is located on the centrifugal portion, the positioning block has a positioning surface, the mounting portion is rotatably mounted on the positioning block through the positioning shaft, when the mounting portion rotates around the positioning shaft, the clamping portion rotates in a direction approaching or away from the positioning surface, the clamping portion is located above the positioning surface and forms a clamping space between the positioning surface.

[0014] Optionally, the first bearing assembly further comprises a plurality of support blocks; the plurality of support blocks are arranged on the first bearing seat at intervals along the circumference of the porous ceramic seat, and the support blocks have a support surface, which is flush with the positioning surface.

[0015] Optionally, the driving assembly includes a frame, a motor mounted on the frame, a transmission shaft transmission-connected to the motor, and a flange mounted on the transmission shaft; the transmission part is located on the flange, and the first carrier and the second carrier are respectively detachably mounted on the transmission part of the flange.

[0016] Optionally, a connecting key is provided on the outer peripheral side surface of the transmission shaft, the flange is provided with an axial hole and a keyway connected to the axial hole, the flange is sleeved on the transmission shaft along the axial direction of the transmission shaft through the axial hole and the connecting key is engaged with the keyway.

[0017] Optionally, the first carrier or the second carrier is threadedly connected to the flange.

[0018] Optionally, the driving assembly further comprises a turntable mounted on the transmission shaft and a detector mounted on the frame; the turntable has a sensing portion matching the detector, and the detector is located on a rotation path of the sensing portion.

[0019] Optionally, the driving assembly further includes a base and a lifter mounted on the base; the lifter has a telescopic rod, and the frame is mounted on the telescopic rod.

[0020] Optionally, the plurality of suction cups are sequentially arranged at intervals along the circumferential direction of the rotation axis of the second carrier, the transmission shaft is provided with a first gas channel, the flange is provided with a second gas channel connected to the first gas channel, the first carrier is provided with a third gas channel, and the second carrier is provided with a plurality of fourth gas channels; the plurality of fourth gas channels correspond to the plurality of suction cups one by one;

[0021] When the first carrier is mounted on the flange, the second gas channel, the third gas channel, and the gas holes of the porous ceramic seat are connected in sequence;

[0022] When the second carrier is mounted on the flange, the second gas channel, the fourth gas channel, and the air holes of the suction cup are connected in sequence.

[0023] On the other hand, a cleaning device is provided, comprising a cleaning cover having a cleaning cavity, a cleaning device having a nozzle, and the above-mentioned cleaning table; the nozzle and the cleaning table are both located in the cleaning cavity.

[0024] The beneficial effects of the utility model are as follows: the cleaning table is adapted to different types of wafers by arranging a first bearing component and a second bearing component, wherein the first bearing component adopts a porous ceramic seat and a clamp to realize the adsorption and positioning of the ultra-thin wafer of the Frame frame, and the second bearing component adopts a suction cup to realize the adsorption and positioning of the flat wafer and the warped wafer, and the first bearing component and the second bearing component are respectively detachably mounted on the driving component to realize interchangeability, so that the cleaning table can carry different types of wafers for cleaning.

[0025] By adopting the above-mentioned cleaning platform, the cleaning device can clean different types of wafers, thereby improving the versatility of the cleaning device. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The utility model is further described in detail below based on the drawings and embodiments.

[0027] Figure 1 It is a structural schematic diagram of a washing table, in which the first bearing assembly is installed on the driving assembly;

[0028] Figure 2 is a schematic diagram of the structure of the cleaning station, in which the second bearing assembly is installed on the driving assembly;

[0029] Figure 3 is a structural schematic diagram of a first load-bearing assembly;

[0030] Figure 4 This is a schematic diagram of the installation of the clamp;

[0031] Figure 5 is a structural schematic diagram of a second load-bearing assembly;

[0032] Figure 6 It is a schematic diagram of the structure of the flange;

[0033] Figure 7 is a schematic diagram of the structure of the drive component;

[0034] Figure 8Schematic diagram of the coordination between the detector and the turntable.

