Composite film and display component using the same

Abstract

The composite film of the utility model comprises an electromagnetic shielding layer and an absorbing layer, wherein the first surface of the electromagnetic shielding layer and the first surface of the absorbing layer are sticky, and the second surface of the absorbing layer is attached to the first surface of the electromagnetic shielding layer. When electromagnetic waves contact the composite film, the absorbing material can absorb these electromagnetic waves and convert them into heat energy or other forms of energy. At the same time, the electromagnetic shielding layer can effectively guide out redundant electromagnetic waves. This composite film is applied to display components, wherein the absorbing layer is attached to the top of the IC, and the composite film is extended and attached to the FPC, and is connected to the copper exposed area of ​​the FPC, so as to guide out electromagnetic interference, thereby improving the electromagnetic compatibility of the overall device.

Description

Technical Field

[0001] The utility model relates to the technical field of an anti-interference composite film, in particular to an anti-interference composite film and a display component using the same. Background Art

[0002] TFT IC is susceptible to electromagnetic interference, which may cause the display screen to be white, blue, with erroneous characters or data, or the screen to shift or turn upside down, making it impossible to identify or view the displayed content normally. Continuous electromagnetic interference may also cause the performance of TFTIC to deteriorate, affecting its stability and reliability, and may even cause equipment failure or damage. Utility Model Content

[0003] The utility model aims to overcome the shortcomings of the prior art and provide a composite film covering an IC to protect the IC from interference.

[0004] The purpose of this utility model is achieved through the following technical solutions:

[0005] A composite film, characterized in that the composite film comprises an electromagnetic shielding layer and an absorbing layer, the first surface of the electromagnetic shielding layer and the first surface of the absorbing layer are sticky, and the second surface of the absorbing layer is attached to the first surface of the electromagnetic shielding layer.

[0006] Preferably, the wave absorbing layer is made of an insulating material mixed with a nano-composite wave absorbing agent.

[0007] Preferably, the first surface of the absorbing layer has anti-EMI thermal conductive glue.

[0008] Preferably, the electromagnetic shielding layer is made of conductive and magnetic materials.

[0009] A display component uses the composite film, which includes a TFT first glass, a TFT second glass, an IC, and an FPC. The TFT first glass and the TFT second glass are bonded together, the IC and the FPC are bonded to the TFT second glass, the wave absorbing layer of the composite film is bonded to the side of the IC away from the TFT second glass, and the electromagnetic shielding layer of the composite film is extended and bonded to the FPC.

[0010] Furthermore, the height of the TFT first glass is smaller than that of the TFT second glass, the IC is attached within the height difference region between the TFT second glass and the TFT first glass, and the height of the absorbing layer of the composite film is equal to the height difference between the TFT first glass and the TFT second glass.

[0011] Furthermore, the composite film is connected to the IC and the FPC by heat pressing.

[0012] Furthermore, the FPC is provided with an alignment line to which the electromagnetic shielding layer is adhered.

[0013] Furthermore, a copper exposed area is provided on the FPC, and a continuous grounding wire or grounding grid is arranged around the copper exposed area to provide a low-impedance grounding path.

[0014] The utility model combines an electromagnetic shielding layer and an absorbing layer to form a composite film. When electromagnetic waves contact the composite film, the absorbing material can absorb these electromagnetic waves and convert them into heat energy or other forms of energy. At the same time, the electromagnetic shielding layer can effectively guide out excess radio waves. This composite film is used in display components. Its absorbing layer is attached to the top of the IC, and the composite film extends to the FPC and is connected to the copper exposed area of ​​the FPC. The electromagnetic interference is guided out through the FPC, thereby improving the electromagnetic compatibility of the overall equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 is a schematic diagram of the composite membrane;

[0017] Figure 2 A front view of a display component using the composite film;

[0018] Figure 3 A schematic side view of a display component using the composite film. DETAILED DESCRIPTION

[0019] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively with reference to the relevant drawings. The drawings provide preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly and comprehensively understood.

[0020] It should be noted that the terms “first”, “second” and similar expressions used in this document are only for illustrative purposes and do not represent the only implementation methods.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0022] See also Figure 1 In the first embodiment, the composite film includes an electromagnetic shielding layer 1 and an absorbing layer 2. The first surface of the electromagnetic shielding layer 1 and the first surface of the absorbing layer 2 are sticky, and the second surface of the absorbing layer 2 is attached to the first surface of the electromagnetic shielding layer 1. That is, the composite film includes electromagnetic shielding materials and absorbing materials. When in use, the absorbing layer 1 of the composite film is attached to the IC3. When electromagnetic waves contact the composite film, the absorbing material of the absorbing layer 1 can absorb these electromagnetic waves and convert them into heat energy or other forms of energy, making them no longer destructive. The composite film electromagnetic shielding layer 1 extends from the absorbing layer 2 and is attached to the grounding line or component, which will effectively prevent the superposition of electric waves, eliminate the redundant electric waves in the EMC, and cooperate with the absorbing layer 2 to achieve electromagnetic interference shielding.

