Vertical interconnection structure

Abstract

The utility model relates to a vertical interconnection structure. The vertical interconnection structure includes a first transmission line and a second transmission line arranged along a first direction. The first transmission line includes: a first packaging substrate, which has a first surface in the first direction, the first surface has a first groove, and the first groove extends along a second direction perpendicular to the first direction; a first boss, which is convexly arranged at the bottom of the first groove and extends along the second direction, and the side wall of the first boss is spaced from the side wall of the first groove; a first conductive layer, which is arranged on the top surface of the first boss, and the first conductive layer is coupled or electrically connected to the second transmission line; a second conductive layer, which is at least arranged on the side wall of the first groove, and the second conductive layer is insulated from the first conductive layer; and a grounding plate, which is arranged on the first surface, the grounding plate is insulated from the first conductive layer, and the second conductive layer is electrically connected to the grounding plate, so as to reduce the transmission loss of the first transmission line and facilitate integration with microwave and millimeter wave circuits to form a three-dimensional circuit structure.

Description

Technical Field

[0001] The present application relates to the field of microwave transmission technology, and in particular to a vertical interconnection structure. Background Art

[0002] In microwave multilayer boards, interlayer vertical interconnection structures are usually used to achieve miniaturization and high-density design of component structures. When signals are transmitted between different layers, good performance interconnection structures are required to achieve good matching, otherwise the transmission characteristics will deteriorate, causing additional insertion loss to signal transmission. Therefore, it is necessary to study the vertical interconnection structure between transmission lines on different layers. Utility Model Content

[0003] The utility model aims to provide a vertical interconnection structure, which can solve the technical problems of high insertion loss in the existing vertical interconnection structure.

[0004] The utility model provides a vertical interconnection structure, which includes a first transmission line and a second transmission line arranged along a first direction, wherein the first transmission line includes: a first packaging substrate, which has a first surface in the first direction, the first surface has a first groove, and the first groove extends along a second direction perpendicular to the first direction; a first boss, which is convexly arranged on the bottom of the first groove and extends along the second direction, and the side wall of the first boss is spaced apart from the side wall of the first groove; a first conductive layer, which is arranged on the top surface of the first boss, and the first conductive layer is coupled or electrically connected to the second transmission line; a second conductive layer, which is at least arranged on the side wall of the first groove, and the second conductive layer is insulated from the first conductive layer; and a grounding plate, which is arranged on the first surface, the grounding plate is insulated from the first conductive layer, and the second conductive layer is electrically connected to the grounding plate.

[0005] Furthermore, the first conductive layer includes a first conductive part and a second conductive part connected to each other, the first conductive part and the second conductive part are extended and arranged along the second direction, the first conductive part is coupled or electrically connected to the second transmission line; and the maximum width of the first conductive part is greater than the maximum width of the second conductive part.

[0006] Furthermore, the width of a side of the first conductive portion close to the second conductive portion is greater than or equal to the width of a side of the second conductive portion close to the first conductive portion.

[0007] Furthermore, the first boss includes a first boss portion and a second boss portion connected to each other, the maximum thickness of the first boss portion is greater than the maximum thickness of the second boss portion; the first conductive portion is arranged on the top surface of the first boss portion, and the second conductive portion is arranged on the top surface of the second boss portion.

[0008] Furthermore, the thickness of the first boss portion on a side close to the second boss portion is greater than or equal to the thickness of the second boss portion on a side close to the first boss portion.

[0009] Furthermore, the second transmission line is arranged on a side of the grounding plate away from the first packaging substrate; the second transmission line includes: a second packaging substrate, a surface of which is close to the grounding plate and has a second groove, and the second groove extends along the second direction; a second boss, which is protruding from the bottom of the second groove and extends along the second direction, and the side wall of the second boss is spaced apart from the side wall of the second groove; a third conductive layer, which is arranged on the top surface of the second boss, the third conductive layer is coupled or electrically connected to the first conductive layer, and the third conductive layer is insulated from the grounding plate; and a fourth conductive layer, which is at least arranged on the side wall of the second groove, the fourth conductive layer is insulated from the third conductive layer, and the fourth conductive layer is electrically connected to the grounding plate; wherein, a first through hole is provided on the grounding plate, the first through hole at least partially exposes the first conductive layer and the third conductive layer, a fifth conductive layer is provided on the hole wall of the first through hole, one end of the fifth conductive layer is electrically connected to the second conductive layer, and the other end of the fifth conductive layer is electrically connected to the fourth conductive layer.

[0010] Furthermore, the first conductive layer and the third conductive layer are spaced apart, and the third conductive layer is coupled to the first conductive layer.

[0011] Furthermore, the first through hole extends along a third direction, and the third direction is perpendicular to the first direction and intersects with the second direction.

[0012] Furthermore, the first conductive layer and the third conductive layer are in direct contact, and the third conductive layer is electrically connected to the first conductive layer.

[0013] Furthermore, the first conductive layer has a first clamping portion, the first boss has a second clamping portion interlocked with the first clamping portion; the third conductive layer has a third clamping portion interlocked with the first clamping portion, the second boss has a fourth clamping portion interlocked with the third clamping portion.

[0014] Furthermore, the first through hole extends along the second direction.

[0015] Furthermore, the second transmission line includes a coaxial connector, which includes: an inner conductor, an insulating layer surrounding the inner conductor, and an outer conductor surrounding the insulating layer, wherein the inner conductor protrudes from the insulating layer along a first direction; wherein the inner conductor is electrically connected to the first conductive layer and is insulated from the ground plate; wherein the second conductive layer also covers the bottom of the first groove, and the outer conductor is electrically connected to the second conductive layer at the bottom of the first groove.