[0035] Description of the accompanying drawings:

[0036] 11. First bearing assembly; 12. Second bearing assembly; 13. Driving assembly; 14. Buffer plate; 15. Buffer pad;

[0037] 111, first carrier; 112, porous ceramic carrier; 113, clamp; 114, support block;

[0038] 121. second carrier; 122. suction cup;

[0039] 131, frame; 132, motor; 133, transmission shaft; 134, flange; 135, connecting key; 136, turntable; 137, detector; 138, base; 139, lifter;

[0040] 1211, connecting screw hole;

[0041] 1131, positioning block; 1132, positioning shaft; 1133, clamping block; 1134, clamping portion; 1135, mounting portion; 1136, centrifugal portion; 1137, positioning surface;

[0042] 1141, support surface;

[0043] 1331, first gas channel;

[0044] 1341, keyway; 1342, transmission part; 1343, second gas channel; 1344, shaft hole;

[0045] 1361, Department of Induction;

[0046] 1371. Inspection Department. DETAILED DESCRIPTION

[0047] In order to make the technical problems solved by the utility model, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the utility model will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.

[0048] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "fixed", "connected", "communicated", "abutted", "clamped" and the like should be understood in a broad sense, for example, it can be a fixed connection, or a detachable connection or an integral one; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0049] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0050] In the description of this article, it should be understood that the terms "upper", "lower", "left", "right" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0051] In the description of this specification, the description with reference to the terms "an embodiment", "example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0052] In addition, it should be understood that although this specification is described according to implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0053] Unless specifically stated or defined otherwise, the term “and / or” used in the present invention includes any and all combinations of one or more of the associated listed items.

[0054] For the convenience of description, unless otherwise specified, the up and down directions mentioned below are the same as Figure 1 The up and down directions are consistent.

[0055] In the existing semiconductor technology field, there are many types of wafers. The more common wafers are generally frame ultra-thin wafers, flat wafers and warped wafers. Flat wafers and warped wafers are both single wafers, where flat wafers are wafers in a plane and warped wafers are wafers with a certain curvature on the surface. Frame ultra-thin wafers are wafers with frames. The center of the Farme frame ultra-thin wafer is the wafer, and the outer ring is the Farme frame, that is, the outer ring is an iron ring, and the iron ring and the wafer are connected by a film.

[0056] like Figures 1 to 5 As shown, this embodiment provides a cleaning station, including a first bearing assembly 11, a second bearing assembly 12, and a driving assembly 13. The first bearing assembly 11 is used to adsorb the ultra-thin wafer of the Frame, and the second bearing assembly 12 is used to adsorb the flat wafer and the warped wafer. One of the first bearing assembly 11 and the second bearing assembly 12 can be selected and installed on the driving assembly 13 according to the type of wafer. It is highly targeted for wafers of different sizes and types, easy to disassemble and assemble, and has high assembly accuracy. The first bearing assembly 11 and the second bearing assembly 12 can be installed interchangeably. The driving assembly 13 is used to drive the first bearing assembly 11 or the second bearing assembly 12 to rotate.

[0057] The first carrier assembly 11 includes a first carrier 111, a porous ceramic seat 112 mounted on the first carrier 111, and a plurality of clamps 113. The porous ceramic seat 112 is also called microporous ceramic, and its surface and interior contain a large number of open or closed micron-sized pores. When adsorbing the Frame ultra-thin wafer, the adsorption force is uniform and will not damage the wafer structure. The porous ceramic seat 112 and the plurality of clamps 113 are all mounted on the upper surface of the first carrier 111, and the porous ceramic seat 112 is located in the area enclosed by the plurality of clamps 113. The plurality of clamps 113 are arranged on the first carrier 111 along the circumferential spacing of the porous ceramic seat 112, and the plurality of clamps 113 are all used to fix the frame on the Frame ultra-thin wafer. Since the ultra-thin wafer in the frame has a frame, its mass and volume are large, and the centrifugal force it is subjected to during rotation is also large. If suction cups 122 are used for adsorption, a large number of suction cups 122 are required. Therefore, a porous ceramic seat 112 is used to adsorb the wafer in the frame. However, the adsorption force of the porous ceramic seat 112 is limited, so an additional clamp 113 is required to clamp the frame to prevent the centrifugal force generated during the rotation of the first bearing component 11 from throwing the frame out. The clamp 113 is added to cooperate with the porous ceramic seat 112. Optionally, the first bearing component 11 is suitable for ultra-thin wafers in the frame with a diameter of twelve inches.