[0023] In this embodiment, the absorbing layer 2 is made of an insulating material mixed with a nano-composite absorbing agent, which can better absorb or significantly reduce the received electromagnetic wave energy, thereby reducing electromagnetic interference, and can be directly bonded to the IC.

[0024] In this embodiment, the first surface of the absorbing layer 2 has an anti-EMI thermal conductive adhesive to reduce thermal resistance, thereby improving the overall thermal conductivity efficiency.

[0025] In this embodiment, the electromagnetic shielding layer 1 is made of conductive and magnetic materials, which can effectively block the radiation of electromagnetic waves, prevent or reduce the leakage of electromagnetic signals, and prevent interference from external signals.

[0026] See also Figure 2 , Figure 3The display component in the second embodiment uses a composite film including an electromagnetic shielding layer 1 and an absorbing layer 2 for electromagnetic interference shielding. The absorbing layer 2 of the composite film is cut and formed and the non-sticky surface is attached to the sticky surface of the electromagnetic shielding layer 1 of the composite film. The TFT first glass 4 and the TFT second glass 5 are attached to each other. The height of the TFT first glass 4 is less than the height of the TFT second glass 5. IC3 is attached to the height difference area between the TFT second glass 5 and the TFT first glass 4. FPC6 is bound to the side of the TFT second glass 5 close to IC3. The absorbing layer 2 of the composite film is attached to the side of IC3 away from the TFT second glass 5. The electromagnetic shielding layer 1 of the composite film extends and is attached to the FPC6, and is connected to the copper exposed area 7 of the FPC6. In this way, the composite film absorbs and converts electromagnetic waves through the absorbing layer 2 on the one hand, and the excess electromagnetic waves are guided to the copper exposed area 7 through the electromagnetic shielding layer 1, and the electromagnetic interference is guided out through the FPC5.

[0027] In this embodiment, the height of the wave absorbing layer 2 of the composite film is equal to the height difference between the first TFT glass 4 and the second TFT glass 5, and the IC 3 is fully covered and bonded.

[0028] In this embodiment, the composite film is connected to IC3 and FPC6 by heat pressing to achieve good physical connection and electrical contact.

[0029] In this embodiment, FPC6 is provided with alignment lines for pasting the electromagnetic shielding layer 1, so that the extended electromagnetic shielding layer 6 can be accurately placed on the area on FPC6 that needs to be shielded during pasting to ensure that the tape completely covers the sensitive area without interfering with other components or connection points on FPC6.

[0030] In this embodiment, a continuous grounding wire or a grounding grid is arranged around the copper exposed area 7 to effectively connect the copper exposed area 7 with the grounding wire or the grounding plane, thereby realizing rapid electromagnetic extraction and grounding.

[0031] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A composite film, characterized in that The composite film comprises an electromagnetic shielding layer and an absorbing layer. The first surface of the electromagnetic shielding layer and the first surface of the absorbing layer are sticky, and the second surface of the absorbing layer is attached to the first surface of the electromagnetic shielding layer.

2. The composite membrane according to claim 1, characterized in that The first surface of the wave absorbing layer has anti-EMI thermal conductive glue.

3. The composite membrane according to claim 1, characterized in that The electromagnetic shielding layer is made of conductive and magnetic materials.

4. A display component, characterized in that: It comprises a TFT first glass, a TFT second glass, an IC, an FPC and a composite film according to any one of claims 1 to 3, wherein the TFT first glass and the TFT second glass are bonded together, the IC and the FPC are bonded to the TFT second glass, the wave absorbing layer of the composite film is bonded to the side of the IC away from the TFT second glass, and the electromagnetic shielding layer of the composite film is extended and bonded to the FPC.

5. The display assembly according to claim 4, characterized in that: The height of the TFT first glass is smaller than the height of the TFT second glass, and the IC is attached within the height difference region between the TFT second glass and the TFT first glass.

6. The display assembly according to claim 5, characterized in that: The height of the wave absorbing layer of the composite film is equal to the height difference between the first glass of the TFT and the second glass of the TFT.

7. The display assembly according to claim 6, characterized in that: The composite film is connected to the IC and the FPC by heat pressing.

8. The display assembly according to claim 7, characterized in that: The FPC is provided with an alignment line to which the electromagnetic shielding layer is adhered.

9. The display assembly according to claim 8, characterized in that: A copper exposed area is provided on the FPC, and a continuous grounding wire or a grounding grid is arranged around the copper exposed area.

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