Heat transfer system
By designing a heat transfer system containing a loop thermosiphon, the problem of difficulty in cooling multiple different heat sources and uneven heat dissipation of traditional radiators is solved, and the heat source temperature difference equalization and heat distribution efficiency are improved.
Patent Information
- Application Number
- CN202420724092.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2023-04-13
- Filing Date
- 2024-04-09
- Publication Date
- 2025-04-11
- Estimated Expiration
- 2034-04-09
AI Technical Summary
Traditional radiators are difficult to cool multiple different heat sources at the same time, and there are limitations in heat dissipation, which cannot effectively balance the temperature difference between different heat sources.
A heat transfer system is designed, which includes a cooling element consisting of a main body, an elongated channel, a return channel and a connecting channel to form a loop thermosiphon, which can effectively cool multiple heat sources and equalize their temperature differences.
Effective cooling of multiple heat sources is achieved, ensuring equal temperature differences between the heat sources and improving the heat distribution efficiency on the entire cooling element.
Smart Images
Figure CN222750737U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a heat transfer system. Background Art
[0002] Conventionally, cooling of electrical and optical components is based on attaching heat transfer elements to the physical and thermally conductive connections of the components. Such heat transfer elements typically include heat sinks that provide a large heat dissipation area for dissipating heat away from the components and into the surrounding environment. Heat sinks may include heat pipes integrated within the heat sink.
[0003] However, these heat sinks may not allow several different heat sources to be mounted on a single heat sink and do not allow the temperature differences between the heat sources to be equalized. In addition, the ability of the heat sink to spread heat over a large heat dissipation area may be limited.
[0004] There is still a need to further develop the technology of using heat transfer elements to cool electrical and optical components. Therefore, it is an object of the present invention to at least alleviate some of the problems mentioned above. Utility Model Content
[0005] One object of the present invention is to provide a heat transfer system that can effectively cool electrical and optical components. Another object is to enable several separate heat sources to be mounted on a single heat transfer system and to equalize the temperature differences between the heat sources. Another object is to provide a heat transfer system that facilitates efficient heat distribution throughout a cooling element.
[0006] According to one aspect of the present disclosure, there is provided a heat transfer system, the heat transfer system comprising:
[0007] - a cooling element, said cooling element comprising:
[0008] a body extending in a first dimension,
[0009] one or more elongated channels, the one or more elongated channels being integrated into the body and extending in the first dimension,
[0010] one or more return channels, the one or more return channels being integrated into the body and extending in the first dimension, and
[0011] one or more connecting channels, the one or more connecting channels being integrated into the body and extending in a second dimension at an angle relative to the first dimension,
[0012] The connecting channel connects one or more elongated channels and one or more return channels together to form a loop thermosiphon.
[0013] - one or more heat sources, the one or more heat sources being configured to be connected to the cooling element so as to cover a portion of the elongated channel,
[0014] wherein the covered portion of the elongated channel is configured to form an evaporator, and
[0015] The heat transfer system also includes an uncovered portion of the elongated channel configured to form a condenser.
[0016] Significant benefits are obtained by means of the heat transfer system of the utility model including the cooling element. It provides effective cooling of the heat source connected to the cooling element. The elongated channel can spread the heat on the cooling element. Even if the heat sources produce different powers, the connecting channel will equalize the temperature difference between the heat sources. The return channel acts as a condenser channel. The return channel can form an additional condenser area at one side of the elongated channel and / or between the elongated channel or multiple groups of elongated channels along the second dimension. The return channel improves the performance of the cooling element.
[0017] One or more embodiments may include one or more features from the following itemized list:
[0018] - The cooling element comprises two or more elongated channels
[0019] - the cooling element comprises one or more return channels which are integrated into the body between adjacent elongated channels
[0020] - the cooling element comprises one or more than one group of the elongated channels
[0021] - The group includes two or more elongated channels
[0022] - the cooling element comprises one or more return channels integrated into the body between adjacent groups of the elongated channels
[0023] - the cooling element comprises two or more connecting channels which are integrated into the body at a certain distance from each other in the first dimension
[0024] - the elongated channel is configured to sequentially form an evaporation region and a condensation region in the first dimension
[0025] - the cooling element is configured to receive a heat source at the evaporation region
[0026] - the elongated channel (each of them) and the return channel (each of them) have a first end and a second end
[0027] - A first connecting channel of the connecting channels connects the first ends together
[0028] - A second connecting channel in the connecting channels connects the second ends together
[0029] - the cooling element further comprises a heat sink segment extending from the body in a third dimension, the heat sink segment being angled relative to the first dimension
[0030] - the elongated channel or at least some of the elongated channels comprise a plurality of grooves extending in the first dimension
[0031] - the elongated channel, the connecting channel and the return channel comprise mechanical plugs for sealing the channels. The cooling element as part of the heat transfer system may be provided by a method comprising:
[0032] – providing a body extending in a first dimension,
[0033] - providing said body with one or more elongate channels extending in said first dimension,
[0034] - providing said body with one or more return channels, said return channels extending in said first dimension,
[0035] One or more connecting channels are provided and extend in a second dimension angled relative to the first dimension to connect one or more elongated channels and one or more return channels together for forming a loop thermosyphon.