[0016] Furthermore, the coaxial connector is located on a side of the grounding plate away from the first packaging substrate; the grounding plate is provided with an insulating portion at a position corresponding to the insulating layer, and the insulating portion is provided with a second through hole at a position corresponding to the inner conductor; an opening is provided on the first boss, and the first conductive layer is also provided in the opening; the inner conductor is inserted into the opening through the second through hole and is electrically connected to the first conductive layer; at least one third through hole is provided on the grounding plate on the peripheral side of the insulating portion, and a sixth conductive layer is provided on the hole wall of the third through hole, one end of the sixth conductive layer is electrically connected to the second conductive layer, and the other end of the sixth conductive layer is electrically connected to the outer conductor.

[0017] Furthermore, the coaxial connector is located on a side of the first packaging substrate away from the ground plate; a fourth through hole is provided on the first boss, and the inner conductor passes through the fourth through hole and is electrically connected to the first conductive layer; at least one fifth through hole is provided on the first packaging substrate, and a seventh conductive layer is provided on the hole wall of the fifth through hole, one end of the seventh conductive layer is electrically connected to the second conductive layer, and the other end of the seventh conductive layer is electrically connected to the outer conductor.

[0018] Furthermore, the second transmission line is arranged on a side of the first packaging substrate away from the ground plane; the second transmission line includes a coplanar waveguide transmission line, and the coplanar waveguide transmission line includes: a center band and a grounding band arranged around the center band; the first boss has a sixth through hole, and the hole wall of the sixth through hole is provided with an eighth conductive layer, one end of the eighth conductive layer is electrically connected to the first conductive layer, and the other end of the eighth conductive layer is electrically connected to the center band; the second conductive layer also covers the bottom of the first groove; the first packaging substrate has at least one seventh through hole, and the hole wall of the seventh through hole is provided with a ninth conductive layer, one end of the ninth conductive layer is electrically connected to the second conductive layer at the bottom of the first groove, and the other end of the ninth conductive layer is electrically connected to the grounding band.

[0019] The advantages of the utility model are: a first transmission line of the utility model is provided with a first groove on the first packaging substrate, a first boss is provided at the bottom of the first groove, a first conductive layer is provided on the first boss, a second conductive layer is provided on the side wall of the first groove, the second conductive layer is insulated from the first conductive layer, a grounding plate is provided on the side of the first packaging substrate having the first groove, the grounding plate is insulated from the first conductive layer, and the second conductive layer is electrically connected to the grounding plate, thereby greatly reducing the transmission loss of the first transmission line, facilitating integration with microwave and millimeter wave circuits, and facilitating the formation of a three-dimensional circuit structure.

[0020] The first transmission line and the second transmission line of the utility model are arranged along the first direction, and the first transmission line is coupled or electrically connected to the second transmission line to realize signal transmission, with low insertion loss, low reflection, broadband and simple structure at high frequency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 It is an assembly diagram of the vertical interconnection structure of Example 1 of the utility model;

[0023] Figure 2 is an exploded view of the vertical interconnection structure of Example 1 of the utility model;

[0024] Figure 3 yes Figure 1 AA section view;

[0025] Figure 4 It is a structural schematic diagram of the second packaging substrate of the utility model;

[0026] Figure 5 yes Figure 4 A partial enlarged view of

[0027] Figure 6 yes Figure 2 A partial enlarged view of

[0028] Figure 7 It is an assembly diagram of the vertical interconnection structure of Example 2 of the utility model;

[0029] Figure 8 is an exploded view of the vertical interconnection structure of Example 2 of the utility model;

[0030] Fig. 9 yes Figure 7 BB cross-section diagram;

[0031] Fig.10 is an exploded cross-sectional view of a first packaging substrate, a ground plate, and a second packaging substrate of Embodiment 2;

[0032] Fig.11 It is an assembly diagram of the vertical interconnection structure of Example 3 of the utility model;

[0033] Fig.12 is an exploded view of the vertical interconnection structure of Example 3 of the utility model;

[0034] Fig.13 yes Fig.11 CC profile of ;

[0035] Fig.14 is an exploded cross-sectional view of the first packaging substrate, the ground plate and the coaxial connector of Example 3;

[0036] Fig.15 It is an assembly diagram of the vertical interconnection structure of Example 4 of the utility model;

[0037] Fig.16 is an exploded view of the vertical interconnection structure of Example 4 of the utility model;

[0038] Fig.17 yes Fig.15 DD profile diagram;

[0039] Fig.18 is an exploded cross-sectional view of a first packaging substrate, a ground plate, and a coaxial connector of Embodiment 4;

[0040] Fig.19 The vertical interconnection structure of the utility model embodiment 5 is assembled Figure 1 ;

[0041] Fig. 20 is an exploded view of the vertical interconnection structure of Example 5 of the utility model;

[0042] Fig.21 The vertical interconnection structure of the utility model embodiment 5 is assembled Figure 2 ;

[0043] Fig. 22 It is a plan view of the first conductive layer of Example 5 of the utility model.

[0044] Description of reference numerals:

[0045] 1. First transmission line; 2. Second transmission line;

[0046] 11. first packaging substrate; 12. first boss; 13. first conductive layer; 14. second conductive layer; 15. ground plate;

[0047] 111, first groove; 1101, first surface; 1102, second surface; 112, fifth through hole; 1121, seventh conductive layer; 113, seventh through hole; 1131, ninth conductive layer;

[0048] 121, first boss portion; 122, second boss portion; 1201, second clamping portion; 1202, opening; 1203, fourth through hole; 1204, sixth through hole; 12041, eighth conductive layer;

[0049] 131, first conductive part; 132, second conductive part; 1301, first clamping part; 133, 1 / 4 wavelength impedance converter;

[0050] 151, first through hole; 152, insulating portion; 1521, second through hole; 153, third through hole; 1531, sixth conductive layer;

[0051] 21. second packaging substrate; 22. second boss; 23. third conductive layer; 24. fourth conductive layer;

[0052] 211, second groove; 2101, third surface; 2102, fourth surface;

[0053] 221, third boss portion; 222, fourth boss portion; 2201, fourth clamping portion;

[0054] 231, third conductive portion; 232, fourth conductive portion; 2301, third clamping portion;

[0055] 201, coaxial connector; 2011, inner conductor; 2012, insulation layer; 2013, outer conductor;

[0056] 202. coplanar waveguide transmission line; 2021. center strip; 2022. ground strip. DETAILED DESCRIPTION

[0057] The following describes in detail the preferred embodiments of the present invention in conjunction with the drawings in the specification, so as to fully introduce the technical content of the present invention to those skilled in the art, to illustrate that the present invention can be implemented, to make the technical content disclosed by the present invention clearer, and to make it easier for those skilled in the art to understand how to implement the present invention. However, the present invention can be embodied in many different forms of embodiments, and the protection scope of the present invention is not limited to the embodiments mentioned in the text, and the description of the embodiments below is not intended to limit the scope of the present invention.

