Silicon wafer edge processing equipment

Abstract

The utility model discloses a silicon wafer edge wrapping processing equipment, comprising: a gluing unit, which comprises a first gluing mechanism and a second gluing mechanism which are sequentially distributed and perpendicular to each other; a silicon wafer positioning information acquisition unit, which comprises a first silicon wafer positioning information acquisition mechanism arranged in conjunction with the first gluing mechanism and a second silicon wafer positioning information acquisition mechanism arranged in conjunction with the second gluing mechanism; a silicon wafer transmission unit, which is used for transmitting silicon wafers so that the silicon wafers flow between the first gluing mechanism and the second gluing mechanism; wherein the first gluing mechanism and the second gluing mechanism both comprise two rubber wheel mechanisms arranged in pairs; each rubber wheel mechanism comprises; a support platform; a rubber wheel assembly, which comprises two supporting frames arranged in pairs above the support platform, a rubber wheel arranged between the two supporting frames and suitable for self-rotation, and a driving structure connected to the rubber wheel for driving the rubber wheel to perform self-rotation; and a deviation correction assembly, which is arranged below the support platform to drive the support platform to perform deflection movement.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer processing, in particular to silicon wafer edge wrapping processing equipment. Background Art

[0002] Silicon wafer hemming equipment is a device used to hem the four sides and right-angled sides of silicon wafers during the production of solar cells. The hemming operation of silicon wafers can prevent the edge areas of semiconductor silicon wafers from producing mechanical defects such as microcracks and edge collapse. These defects can cause quality problems in subsequent processing of chips, such as fragments during cutting and grinding, and accumulation of impurities during wafer cleaning and etching. Hemming treatment can improve edge quality and reduce defect rate.

[0003] Wafer hemming is usually used in the wafer edge packaging process in the semiconductor manufacturing industry. In the process of hemming silicon wafers, rubber wheels are generally required. Such rubber wheels are sometimes also called rollers or rubber coating wheels. They are mainly used to apply hemming materials on the edge of silicon wafers to prevent debris and contaminants from entering the effective area during subsequent wafer processing, affecting chip quality and yield.

[0004] Specifically, the glue wheel mechanism commonly used in general technology has glue on the glue wheel, and after the silicon wafer is transferred, the two rubber wheels are close to each other to achieve the glue brushing operation on the edge of the rubber wheel. This glue coating mechanism is only suitable for the neat position of the silicon wafer, that is, the edge of the silicon wafer needs to be arranged in parallel with the coating surface of the glue coating wheel in the glue wheel mechanism for coating glue to meet the use requirements.

[0005] However, in reality, when the silicon wafer is transferred to the glue coating position, it needs to go through different processes, so the position of the silicon wafer may float in a small range during the transmission process. When the position of the silicon wafer changes slightly, the glue coating wheel only coats the silicon wafer by being relatively close, which may cause the problem of uneven glue coating.

[0006] Therefore, in order to meet the actual glue coating needs when silicon wafers flow between serial processing steps and there are slight changes in position, it is also necessary to further optimize the overall structure of the silicon wafer edge processing equipment. Utility Model Content

[0007] The utility model aims to provide a silicon wafer edge wrapping processing device to solve the technical problem of improving the uniformity of the silicon wafer edge wrapping glue coating operation.

[0008] The silicon wafer edge processing equipment of the utility model is realized as follows:

[0009] A silicon wafer edge processing device, comprising:

[0010] The gluing unit comprises a first gluing mechanism and a second gluing mechanism which are sequentially distributed and perpendicular to each other;

[0011] A silicon wafer positioning information collection unit, comprising a first silicon wafer positioning information collection mechanism arranged in cooperation with the first gluing mechanism and a second silicon wafer positioning information collection mechanism arranged in cooperation with the second gluing mechanism;

[0012] The silicon wafer transfer unit is used to transfer the silicon wafer so that the silicon wafer flows between the first glue coating mechanism and the second glue coating mechanism;

[0013] The first gluing mechanism and the second gluing mechanism both include two rubber wheel mechanisms arranged in pairs; each of the rubber wheel mechanisms includes:

[0014] Support table;

[0015] The rubber wheel assembly comprises two supporting frames arranged in pairs above the supporting platform, a rubber coating wheel disposed between the two supporting frames and suitable for self-rotation, and a driving structure connected to the rubber coating wheel for driving the rubber coating wheel to self-rotate;

[0016] The deflection correction component is arranged below the support platform to drive the support platform to perform deflection movement.

[0017] In an optional implementation of the present invention, the first silicon wafer positioning information collection mechanism and the second silicon wafer positioning information collection mechanism both include at least a camera for positioning and photographing the silicon wafer.