[0036] The heat transfer system may be provided by a method comprising:
[0037] – provide cooling elements, and
[0038] - Connecting one or more heat sources to the cooling element so as to cover a portion of the elongated channel. BRIEF DESCRIPTION OF THE DRAWINGS
[0039] Figure 1 illustrates a schematic cross-sectional view of a cooling element according to at least some embodiments, the cooling element comprising an elongated channel;
[0040] Figure 2illustrates a schematic cross-sectional view of a cooling element according to at least some embodiments, the cooling element including an elongated channel and a connecting channel;
[0041] Figure 3 A heat transfer system according to at least some embodiments is illustrated, the heat transfer system comprising Figure 2 Cooling elements;
[0042] Figure 4 illustrates a schematic cross-sectional view of a cooling element according to at least some embodiments;
[0043] Figure 5 A schematic cross-sectional view of a heat transfer system according to at least some embodiments is illustrated, the heat transfer system comprising Figure 4 A cooling element and a heat source mounted on the cooling element;
[0044] Figure 6 illustrates a schematic cross-sectional view of a cooling element according to at least some embodiments, the cooling element comprising two connecting channels;
[0045] Figure 7 A schematic cross-sectional view of a heat transfer system according to at least some embodiments is illustrated, the heat transfer system comprising Figure 6 A cooling element and a heat source mounted on the cooling element;
[0046] Figure 8 illustrates a schematic cross-sectional view of a cooling element including two return channels between adjacent groups of elongated channels according to at least some embodiments;
[0047] Fig. 9 illustrates a schematic cross-sectional view of a cooling element including an elongated channel with grooves according to at least some embodiments;
[0048] Fig.10 Illustrated is a diagram of a first dimension according to at least some embodiments. Fig. 9 Cooling elements;
[0049] Fig.11 A heat transfer system is illustrated according to at least some embodiments, wherein the cooling element is angled in a first dimension;
[0050] Fig.12 Illustrated in accordance with at least some embodiments for Fig.11 Alternative solutions for heat transfer systems;
[0051] Fig.13 illustrates a perspective view of a cooling element according to at least some embodiments; and
[0052] Fig.14 Illustrated according to at least some embodiments Fig.12 Cross-sectional view of a cooling element. DETAILED DESCRIPTION
[0053] In the present context, a "cooling element" refers to a device for cooling electrical or optical components.
[0054] In the present context, "evaporator region" refers to the region of the cooling element that is used to change liquid into vapor.
[0055] In this context, "condensation area" refers to the area of the cooling element that is used to change vapor into liquid.
[0056] In this context, "integrated" refers to an element or feature that is an integral part of another element or feature such that the element or feature is inseparable. Additionally, the term refers to an element or feature that is formed from the material of the body.
[0057] In this context, a "loop thermosyphon" refers to a structure having a loop formed by an elongated channel in the body of the cooling element, one or more connecting channels and optionally one or more return channels, the structure being configured to perform a phase change of a heat transfer phase change fluid.
[0058] The cooling element 110 may include:
[0059] a body 111 extending in a first dimension X, and
[0060] - one or more elongated channels 112 which are integrated into the body 111 and extend in a first dimension X.
[0061] The cooling element 110 is easy to manufacture because it can be produced mainly by additive manufacturing (e.g., extrusion). Because the elongated channel can be formed simultaneously with the main body 111 during the additive manufacturing of the main body 111, machining such as drilling is not required for forming the elongated channel. The elongated channel 112 is configured to: when the heat source 120 is mounted on the cooling element 110 to cover a portion of the elongated channel 112 and the cooling element 110 is equipped with a heat transfer phase change fluid, an evaporation region 116 and a condensation region 117 are continuously formed in the first dimension X. Then, the portion of the elongated channel 112 covered by the heat source 120 can receive heat from the heat source 120, thereby forming the evaporation region 116. Then, the heat transfer phase change fluid becomes steam at the evaporation region 116. When the steam reaches the condensation region 117, it turns back into liquid. The liquid can flow back to the bottom of the cooling element 110 via the elongated channel 112.
[0062] The cooling element 110 may include one or more than one group of elongated channels 112. The group may include two or more than two elongated channels 112.
[0063] Figure 1 A schematic cross-sectional view of a cooling element is illustrated, the cooling element comprising elongated channels 112. The cooling element 110 comprises a body 111 extending in a first dimension X. The cooling element 110 comprises three groups of elongated channels 112. Each of these groups comprises three elongated channels 112. However, the number of elongated channels 112 may be two or more than three.
[0064] The cooling element 110 may include:
[0065] a body 111 extending in a first dimension X,
[0066] - two or more elongated channels 112 which are integrated into the body 111 and extend in a first dimension X, and
[0067] - one or more connecting channels 113a, 113b, which are integrated into the body 111 and are in contact with each other.