[0058] The second carrier assembly 12 includes a second carrier 121 and a plurality of suction cups 122 mounted on the second carrier 121. The rubber material of the suction cups 122 can completely adhere to and absorb the warped wafer. The plurality of suction cups 122 are arranged at intervals. The plurality of suction cups 122 are arranged at intervals on the upper surface of the second carrier 121. The suction cups 122 can absorb flat wafers and warped wafers. Flat wafers and warped wafers do not have frames and are light in weight. The suction force of the suction cups 122 is sufficient to absorb the wafers. Optionally, the second carrier assembly 12 is mainly used to absorb wafers with a diameter of eight inches. Compared with the twelve-inch frame ultra-thin wafers suitable for the first carrier assembly 11, the wafers suitable for the second carrier assembly 12 are smaller in size, have a more uniform mass distribution, and have higher stability under high-speed rotation. Therefore, it is sufficient to use a plurality of suction cups 122 for absorption, and there is no need to use a clamp 113 to fix the wafer.

[0059] The driving assembly 13 has a transmission part 1342 for driving the first carrier 111 or the second carrier 121 to rotate. The transmission part 1342 can rotate, and the rotation axis of the transmission part 1342 is vertically arranged. The driving assembly 13 drives the first carrier 111 or the second carrier 121 to rotate through the transmission part 1342. The first carrier 111 and the second carrier 121 are detachably mounted on the transmission part 1342. The cleaning table has a first use state in which the first carrier 111 is detachably mounted on the transmission part 1342 and a second use state in which the second carrier 121 is detachably mounted on the transmission part 1342. In the first use state, that is, when the first carrier 111 is mounted on the driving assembly 13, the first carrier 111 is detachably connected to the transmission part 1342. In the second use state, that is, when the second carrier 121 is mounted on the driving assembly 13, the second carrier 121 is detachably connected to the transmission part 1342.

[0060] When the Frame ultra-thin wafer needs to be cleaned, the first carrier 111 of the first bearing assembly 11 is installed on the transmission part 1342 of the driving assembly 13, and then the Frame ultra-thin wafer is placed on the first carrier 111 and the Frame ultra-thin wafer is adsorbed and positioned through the porous ceramic seat 112 and the clamp 113. When the first bearing assembly 11 is installed on the transmission part 1342 of the driving assembly 13, the first carrier 111 is detachably connected to the transmission part 1342, and the cleaning table is in the first use state.

[0061] When it is necessary to clean the flat wafer or the warped wafer, the second carrier 121 of the second bearing assembly 12 is installed on the transmission part 1342 of the driving assembly 13, and then the flat wafer or the warped wafer is placed on the second carrier 121 and the flat wafer or the warped wafer is adsorbed and positioned by the suction cup 122. When the second bearing assembly 12 is installed on the transmission part 1342 of the driving assembly 13, the second carrier 121 is detachably connected to the transmission part 1342, and the cleaning table is in the second use state.

[0062] The cleaning station of this embodiment is used to clean and remove the bonding glue on the surface of the wafer after debonding. Under the premise of ensuring that the wafer runs stably and is not damaged when rotating at high speed, it can achieve effective adsorption of ultra-thin wafers, flat wafers and warped wafers with different sizes of frames.

[0063] like Figure 3 to Figure 4 As shown, in one embodiment, a plurality of clamps 113 are arranged at intervals along the circumference of the rotation axis of the first carrier 111. Specifically, the porous ceramic seat 112 and the first carrier 111 are both disc-shaped. The center of the porous ceramic seat 112 and the center of the first carrier 111 are both located on the rotation axis of the first carrier 111. When the frame ultra-thin wafer is placed on the porous ceramic seat 112, the center of the frame ultra-thin wafer is located on the rotation axis of the first carrier 111.

