Anti-reflux liquid cooling device

Abstract

The utility model provides an anti-backflow liquid cooling heat dissipation device, comprising a module cavity, a module cover and a heat conduction mechanism, wherein a flow channel is arranged on the module cavity; the module cover is installed on the module cavity, and the module cover is used to seal the module cavity; the heat conduction mechanism is installed in the flow channel and is used to conduct heat to the cooling medium entering the flow channel; wherein a water baffle plate for blocking the backflow of the cooling medium is rotatably installed on the liquid inlet end of the flow channel, a torsion spring is connected to the water baffle plate, and the water baffle plate is connected to the module cavity via the torsion spring; the utility model can solve the problem in the prior art that the heat dissipation effect only through the heat sink is poor, resulting in that the components on the functional board are easily burned out under long-term high temperature, thereby affecting the normal use of the audio.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation devices, in particular to a backflow-proof liquid-cooling heat dissipation device. Background Art

[0002] The power amplifier is an important part of the audio system. Its function is to amplify the pre-stage signal so that they have enough power to drive the speakers. The output power of the power amplifier depends on its power supply voltage and output current, so a lot of heat will be generated when the power amplifier is running.

[0003] The heat generated by the power amplifier needs to be dissipated in time to ensure the normal operation of the power amplifier. The power amplifier usually uses natural cooling of the heat sink arranged on the shell of the power amplifier to reduce the temperature. For example, the utility model with the publication number CN220798925U discloses a porous ceramic heat sink (hereinafter referred to as prior art 1), including a heat sink, the bottom end of which is connected to a bottom plate through a heat pipe, the bottom end of the bottom plate is provided with a fixed bracket, and a honeycomb bottom plate is installed on the fixed bracket; the honeycomb bottom plate includes a plurality of honeycomb through holes, a shell, a bottom groove, a scraper and a threaded hole, a plurality of the honeycomb through holes are arranged on the shell, the bottom groove is opened at the bottom end of the shell, the scraper is arranged on the bottom groove, and the threaded hole is opened on the side of the shell.

[0004] Although a heat sink is provided in the prior art 1 to dissipate heat from the power amplifier tube, the heat dissipation effect of the heat sink alone is poor, which causes the components on the functional board to be easily burned out under long-term high temperature, thereby affecting the normal use of the audio. Utility Model Content

[0005] The purpose of the utility model is to provide an anti-backflow structure for a thermal device, which, in actual use, can solve the problem in the prior art that the heat dissipation effect of only using a heat sink is poor, resulting in the components on the functional board being easily burned out under long-term high temperature, thereby affecting the normal use of the audio.

[0006] In order to solve the above technical problems, the technical solution adopted by the utility model is:

[0007] A backflow-proof liquid cooling device, comprising:

[0008] A module cavity, wherein a flow channel is provided on the module cavity;

[0009] A module cover plate, the module cover plate is mounted on the module cavity, and the module cover plate is used to seal the module cavity;

[0010] A heat conduction mechanism, which is installed in the flow channel and is used to conduct heat to the cooling medium entering the flow channel;

[0011] Wherein, a water baffle plate for blocking the reflowing cooling medium is rotatably installed at the liquid inlet end of the flow channel, and a torsion spring is connected to the water baffle plate, and the water baffle plate is connected to the module cavity through the torsion spring.

[0012] Preferably, the heat conduction mechanism includes a first heat conduction plate assembly and a second heat conduction plate assembly, the first heat conduction plate assembly and the second heat conduction plate assembly are arranged on both sides of the flow channel, the first heat conduction plate assembly and the second heat conduction plate assembly are both inclined toward the direction of flow of the cooling medium, and the first heat conduction plate assembly and the second heat conduction plate assembly are staggered.

[0013] Preferably, the first heat conducting plate assembly includes a first heat conducting plate and a second heat conducting plate, one end of the first heat conducting plate is connected to the module cavity, the second heat conducting plate and the first heat conducting plate are staggered and a first branch flow channel is formed between the first heat conducting plate and the adjacent second heat conducting plate.

[0014] Preferably, the second heat conducting plate assembly includes a third heat conducting plate and a fourth heat conducting plate, one end of the third heat conducting plate is connected to the module cavity, the fourth heat conducting plate and the third heat conducting plate are staggered and a second branch flow channel is formed between the fourth heat conducting plate and the adjacent third heat conducting plate.

[0015] Preferably, the module cavity is provided with a placement groove for fitting with the power amplifier board.

[0016] Preferably, the water retaining plate is provided with an arc surface.

[0017] Preferably, a valve is provided at the liquid inlet end of the flow channel.

[0018] Preferably, a sealing portion is installed on the module cover.

[0019] Preferably, the module cover is detachably connected to the module cavity by bolts.

