FPC board bonding structure

Abstract

The present application relates to a bonding structure of an FPC board. The bonding structure of the FPC board includes: a backlight iron frame and a limiting component, and a material placement slot is provided on the backlight iron frame; the limiting component includes a spring sheet and a bending portion, and the spring sheet is arranged at the bottom of the material placement slot, and the bending portion is connected to the spring sheet, and the bending portion is arranged on the backlight iron frame. The solution provided by the present application can bond and fix the entire FPC board in a naturally bent state, so as to prevent the FPC board from swinging irregularly when vibration occurs during transportation, thereby causing damage to the components.

Description

Technical Field

[0001] The utility model relates to the technical field of display screens, in particular to a bonding structure of an FPC board. Background Art

[0002] At present, for the module where the display screen and the touch screen are bonded, the FPC board of the touch screen is transferred to the FPC board of the display screen through welding, and then the welded FPC board is bent for installation. Due to the laminated structure, there is a height difference between the FPC board of the touch screen and the FPC board of the display screen. Therefore, in order to ensure that the FPC board of the touch screen and the FPC board of the display screen do not overlap and interfere when they can be bent backwards 180 degrees, the pad positions of the two FPC boards are misaligned when they are unfolded without welding. The FPC pad position of the touch screen is longer than that of the display screen. In this way, after the alignment and welding are completed, there is stress between the two FPC boards, which makes the entire FPC board after welding in a natural bending state. Therefore, when the natural bending state is shipped from the factory, when vibration occurs during transportation, the irregular swing and collision of the FPC board may damage the components, and the risk of quality problems is also increased. Utility Model Content

[0003] The purpose of the utility model is to overcome the deficiencies in the prior art and provide a fitting structure of an FPC board, which can fit and fix the entire FPC board in a naturally bent state, thereby preventing the FPC board from swinging irregularly when vibration occurs during transportation, thereby causing component damage.

[0004] The purpose of this utility model is achieved through the following technical solutions:

[0005] The first aspect of the present application provides a bonding structure of an FPC board, comprising: a backlight iron frame, on which a material placement slot is provided; a limiting component, the limiting component comprising a spring sheet and a bending portion, the spring sheet being arranged at the bottom of the material placement slot, the bending portion being connected to the spring sheet, and the bending portion being arranged on the backlight iron frame.

[0006] The limiting assembly further includes a lifting portion, and the lifting portion is arranged on the spring sheet.

[0007] The lifting portion is located in a first direction, the spring sheet is located in a second direction, and an angle formed by the first direction and the second direction ranges from 20 degrees to 30 degrees.

[0008] A spacing area is arranged between the lifting portion and the groove wall of the material placing groove.

[0009] A clearing area is arranged between the bending portion and the backlight iron frame.

[0010] The height of the air avoidance zone ranges from 2 mm to 2.2 mm.

[0011] The depth of the material placing groove ranges from 1.0 mm to 1.2 mm.

[0012] It also includes a backlight module, which is arranged on the backlight iron frame.

[0013] It also includes optical glue, which is arranged on the backlight module.

[0014] It also includes a display module, which is arranged on the optical glue.

[0015] Compared with the prior art, the utility model has at least the following advantages:

[0016] The present application places the FPC board in the material slot, and presses the FPC board into the material slot by bending the spring sheet. In this way, the FPC board can be fixed and will not be in a natural bending state all the time, thereby preventing the FPC board from swinging irregularly during the vibration during transportation, causing damage to the components. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.

[0018] Figure 1 It is a structural schematic diagram of the bonding structure of the FPC board in one embodiment of the utility model;

[0019] Figure 2 It is a structural schematic diagram of another implementation of the bonding structure of the FPC board in one embodiment of the utility model. DETAILED DESCRIPTION

[0020] The embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.

[0021] It should be understood that although the terms "first", "second", "third", etc. may be used in this application to describe various information, this information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0022] Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, or a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0023] For the module where the display screen and the touch screen are bonded, the FPC board of the touch screen is transferred to the FPC board of the display screen through welding, and then the welded FPC board is bent for installation. Due to the laminated structure, there is a height difference between the FPC board of the touch screen and the FPC board of the display screen. Therefore, in order to ensure that the FPC board of the touch screen and the FPC board of the display screen do not overlap and interfere when they are bent backwards 180 degrees, the pad positions of the two FPC boards are misaligned when they are unfolded without welding. The FPC pad position of the touch screen is longer than that of the display screen. In this way, after the alignment and welding are completed, there is stress between the two FPC boards, which makes the entire FPC board after welding in a natural bending state. Therefore, it is shipped in a natural bending state. When vibration occurs during transportation, the irregular swing and collision of the FPC board may damage the components.

[0024] In response to the above problems, an embodiment of the present application provides a bonding structure of an FPC board, which can bond and fix the entire FPC board in a naturally bent state to prevent the FPC board from swinging irregularly when vibration occurs during transportation, thereby preventing damage to components.

[0025] The technical solution of the embodiments of the present application is described in detail below with reference to the accompanying drawings.