[0064] Each clamp 113 includes a positioning block 1131, a positioning shaft 1132 arranged on the positioning block 1131, and a clamping block 1133. The positioning block 1131 is arranged on the first carrier 111. In order to strengthen the installation strength of the positioning block 1131, one end of the positioning block 1131 is connected to the edge of the porous ceramic seat 112. The clamping block 1133 has a clamping portion 1134, a mounting portion 1135, and a centrifugal portion 1136 arranged in sequence along the direction away from the rotation axis of the first carrier 111. Specifically, the clamping portion 1134, the mounting portion 1135, and the centrifugal portion 1136 are arranged in sequence along the direction away from the porous ceramic seat 112, the mounting portion 1135 is close to the edge of the first carrier 111, and the centrifugal portion 1136 is suspended on the outside of the first carrier 111. The center of gravity of the clamping block 1133 is located on the centrifugal portion 1136. The positioning block 1131 has a positioning surface 1137, the clamping portion 1134 is located above the positioning surface 1137 and forms a clamping space between the positioning surface 1137, the mounting portion 1135 is rotatably mounted on the positioning block 1131 through the positioning shaft 1132, when the mounting portion 1135 rotates around the positioning shaft 1132, the clamping portion 1134 can rotate in a direction close to or away from the positioning surface 1137, the axis of the positioning shaft 1132 is horizontally arranged, the clamping portion 1134 and the centrifugal portion 1136 both rotate up and down around the positioning shaft 1132, and the rotation directions of the clamping portion 1134 and the centrifugal portion 1136 relative to the mounting portion 1135 are opposite, for example, when the clamping portion 1134 moves downward relative to the mounting portion 1135, the centrifugal portion 1136 moves upward relative to the mounting portion 1135. When the driving assembly 13 stops working, under the action of gravity, the centrifugal part 1136 moves downward to the bottom of the positioning surface 1137, so that the clamping part 1134 moves upward to the top of the positioning surface 1137, so as to facilitate the placement of the Frame ultra-thin wafer. After the Frame ultra-thin wafer is placed on the porous ceramic seat 112, the frame of the Frame ultra-thin wafer abuts against the positioning surface 1137 of the positioning block 1131 and is located below the clamping part 1134. Start the driving component 13 to drive the first carrier 111 to rotate. Under the action of centrifugal force, the centrifugal portion 1136 of the clamping block 1133 moves upward, and the clamping portion 1134 of the clamping block 1133 moves downward so that the frame can be clamped between the positioning surface 1137 and the clamping portion 1134. The faster the driving component 13 drives the first carrier 111 to rotate, the greater the centrifugal force exerted on the clamping block 1133, and the greater the pressure exerted on the frame by the clamping portion 1134. Therefore, the clamping force of the clamp 113 on the Frame ultra-thin wafer is greater, and the installation and positioning of the Frame ultra-thin wafer during the cleaning process is more stable.

[0065] The clamp 113 is cleverly designed by using physical principles such as gravity and centrifugal force, combined with the structural characteristics of the pressure claws. It can clamp the frame in the working state to play a fixing role, and open it in the non-working state to facilitate the transfer of materials before and after cleaning. It has a simple structure and stable clamping.

[0066] Furthermore, the first bearing assembly 11 also includes a plurality of support blocks 114. The support blocks 114 are used to support the frame of the Frame ultra-thin wafer. The support blocks 114 can share the weight of the Frame ultra-thin wafer and reduce the load of the positioning block 1131. A plurality of support blocks 114 are arranged at intervals along the circumference of the porous ceramic seat 112 on the first carrier 111. Specifically, at least one support block 114 can be arranged between two adjacent clamps 113. The support block 114 is installed on the upper surface of the first carrier 111 by fasteners such as bolts or screws. Each support block 114 and each clamp 113 are close to the edge of the first carrier 111. The support block 114 has a support surface 1141, the lower end surface of the support block 114 is in contact with the upper surface of the first carrier 111, the support surface 1141 is the upper end surface of the support block 114 and is arranged upward, the support surface 1141 is flush with the positioning surface 1137, so that the frame of the Frame ultra-thin wafer falls on the support surface 1141 and the positioning surface 1137, and the support of the frame is achieved by the support surface 1141 and the positioning surface 1137.

[0067] like Figure 1 , Figure 2 , Figure 7 As shown, in one embodiment, the driving assembly 13 includes a frame 131, a motor 132 mounted on the frame 131, a transmission shaft 133 drivingly connected to the motor 132, and a flange 134 mounted on the transmission shaft 133. The transmission shaft 133 is vertically arranged, the lower end of the transmission shaft 133 is drivingly connected to the motor 132, and the upper end of the transmission shaft 133 is connected to the flange 134. The transmission part 1342 is located on the flange 134, and the first carrier 111 and the second carrier 121 are respectively detachably mounted on the transmission part 1342 of the flange 134, and the flange 134 is used to realize the detachable installation of the first carrier 111 and the second carrier 121.

