A high heat dissipation photovoltaic optimizer

Abstract

The present application relates to a photovoltaic optimizer with high heat dissipation performance, and to the technical field of photovoltaic optimizers, which includes an inner base, a circuit board located in the inner base, and an inner shell cover arranged on the inner base, wherein the outer sides of the inner base and the inner shell cover are respectively provided with an outer bottom plate and an outer shell cover, and the outer side surface of the outer shell cover is provided with heat dissipation fins, and a plurality of first heat sources are fixedly arranged on the side of the circuit board facing the inner base; an insulating heat-conducting ceramic sheet opposite to the first heat source is provided on the side of the circuit board facing the inner shell cover, and a main heat-equalizing block is provided on the side of the insulating heat-conducting ceramic sheet away from the circuit board; a heat-dissipating block opposite to the first heat source is provided on the side of the inner base away from the inner shell cover, and a plurality of heat-dissipating fins are fixedly arranged on the heat-dissipating block. In the present application, the heat-equalizing and heat-dissipating performance of the photovoltaic optimizer is comprehensively improved by using the insulating heat-conducting ceramic sheet, the main heat-equalizing block, the heat-dissipating block, and the heat-dissipating fins to equalize the heat and dissipate the heat on both sides of the first heat source on the circuit board.

Description

Technical Field

[0001] The present application relates to the technical field of photovoltaic optimizers, and in particular to a photovoltaic optimizer with high heat dissipation. Background Art

[0002] Solar photovoltaic power generation, with its clean, environmentally friendly and renewable characteristics, occupies an important position in the field of renewable energy. However, in practical applications, the power generation of photovoltaic systems is often seriously affected by factors such as shadow obstruction, differences in component orientation or inconsistent component attenuation. In order to solve these problems, photovoltaic optimizers came into being. It uses a unique software algorithm to track the maximum power point of a single component in real time, achieve the maximum power output of a single component and online monitoring, thereby improving system efficiency.

[0003] In the related art, a photovoltaic optimizer usually includes a metal shell, a printed circuit board module, an end cap, and a cable. The metal shell has an open hollow structure for accommodating and protecting the internal printed circuit board module; the end cap is used to cover the opening of the metal shell to form a closed accommodating cavity, and includes at least one through hole for the access of the cable. The electronic devices inside the photovoltaic optimizer will perform energy conversion during operation, but at the same time, they will also be accompanied by a certain amount of energy loss. Most of this lost energy will be converted into heat and accumulated inside the photovoltaic optimizer.

[0004] Since photovoltaic optimizers usually adopt a compact packaging design, although this design effectively protects the internal electronic devices from the influence of the external environment, it also limits the heat dissipation channel and heat dissipation area. Although heat dissipation fins have been set on the outside of the existing metal shell to enhance the heat dissipation effect, the actual effect is not ideal. The effective dissipation of heat is still limited, which may not only seriously affect the working stability of the photovoltaic optimizer, but also reduce its overall working efficiency, thereby limiting the overall performance of the photovoltaic system, and there is room for improvement. Utility Model Content

[0005] The purpose of this application is to provide a high heat dissipation photovoltaic optimizer to solve the problem that the heat dissipation performance of the photovoltaic optimizer in the above-mentioned related technologies is poor, affecting its working stability and overall working efficiency.

[0006] The high heat dissipation photovoltaic optimizer provided in this application adopts the following technical solution:

[0007] A photovoltaic optimizer with high heat dissipation performance comprises an inner base, a circuit board located in the inner base, and an inner shell cover arranged on the inner base, wherein the outer sides of the inner base and the inner shell cover are respectively provided with an outer bottom plate and an outer shell cover, and the outer side surface of the outer shell cover is provided with heat dissipation fins, and a plurality of first heat sources are fixedly arranged on the side of the circuit board facing the inner base; an insulating heat-conducting ceramic sheet opposite to the first heat source is provided on the side of the circuit board facing the inner shell cover, and a main heat-averaging block is provided on the side of the insulating heat-conducting ceramic sheet away from the circuit board; a heat dissipation block opposite to the first heat source is provided on the side of the inner base away from the inner shell cover, and a plurality of heat dissipation fins are fixedly arranged on the heat dissipation block.