[0068] For the first dimension X, the second dimension Y extends at an angle,
[0069] The connecting channels 113a and 113b connect two or more elongated channels 112 together to form a loop thermosiphon.
[0070] The formed loop thermosyphon provides effective cooling for the heat source 120 connected to the cooling element 100. The elongated channel 112 is capable of spreading heat on the cooling element 110. The elongated channel 112 is configured to continuously form an evaporation region 116 and a condensation region 117 in the first dimension X when the heat source 120 is mounted on the cooling element 110 to cover a portion of the elongated channel 112 and the cooling element 110 is provided with a heat transfer phase change fluid. Then, the portion of the elongated channel 112 covered by the heat source 120 can receive heat from the heat source 120, thereby forming the evaporation region 116. Then, the heat transfer phase change fluid becomes vapor at the evaporation region 116. When the vapor reaches the condensation region 117, it turns back into liquid. The liquid can flow back to the bottom of the cooling element 110 via the elongated channel 112. Even if the heat sources generate different powers, the connecting channels 113a, 113b equalize the temperature difference between the heat sources.
[0071] The cooling element 110 may include one or more than one group of elongated channels 112. The group may include two or more than two elongated channels 112.
[0072] Figure 2A schematic cross-sectional view of a cooling element 110 is illustrated, the cooling element comprising an elongated channel 112 and connecting channels 113a, 113b. The cooling element 110 comprises three groups of elongated channels 112 and two connecting channels 113a, 113b. Each of these groups comprises three elongated channels 112. However, the number of elongated channels 112 may be two or more. The two connecting channels 113a, 113b are integrated into the body 111 at a distance from each other in a first dimension X, and extend in a second dimension Y at an angle relative to the first dimension X. The two connecting channels 113a, 113b connect the elongated channels 112 together to form a loop thermosyphon.
[0073] The cooling element 110 may include:
[0074] a body 111 extending in a first dimension X,
[0075] - one or more elongated channels 112 which are integrated into the body 111 and extend in a first dimension X,
[0076] - one or more return channels 114 which are integrated into the body 111 and extend in a first dimension X, and
[0077] - one or more connecting channels 113a, 113b, which are integrated into the body 111 and are in contact with each other.
[0078] For the first dimension X, the second dimension Y extends at an angle,
[0079] The connecting channels 113 a and 113 b connect one or more of the elongated channel 112 and the return channel 114 together to form a loop thermosiphon.
[0080] The cooling element 110 provides effective cooling for the heat source 120 connected to the cooling element 110. The elongated channel 112 is capable of distributing heat on the cooling element 110. The elongated channel 112 is configured to continuously form an evaporation region 116 and a condensation region 117 in the first dimension X when the heat source 120 is mounted on the cooling element 110 to cover a portion of the elongated channel 112 and the cooling element 110 is equipped with a heat transfer phase change fluid. Then, the portion of the elongated channel 112 covered by the heat source 120 can receive heat from the heat source 120, thereby forming the evaporation region 116. Then, the heat transfer phase change fluid becomes steam at the evaporation region 116. When the steam reaches the condensation region 117, it changes back to liquid. The return channel 114 acts as a condenser channel. The liquid can flow back to the bottom of the cooling element 110 via the return channel 114. The return channel 114 may form an additional condenser area in the second dimension Y, for example at one side of the elongated channel 112 and / or between the elongated channel 112 or a group of elongated channels 112. The return channel 114 improves the performance of the cooling element 110. The liquid may also flow back to the bottom of the cooling element 110 via the elongated channel 112. In addition, the elongated channel 112 may also act as a condenser channel above the heat source when viewed in the first dimension X. The connecting channels 113a, 113b equalize the temperature difference between the heat sources even if the heat sources generate different powers.
[0081] The cooling element 110 may include one or more elongated channels 112. The group may include two or more elongated channels 112. Then, the return channel 114 may be located at one side of one or more groups of elongated channels 112 and / or between multiple groups of elongated channels 112 adjacent in the second dimension Y.
[0082] The connecting channels 113a, 113b connect one or more elongated channels 112 and one or more return channels 114 together. This means that the connecting channels 113a, 113b connect at least one of the elongated channels 112 or multiple groups of elongated channels 112 with the return channel 114. Some of the elongated channels 112 or multiple groups of elongated channels 112 may not be connected to the return channel 114 through the connecting channels 113a, 113b. For example, if the cooling element 110 includes three groups of elongated channels 112, one or two groups of elongated channels may be connected to the return channel 114.
[0083] Figure 4A schematic cross-sectional view of a cooling element 110 is illustrated. The cooling element 100 comprises: a body 111 extending in a first dimension X. A set of elongated channels 112 is integrated into the body 111 and extends in the first dimension X. The set of elongated channels comprises three elongated channels 112. However, the number of elongated channels 112 may be two or more. Two return channels 114 are integrated into the body 111 and extend in the first dimension X. However, the number of return channels 114 may be one or more than two. The elongated channel 112 is arranged between the two return channels 114. Two connecting channels 113a, 113b are integrated into the body 111 at a distance from each other in the first dimension X and extend in a second dimension Y at an angle relative to the first dimension X. The two connecting channels 113a, 113b connect the elongated channels 112 and the return channels 114 together to form a loop thermosyphon.