[0068] Optionally, a connecting key 135 is provided on the outer peripheral side of the transmission shaft 133, and the connecting key 135 is integrally formed with the transmission shaft 133 or is bolted to the outer peripheral side of the upper end of the transmission shaft 133. An axial hole 1344 is provided on the lower end surface of the flange 134, and a key groove 1341 communicating with the axial hole 1344 is provided on the outer peripheral side of the lower end of the flange 134, and the key groove 1341 and the connecting key 135 both extend from top to bottom. When installing the flange 134, the flange 134 is sleeved on the transmission shaft 133 along the axial direction of the transmission shaft 133 through the shaft hole 1344, and after the flange 134 is sleeved on the transmission shaft 133, the connecting key 135 and the key slot 1341 are just engaged. When the flange 134 is driven by the motor 132 to rotate, the flange 134 can be driven to rotate. The engagement of the connecting key 135 and the key slot 1341 limits the relative rotation of the flange 134 and the transmission shaft 133, so that the flange 134 and the transmission shaft 133 rotate synchronously. Under the action of gravity, the flange 134 is connected by the engagement of the connecting key 135 and the key slot 1341. When removing the flange 134, it is only necessary to lift the flange 134 upward to separate the connecting key 135 from the key slot 1341, which is convenient for the installation, removal and replacement of the flange 134.

[0069] In one embodiment, the first carrier 111 and the second carrier 121 are selectively threadedly connected to the flange 134. Specifically, the first carrier 111 and the second carrier 121 both have a collar, the collar is formed with a collar hole, and the collar is provided with a plurality of connection screw holes 1211 spaced along the extension direction of the collar. The first carrier 111 and the second carrier 121 are sleeved on the upper end of the flange 134 through the collar hole, and then fasteners such as screws or bolts pass through the connection screw holes 1211 to abut against the side of the flange 134, so as to realize the detachable installation of the first carrier 111 and the second carrier 121.

[0070] When the first carrier 111 and the second carrier 121 are replaced with each other, the first carrier 111 and the second carrier 121 can be removed from the flange 134, and the flange 134 can also be removed from the transmission shaft 133. Since the connection between the first carrier 111 and the flange 134 and the connection between the second carrier 121 and the flange 134 are both threaded connections, frequent disassembly is prone to thread slippage, so in this embodiment, it is preferred to remove the flange 134 from the transmission shaft 133. Usually, the connection between the first carrier 111 and the flange 134 and the connection between the second carrier 121 and the flange 134 are fixed and not removed. The first carrier 111 and the second carrier 121 are respectively equipped with a flange 134, and the keyway 1341 on the flange 134 and the connecting key 135 on the transmission shaft 133 are used to realize the quick interchangeable installation of the first carrier 111 and the second carrier 121.

[0071] like Figure 7 , Figure 8As shown, in one embodiment, the driving assembly 13 further includes a turntable 136 mounted on the transmission shaft 133 and a detector 137 mounted on the frame 131. The detector 137 may be a position sensor, and the detector 137 has a detection portion 1371, and the detection portion 1371 is a detection end of the detector 137, including detection methods such as infrared sensing, and the turntable 136 has a sensing portion 1361 matching the detector 137, and the detector 137 is located on the rotation path of the sensing portion 1361. The detector 137 can sense the position of the sensing portion 1361, and the position of the sensing portion 1361 is set as the origin. When the sensing portion 1371 of the detector 137 detects that the sensing portion 1361 has arrived, it is considered that the first carrier 111 or the second carrier 121 has rotated to the origin position, which is convenient for subsequent wafer placement or removal and other transportation processes.

[0072] Furthermore, the sensing part 1361 is provided with an opening, and the detection part 1371 of the detector 137 includes a transmitting end and a receiving end. The transmitting end transmits a light beam from top to bottom to the receiving end, and the turntable 136 is located between the transmitting end and the receiving end. When the opening of the turntable 136 passes through the transmitting end and the receiving end, the receiving end can receive the signal of the light beam, which means that the first carrier 111 or the second carrier 121 rotates to the origin position. When the rest of the turntable 136 passes through the transmitting end and the receiving end, it will block the light beam, which means that the first carrier 111 or the second carrier 121 is not at the origin position. The origin detection is set on the cleaning table to ensure that the starting and ending positions of the cleaning table are fixed, which is convenient for material handover, and can also effectively deal with emergencies such as power outages, ensuring that the present invention has high safety.