[0018] In an optional implementation of the present invention, the silicon wafer transfer unit includes a first silicon wafer sliding transport component for cooperating with the first gluing mechanism, a second silicon wafer sliding transport component for cooperating with the second gluing mechanism, and a silicon wafer transfer component for transferring the silicon wafer from the first silicon wafer sliding transport component to the second silicon wafer sliding transport component.

[0019] In an optional implementation of the present invention, the running track of the first silicon wafer sliding transport assembly is perpendicular to the running track of the second silicon wafer sliding transport assembly.

[0020] In an optional implementation of the present invention, the first silicon wafer sliding transport assembly and the second silicon wafer sliding transport assembly both include a slide rail and a carrier suitable for moving on the slide rail and for carrying silicon wafers.

[0021] In an optional implementation of the present invention, the driving structure includes a driving motor and a pulley structure for connecting the driving motor and one end of the rubber coating wheel.

[0022] In an optional implementation of the present invention, the rubber wheel assembly also includes a paving knife disposed on two support frames and used for scraping the glue on the rubber coating wheel.

[0023] In an optional implementation of the utility model, both ends of the glue coating surface of the glue coating wheel are respectively provided with annular parts; the outer diameter of the annular parts is larger than the outer diameter of the glue coating surface;

[0024] A tapered transition portion is provided between the annular portion and the rubber coating surface; and

[0025] The small outer diameter portion of the tapered bevel transition portion is connected to the glue coating surface, and the large outer diameter portion of the tapered bevel transition portion is connected to the annular portion.

[0026] In an optional implementation of the present invention, the rubber wheel assembly also includes a glue storage box for collecting colloid, which is arranged between the two support frames and below the rubber coating wheel.

[0027] In an optional implementation of the present invention, the deviation correction component adopts a UVW three-dimensional adjustment platform structure.

[0028] By adopting the above technical solution, the utility model has the following beneficial effects: the silicon wafer hemming processing equipment of the utility model can realize the gluing operation on the four side edges of the silicon wafer from two different directions through the coordinated use of the first gluing mechanism and the second gluing mechanism which are perpendicular to each other, and then the silicon wafer is transferred between the first gluing mechanism and the second gluing mechanism through the silicon wafer transmission unit, thereby improving the efficiency of the serialized gluing process of the silicon wafer. Furthermore, the silicon wafer positioning information acquisition unit obtains the position information of the silicon wafer, so that the rubber wheel mechanism used by the first gluing mechanism and the second gluing mechanism can adjust the gluing angle of the gluing surface of the gluing wheel relative to the silicon wafer according to the offset angle of the silicon wafer position under the action of the deviation correction component, thereby making the gluing wheel in the rubber wheel assembly adapt to the offset angle of the silicon wafer. In summary, the uniformity of gluing of silicon wafers with slight position deviations is improved by cooperating with the gluing wheel through the deviation correction component. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a schematic structural diagram of the silicon wafer edge processing equipment from the first perspective of the present invention;

[0030] Figure 2 It is a second perspective structural schematic diagram of the silicon wafer edge processing equipment of the utility model;

[0031] Figure 3 It is a first-view structural schematic diagram of the rubber wheel mechanism of the silicon wafer hemming processing equipment of the utility model;

[0032] Figure 4 It is a second perspective structural schematic diagram of the rubber wheel mechanism of the silicon wafer hemming processing equipment of the utility model;

[0033] Figure 5It is a third-view structural diagram of the rubber wheel mechanism of the silicon wafer hemming processing equipment of the utility model;

[0034] Figure 6 This is a schematic structural diagram of the rubber wheel mechanism of the silicon wafer hemming processing equipment from the fourth viewing angle of the present invention.

[0035] In the figure: feeding conveyor belt 101, guide frame 102, silicon wafer transfer structure 103, camera 104, silicon wafer adsorption releaser 105, carrier 106, guide rail 107, support table 1, support base plate 2, support frame 31, glue coating wheel 32, paving knife 33, glue coating surface 34, glue storage box 35, annular portion 36, conical inclined surface transition portion 37, drive motor 41, active gear disc 42, driven gear disc 43, transmission belt 44, deviation correction component 5. DETAILED DESCRIPTION

[0036] In order to make the content of the utility model more clearly understood, the utility model is further described in detail below based on specific embodiments and in conjunction with the accompanying drawings.

[0037] Example 1: Please refer to Figures 1 to 6 As shown, this embodiment provides a silicon wafer edge processing equipment, including: a gluing unit, which includes a first gluing mechanism and a second gluing mechanism that are distributed in sequence and perpendicular to each other; a silicon wafer positioning information collection unit, which includes a first silicon wafer positioning information collection mechanism arranged to cooperate with the first gluing mechanism and a second silicon wafer positioning information collection mechanism arranged to cooperate with the second gluing mechanism; a silicon wafer transmission unit, which is used to transmit silicon wafers so that the silicon wafers flow between the first gluing mechanism and the second gluing mechanism; wherein the first gluing mechanism and the second gluing mechanism both include two glue wheel mechanisms arranged in pairs.