[0008] By adopting the above technical scheme, when the first heat source generates heat, one side of the first heat source on the circuit board is heat-equalized and dissipated through the insulating thermally conductive ceramic sheet, the main heat-equalizing block and the heat dissipation fins, wherein the insulating thermally conductive ceramic sheet can increase the heat-equalizing area under different electric potentials, thereby expanding the contact area with the heat-equalizing aluminum block; and the other side of the first heat source on the circuit board is heat-equalized and dissipated through the heat dissipation block and the heat dissipation fins; thereby comprehensively improving the heat dissipation performance of the photovoltaic optimizer, reducing the temperature rise during the operation of the photovoltaic optimizer, and improving the working stability of the photovoltaic optimizer during operation.

[0009] Optionally, two second heat sources at equipotential positions are fixedly provided on the side of the circuit board facing the inner base, a secondary heat equalizing block opposite to the second heat source is provided on the side of the circuit board facing the outer shell cover, and a thermally conductive gasket for connecting the heat equalizing block is fixedly provided on the insulating thermally conductive ceramic sheet.

[0010] By adopting the above technical solution, due to the setting of the auxiliary heat equalizing block and the thermally conductive gasket, when the second heat source generates heat, the generated heat is conducted to the insulating thermally conductive ceramic sheet through the auxiliary heat equalizing block and the thermally conductive gasket, and then the heat is dissipated along the conduction path of the heat generated by the first heat source, thereby further improving the heat dissipation performance of the photovoltaic optimizer.

[0011] Optionally, a first heat-conducting layer is provided between the circuit board and the insulating heat-conducting ceramic sheet, and a second heat-conducting layer is provided between the insulating heat-conducting ceramic sheet and the main heat-absorbing block.

[0012] By adopting the above technical solution, due to the coordinated setting of the first thermal conductive layer and the second thermal conductive layer, the heat on the circuit board is better transferred to the insulating thermal conductive ceramic sheet, and the heat on the insulating thermal conductive ceramic sheet is transferred to the main heat equalizing block, thereby improving the thermal conductivity between the circuit board, the conductive ceramic sheet and the main heat equalizing block, thereby further improving the heat dissipation performance of the photovoltaic optimizer.

[0013] Optionally, a mounting through hole is provided on the inner shell cover, and the main heat-dissipating block is placed in the mounting through hole at a side away from the circuit board and abuts against an inner side surface of the outer shell cover.

[0014] By adopting the above technical solution, due to the setting of the mounting through hole, the heat conducted to the main heat equalizing block can be better conducted to the outer shell cover, and can also be better conducted to the outside through the heat dissipation fins on the outer shell cover.

[0015] Optionally, a third heat conducting layer is provided on the side of the main heat equalizing block facing the outer shell cover, an insulating layer is provided on the outer side of the third heat conducting layer of the main heat equalizing block, and a gap is reserved between the main heat equalizing block and the inner side of the outer shell cover for inserting the second heat conducting layer and the insulating layer.

[0016] By adopting the above technical solution, due to the coordinated arrangement of the third heat-conducting layer and the insulating paper, the main heat-averaging block and the outer shell cover are blocked, which can not only better conduct heat, but also play a role of double protection.

[0017] Optionally, a receiving groove is provided on the side of the inner base away from the inner shell cover, and a fixing slot for the heat sink block to be fixed is provided on the bottom side of the receiving groove; and a plurality of heat dissipation notches are provided on the opening edge of the receiving groove of the inner base.

[0018] By adopting the above technical solution, when the heat dissipation block and the heat sink are used to evenly distribute heat and dissipate heat on the other side of the circuit board, the conducted heat can be better discharged to the outside through the heat dissipation gap.

[0019] Optionally, a positioning through hole is provided on the outer bottom plate, and guide slots for inserting the inner base are provided on two inner edges of the opening of the outer shell cover facing the outer bottom plate; the inner base is fixedly provided with a limit block on the opening edge of the accommodating groove for abutting and limiting the inner base, and the inner base is fixedly provided with a limit block on the inner wall of the accommodating groove for inserting into the positioning through hole, and an abutment block is fixedly provided on the inner wall of the positioning through hole for abutting against the limit block.