[0084] The elongated channel 112 can be configured to continuously form an evaporation region 116 and a condensation region 117 in a first dimension X. The evaporation region 116 can receive heat from the heat source 120 and can change the heat transfer phase change fluid into steam. The condensation region 117 can change the steam back into a fluid. The evaporation region 116 and the condensation region 117 provide a thermosiphon cycle. This in turn provides effective cooling of the heat source 120.
[0085] Thermosyphon cycle refers to a physical phenomenon in which the heat source 120 heats the heat transfer phase change fluid into vapor in the area covered by the heat source 120, so that the vapor travels through the elongated channel 112 to the relatively cold area of the body 111 (i.e., the area not covered by the heat source 120), where the vapor condenses into liquid. After being converted back into liquid, the heat transfer phase change fluid returns to the evaporation area 116 via the return channel 114 and optionally also via the elongated channel 112 to be used in the next cycle. Thermosyphon cycle consists of Figure 7 The phase change absorbs or releases latent heat trapped in the heat transfer phase change fluid, resulting in efficient heat transfer. The liquid can return to the evaporation region by several different modes (e.g., gravity or capillary action).
[0086] The position of the heat source 120 determines the formation of the evaporation region 116 and the condensation region 117. The portion of the elongated channel 112 covered by the heat source 120 is configured to form the evaporation region 116. The uncovered portions of the elongated channel 112 and the return channel 114 are configured to form the condensation region 117. Preferably, the return channel 114 is substantially uncovered by the heat source 120. The elongated channel 112 in the condensation region 117 forms a first condensation region, while the return channel 114 forms a second condensation region.
[0087] However, it should be noted that the heat transfer phase change fluid condensed into liquid can also be returned to the evaporation region 116 via the elongated channel 112. The liquid can be returned to the evaporation region 116 via the elongated channel 112, especially before the heat flux exceeds the condensation capacity. When the heat flux exceeds the condensation capacity, the liquid will also or mainly return via the return channel 114.
[0088] The cooling element 110 may be configured to receive the heat source 120 at the evaporation region 116. The heat source 120 may be mounted to one end of the body 111 to reserve enough space for the condensation region 117. Preferably, all the heat sources 120 are disposed on the same side of the body 111.
[0089] The cooling element 110 may include two or more elongated channels 112 or multiple groups of elongated channels 112 and one or more return channels 114, which are integrated into the body 111 between adjacent elongated channels or multiple groups of elongated channels 112. This enables two or more heat sources 120 to be connected to the cooling element 110. The heat transfer phase change fluid can then be returned to the bottom of the elongated channels 112 in liquid form via the return channels arranged between the heat sources 120.
[0090] The cooling element 110 may include two or more connecting channels 113a, 113b, which are integrated into the body 111 at a certain distance from each other in the first dimension X. The two connecting channels 113a, 113b can connect the elongated channel 112 and the return channel 114 from both ends of the elongated channel 112 and the return channel 114. This provides a loop thermosiphon between the two ends, thereby cooling the heat source 120 more effectively.
[0091] The elongated channels 112 (each) and the return channels 114 (each) may have a first end and a second end, with the first connecting channel 113a of the connecting channels 113a, 113b connecting the first ends together and the second connecting channel 113b of the connecting channels 113, 113b connecting the second ends together.
[0092] Preferably, when viewed from the first dimension X, the connection channel 113 a connecting the first ends together is disposed below the heat source 120 .
[0093] Preferably, the cooling element 110 includes two connecting channels 113a, 113b. However, the cooling element 110 may include more than two connecting channels 113a, 113b, for example, three connecting channels (not illustrated). Then, the cooling element may include one connecting channel 113a and two connecting channels 113b, wherein the one connecting channel 113a connects the first end together and the two connecting channels 113b connect the second end together. The connecting channels 113b connecting the second ends together may be integrated into the body 111 at a certain distance from each other in the first dimension X.
[0094] Figure 6 A schematic cross-sectional view of a cooling element 110 is illustrated, which includes two connecting channels 113a, 113b. The connecting channels 113a, 113b are integrated into the body 111 at a distance from each other in a first dimension X, and extend in a second dimension Y at an angle relative to the first dimension X. The cooling element 110 also includes three groups of elongated channels 112, which are integrated into the body 111 and extend in the first dimension X. Each of the three groups of elongated channels includes three elongated channels 112. However, the number of elongated channels 112 in these groups can be two or more. In addition, a return channel 114 is integrated into the body 111 and extends along the first dimension X between the elongated channels 112 of adjacent groups. However, the number of return channels 114 between the elongated channels 112 of adjacent groups can be two or more. The connecting channels 113a, 113b connect the elongated channels 112 and the return channels 114 together to form a loop thermosyphon. A first connecting channel 113a of the connecting channels 113a, 113b connects first ends of the elongated channel 112 and the return channel 114 together, and a second connecting channel 113b of the connecting channels 113a, 113b connects second ends of the elongated channel 112 and the return channel 114 together.