[0058] The directional terms mentioned in the present invention, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "side", etc., are only directions in the drawings. The directional terms used in this article are used to explain and illustrate the present invention, and are not used to limit the scope of protection of the present invention.

[0059] In the drawings, components with the same structure are represented by the same numerical labels, and components with similar structures or functions are represented by similar numerical labels. In addition, for the convenience of understanding and description, the size and thickness of each component shown in the drawings are arbitrarily shown, and the utility model does not limit the size and thickness of each component.

[0060] In microwave multilayer boards, interlayer vertical interconnection structures are usually used to achieve miniaturization and high-density design of component structures. When signals are transmitted between different layers, good performance interconnection structures are required to achieve good matching, otherwise the transmission characteristics will deteriorate, causing additional insertion loss to signal transmission. Therefore, it is necessary to study the vertical interconnection structure between transmission lines on different layers.

[0061] Example 1

[0062] like Figure 1-Figure 6 As shown, this embodiment provides a vertical interconnection structure. The vertical interconnection structure includes a first transmission line 1 and a second transmission line 2 arranged along a first direction Z. The first transmission line 1 and the second transmission line 2 are coupled or electrically connected. It is worth noting that the electrical connection here refers to direct contact to achieve signal transmission, and coupling refers to signal transmission without mutual contact. In this embodiment, the first transmission line 1 and the second transmission line 2 are coupled. As shown in FIG. Figure 2 and Figure 3 As shown, the first transmission line 1 includes: a first packaging substrate (can be called a dielectric substrate) 11, a first boss (can be called a dielectric ridge) 12, a first conductive layer (can be called a metal conductive strip) 13, a second conductive layer 14 and a ground plane 15.

[0063] like Figure 6 As shown, the first package substrate 11 has a first groove 111 on one side in the first direction Z, and the first groove 111 extends along a second direction X perpendicular to the first direction Z. Specifically, the first package substrate 11 has a first surface (i.e., upper surface) 1101 and a second surface (i.e., lower surface) 1102 in the first direction Z. That is, the first surface (i.e., upper surface) 1101 and the second surface (i.e., lower surface) 1102 are perpendicular to the first direction Z. In this embodiment, the first groove 111 is located on the first surface 1101. The first package substrate 11 is used to provide external protection for the first transmission line 1 to prevent the external environment from affecting the first transmission line 1, and at the same time, different dielectric materials can be selected to specifically guide and transmit electromagnetic waves.

[0064] like Figure 2 and Figure 6 As shown, the first boss 12 is protruding from the bottom of the first groove 111 and extends along the second direction X. The first boss 12 is used to support the first conductive layer 13. The side wall of the first boss 12 is spaced apart from the side wall of the first groove 111. That is, there is a gap between the side wall of the first boss 12 and the side wall of the first groove 111, thereby preventing the first conductive layer 13 on the first boss 12 and the second conductive layer 14 on the side wall of the first groove 111 from contacting and causing a short circuit.

[0065] The first conductive layer 13 is disposed on the top surface of the first boss 12. The first conductive layer 13 serves as a transmission line of the first transmission line 1, and is used to conduct electricity and transmit electromagnetic wave signals. The first conductive layer 13 is coupled with the second transmission line 2, thereby enabling signal transmission between the first transmission line 1 and the second transmission line 2.

[0066] The second conductive layer 14 is at least disposed on the sidewall of the first groove 111. The second conductive layer 14 is insulated from the first conductive layer 13, thereby preventing a short circuit between the first conductive layer 13 and the second conductive layer 14. The first conductive layer 13 and the second conductive layer 14 interact with each other to achieve the guidance and transmission of electromagnetic waves.

[0067] The grounding plate 15 is disposed on the first surface of the first package substrate 11. Specifically, an air cavity is formed between the surface of the grounding plate 15 close to the first package substrate 11 and the first groove 111 of the first package substrate 11, and the first boss 12, the first conductive layer 13 and the second conductive layer 14 are disposed in the air cavity. By adopting the flat grounding plate 15, the assembly of the first transmission line 1 becomes tighter and easier, the fit between the first package substrate 11 and the grounding plate 15 is improved, and the design requirements and functions can be better met.

[0068] The grounding plate 15 is used for grounding. The grounding plate 15 is insulated from the first conductive layer 13, and the second conductive layer 14 is electrically connected to the grounding plate 15. In this embodiment, the grounding plate 15 is a FR4 copper clad laminate. In other embodiments, other types of copper clad laminates may be used, and this application does not make a mandatory requirement for this.

[0069] In this embodiment, the second transmission line 2 is disposed on a side of the ground plate 15 away from the first packaging substrate 11 .

[0070] like Figure 2 , Figure 4 and Figure 5 As shown, the second transmission line 2 includes: a second packaging substrate 21 , a second boss 22 , a third conductive layer 23 and a fourth conductive layer 24 .

[0071] like Figure 5 As shown, the surface of the second packaging substrate 21 on one side close to the ground plate 15 has a second groove 211, and the second groove 211 extends along the second direction X. Specifically, the second packaging substrate 21 has a third surface (i.e., an upper surface) 2101 and a fourth surface (i.e., a lower surface) 2102 perpendicular to the first direction Z. In this embodiment, the second groove 211 is located on the fourth surface 2102. The second packaging substrate 21 is used to provide external protection for the second transmission line 2 to prevent the external environment from affecting the second transmission line 2, and at the same time, different dielectric materials can be selected to specifically guide and transmit electromagnetic waves.