[0073] Optionally, the driving assembly 13 also includes a base 138 and a lifter 139 mounted on the base 138. The lifter 139 has a telescopic rod, and the frame 131 is mounted on the telescopic rod. The lifter 139 can be a linear drive module such as a cylinder, a hydraulic cylinder, an electric telescopic rod, a screw module, etc. The lifter 139 can be used to drive the frame 131 to move up and down. In order to improve the stability of the up and down movement of the frame 131, at least two lifters 139 can be provided and arranged at intervals. The frame 131 is driven up and down by multiple lifters 139 at the same time, thereby realizing the up and down movement of the first carrier 111 or the second carrier 121, so that the cleaning table can adjust the height according to the position of the cleaning device such as the cleaning gun, which is convenient for cleaning the wafer. The up and down movement of the first carrier 111 or the second carrier 121 can also facilitate the robot to place or take away the wafer.

[0074] Furthermore, a buffer plate 14 is provided on the telescopic rod, a buffer pad 15 is provided on the buffer plate 14, and the frame 131 is connected to the buffer pad 15. The buffer plate 14 and the buffer pad 15 can alleviate the vibration generated by the high-speed movement of the washing table, so that the washing table can maintain high stability under high-speed rotation.

[0075] like Figures 3 to 7 As shown, in one embodiment, a plurality of suction cups 122 are arranged at intervals along the circumference of the rotation axis of the second carrier 121, a first gas channel 1331 is provided in the transmission shaft 133, a second gas channel 1343 connected to the upper end of the first gas channel 1331 is provided in the flange 134, and a third gas channel is provided on the first carrier 111. A plurality of fourth gas channels are provided on the second carrier 121. There are multiple second gas channels 1343 and fourth gas channels and they correspond one to one, and the plurality of fourth gas channels correspond one to one with the plurality of suction cups 122. The plurality of suction cups 122 can be extended and retracted up and down according to the flatness of the wafer, and can be adapted to both flat wafers and warped wafers. By providing the first gas channel 1331 in the transmission shaft 133, the second gas channel 1343 is provided in the flange 134, the third gas channel is provided on the first carrier 111, and the plurality of fourth gas channels are provided on the second carrier 121, the external pipelines are reduced, and the gas path required for the cleaning table to generate vacuum suction is hidden inside the cleaning table, simplifying the overall structure of the cleaning table and facilitating assembly.

[0076] When the first carrier 111 is mounted on the flange 134, the second gas channel 1343, the third gas channel, and the air holes of the porous ceramic seat 112 are connected in sequence. When the second carrier 121 is mounted on the flange 134, the second gas channel 1343, the fourth gas channel, and the air holes of the suction cup 122 are connected in sequence. The second gas channel 1343 is connected by using an air pump or other instrument, so that the porous ceramic seat 112 or the suction cup 122 forms a negative pressure to achieve adsorption and positioning of the wafer.

[0077] This embodiment also provides a cleaning device, including a cleaning cover with a cleaning cavity, a cleaning device with a nozzle, and the above-mentioned cleaning table. The cleaning cover can prevent the cleaning liquid from splashing, and the nozzle and the cleaning table are both located in the cleaning cavity.

[0078] The technical principle of the present invention is described above in combination with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the protection scope of the present invention in any way. Based on the explanations here, technicians in this field can think of other specific implementation methods of the present invention without creative work, and these methods will fall within the protection scope of the present invention.

Claims

1. A cleaning station, characterized in that: include: A first bearing assembly (11) comprises a first carrier (111), a porous ceramic seat (112) mounted on the first carrier (111), and a plurality of clamps (113); the plurality of clamps (113) are arranged on the first carrier (111) at intervals along the circumference of the porous ceramic seat (112); A second bearing assembly (12) comprises a second carrier (121) and a plurality of suction cups (122) mounted on the second carrier (121); the plurality of suction cups (122) are arranged at intervals; as well as The driving assembly (13) has a transmission part (1342) for driving the first carrier (111) or the second carrier (121) to rotate; the cleaning table has a first use state in which the first carrier (111) is detachably mounted on the transmission part (1342) and a second use state in which the second carrier (121) is detachably mounted on the transmission part (1342).