[0020] Compared with the prior art, the utility model has the following beneficial effects:

[0021] In the utility model, the module cavity is used to dissipate heat from the power amplifier board after being attached to the power amplifier board, and the module cavity can be sealed after the cover plate is connected to the module cavity, and the bottom end of the module cover plate is in contact with the heat conduction mechanism; the heat conduction mechanism is inclined toward the direction of flow of the cooling medium, and when the cooling medium flows from the liquid inlet end of the flow channel to the liquid outlet end of the flow channel, the baffle plate rotatably installed in the flow channel rotates under the pressure of the cooling medium, so that a gap connected to the flow channel is formed between the baffle plate and the cover plate, and the cooling medium can enter the flow channel through the gap, and the torsion spring is compressed; by setting the heat conduction mechanism, the contact area between the cooling medium and the module cavity can be increased, thereby further improving the cooling effect of the cooling medium on the power amplifier board;

[0022] When the cooling medium flows back toward the liquid inlet end of the flow channel due to the change in pressure in the flow channel, the torsion spring connecting the water baffle plate and the module cavity expands, so that the water baffle plate rotates in the direction away from the cooling medium under the action of the torsion spring and then contacts the module cover plate; after the water baffle plate contacts the module cover plate, the liquid inlet end of the flow channel can be closed, and the cooling medium flowing back to the liquid inlet end of the flow channel can be blocked, so as to prevent the returning cooling medium from impacting the equipment connected to the flow channel, thereby affecting the normal operation of the heat dissipation device. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solution of the implementation mode of the utility model, the drawings required for use in the implementation mode will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 It is a three-dimensional diagram of the utility model.

[0025] Figure 2 It is a structural schematic diagram of the heat conduction mechanism in the utility model.

[0026] Figure 3 It is a structural schematic diagram of the water retaining plate in the utility model.

[0027] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0028] 101-module cavity, 102-flow channel, 103-torsion spring, 104-module cover, 105-heat conduction mechanism, 106-placement groove, 107-first heat conduction plate assembly, 108-second heat conduction plate assembly, 109-first heat conduction plate, 110-second heat conduction plate, 111-third heat conduction plate, 112-fourth heat conduction plate, 113-water retaining plate. DETAILED DESCRIPTION

[0029] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the embodiments of the present invention. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0030] In the description of the embodiments of the present invention, it should be understood that the terms "length", "vertical", "horizontal", "top", "bottom", etc. indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present invention.

[0031] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present utility model, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0032] In the embodiments of the present utility model, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present utility model can be understood according to specific circumstances.

[0033] In the embodiments of the present utility model, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through another feature between them. Moreover, the first feature being "above", "above" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature includes the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0034] The disclosure below provides many different embodiments or examples for realizing different structures of the embodiments of the present utility model. In order to simplify the disclosure of the embodiments of the present utility model, the components and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the embodiments of the present utility model. In addition, the embodiments of the present utility model can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0035] The embodiments of the present utility model are described in detail below with reference to the accompanying drawings.

[0036] See also Figure 1-Figure 3 , this embodiment discloses an anti-backflow liquid cooling device, comprising a module cavity 101, a module cover 104 and a heat conduction mechanism 105, wherein a flow channel 102 is provided on the module cavity 101;

[0037] The module cover 104 is installed on the module cavity 101, and the module cover 104 is used to seal the module cavity 101; the heat conduction mechanism 105 is installed in the flow channel 102 and is used to conduct heat to the cooling medium entering the flow channel 102;

[0038] A water baffle 113 for blocking the reflowing cooling medium is rotatably mounted at the liquid inlet end of the flow channel 102 . A torsion spring 103 is connected to the water baffle 113 . The water baffle 113 is connected to the module cavity 101 via the torsion spring 103 .

[0039] In this embodiment, one end of the torsion spring 103 is fixedly connected to the water baffle 113, and the other end is fixedly connected to the module cavity 101; the module cavity 101 is used to dissipate heat for the power amplifier board after being fitted with the power amplifier board, and the module cavity 101 can be sealed after the cover plate is connected to the module cavity 101, and the bottom end of the module cover plate 104 is in contact with the heat conduction mechanism 105; the heat conduction mechanism 105 is inclined toward the direction of flow of the cooling medium, and when the cooling medium enters the flow channel 102 from the liquid inlet end of the flow channel 102, the baffle rotatably installed in the flow channel 102 rotates under the pressure of the cooling medium, so that a gap connected to the flow channel 102 is formed between the baffle and the cover plate, and the cooling medium can enter the flow channel 102 through the gap, and the torsion spring 103 is compressed; by setting the The heat conduction mechanism 105 can increase the contact area between the cooling medium and the module cavity 101, thereby further improving the cooling effect of the cooling medium on the power amplifier board; when the cooling medium flows back toward the liquid inlet end of the flow channel 102 due to the change in pressure in the flow channel 102, the torsion spring 103 connecting the water baffle 113 and the module cavity 101 is relaxed, so that the water baffle 113 rotates in the direction away from the cooling medium under the action of the torsion spring 103 and then contacts the module cover 104; after the water baffle 113 contacts the module cover 104, the liquid inlet end of the flow channel 102 can be closed, thereby blocking the cooling medium flowing back to the liquid inlet end of the flow channel 102, preventing the refluxed cooling medium from impacting the equipment connected to the flow channel 102, thereby affecting the normal operation of the heat dissipation device.