[0072] The second boss 22 is protruding from the bottom of the second groove 211 and extends along the second direction X. The second boss 22 is used to support the third conductive layer 23. The side wall of the second boss 22 is spaced apart from the side wall of the second groove 211. That is, there is a gap between the side wall of the second boss 22 and the side wall of the second groove 211, thereby preventing the third conductive layer 23 on the second boss 22 and the fourth conductive layer 24 on the side wall of the second groove 211 from contacting and causing a short circuit.

[0073] The third conductive layer 23 is disposed on the top surface of the second boss 22. The third conductive layer 23 serves as a transmission line of the second transmission line 2, and is used for conducting electricity and transmitting electromagnetic wave signals. The third conductive layer 23 is coupled with the first conductive layer 13, thereby enabling signal transmission between the first transmission line 1 and the second transmission line 2.

[0074] The fourth conductive layer 24 is at least disposed on the sidewall of the second groove 211, and the fourth conductive layer 24 is insulated from the third conductive layer 23, thereby preventing a short circuit between the third conductive layer 23 and the fourth conductive layer 24. The third conductive layer 23 and the fourth conductive layer 24 interact with each other to achieve the guidance and transmission of electromagnetic waves.

[0075] The third conductive layer 23 is insulated from the ground plane 15 , and the fourth conductive layer 24 is electrically connected to the ground plane 15 , that is, the signal on the ground plane 15 can only be transmitted to the fourth conductive layer 24 but not to the third conductive layer 23 .

[0076] The grounding plate 15 is provided with a first through hole 151. The first through hole 151 at least partially exposes the first conductive layer 13 and the third conductive layer 23. By providing the first through hole 151 on the grounding plate 15, electromagnetic coupling of energy is achieved, so that the transmission performance is good. In this embodiment, the shape of the first through hole 151 is a rectangle. In other embodiments, the shape of the first through hole 151 can also be a regular shape such as an ellipse, or a special shape.

[0077] A fifth conductive layer (not shown) is provided on the hole wall of the first through hole 151, one end of the fifth conductive layer is electrically connected to the second conductive layer 14, and the other end of the fifth conductive layer is electrically connected to the fourth conductive layer 24. That is, the electrical connection between the second conductive layer 14 and the fourth conductive layer 24 is achieved through the fifth conductive layer on the hole wall of the first through hole 151.

[0078] In this embodiment, the first conductive layer 13 and the third conductive layer 23 are spaced apart, and the third conductive layer 23 is coupled to the first conductive layer 13. That is, the first conductive layer 13 and the third conductive layer 23 are not in direct contact, but signal transmission is achieved by coupling. The signal transmission between the first conductive layer 13 and the third conductive layer 23 is achieved by coupling, and electromagnetic coupling is used to transmit the energy of the two-layer microwave network without direct contact or welding, which solves the problem of difficult welding of the vertical interconnection structure and the impact of welding abnormality on the reliability of the vertical interconnection structure in the prior art, greatly reduces the process requirements, and reduces the process difficulty.

[0079] The first through hole 151 extends along the third direction Y, which is perpendicular to the first direction Z and intersects with the second direction X. In this embodiment, the third direction Y is perpendicular to the first direction Z and the second direction X, thereby reducing the leakage of electromagnetic waves in the second direction X, making the electromagnetic waves in the third direction Y fully coupled, so that the energy propagation performance is excellent and the loss is very low.

[0080] In this embodiment, the first conductive layer 13 includes a first conductive portion 131 and a second conductive portion 132 connected to each other, and the first conductive portion 131 is coupled to the second transmission line 2. Specifically, the first conductive portion 131 and the second conductive portion 132 are arranged along the second direction X from the center to the edge of the first package substrate 11.

[0081] like Figure 2 and Figure 6 As shown, the maximum width of the first conductive portion 131 is greater than the maximum width of the second conductive portion 132. By increasing the width of the first conductive portion 131 coupled to the second transmission line 2, the coupling performance of the first conductive portion 131 and the second transmission line 2 is increased, so that it has a wider range of applications. It is worth noting that the maximum width of the first conductive portion 131 refers to the maximum size of the first conductive portion 131 in the third direction Y. Similarly, the maximum width of the second conductive portion 132 refers to the maximum size of the second conductive portion 132 in the third direction Y.

[0082] The width of the first conductive portion 131 on the side close to the second conductive portion 132 is greater than or equal to the width of the second conductive portion 132 on the side close to the first conductive portion 131. In this embodiment, the width of the first conductive portion 131 on the side close to the second conductive portion 132 is greater than the width of the second conductive portion 132 on the side close to the first conductive portion 131.

[0083] like Figure 2 and Figure 6As shown, the first boss 12 includes a first boss portion 121 and a second boss portion 122 connected to each other. The first boss portion 121 and the second boss portion 122 are arranged from the center to the edge of the first package substrate 11 along the second direction X. The first conductive portion 131 is disposed on the top surface of the first boss portion 121, and the second conductive portion 132 is disposed on the top surface of the second boss portion 122.

[0084] like Figure 3 As shown, the maximum thickness of the first boss portion 121 is greater than the maximum thickness of the second boss portion 122. By increasing the thickness of the first boss portion 121, the height of the first conductive portion 131 located on the first boss portion 121 is increased, thereby reducing the coupling distance between the first conductive portion 131 and the third conductive layer 23, enhancing the coupling strength, and greatly reducing the energy reflection in the vertical interconnection structure. It is worth noting that the maximum thickness of the first boss portion 121 refers to the maximum size of the first boss portion 121 in the first direction Z. Similarly, the maximum thickness of the second boss portion 122 refers to the maximum size of the second boss portion 122 in the first direction Z.