[0020] By adopting the above technical solution, when the outer bottom plate is installed on the outer shell cover, the limit card block is inserted into the positioning through hole, and one side of the limit card block is pressed against the bottom side of the abutment block, thereby realizing the assembly and fixation of the outer bottom plate and the outer shell cover; the positioning through hole can not only be used for limiting and fixing the outer bottom plate, but also for discharging heat.

[0021] Optionally, a heat-conducting adhesive is provided in the cavity formed by the inner base and the inner shell cover, and a glue injection hole for injecting the heat-conducting adhesive and an exhaust hole for exhausting gas are provided on the side surface of the inner base.

[0022] By adopting the above technical solution, thermal conductive adhesive is used to further improve the heat dissipation performance of the circuit board; after the inner shell cover and the inner base are connected, the thermal conductive adhesive is injected into the cavity formed by the inner base and the inner shell cover through the glue injection hole, and the gas is discharged from the exhaust hole during this process.

[0023] In summary, the present application includes at least one of the following beneficial technical effects:

[0024] 1. When the photovoltaic optimizer is in operation, one side of the first heat source on the circuit board is heat-equalized and dissipated through the insulating thermally conductive ceramic sheet, the main heat-equalizing block and the heat dissipation fins, and the other side of the first heat source on the circuit board is heat-equalized and dissipated through the heat dissipation block and the heat sink; thereby comprehensively improving the heat dissipation performance of the photovoltaic optimizer, reducing the temperature rise during the operation of the photovoltaic optimizer, and improving the working stability during the operation of the photovoltaic optimizer.

[0025] 2. After the inner shell cover and the inner base are connected, the thermal conductive glue is injected into the cavity formed by the inner base and the inner shell cover through the glue injection hole. During this process, the gas is discharged from the exhaust hole; the use of thermal conductive glue further improves the heat dissipation performance of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0027] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application;

[0028] Figure 2 is a schematic diagram of the explosion structure of an embodiment of the present application;

[0029] Figure 3 It is a schematic cross-sectional structure diagram of the installation and matching of the insulating thermally conductive ceramic sheet and the main heat equalizing block in the embodiment of the present application;

[0030] Figure 4 yes Figure 3 A magnified schematic diagram of part A;

[0031] Figure 5 It is a schematic cross-sectional structure diagram of the installation and matching of the circuit board in the embodiment of the present application;

[0032] Figure 6 It is a partial cross-sectional structural schematic diagram of the installation and coordination of the auxiliary heat equalizing block in the embodiment of the present application;

[0033] Figure 7 It is a partial cross-sectional structural schematic diagram of the embodiment of the present application showing the installation and cooperation between the outer bottom plate and the outer shell cover;

[0034] Figure 8 It is a partial cross-sectional structural schematic diagram of the heat sink installation and coordination in the embodiment of the present application;

[0035] Fig. 9 yes Figure 8 A magnified schematic diagram of part B;

[0036] Fig.10 It is a structural schematic diagram of the distribution of injection holes and exhaust holes in an embodiment of the present application.

[0037] In the figure, 1, inner base; 11, accommodating sink groove; 12, fixing slot; 13, heat dissipation notch; 14, limit block; 15, limit card block; 16, glue injection hole; 17, exhaust hole; 2, inner shell cover; 21, mounting through hole; 22, support block; 221, support groove; 23, insulating screw sleeve; 3, outer bottom plate; 31, positioning through hole; 32, abutment block; 4, outer shell cover; 41, heat dissipation fin; 42, guide slot; 5, circuit board; 51, first heat source; 52, second heat source; 6, heat conduction component; 61, insulating thermal conductive ceramic sheet; 62, main heat equalizing block; 63, first heat conduction layer; 64, second heat conduction layer; 65, third heat conduction layer; 66, insulation layer; 67, auxiliary heat equalizing block; 68, heat dissipation block; 681, heat sink; 69, thermal gasket. DETAILED DESCRIPTION

[0038] The present application is further described in detail below in conjunction with all the accompanying drawings.