[0040] In some embodiments, the heat conducting mechanism 105 includes a first heat conducting plate assembly 107 and a second heat conducting plate assembly 108, the first heat conducting plate assembly 107 and the second heat conducting plate assembly 108 are arranged on both sides of the flow channel 102, and the first heat conducting plate assembly 107 and the second heat conducting plate assembly 108 are arranged obliquely toward the direction of the flow of the cooling medium and are arranged alternately with the first heat conducting plate assembly 107 and the second heat conducting plate assembly 108. The first heat conducting plate assembly 107 and the second heat conducting plate assembly 108 arranged in this embodiment can form a Tesla valve structure, so that the first heat conducting plate assembly 107 and the second heat conducting plate assembly 108 can guide the cooling medium in the process of the cooling medium flowing from the liquid inlet end of the flow channel 102 to the liquid outlet end of the flow channel 102; by arranging the first heat conducting plate assembly 107 and the second heat conducting plate assembly 108, the contact area between the cooling medium and the module cavity 101 can be increased, thereby further improving the cooling effect of the cooling medium on the power amplifier board.

[0041] In some embodiments, the first heat conducting plate assembly 107 includes a first heat conducting plate 109 and a second heat conducting plate 110, one end of the first heat conducting plate 109 is connected to the module cavity 101, the second heat conducting plate 110 is staggered with the first heat conducting plate 109, and a first branch flow channel is formed between the first heat conducting plate 109 and the adjacent second heat conducting plate 110. The bottom surfaces of the first heat conducting plate 109 and the second heat conducting plate 110 are fixedly connected to the module cavity 101; one end of the first heat conducting plate 109 close to the liquid inlet end of the flow channel 102 is connected to the module cavity 101; when the cooling medium flows back toward the liquid inlet end of the flow channel 102 due to the change in the pressure in the flow channel, the flow velocity of the cooling medium in the first branch flow channel of the return flow is reduced and a vortex is formed, thereby hindering the return of the cooling medium, and the first heat conducting plate 109 and the second heat conducting plate 110 can increase the contact area between the cooling medium and the module cavity 101, thereby further improving the cooling effect of the cooling medium on the power amplifier board.

[0042] In some embodiments, the second heat conducting plate assembly 108 includes a third heat conducting plate 111 and a fourth heat conducting plate 112, one end of the third heat conducting plate 111 is connected to the module cavity 101, the fourth heat conducting plate 112 is staggered with the third heat conducting plate 111, and a second branch flow channel is formed between the fourth heat conducting plate 112 and the adjacent third heat conducting plate 111. The bottom surfaces of the third heat conducting plate 111 and the fourth heat conducting plate 112 are both fixedly connected to the module cavity 101; one end of the third heat conducting plate 111 close to the liquid inlet end of the flow channel 102 is connected to the module cavity 101; when the cooling medium flows back toward the liquid inlet end of the flow channel 102 due to the change in the pressure in the flow channel, the flow velocity of the cooling medium in the second branch flow channel is reduced and a vortex is formed, thereby hindering the return of the cooling medium. By connecting one end of the third heat conducting plate 111 to the module cavity 101 , the contact area between the cooling medium and the module cavity 101 can be increased, thereby further improving the cooling effect of the cooling medium on the power amplifier board.

[0043] In some embodiments, a placement groove 106 for fitting with a power amplifier board is provided on the module cavity 101. The placement groove 106 can be provided to position the power amplifier board that needs to be cooled, so that the module cavity 101 fits the power amplifier board more closely, thereby further improving the cooling effect of the cooling medium on the power amplifier board.

[0044] In some embodiments, the water baffle 113 is provided with an arc surface. When the cooling medium flows from the liquid inlet end of the flow channel 102 to the liquid outlet end of the flow channel 102, the arc surface provided on the water baffle 113 can guide the cooling medium, so that the cooling medium can enter the flow channel 102; when the cooling medium flows back from the liquid outlet end of the flow channel 102 to the liquid inlet end of the flow channel 102, the arc surface provided on the water baffle 113 can further prevent the cooling medium from flowing back, thereby preventing the cooling medium from flowing back from the liquid outlet end of the flow channel 102 from impacting the equipment connected to the flow channel 102.