[0085] The thickness of the first boss portion 121 on the side close to the second boss portion 122 is greater than or equal to the thickness of the second boss portion 122 on the side close to the first boss portion 121. In this embodiment, the thickness of the first boss portion 121 on the side close to the second boss portion 122 is equal to the thickness of the second boss portion 122 on the side close to the first boss portion 121. The first boss portion 121 has a slope at one end close to the second boss portion 122. The height of the slope gradually increases from the second boss portion 122 to the first boss portion 121. The height of the first boss portion 121 is increased by the slope, so as to avoid the first conductive layer 13 from vertically climbing at the connection between the second boss portion 122 and the first boss portion 121, thereby affecting the performance of the first conductive layer 13.

[0086] like Figure 3 As shown, in this embodiment, the third conductive layer 23 includes a third conductive portion 231 and a fourth conductive portion 232 connected to each other, and the third conductive portion 231 is coupled to the first conductive portion 131. Specifically, the third conductive portion 231 and the fourth conductive portion 232 are arranged along the second direction X from the center to the edge of the second packaging substrate 21.

[0087] The maximum width of the third conductive portion 231 is greater than the maximum width of the fourth conductive portion 232. By increasing the width of the third conductive portion 231 coupled with the first conductive portion 131, the coupling performance of the third conductive portion 231 with the first conductive portion 131 is increased, so that it has a wider range of applications. It is worth noting that the maximum width of the third conductive portion 231 refers to the maximum size of the third conductive portion 231 in the third direction Y. Similarly, the maximum width of the fourth conductive portion 232 refers to the maximum size of the fourth conductive portion 232 in the third direction Y.

[0088] The width of the third conductive portion 231 on the side close to the fourth conductive portion 232 is greater than or equal to the width of the fourth conductive portion 232 on the side close to the third conductive portion 231. In this embodiment, the width of the third conductive portion 231 on the side close to the fourth conductive portion 232 is greater than the width of the fourth conductive portion 232 on the side close to the third conductive portion 231.

[0089] The second boss 22 includes a third boss portion 221 and a fourth boss portion 222 connected to each other. The third boss portion 221 and the fourth boss portion 222 are arranged from the center to the edge of the second package substrate 21 along the second direction X. The third conductive portion 231 is disposed on the top surface of the third boss portion 221, and the fourth conductive portion 232 is disposed on the top surface of the fourth boss portion 222.

[0090] Among them, the maximum thickness of the third boss portion 221 is greater than the maximum thickness of the fourth boss portion 222. By increasing the thickness of the third boss portion 221, the height of the third conductive portion 231 located on the third boss portion 221 is increased, thereby reducing the coupling distance between the third conductive portion 231 and the first conductive portion 131, enhancing the coupling strength, and greatly reducing the energy reflection in the vertical interconnection structure. It is worth noting that the maximum thickness of the third boss portion 221 refers to the maximum size of the third boss portion 221 in the first direction Z. Similarly, the maximum thickness of the fourth boss portion 222 refers to the maximum size of the fourth boss portion 222 in the first direction Z.

[0091] The thickness of the third boss portion 221 on the side close to the fourth boss portion 222 is greater than or equal to the thickness of the fourth boss portion 222 on the side close to the third boss portion 221. In this embodiment, the thickness of the third boss portion 221 on the side close to the fourth boss portion 222 is equal to the thickness of the fourth boss portion 222 on the side close to the third boss portion 221. The end of the third boss portion 221 close to the fourth boss portion 222 has a slope, and the height of the slope gradually increases from the fourth boss portion 222 to the third boss portion 221. The height of the third boss portion 221 is increased by the slope, so as to avoid the third conductive layer 23 from vertically climbing at the connection between the fourth boss portion 222 and the third boss portion 221, thereby affecting the performance of the third conductive layer 23.

[0092] In summary, this embodiment mainly describes a transmission scenario in which a Tiered Circuit Board (TCB) is converted to a Tiered Circuit Board (TCB) by coupling.

[0093] Example 2

[0094] like Figure 7-10As shown, this embodiment includes most of the technical features of Example 1. The difference between this embodiment and Example 1 is that the first conductive layer 13 and the third conductive layer 23 are electrically connected, that is, the first conductive layer 13 and the third conductive layer 23 are in direct contact to achieve signal transmission, rather than using the coupling method in Example 1 to achieve signal transmission.

[0095] The thickness of the first boss portion 121 in this embodiment is greater than the thickness of the first boss portion 121 in Example 1; and / or the thickness of the third boss portion 221 is greater than the thickness of the third boss portion 221 in Example 1, thereby allowing the first conductive layer 13 on the first boss portion 121 or the third conductive layer 23 on the third boss portion 221 to achieve direct contact through the first through hole 151 in the grounding plate 15.

[0096] Furthermore, if Figure 8 and Fig.10 As shown, the first conductive layer 13 has a first clamping portion 1301, and the first boss 12 has a second clamping portion 1201 that interlocks with the first clamping portion 1301; the third conductive layer 23 has a third clamping portion 2301 that interlocks with the first clamping portion 1301, and the second boss 22 has a fourth clamping portion 2201 that interlocks with the third clamping portion 2301. Specifically, in this embodiment, the second clamping portion 1201 is a recessed portion, and the fourth clamping portion 2201 is a protruding portion. The first clamping portion 1301 covers the bottom and side walls of the recessed portion, thereby interlocking with the second clamping portion 1201. The third clamping portion 2301 covers the top surface and side walls of the protruding portion, thereby interlocking with the fourth clamping portion 2201. Furthermore, the protrusion is in the shape of a truncated cone, and the radius of the surface of the protrusion close to the concave portion is smaller than the radius of the surface of the protrusion away from the concave portion, thereby making the first clamping portion 1301 and the third clamping portion 2301 more firmly in contact. In other embodiments, the second clamping portion 1201 may be a protrusion, and the fourth clamping portion 2201 may be a concave portion.