2. The cleaning station according to claim 1, characterized in that The plurality of clamps (113) are arranged at intervals along the circumference of the rotation axis of the first carrier (111); Each of the clamps (113) comprises a positioning block (1131), a positioning shaft (1132) arranged on the positioning block (1131), and a clamping block (1133); the clamping block (1133) comprises a clamping portion (1134), a mounting portion (1135), and a centrifugal portion (1136) arranged in sequence along a direction away from the rotation axis of the first carrier (111); the center of gravity of the clamping block (1133) is located on the centrifugal portion (1136); and the positioning block (113 1) having a positioning surface (1137), the mounting portion (1135) being rotatably mounted on the positioning block (1131) via the positioning shaft (1132), and when the mounting portion (1135) rotates around the positioning shaft (1132), the clamping portion (1134) rotates in a direction approaching or away from the positioning surface (1137), and the clamping portion (1134) is located above the positioning surface (1137) and forms a clamping space between the clamping portion and the positioning surface (1137).

3. The cleaning station according to claim 2, characterized in that: The first bearing assembly (11) further comprises a plurality of support blocks (114); the plurality of support blocks (114) are arranged on the first bearing seat (111) at intervals along the circumference of the porous ceramic seat (112); the support blocks (114) have a support surface (1141), and the support surface (1141) is flush with the positioning surface (1137).

4. The cleaning station according to any one of claims 1 to 3, characterized in that: The driving assembly (13) comprises a frame (131), a motor (132) mounted on the frame (131), a transmission shaft (133) transmission-connected to the motor (132), and a flange (134) mounted on the transmission shaft (133); the transmission part (1342) is located on the flange (134), and the first carrier (111) and the second carrier (121) are respectively detachably mounted on the transmission part (1342) of the flange (134).

5. The cleaning station according to claim 4, characterized in that A connecting key (135) is provided on the outer peripheral side surface of the transmission shaft (133); the flange (134) is provided with an axial hole (1344) and a keyway (1341) connected to the axial hole (1344); the flange (134) is sleeved on the transmission shaft (133) along the axial direction of the transmission shaft (133) through the axial hole (1344) and the connecting key (135) is engaged with the keyway (1341).

6. The cleaning station according to claim 4, characterized in that The first carrier (111) or the second carrier (121) is threadedly connected to the flange (134).

7. The cleaning station according to claim 4, characterized in that The driving assembly (13) further comprises a turntable (136) mounted on the transmission shaft (133) and a detector (137) mounted on the frame (131); the turntable (136) has a sensing portion (1361) matching the detector (137), and the detector (137) is located on the rotation path of the sensing portion (1361).

8. The cleaning station according to claim 4, characterized in that The driving assembly (13) further comprises a base (138) and a lifter (139) mounted on the base (138); the lifter (139) has a telescopic rod, and the frame (131) is mounted on the telescopic rod.

9. The cleaning station according to claim 4, characterized in that The plurality of suction cups (122) are arranged in sequence and spaced apart along the circumferential direction of the rotation axis of the second carrier (121); the transmission shaft (133) is provided with a first gas channel (1331); the flange (134) is provided with a second gas channel (1343) connected to the first gas channel (1331); the first carrier (111) is provided with a third gas channel; the second carrier (121) is provided with a plurality of fourth gas channels; the plurality of fourth gas channels correspond to the plurality of suction cups (122) one by one; When the first carrier (111) is installed on the flange (134), the second gas channel (1343), the third gas channel, and the gas holes of the porous ceramic seat (112) are connected in sequence; When the second carrier (121) is installed on the flange (134), the second gas channel (1343), the fourth gas channel, and the air holes of the suction cup (122) are connected in sequence.

10. A cleaning device, characterized in that: It comprises a cleaning cover with a cleaning cavity, a cleaning device with a nozzle, and a cleaning table as claimed in any one of claims 1 to 9; the nozzle and the cleaning table are both located in the cleaning cavity.

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