[0095] Figure 8A schematic cross-sectional view of a cooling element 110 is illustrated, the cooling element comprising: two return channels 114 located between adjacent groups of elongated channels 112. However, the number of return channels 114 between adjacent groups of elongated channels 112 may be more than two. The return channels 114 are integrated into the body 111 and extend in a first dimension X. The cooling element 110 comprises three groups of elongated channels 112, which are integrated into the body 111 and extend in a first dimension X. Each of the three groups comprises three elongated channels 112. However, the number of elongated channels 112 in these groups may be two or more than three. These groups may have different numbers of elongated channels 112. Connecting channels 113a, 113b are integrated into the body 111 at a distance from each other in the first dimension X, and extend in a second dimension Y at an angle relative to the first dimension X. The connecting channels 113a, 113b connect the elongated channels 112 and the return channels 114 together to form a loop thermosyphon. A first connecting channel 113a of the connecting channels 113a, 113b connects first ends of the elongated channel 112 and the return channel 114 together, and a second connecting channel 113b of the connecting channels 113a, 113b connects second ends of the elongated channel 112 and the return channel 114 together.
[0096] Fig.13 A perspective view of a cooling element 110 is illustrated, and Fig.14 Illustrated Fig.13 1 is a cross-sectional view of a cooling element 110. The cooling element 110 comprises: a body 111 extending in a first dimension X. A set of elongated channels 112 is integrated into the body 111 and extends in the first dimension X. The set of elongated channels comprises two elongated channels 112. Two return channels 114 are integrated into the body 111 and extend in the first dimension. Two connecting channels 113a, 113b are integrated into the body 111 and extend in a second dimension Y, which is angled relative to the first dimension X. The connecting channels 113a, 113b connect the elongated channels 112 and the return channels 114 together to form a loop thermosyphon.
[0097] like Figures 1 to 10 , Fig.13 and Fig.14 As illustrated in , the cooling element 110 may further include a heat dissipation section 115 extending from the body 111 along a third dimension Z that is angled relative to the first dimension X. The heat dissipation section 115 may be disposed on a side of the body 111 opposite to the heat source 120. Figures 1 to 10 As illustrated, the heat sink section 115 may extend across the entire width and length of the body 111 , or the heat sink section 115 may be offset from the evaporation region 116 (not illustrated).
[0098] The heat dissipation section 115 may include a plurality of fins. The fins may be plate-like planes or curved elements extending from the body 111. The fins provide a large heat dissipation area for dissipating heat away from a heat source and into the environment.
[0099] like Fig.13 As illustrated in , the heat dissipation section 115 may include a first plurality of fins and a second plurality of fins extending in opposite directions from the body 111 in a third dimension Z. This provides a large heat dissipation section and efficient heat transfer because heat can be transferred away in two directions.
[0100] Fig.13 A heat dissipation section 115 is illustrated. The heat dissipation section 115 extends in a third dimension Z. The heat dissipation section 115 comprises a first plurality of fins and a second plurality of fins. The first plurality of fins and the second plurality of fins extend in opposite directions from the body 111 in the third dimension Z.
[0101] The elongated channel 112 or at least some of the elongated channels 112 include a plurality of grooves extending in the first dimension X. The grooves may extend the entire length of the elongated channel 112. The grooves can increase the area of the elongated channel 112, which in turn provides more efficient heat transfer via the elongated channel 112.
[0102] Fig. 9 A schematic cross-sectional view of a cooling element 110 is illustrated, which comprises an elongated channel 112 with grooves. All elongated channels 112 have grooves. However, these grooves may be formed in only some of the elongated channels 112. These grooves extend the entire length of the elongated channels 112.
[0103] Fig.10 This example shows the observation from the first dimension X. Fig. 9 Each of the elongated channels 112 has a groove around the entire periphery of the elongated channel 112.
[0104] The elongated channel 112, the connecting channels 113a and 113b, and the return channel 114 may include a mechanical plug 118 for sealing the channels 112, 113a, 113b, 114. The mechanical plug 118 may be made of a metal such as aluminum, an aluminum alloy, or copper or a copper alloy (e.g., brass). The mechanical plug 118 prevents leakage from the channel. Therefore, the mechanical plug 118 protects the structure of the cooling element from damage and enables the cooling element to function effectively.