[0097] In this embodiment, the first clamping portion 1301 and the third clamping portion 2301 are engaged with each other to achieve direct contact between the first conductive layer 13 and the third conductive layer 23 in the first direction Z, thereby achieving good energy propagation in the first direction Z. The first clamping portion 1301 and the third clamping portion 2301 are used to compensate or offset the discontinuity of the transmission process of the first transmission line 1 and the second transmission line 2 in the vertical interconnection structure, thereby achieving impedance matching and achieving low reflection of electromagnetic signals.

[0098] In this embodiment, the first through hole 151 extends along the second direction X. Specifically, the first through hole 151 is elliptical, and the major axis of the ellipse is parallel to the second direction X. Thus, the connection performance of the first transmission line 1 and the second transmission line 2 can be improved to the greatest extent.

[0099] In summary, this embodiment mainly describes a transmission scenario in which a Tiered Circuit Board (TCB) is transferred to a Tiered Circuit Board (TCB) by direct contact.

[0100] Example 3

[0101] like Figure 11-Figure 14 As shown, this embodiment includes most of the technical features of the embodiment 1. The difference between this embodiment and the embodiment 1 is that in this embodiment, the first conductive layer 13 and the third conductive layer 23 are electrically connected, that is, the first conductive layer 13 and the third conductive layer 23 are in direct contact to achieve signal transmission, rather than using the coupling method in the embodiment 1 to achieve signal transmission. The second transmission line 2 includes a coaxial connector 201. The coaxial connector 201 includes: an inner conductor 2011, an insulating layer 2012 surrounding the inner conductor 2011, and an outer conductor 2013 surrounding the insulating layer 2012. Among them, the inner conductor 2011 protrudes from the insulating layer 2012 along the first direction Z. The axis of the outer conductor 2013 coincides with the axis of the inner conductor 2011.

[0102] The inner conductor 2011 is electrically connected to the first conductive layer 13 and is insulated from the ground plane 15 .

[0103] In this embodiment, the second conductive layer 14 also covers the bottom of the first groove 111 , and the outer conductor 2013 is electrically connected to the second conductive layer 14 at the bottom of the first groove 111 .

[0104] In this embodiment, the coaxial connector 201 is located on a side of the ground plate 15 away from the first packaging substrate.

[0105] Specifically, the ground plate 15 is provided with an insulating portion 152 at a position corresponding to the insulating layer 2012, and the insulating portion 152 is provided with a second through hole 1521 at a position corresponding to the inner conductor 2011. The insulating portion 152 prevents the entire ground plate from causing a short circuit between the inner conductor 2011 and the outer conductor 2013.

[0106] The first boss 12 is provided with an opening 1202, and the first conductive layer 13 is also provided in the opening 1202. The first conductive layer 13 in the opening 1202 is used to compensate or offset the discontinuity of the transmission process of the first transmission line 1 and the second transmission line 2 in the vertical interconnection structure, thereby achieving impedance matching and achieving low reflection of electromagnetic signals.

[0107] The inner conductor 2011 is inserted into the opening 1202 through the second through hole 1521 and electrically connected to the first conductive layer 13. The height of the first boss portion 121 is increased by using the slope of one end of the first boss portion 121 close to the second boss portion 122, and then the opening 1202 is set on the first conductive portion 131, and the inner conductor 2011 is inserted into the opening 1202, so that the inner conductor 2011 and the first conductive layer 13 are more firmly welded together, the connection reliability between the inner conductor 2011 and the first conductive layer 13 is improved, poor contact is avoided, and misalignment between the inner conductor 2011 and the first conductive layer 13 is prevented, thereby improving the assembly accuracy of the vertical interconnection structure.

[0108] like Fig.12 As shown, in this embodiment, a tenth conductive layer 1205 may be further provided on the hole wall of the second through hole 1521. One end of the tenth conductive layer 1205 is electrically connected to the inner conductor 2011, and the other end thereof is electrically connected to the first conductive layer 13. When the inner conductor 2011 is too short to contact the first conductive layer 13, the tenth conductive layer 1205 can still ensure the electrical connection performance between the inner conductor 2011 and the first conductive layer 13.

[0109] In this embodiment, at least one third through hole 153 is provided on the grounding plate 15 around the insulating portion 152, and a sixth conductive layer 1531 is provided on the hole wall of the third through hole 153. One end of the sixth conductive layer 1531 is electrically connected to the second conductive layer 14, and the other end of the sixth conductive layer 1531 is electrically connected to the outer conductor 2013.

[0110] In summary, this embodiment mainly describes a transmission scenario in which a Tiered Circuit Board (TCB) is transferred to a coaxial connector by direct contact, and the coaxial connector is located on a side of the ground plate 15 away from the first packaging substrate 11 .

[0111] Example 4

[0112] like Figure 15-18 As shown, this embodiment includes most of the technical features of the embodiment 1. The difference between this embodiment and the embodiment 1 is that in this embodiment, the first conductive layer 13 and the third conductive layer 23 are electrically connected, that is, the first conductive layer 13 and the third conductive layer 23 are in direct contact to achieve signal transmission, rather than using the coupling method in the embodiment 1 to achieve signal transmission. The second transmission line 2 includes a coaxial connector 201. The coaxial connector 201 includes: an inner conductor 2011, an insulating layer 2012 surrounding the inner conductor 2011, and an outer conductor 2013 surrounding the insulating layer 2012. Among them, the inner conductor 2011 protrudes from the insulating layer 2012 along the first direction Z. The axis of the outer conductor 2013 coincides with the axis of the inner conductor 2011.

[0113] In this embodiment, the coaxial connector 201 is located on a side of the first package substrate 11 away from the ground plate 15. Since the coaxial connector 201 of this embodiment is located on a side of the first package substrate 11 away from the ground plate 15, the maximum thickness of the first boss portion 121 in this embodiment can be equal to or even less than the maximum thickness of the second boss portion 122, thereby avoiding increasing the spacing between the first conductive layer 13 and the inner conductor 2011 and affecting the transmission performance between the first conductive layer 13 and the inner conductor 2011.