[0045] In some embodiments, the first heat conducting plate 109 , the second heat conducting plate 110 , the third heat conducting plate 111 and the fourth heat conducting plate 112 are all wave structures, thereby further increasing the contact area between the cooling medium in the flow channel 102 and the module cavity 101 , effectively improving the heat dissipation efficiency.

[0046] In some embodiments, a valve is installed at the liquid inlet end of the flow channel 102. When the valve is in a normally open state, the liquid source device can be connected to the flow channel 102; when the valve is closed, it is convenient for operators to repair and replace the module cavity, cover plate and baffle. In this embodiment, the liquid source device is used to input cooling medium into the flow channel 102. The liquid source device and valve are both conventional devices in the prior art, and their structures and functions are not described one by one here.

[0047] In some embodiments, a sealing portion is installed on the module cover 104. The sealing portion is made of rubber material and is used to seal the gap between the module cover 104 and the module cavity 101.

[0048] In some embodiments, the module cover 104 is detachably connected to the module cavity 101 by bolts. Connecting the module cover 104 and the module cavity 101 by bolts can facilitate installation and replacement of the module cover 104.

[0049] In some embodiments, a stepped platform is provided on the module cover plate 104. When the cooling medium flows back toward the liquid inlet end of the flow channel 102 due to the change in the pressure in the flow channel 102, the torsion spring 103 connecting the water baffle plate 113 and the module cavity 101 is relaxed, so that the water baffle plate 113 rotates in the direction away from the cooling medium under the action of the torsion spring 103 and contacts with the stepped platform fixedly connected to the module cover plate 104; by providing the stepped platform, the contact area between the module cover plate 104 and the water baffle plate 113 can be increased, thereby further improving the sealing effect of the water baffle plate 113 on the liquid inlet end of the flow channel 102 after contacting the stepped platform.

[0050] Although the preferred embodiments of the present invention have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present invention.

[0051] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A backflow-proof liquid cooling device, characterized in that: include: A module cavity (101), wherein a flow channel (102) is provided on the module cavity (101); A module cover plate (104), the module cover plate (104) being mounted on the module cavity (101), and the module cover plate (104) being used to seal the module cavity (101); A heat conduction mechanism (105), the heat conduction mechanism (105) being installed in the flow channel (102) and used to conduct heat to the cooling medium entering the flow channel (102); A water baffle (113) for blocking the reflowing cooling medium is rotatably mounted at the liquid inlet end of the flow channel (102); a torsion spring (103) is connected to the water baffle (113); and the water baffle (113) is connected to the module cavity (101) via the torsion spring (103).

2. The anti-backflow liquid cooling heat dissipation device according to claim 1, characterized in that: The heat conduction mechanism (105) comprises a first heat conduction plate assembly (107) and a second heat conduction plate assembly (108); the first heat conduction plate assembly (107) and the second heat conduction plate assembly (108) are arranged on both sides of the flow channel (102); the first heat conduction plate assembly (107) and the second heat conduction plate assembly (108) are both arranged obliquely toward the direction of flow of the cooling medium, and the first heat conduction plate assembly (107) and the second heat conduction plate assembly (108) are arranged in an alternating manner.

3. The anti-backflow liquid cooling heat dissipation device according to claim 2, characterized in that: The first heat conducting plate assembly (107) comprises a first heat conducting plate (109) and a second heat conducting plate (110), one end of the first heat conducting plate (109) is connected to the module cavity (101), the second heat conducting plate (110) and the first heat conducting plate (109) are arranged alternately, and a first branch flow channel is formed between the first heat conducting plate (109) and the adjacent second heat conducting plate (110).

4. The anti-backflow liquid cooling heat dissipation device according to claim 3, characterized in that: The second heat conducting plate assembly (108) comprises a third heat conducting plate (111) and a fourth heat conducting plate (112); one end of the third heat conducting plate (111) is connected to the module cavity (101); the fourth heat conducting plate (112) and the third heat conducting plate (111) are arranged alternately; and a second branch flow channel is formed between the fourth heat conducting plate (112) and the adjacent third heat conducting plate (111).

5. The anti-backflow liquid cooling heat dissipation device according to claim 4, characterized in that: The module cavity (101) is provided with a placement groove (106) for fitting with a power amplifier board.

6. The anti-backflow liquid cooling heat dissipation device according to claim 1, characterized in that: The water baffle plate (113) is provided with an arc surface.

7. The anti-backflow liquid cooling heat dissipation device according to claim 1, characterized in that: The liquid inlet end of the flow channel (102) is provided with a valve.

8. The anti-backflow liquid cooling heat dissipation device according to claim 1, characterized in that: A sealing portion is installed on the module cover plate (104).

9. The anti-backflow liquid cooling heat dissipation device according to claim 1, characterized in that: The module cover plate (104) is detachably connected to the module cavity (101) via bolts.

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