[0039] Example:

[0040] Reference Figure 1 and Figure 2 A photovoltaic optimizer with high heat dissipation performance comprises an inner base 1, a circuit board 5 located in the inner base 1, an inner shell cover 2 covered on the inner base 1, an outer bottom plate 3 and an outer shell cover 4 are respectively provided outside the inner base 1 and the inner shell cover 2, and a plurality of heat dissipation fins 41 evenly distributed are integrally formed on the outer surface of the outer shell cover 4;

[0041] Reference Figure 2 and Figure 3 Four first heat sources 51 are fixedly arranged on the side of the circuit board 5 facing the inner base 1, and a heat conducting component 6 is arranged inside the inner base 1, wherein the heat conducting component 6 comprises an insulating heat conducting ceramic sheet 61 and a main heat balancing block 62 made of aluminum, wherein the insulating heat conducting ceramic sheet 61 is located on the side of the circuit board 5 facing the inner shell cover 2, and the main heat balancing block 62 is located on the side of the insulating heat conducting ceramic sheet 61 away from the circuit board 5;

[0042] The insulating thermally conductive ceramic sheet 61 and the main heat balancing block 62 dissipate heat and balance heat for the first heat source 51, thereby reducing the heat near the first heat source 51 on the circuit board 5. The insulating thermally conductive ceramic sheet 61 and the main heat balancing block 62 balance heat and dissipate heat for one side of the circuit board 5.

[0043] Reference Figure 3 and Figure 4A first heat-conducting layer 63 is provided between the circuit board 5 and the insulating heat-conducting ceramic sheet 61, and a second heat-conducting layer 64 is provided between the insulating heat-conducting ceramic sheet 61 and the main heat-absorbing block 62. The first heat-conducting layer 63 and the second heat-conducting layer 64 are both heat-conducting mud, so as to improve the thermal conductivity between the circuit board 5, the conductive ceramic sheet and the main heat-absorbing block 62.

[0044] Reference Figure 3 and Figure 4 The inner shell cover 2 is provided with a mounting through hole 21, and the side of the main heat balancing block 62 away from the circuit board 5 is placed in the mounting through hole 21 and abuts against the inner side of the outer shell cover 4. The side of the main heat balancing block 62 facing the outer shell cover 4 is provided with a third heat conducting layer 65, and the main heat balancing block 62 is provided with an insulating layer 66 on the outer side of the third heat conducting layer 65;

[0045] The third heat-conducting layer 65 is also heat-conducting mud, and the insulating layer 66 is insulating paper, so that the heat on the main heat-equalizing block 62 can be better transferred to the heat dissipating fins 41 on the outer shell cover 4; a gap is reserved between the main heat-equalizing block 62 and the inner side of the outer shell cover 4 for the second heat-conducting layer 64 and the insulating layer 66 to be placed. The heat-conducting mud is a high-performance mud-like heat-conducting material, which feels similar to plasticine, and the insulating paper is a rubber insulating material, which will not be described in detail here.

[0046] Reference Figure 5 and Figure 6 Two second heat sources 52 at equipotential positions are fixedly arranged on the side of the circuit board 5 facing the inner base 1, and a secondary heat equalizing block 67 opposite to the second heat source 52 is arranged on the side of the circuit board 5 facing the outer shell cover 4, wherein the secondary heat equalizing block 67 is also made of aluminum, and since the secondary heat equalizing block 67 is opposite to the second heat source 52 and is also at equipotential positions, no insulating material is required to insulate and isolate it from the circuit board 5; a thermally conductive gasket 69 for connecting the heat equalizing block is fixedly arranged on the insulating thermally conductive ceramic sheet 61.

[0047] When the four first heat sources 51 generate heat, the two second heat sources 52 do not generate heat; when the two second heat sources 52 generate heat, the four first heat sources 51 do not generate heat, and the two second heat sources 52 simultaneously use a secondary heat equalizing block 67, so as to reduce the number of thermal conductive gaskets 69 used, increase the heat dissipation area, and further improve the heat dissipation performance.