[0114] The inner conductor 2011 is electrically connected to the first conductive layer 13 and is insulated from the ground plane 15 .

[0115] In this embodiment, the second conductive layer 14 also covers the bottom of the first groove 111 , and the outer conductor 2013 is electrically connected to the second conductive layer 14 at the bottom of the first groove 111 .

[0116] like Fig.16 , Fig.17 and Fig.18 As shown, the first boss 12 has a fourth through hole 1203 , and the inner conductor 2011 passes through the fourth through hole 1203 to be electrically connected to the first conductive layer 13 .

[0117] The first package substrate 11 has at least one fifth through hole 112, and a seventh conductive layer 1121 is disposed on the hole wall of the fifth through hole 112. One end of the seventh conductive layer 1121 is electrically connected to the second conductive layer 14, and the other end of the seventh conductive layer 1121 is electrically connected to the outer conductor 2013.

[0118] In summary, this embodiment mainly describes a transmission scenario in which a Tiered Circuit Board (TCB) is transferred to a coaxial connector by direct contact, and the coaxial connector is located on a side of the first packaging substrate 11 away from the ground plate 15 .

[0119] Example 5

[0120] like Figure 19-21As shown, this embodiment includes most of the technical features of the embodiment 1. The difference between this embodiment and the embodiment 1 is that in this embodiment, the first conductive layer 13 and the third conductive layer 23 are electrically connected, that is, the first conductive layer 13 and the third conductive layer 23 are in direct contact to achieve signal transmission, rather than using the coupling method in the embodiment 1 to achieve signal transmission. The second transmission line 2 is arranged on the side of the first packaging substrate 11 away from the grounding plate 15. Since the second transmission line 2 is located on the side of the first packaging substrate 11 away from the grounding plate 15, the maximum thickness of the first boss portion 121 in this embodiment can be equal to or even less than the maximum thickness of the second boss portion 122, so as to avoid increasing the spacing between the first conductive layer 13 and the inner conductor 2011 and affecting the transmission performance between the first conductive layer 13 and the inner conductor 2011.

[0121] In this embodiment, the second transmission line 2 comprises a coplanar waveguide transmission line 202. The coplanar waveguide transmission line 202 comprises a central strip 2021 and a ground strip 2022 arranged around the central strip 2021.

[0122] The first boss 12 has a sixth through hole 1204 , and an eighth conductive layer 12041 is disposed on the hole wall of the sixth through hole 1204 . One end of the eighth conductive layer 12041 is electrically connected to the first conductive layer 13 , and the other end of the eighth conductive layer 12041 is electrically connected to the central band 2021 .

[0123] The second conductive layer 14 also covers the bottom of the first groove 111; the first package substrate 11 has at least one seventh through hole 113, and a ninth conductive layer 1131 is disposed on the wall of the seventh through hole 113. One end of the ninth conductive layer 1131 is electrically connected to the second conductive layer 14 at the bottom of the first groove 111, and the other end of the ninth conductive layer 1131 is electrically connected to the grounding strip 2022.

[0124] like Fig. 22 As shown, in this embodiment, a quarter wavelength impedance converter 133 is provided between the first conductive portion 131 and the second conductive portion 132 of the first conductive layer 13. The quarter wavelength impedance converter 133 is used to match a wider line width and then transition to the second conductive portion 132.

[0125] like Fig. 20 As shown, the first groove 111 penetrates the first packaging substrate 11 along the first direction X, thereby thinning the thickness of the first packaging substrate 11 corresponding to the coplanar waveguide transmission line 202, thereby avoiding the first packaging substrate 11 being too thick to affect the transmission performance of the coplanar waveguide transmission line 202 and the first conductive layer 13.

[0126] like Fig.21As shown, the grounding strip 2022 of the coplanar waveguide transmission line 202 partially covers the second surface 1102 of the first packaging substrate 11, thereby preventing strong resonance between the grounding strip 2022 and the ground plate 15, which greatly affects the transmission performance.

[0127] In summary, this embodiment mainly describes a transmission scenario in which a Tiered Circuit Board (TCB) is transferred to a coplanar waveguide transmission line by direct contact.

[0128] The vertical interconnection structure provided by the present application is introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A vertical interconnection structure, characterized in that: It comprises a first transmission line (1) and a second transmission line (2) arranged along a first direction, wherein the first transmission line (1) comprises: A first packaging substrate (11), which has a first surface in the first direction, the first surface has a first groove (111), and the first groove (111) extends along a second direction perpendicular to the first direction; A first boss (12) is protruding from the bottom of the first groove (111) and extends along the second direction, and a side wall of the first boss (12) is spaced apart from a side wall of the first groove (111); A first conductive layer (13) is arranged on the top surface of the first boss (12), and the first conductive layer (13) is coupled or electrically connected to the second transmission line (2); a second conductive layer (14), at least arranged on a side wall of the first groove (111), the second conductive layer (14) being insulated from the first conductive layer (13); and A grounding plate (15) is arranged on the first surface, the grounding plate (15) is insulated from the first conductive layer (13), and the second conductive layer (14) is electrically connected to the grounding plate (15).

2. The vertical interconnection structure according to claim 1, characterized in that: The first conductive layer (13) comprises a first conductive portion (131) and a second conductive portion (132) connected to each other, the first conductive portion (131) and the second conductive portion (132) extending along the second direction, and the first conductive portion (131) is coupled or electrically connected to the second transmission line (2); The maximum width of the first conductive portion (131) is greater than the maximum width of the second conductive portion (132).

3. The vertical interconnection structure according to claim 2, characterized in that: The width of a side of the first conductive portion (131) close to the second conductive portion (132) is greater than or equal to the width of a side of the second conductive portion (132) close to the first conductive portion (131).

4. The vertical interconnection structure according to claim 2, characterized in that: The first boss (12) comprises a first boss portion (121) and a second boss portion (122) which are connected, and the maximum thickness of the first boss portion (121) is greater than the maximum thickness of the second boss portion (122); The first conductive portion (131) is arranged on the top surface of the first boss portion (121), and the second conductive portion (132) is arranged on the top surface of the second boss portion (122).