[0105] According to one embodiment, a heat transfer system 100 is provided, the heat transfer system comprising:
[0106] - A cooling element 110, comprising:
[0107] a body 111 extending in a first dimension X,
[0108] one or more elongated channels 112 which are integrated into the body 111 and extend in a first dimension X,
[0109] one or more return channels 114 which are integrated into the body 111 and extend in a first dimension X, and
[0110] one or more connecting channels 113a, 113b, which are integrated into the body 111 and extend in a second dimension Y at an angle relative to the first dimension X,
[0111] The connecting channels 113a and 113b connect one or more elongated channels 112 and one or more return channels 114 to form a loop thermosyphon, and
[0112] - one or more heat sources 120 configured to be connected to the cooling element 110 so as to cover a portion of the elongated channel 112,
[0113] Therein, the covered portion of the elongated channel 112 is configured to form an evaporator, and the heat transfer system further comprises an uncovered portion of the elongated channel 112, which is configured to form a condenser.
[0114] Heat transfer system 100 provides efficient cooling for one or more heat sources 120 because elongated channels 112 spread the heat across cooling element 110 and connecting channels 113a, 113b equalize temperature differences between heat sources 120 even if the heat sources generate different powers.
[0115] According to one embodiment, the covered portion of the elongated channel 112 is configured to form an evaporator.
[0116] According to one embodiment, it further comprises: an uncovered portion of the elongated channel 112, the uncovered portion being configured to form a condenser.
[0117] Figure 5 A schematic cross-sectional view of a heat transfer system 100 is illustrated, the heat transfer system comprising: Figure 4A cooling element 110 and a heat source 120 mounted on the cooling element 110. The heat source 120 is mounted to one end of the body 111 in a first dimension X. The heat source 120 covers a portion of the elongated channel 112, and the covered portion forms an evaporator. Therefore, the heat source 120 is mounted to the evaporation region 116. The body 111 of the cooling element 110 also includes an uncovered portion of the elongated channel 112, and the uncovered portion forms a condenser. Therefore, the body 111 includes: a condensation region 117, which is continuous with the evaporation region 116 in the first dimension X. The elongated channel 112 in the condensation region 117 forms a first condensation region. The return channel 114 in the condensation region 117 forms a second condensation region. The heat source 120 is mounted on the body 111 so as not to cover the return channel 114 or the connecting channels 113a, 113b. The liquid level of the fluid can be between the evaporation region 116 and the condensation region 117 (not shown).
[0118] Figure 7 A schematic cross-sectional view of a heat transfer system 100 is illustrated, the heat transfer system comprising: Figure 6 The present invention relates to a cooling element 110 and a heat source 120 mounted on the cooling element 110. The heat source 120 is mounted to one end of the body 111 in the first dimension X. The heat source 120 is mounted to the evaporation region 116. The body 111 includes a condensation region 117 which is continuous with the evaporation region 116 in the first dimension X. The heat source 120 is mounted on the body 111 so that it covers a portion of the elongated channel 112 but does not cover the return channel 114 or the connecting channels 113a, 113b.
[0119] According to one embodiment, the heat transfer system 100 includes two or more heat sources 120 that are configured to be connected to the cooling element 110 such that one or more return channels 114 are uncovered by the heat sources 120 (not illustrated). A single cooling element 110 can then be used to cool multiple heat sources 120. The uncovered return channels 114 allow condensed liquid to return to the bottom of the body 111, thereby cooling the heat sources 120.
[0120] Figure 7 Only one heat source is illustrated, but one or two heat sources may be installed next to the illustrated heat source 120 in the second direction Y. The heat sources may then be arranged side by side so that one or more return channels 114 between adjacent heat sources 120 are not covered by the heat sources 120.
[0121] According to one embodiment, the heat source is an electrical or optical component, such as an insulated gate bipolar transistor (IGBT) module, a printed circuit board, a chip-on-board light emitting diode (COB-LED), or a power electronics module.
[0122] According to one embodiment, the elongated channel 112 includes a heat transfer phase change fluid.
[0123] Figure 3 A heat transfer system 100 is illustrated, the heat transfer system comprising: Figure 2 The heat transfer system 100 includes a heat transfer phase change fluid. The liquid level 119 of the heat transfer phase change fluid settles horizontally relative to the gravity direction g.
[0124] Fig.11 A heat transfer system 110 is illustrated, wherein the cooling element 110 is angled in a first dimension X. The cooling element 100 comprises: a body 111 extending in the first dimension X. An elongated channel 112 is integrated into the body 111 and extends in the first dimension X. The number of elongated channels 112 is three. However, the number of elongated channels 112 may be one, two or more than three. A return channel 114 is integrated into the body 111 and extends in the first dimension X. The number of return channels 114 is two. However, the number of return channels 114 may be one or more than two. The return channel 114 is arranged at one side of the elongated channel 112 in a second dimension Y, which is angled relative to the first dimension X. Two connecting channels 113a, 113b are integrated into the body 111 at a distance from each other in the first dimension X and extend in the second dimension Y. The connecting channels 113a, 113b extend from the outer surface of the cooling element 110 inside the cooling element 110. Therefore, the elongated channel 112, the return channel 114 and the connecting channels 113a, 113b form a loop thermosyphon. Fig.11 As illustrated in , after the cooling element 110 is produced, the cooling element 110 is placed at an angle in the first dimension X in the application. The cooling element 110 includes a heat transfer phase change fluid. The fluid level 119 settles horizontally relative to the gravity direction g. One or more heat sources 120 (not illustrated) can be installed on the cooling element in the XY plane covering a portion of the elongated channel 112. The heat source 120 heats the fluid into steam, so that the steam passes through the elongated channel 112 and the two connecting channels 113a, 113b and travels to a relatively cold area, where the steam condenses into liquid. Then, the liquid flows back to the bottom of the cooling element 110 in the second direction Y. The temperature of the heat source 120 decreases.