[0048] Reference Figure 5 A plurality of support blocks 22 for limiting the position of the circuit board 5 are integrally formed on the inner side surface of the inner shell cover 2, and a support groove 221 is provided on the support block 22 for the edge of the circuit board 5 to be placed therein; at the same time, after the circuit board 5 and the inner shell cover 2 are initially assembled, the circuit board 5 and the inner shell cover 2 are fixed to the inner wall of the inner shell cover 2 by means of insulating screw sleeves 23 and screws.

[0049] Reference Figure 7 and Figure 8A heat sink 68 is provided on the side of the inner base 1 away from the inner shell cover 2, and a plurality of heat sinks 681 are integrally formed on the heat sink 68; a receiving sink 11 is provided on the side of the inner base 1 away from the inner shell cover 2, and a fixing slot 12 is provided on the bottom side of the receiving sink 11 for the heat sink 68 to be placed and fixed by glue;

[0050] The inner base 1 is provided with a plurality of heat dissipation notches 13 on the opening edge of the accommodating sink 11, and the outer base plate 3 is provided with positioning through holes 31. The heat dissipation block 68 and the heat sink 681 are used to evenly distribute heat and dissipate heat on the other side of the circuit board 5, and then the heat is discharged to the outside through the heat dissipation notches 13 and the positioning through holes 31.

[0051] Reference Figure 8 and Fig. 9 The outer shell cover 4 is provided with guide slots 42 for inserting the inner base 1 on two inner edges of the opening facing the outer bottom plate 3; the inner base 1 is integrally formed with three limit blocks 14 on the opening edge of the receiving sink 11 for abutting and limiting the inner base 1, and the inner base 1 is integrally formed with three limit blocks 15 on the inner wall of the receiving sink 11 that can be inserted into the positioning through hole 31, and an abutment block 32 that is inclined toward the receiving sink 11 and abuts against the limit blocks 15 is fixed on the inner wall of the positioning through hole 31;

[0052] When the outer bottom plate 3 is mounted on the outer shell cover 4 , the limiting block 15 is inserted into the positioning through hole 31 , and one side of the limiting block 15 is pressed against the bottom side of the abutting block 32 , thereby assembling and fixing the outer bottom plate 3 and the outer shell cover 4 .

[0053] Reference Fig.10 , a heat-conducting glue (not shown) is provided in the cavity formed by the inner base 1 and the inner shell cover 2, and a glue injection hole 16 for injecting the heat-conducting glue and an exhaust hole 17 for exhausting the gas are provided on the side of the inner base 1. Ultrasonic welding is performed between the sides of the inner base 1 and the inner shell cover 2 that are close to each other, so as to connect and fix the inner shell cover 2 and the inner base 1;

[0054] Thermally conductive adhesive is an adhesive material containing thermally conductive fillers, usually a single-component or two-component material based on silicone, epoxy or polyurethane series, which will not be described in detail here. After the inner shell cover 2 and the inner base 1 are connected, the thermally conductive adhesive is injected into the cavity formed by the inner base 1 and the inner shell cover 2 through the glue injection hole 16. During this process, the gas is discharged from the exhaust hole 17, and the thermally conductive adhesive is used to enhance the thermal conductivity.

[0055] The implementation principle of the embodiment of the present application is:

[0056] When the first heat source 51 generates heat, the insulating thermally conductive ceramic sheet 61, the main heat averaging block 62 and the heat dissipation fins 41 are used to average heat and dissipate heat on one side of the first heat source 51 on the circuit board 5, and the heat dissipation block 68 and the heat dissipation fins 681 are used to average heat and dissipate heat on the other side of the first heat source 51 on the circuit board 5;

[0057] When the second heat source 52 generates heat, the generated heat is conducted to the insulating thermally conductive ceramic sheet 61 through the auxiliary heat equalizing block 67 and the thermally conductive pad 69 , and then the heat is dissipated along the conduction path of the heat generated by the first heat source 51 .