5. The vertical interconnection structure according to claim 4, characterized in that: The thickness of the first boss portion (121) on a side close to the second boss portion (122) is greater than or equal to the thickness of the second boss portion (122) on a side close to the first boss portion (121).

6. The vertical interconnection structure according to claim 1, characterized in that: The second transmission line (2) is arranged on a side of the ground plate (15) away from the first packaging substrate (11); The second transmission line (2) comprises: A second packaging substrate (21), a surface of which is close to the ground plate (15) and has a second groove (211), wherein the second groove (211) extends along the second direction; A second boss (22) is convexly disposed on the bottom of the second groove (211) and extends along the second direction, and a side wall of the second boss (22) is spaced apart from a side wall of the second groove (211); a third conductive layer (23) disposed on the top surface of the second boss (22), the third conductive layer (23) being coupled or electrically connected to the first conductive layer (13), and the third conductive layer (23) being insulated from the ground plane (15); and a fourth conductive layer (24), at least arranged on a side wall of the second groove (211), the fourth conductive layer (24) being insulated from the third conductive layer (23), and the fourth conductive layer (24) being electrically connected to the ground plate (15); The grounding plate (15) is provided with a first through hole (151), the first through hole (151) at least partially exposes the first conductive layer (13) and the third conductive layer (23), a fifth conductive layer is provided on the hole wall of the first through hole (151), one end of the fifth conductive layer is electrically connected to the second conductive layer (14), and the other end of the fifth conductive layer is electrically connected to the fourth conductive layer (24).

7. The vertical interconnection structure according to claim 6, characterized in that: The first conductive layer (13) and the third conductive layer (23) are arranged with an interval therebetween, and the third conductive layer (23) is coupled to the first conductive layer (13).

8. The vertical interconnection structure according to claim 7, characterized in that: The first through hole (151) extends along a third direction, which is perpendicular to the first direction and intersects with the second direction.

9. The vertical interconnection structure according to claim 6, characterized in that: The first conductive layer (13) is in direct contact with the third conductive layer (23), and the third conductive layer (23) is electrically connected to the first conductive layer (13).

10. The vertical interconnection structure according to claim 9, characterized in that: The first conductive layer (13) has a first clamping portion (1301), and the first boss (12) has a second clamping portion (1201) that is interlocked with the first clamping portion (1301); The third conductive layer (23) has a third clamping portion (2301) interlocked with the first clamping portion (1301), and the second boss (22) has a fourth clamping portion (2201) interlocked with the third clamping portion (2301).

11. The vertical interconnection structure according to claim 9, characterized in that: The first through hole (151) extends along the second direction.

12. The vertical interconnection structure according to claim 1, characterized in that: The second transmission line (2) comprises a coaxial connector (201), the coaxial connector (201) comprising: an inner conductor (2011), an insulating layer (2012) surrounding the inner conductor (2011), and an outer conductor (2013) surrounding the insulating layer (2012), the inner conductor (2011) protruding from the insulating layer (2012) along the first direction; Wherein, the inner conductor (2011) is electrically connected to the first conductive layer (13), and is insulated from the ground plate (15); The second conductive layer (14) also covers the bottom of the first groove (111), and the outer conductor (2013) is electrically connected to the second conductive layer (14) at the bottom of the first groove (111).

13. The vertical interconnection structure according to claim 12, characterized in that: The coaxial connector (201) is located on a side of the ground plate (15) away from the first packaging substrate (11); The ground plate (15) is provided with an insulating portion (152) at a position corresponding to the insulating layer (2012), and the insulating portion (152) is provided with a second through hole (1521) at a position corresponding to the inner conductor (2011); The first boss (12) is provided with an opening (1202), and the first conductive layer (13) is also arranged in the opening (1202); The inner conductor (2011) passes through the second through hole (1521) and is inserted into the opening (1202) to be electrically connected to the first conductive layer (13); At least one third through hole (153) is provided on the grounding plate (15) on the peripheral side of the insulating portion (152), and a sixth conductive layer (1531) is provided on the hole wall of the third through hole (153), one end of the sixth conductive layer (1531) is electrically connected to the second conductive layer (14), and the other end of the sixth conductive layer (1531) is electrically connected to the outer conductor (2013).

14. The vertical interconnection structure according to claim 12, characterized in that: The coaxial connector (201) is located on a side of the first packaging substrate (11) away from the ground plate (15); The first boss (12) has a fourth through hole (1203), and the inner conductor (2011) passes through the fourth through hole (1203) to be electrically connected to the first conductive layer (13); The first packaging substrate (11) has at least one fifth through hole (112), a seventh conductive layer (1121) is provided on the hole wall of the fifth through hole (112), one end of the seventh conductive layer (1121) is electrically connected to the second conductive layer (14), and the other end of the seventh conductive layer (1121) is electrically connected to the outer conductor (2013).

15. The vertical interconnection structure according to claim 1, characterized in that: The second transmission line (2) is arranged on a side of the first packaging substrate (11) away from the ground plate (15); The second transmission line (2) comprises a coplanar waveguide transmission line (202), wherein the coplanar waveguide transmission line (202) comprises: a central strip (2021) and a grounding strip (2022) arranged around the central strip (2021); The first boss (12) has a sixth through hole (1204), an eighth conductive layer (12041) is provided on the hole wall of the sixth through hole (1204), one end of the eighth conductive layer (12041) is electrically connected to the first conductive layer (13), and the other end of the eighth conductive layer (12041) is electrically connected to the central band (2021); The second conductive layer (14) also covers the bottom of the first groove (111); The first packaging substrate (11) has at least one seventh through hole (113), a ninth conductive layer (1131) is provided on the hole wall of the seventh through hole (113), one end of the ninth conductive layer (1131) is electrically connected to the second conductive layer (14) at the bottom of the first groove (111), and the other end of the ninth conductive layer (1131) is electrically connected to the grounding strip (2022).

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