[0125] Fig.12 Illustrated Fig.11An alternative to the heat transfer system 110 of the present invention. The cooling element 100 comprises: a body 111 extending in a first dimension X. An elongated channel 112 is integrated into the body 111 and extends in the first dimension X. The number of the elongated channels is two. However, the number of the elongated channels 112 may be more than two. A return channel 114 is integrated into the body 111 and extends in the first dimension X. The number of the return channels 114 is two. However, the number of the return channels 114 may be more than two. One return channel 114 is arranged between the elongated channels 112, and one return channel 114 is arranged at one side of the set of channels in a second dimension Y, the second dimension being angled relative to the first dimension X. Two connecting channels 113a, 113b are integrated into the body 111 at a distance from each other in the first dimension X and extend in the second dimension Y. Both connecting channels 113a, 113b include two separate parts, which extend from the outer surface of the cooling element 110 inside the cooling element 110. The separated parts extend from opposite sides of the cooling element 110 inside the cooling element. Therefore, the parts connecting the channels 113a, 113b form two loop thermosyphons in the body 111, which include an elongated channel 112 and a return channel 114. After the cooling element 110 is produced, the cooling element 110 is placed at an angle in the first dimension X in the application, such as Fig.12 As illustrated in . The cooling element 110 includes a heat transfer phase change fluid. The liquid level 119 settles horizontally relative to the gravity direction g. One or more heat sources 120 (not illustrated) can be mounted on the cooling element in an XY plane covering a portion of the elongated channel 112. The heat source 120 heats the fluid into steam, causing the steam to travel through a portion of the connecting channel 113b to a relatively cold area of the body 111, where the steam condenses into liquid. The liquid flows back to the bottom of the formed loop thermosiphon in the second dimension Y. The temperature of the heat source 120 decreases.
[0126] According to one embodiment, the heat transfer system 100 is configured to form an integrated loop thermosyphon. The integrated loop thermosyphon performs a thermosyphon cycle.
[0127] The cooling element 110 as part of the heat transfer system 100 may be provided by a method, the method comprising:
[0128] - providing a body 111 extending in a first dimension X,
[0129] - providing the body 111 with one or more elongated channels 112 extending in a first dimension X,
[0130] - providing the body 111 with one or more return channels 114 extending in a first dimension X,
[0131] One or more connecting channels 113a, 113b are provided and extend in a second dimension Y at an angle relative to the first dimension X to connect one or more elongated channels 112 and one or more return channels 114 together for forming a loop thermosyphon.
[0132] The method may include providing one or more elongated channels 112. The group may include two or more elongated channels 112. Then, one or more connecting channels 113a, 113b connect the one or more elongated channels 112 and the return channel 114 together to form a loop thermosyphon.
[0133] The method may include:
[0134] - providing the body 111 with two or more elongated channels 112 extending in a first dimension X, and
[0135] The body 111 is provided with one or more return channels 114 extending along the first dimension X between adjacent elongated channels 112 .
[0136] The method may include:
[0137] - providing the body 111 with two or more sets of elongated channels 112 extending in a first dimension X, and
[0138] The body 111 is provided with one or more return channels 114 extending along the first dimension X between adjacent groups of elongated channels 112 .
[0139] The method may include providing two or more connecting channels 113a, 113b at a distance from each other in a first dimension X and extending in a second dimension Y to connect the elongated channel 112 and the return channel 114 together for forming a loop thermosyphon.
[0140] The body 111 may be provided by additive manufacturing, for example by extrusion.
[0141] The elongate channel 112 and the return channel 114 may be provided simultaneously with the body 111. Thus, the elongate channel 112 and the return channel 114 may be provided by additive manufacturing, for example by extrusion.
[0142] The connecting channels 113a, 113b may be provided by machining (eg by drilling).Thus, after the body 111, the elongated channel 112 and the return channel 114 are formed by additive manufacturing, the body 111 may be provided with the connecting channels 113a, 113b.
[0143] The method may further comprise providing a plurality of grooves in the elongated channel 112 or at least some of the elongated channels 112 extending in the first dimension X. The grooves may be provided during additive manufacturing of the body 111 and the elongated channels 112 or may be produced by machining after the elongated channels 112 are formed.