[0058] Unless otherwise defined, the terms or scientific terms used in this application should be understood by people with ordinary skills in the field to which this application belongs. The "first", "second", "third" and similar words used in this application do not indicate any order, quantity or importance, but are only used to distinguish different components. "One" or "one" and other similar words do not indicate a quantitative limit, but indicate that there is at least one. "Including" or "comprising" and other similar words mean that the elements or objects appearing in front of "including" or "comprising" cover the elements or objects listed after "including" or "comprising" and their equivalents, and do not exclude other elements or objects. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0059] The embodiments of this specific implementation are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. The same components are represented by the same figure marks. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A photovoltaic optimizer with high heat dissipation performance, comprising an inner base (1), a circuit board (5) located in the inner base (1), and an inner shell cover (2) arranged on the inner base (1), wherein the outer sides of the inner base (1) and the inner shell cover (2) are respectively provided with an outer bottom plate (3) and an outer shell cover (4), and the outer side surface of the outer shell cover (4) is provided with heat dissipation fins (41), and a plurality of first heat sources (51) are fixedly provided on the side surface of the circuit board (5) facing the inner base (1); It is characterized in that The side of the circuit board (5) facing the inner shell cover (2) is provided with an insulating heat-conducting ceramic sheet (61) opposite to the first heat source (51), and the side of the insulating heat-conducting ceramic sheet (61) away from the circuit board (5) is provided with a main heat-averaging block (62); the side of the inner base (1) away from the inner shell cover (2) is provided with a heat dissipation block (68) opposite to the first heat source (51), and a plurality of heat dissipation fins (681) are fixedly provided on the heat dissipation block (68).

2. A high heat dissipation photovoltaic optimizer according to claim 1, characterized in that: Two second heat sources (52) at equipotential positions are fixedly arranged on the side of the circuit board (5) facing the inner base (1), a secondary heat equalizing block (67) opposite to the second heat source (52) is provided on the side of the circuit board (5) facing the outer shell cover (4), and a thermally conductive pad (69) for connecting the heat equalizing block is fixedly arranged on the insulating thermally conductive ceramic sheet (61).

3. A high heat dissipation photovoltaic optimizer according to claim 1, characterized in that: A first heat-conducting layer (63) is provided between the circuit board (5) and the insulating heat-conducting ceramic sheet (61), and a second heat-conducting layer (64) is provided between the insulating heat-conducting ceramic sheet (61) and the main heat-dissipating block (62).

4. A high heat dissipation photovoltaic optimizer according to claim 1, characterized in that: The inner shell cover (2) is provided with a mounting through hole (21), and the main heat equalizing block (62) is placed in the mounting through hole (21) on the side away from the circuit board (5) and abuts against the inner side of the outer shell cover (4).

5. A high heat dissipation photovoltaic optimizer according to claim 4, characterized in that: The main heat balancing block (62) is provided with a third heat conducting layer (65) on the side facing the outer shell cover (4), and the main heat balancing block (62) is provided with an insulating layer (66) on the outer side of the third heat conducting layer (65), and a gap is reserved between the main heat balancing block (62) and the inner side of the outer shell cover (4) for inserting the second heat conducting layer (64) and the insulating layer (66).

6. A high heat dissipation photovoltaic optimizer according to claim 1, characterized in that: The inner base (1) is provided with a receiving groove (11) on the side away from the inner shell cover (2), the bottom side of the receiving groove (11) is provided with a fixing slot (12) for the heat sink block (68) to be fixed therein, and the inner base (1) is provided with a plurality of heat dissipation notches (13) on the opening edge of the receiving groove (11).

7. A high heat dissipation photovoltaic optimizer according to claim 6, characterized in that: The outer bottom plate (3) is provided with a positioning through hole (31), and the outer shell cover (4) is provided with guide slots (42) for inserting the inner base (1) on two inner edges of the opening facing the outer bottom plate (3); The inner base (1) is fixedly provided with a limit block (14) on the opening edge of the accommodating sink groove (11) for abutting and limiting the inner base (1); the inner base (1) is fixedly provided with a limit block (15) inserted into the positioning through hole (31) on the inner wall of the accommodating sink groove (11); and an abutment block (32) is fixedly provided on the inner wall of the positioning through hole (31) for tightly abutting against the limit block (15).

8. A high heat dissipation photovoltaic optimizer according to claim 1, characterized in that: A heat-conducting adhesive is provided in the cavity formed by the inner base (1) and the inner shell cover (2), and a glue injection hole (16) for injecting the heat-conducting adhesive and an exhaust hole (17) for exhausting gas are provided on the side surface of the inner base (1).

Images