[0026] See also Figure 1 and Figure 2 A bonding structure of an FPC board includes a backlight iron frame 100 and a limiting component 200. The backlight iron frame 100 is provided with a material placement groove 110; the limiting component 200 includes a spring piece 210 and a bending portion 220. The spring piece 210 is arranged at the bottom of the material placement groove 110, the bending portion 220 is connected to the spring piece 210, and the bending portion 220 is arranged on the backlight iron frame 100.

[0027] It should be noted that the present application places the FPC board in the material slot 110, and presses the FPC board into the material slot 110 by bending the spring sheet 210. In this way, the FPC board can be fixed and will not be in a natural bending state all the time, thereby preventing the FPC board from swinging irregularly during the vibration during transportation, resulting in component damage.

[0028] See also Figure 1 In one embodiment, the limiting assembly 200 further includes a lifting portion 230 , and the lifting portion 230 is disposed on the spring sheet 210 .

[0029] It should be noted that the provision of the lifting portion 230 facilitates the operator to pry open the spring sheet 210 to fix the FPC board.

[0030] See also Figure 1 In one embodiment, the lifting portion 230 is located in a first direction, the spring piece 210 is located in a second direction, and the angle formed by the first direction and the second direction is in a range of 20 degrees to 30 degrees.

[0031] It should be noted that the second direction is the horizontal direction, and the first direction is the tilting angle of the lifting portion 230, which is usually 20 to 30 degrees, which can facilitate operators to pry open the spring pieces without increasing the difficulty of subsequent packaging due to excessive angles.

[0032] See also Figure 1 In one embodiment, a spacing area 120 is provided between the lifting portion 230 and the wall of the material placing trough 110 .

[0033] It should be noted that, by providing the spacing area 120 , it can be ensured that the operator will not pull up the FPC board when prying open the spring sheet 210 .

[0034] See also Figure 1 In one embodiment, a clearance area 130 is provided between the bending portion 220 and the backlight iron frame 100. Specifically, the height of the clearance area 130 ranges from 2 mm to 2.2 mm.

[0035] It should be noted that, by providing the avoidance area 130 , it can be ensured that the spring piece 210 will not break when being pulled up to a large angle.

[0036] See also Figure 1 In one embodiment, the depth of the material placement groove 110 ranges from 1.0 mm to 1.2 mm.

[0037] It should be noted that the depth of the material placement groove 110 is usually in the range of 1.0 mm to 1.2 mm. The present application adopts a groove depth of 1.0 mm, so that the thickness of the FPC boards after stacking can be ensured to be not too large.

[0038] See also Figure 1 In one embodiment, the backlight module 300 is further included, and the backlight module 300 is disposed on the backlight iron frame 100. Specifically, the optical glue 400 is further included, and the optical glue 400 is disposed on the backlight module 300. Specifically, the display module 500 is further included, and the display module 500 is disposed on the optical glue 400.

[0039] It should be noted that the display module 500 is attached to the backlight module 300 via the optical adhesive 400 .

[0040] The scheme of the present application has been described in detail above with reference to the accompanying drawings. In the above embodiments, the descriptions of the various embodiments have their own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments. Those skilled in the art should also be aware that the actions and modules involved in the specification are not necessarily required for the present application. In addition, it can be understood that the steps in the method of the embodiment of the present application can be adjusted in order, merged and deleted according to actual needs, and the modules in the device of the embodiment of the present application can be merged, divided and deleted according to actual needs.

[0041] The embodiments of the present application have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or improvements to the technology in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A bonding structure of an FPC board, characterized in that: include: A backlight iron frame, wherein a material placing trough is provided on the backlight iron frame; The limiting component includes a spring sheet and a bending portion, wherein the spring sheet is arranged at the bottom of the material placing trough, the bending portion is connected to the spring sheet, and the bending portion is arranged on the backlight iron frame.

2. The FPC board bonding structure according to claim 1, characterized in that: The limiting assembly further includes a lifting portion, and the lifting portion is arranged on the spring sheet.

3. The FPC board bonding structure according to claim 2, characterized in that: The lifting portion is located in a first direction, the spring sheet is located in a second direction, and an angle formed by the first direction and the second direction is in a range of 20 degrees to 30 degrees.

4. The FPC board bonding structure according to claim 2, characterized in that: A spacing area is arranged between the lifting portion and the groove wall of the material placing groove.

5. The FPC board bonding structure according to claim 1, characterized in that: A clearing area is arranged between the bending portion and the backlight iron frame.

6. The FPC board bonding structure according to claim 5, characterized in that: The height of the air avoidance zone ranges from 2 mm to 2.2 mm.

7. The FPC board bonding structure according to claim 2, characterized in that: The depth of the material placing groove ranges from 1.0 mm to 1.2 mm.

8. The FPC board bonding structure according to claim 1, characterized in that: It also includes a backlight module, which is arranged on the backlight iron frame.

9. The FPC board bonding structure according to claim 8, characterized in that: It also includes optical glue, which is arranged on the backlight module.

10. The FPC board bonding structure according to claim 9, characterized in that: It also includes a display module, which is arranged on the optical glue.

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