[0144] The method may further include providing a heat dissipation section 115 extending from the body 111 along a third dimension Z, the third dimension being angled relative to the first dimension X. The heat dissipation section 115 may be formed simultaneously with the body 111. The heat dissipation section 115 may then be formed during additive manufacturing (e.g., extrusion) of the body 111. Alternatively, the heat dissipation section 115 may be a separate component. It may then be produced separately from the body 111 and attached to the body 111. Suitable attachment methods include welding, shrink fitting, laser welding, friction stir welding, brazing, press fitting, skiving, pin fins, and any combination thereof.
[0145] The method may further include providing the elongated channel 112 , the connecting channels 113 a and 113 b , and the return channel 114 with a mechanical plug 118 for sealing the channels 112 , 113 a , 113 b , 114 .
[0146] The heat transfer system 100 may be provided by a method comprising:
[0147] - providing a cooling element 110 by the above method, and
[0148] One or more heat sources 120 are connected to the cooling element 110 to cover a portion of the elongated channel 112 .
[0149] The heat source 120 may be mounted to the evaporation region 116 by using a fixture, clamp or other external suspension device penetrating the body 111, welding, brazing, etc. A thermally conductive paste may be applied under the heat source.
[0150] It should be understood that the disclosed embodiments of the present invention are not limited to the specific structures, process steps or materials disclosed herein, but are extended to their equivalents recognized by ordinary technicians in the relevant field. It should also be understood that the terms used herein are only used for the purpose of describing specific embodiments and are not intended to be limiting.
[0151] In addition, the described features, structures or characteristics may be combined in any suitable manner in one or more embodiments.In this specification, many specific details are provided, such as examples of length, width, shape, etc., to provide a comprehensive understanding of the embodiments of the utility model.
[0152] In this document, the verbs "to comprise" and "to include" are used as open limitations, neither excluding nor requiring the presence of unrecited features. The features recited in the dependent claims are mutually freely combinable unless expressly stated otherwise. Furthermore, it should be understood that the use of "a" or "an" (i.e. the singular) throughout this document does not exclude a plurality.
[0153] Reference numerals list
[0154] 100 Heat transfer systems
[0155] 110 Cooling element
[0156] 111 Subject
[0157] 112 Slender Channel
[0158] 113a Connection channel
[0159] 113b Connection Channel
[0160] 114 Return Channel
[0161] 115 heat dissipation section
[0162] 116 Evaporation Area
[0163] 117 Condensation Area
[0164] 118 Mechanical embolization
[0165] 119 Liquid Level
[0166] 120 Heat Source
Claims
1. A heat transfer system (100), comprising: A cooling element (110), the cooling element comprising: a body (111), the body extending in a first dimension (X), one or more elongated channels (112), the one or more elongated channels being integrated into the body (111) and extending in the first dimension (X), one or more return channels (114), the one or more return channels being integrated into the body (111) and extending in the first dimension (X), and one or more connecting channels (113a, 113b), the one or more connecting channels being integrated into the body (111) and extending in a second dimension (Y) at an angle relative to the first dimension (X), wherein the connecting channel (113a, 113b) connects one or more elongated channels (112) and one or more return channels (114) together to form a loop thermal siphon, and one or more heat sources (120) are configured to be connected to the cooling element (110) to cover a portion of the elongated channel (112), wherein the covered portion of the elongated channel (112) is configured to form an evaporator, and Characterized in that the heat transfer system further comprises an uncovered portion of the elongated channel (112), wherein the uncovered portion is configured to form a condenser.
2. The heat transfer system (100) according to claim 1, characterized in that: The heat transfer system comprises two or more connecting channels (113a, 113b), which are integrated into the body (111) at a certain distance from each other in the first dimension (X).
3. The heat transfer system (100) according to any one of the preceding claims, characterized in that: Each of the elongated channels (112) and each of the return channels (114) have a first end and a second end, The first connecting channel (113a) of the connecting channels (113a, 113b) connects the first ends together, and A second connecting channel (113b) among the connecting channels (113a, 113b) connects the second ends together.
4. The heat transfer system (100) according to claim 1, characterized in that: The heat transfer system also includes a heat sink segment (115) extending from the body (111) in a third dimension (Z), the third dimension being angled relative to the first dimension (X).
5. The heat transfer system (100) according to claim 1, characterized in that: The elongated channels (112) or at least some of the elongated channels (112) include: a plurality of grooves extending in the first dimension (X).
6. The heat transfer system (100) according to claim 1, characterized in that: The heat transfer system includes two or more heat sources (120) configured to be connected to the cooling element (110) such that one or more return channels (114) are not covered by the heat sources (120).
7. The heat transfer system (100) according to claim 1, characterized in that: The heat source is an electrical or optical component, such as an insulated gate bipolar transistor module, a printed circuit board, a chip-on-board light emitting diode or a power electronics module.
8. The heat transfer system (100) according to claim 1, characterized in that: The elongated channel (112) includes a heat transfer phase change fluid.
9. The heat transfer system (100) according to claim 1, characterized in that: The heat transfer system is configured to form an integrated loop thermosyphon.