[0038] It should be noted that, here, in combination with the generally rectangular silicon wafer, there are four side edges that need to be coated with glue. The first gluing mechanism coats one pair of opposite side edges of the silicon wafer with glue, and then the second gluing mechanism coats the other pair of opposite side edges of the silicon wafer with glue. To this end, the gluing surfaces formed by the first gluing mechanism and the second gluing mechanism are on working surfaces that are perpendicular to each other.

[0039] Specifically, first, the first silicon wafer positioning information collection mechanism and the second silicon wafer positioning information collection mechanism both include at least a camera 104 for positioning and photographing the silicon wafer. Here, the camera 104 is mounted above the silicon wafer, so that the camera 104 is not only convenient for collecting images of the silicon wafer, but also does not affect the normal transmission flow of the silicon wafer.

[0040] Secondly, the silicon wafer transfer unit includes a first silicon wafer sliding transport assembly for cooperating with the first gluing mechanism, a second silicon wafer sliding transport assembly for cooperating with the second gluing mechanism, and a silicon wafer transfer assembly for transferring the silicon wafer from the first silicon wafer sliding transport assembly to the second silicon wafer sliding transport assembly. The silicon wafer transfer assembly here includes a guide rail 107 and a silicon wafer adsorption releaser 105 suitable for moving along the guide rail 107, and the silicon wafer adsorption releaser 105 can be optionally used, for example but not limited to, a suction cup. After the silicon wafer adsorption releaser 105 adsorbs the silicon wafer, it transfers it from the first silicon wafer sliding transport assembly to the second silicon wafer sliding transport assembly.

[0041] Based on the above situation, it should be noted that the running track of the first silicon wafer sliding transport assembly is perpendicular to the running track of the second silicon wafer sliding transport assembly. In conjunction with the accompanying drawings, for example, the first silicon wafer sliding transport assembly and the second silicon wafer sliding transport assembly both include a slide rail and a carrier 106 suitable for moving on the slide rail for carrying silicon wafers. The carrier 106 can move along the slide rail with the silicon wafer, thereby achieving a transmission effect for the silicon wafer.

[0042] On the basis of the above structure, it should be noted that, in an optional implementation, in order to improve the overall efficiency of the silicon wafer edge wrapping processing equipment of this embodiment for batch silicon wafer edge wrapping processing as much as possible, the silicon wafer edge wrapping processing equipment used in this embodiment can also add the following structure:

[0043] A feeding conveyor belt 101 for transporting silicon wafers, a guide frame 102 arranged above the feeding conveyor belt 101, and a pair of silicon wafer transfer structures 103 arranged on the guide frame 102 and suitable for moving along the guide frame 102 relative to the feeding conveyor belt 101 to both sides. The silicon wafer transfer structure 103 here can also use a suction cup. A set of gluing units, silicon wafer positioning information collection units and silicon wafer transfer units are respectively configured at both ends of the guide frame 102. In this way, when the silicon wafer is placed on the feeding conveyor belt 101, it can be sent to both ends of the guide frame 102 by a pair of silicon wafer transfer structures 103 for simultaneous gluing processing operations.

[0044] Next, it is to be explained that each of the rubber wheel mechanisms comprises: a support platform 1, a rubber wheel assembly arranged on the support platform 1, and a deflection correction assembly arranged under the support platform 1. Of course, it can be understood that, in order to facilitate fixing the rubber wheel mechanism of this embodiment on the work surface, a support base plate 2 for carrying the deflection correction assembly from the bottom is further provided at the bottom of the deflection correction assembly, and the support base plate 2 is fixed on the corresponding work surface, thereby realizing serial processing of silicon wafers.

[0045] Based on the above situation, in order to fully utilize the support surface of the support platform 1 to support the rubber wheel assembly, the support platform 1 in this embodiment may optionally adopt a rectangular structure.

[0046] Next, let's talk about it in detail. First, the rubber wheel assembly:

[0047] Regarding the rubber wheel assembly of this embodiment, any mature means in the prior art can be optionally adopted. Here, an optional implementation method is exemplified in conjunction with the accompanying drawings. The rubber wheel assembly includes two supporting frames 31 arranged in pairs above the support platform 1, a rubber coating wheel 32 suitable for self-rotation disposed between the two supporting frames 31, and a driving unit connected to the rubber coating wheel 32 for driving it to rotate.

[0048] Furthermore, in an optional implementation, the driving unit includes a driving motor 41, and a pulley structure for connecting the driving motor 41 and one end of the rubber coating wheel 32. The pulley structure here includes a driving toothed disc 42 connected to the driving motor 41, a driven toothed disc 43 connected to one end of the rubber coating wheel 32, and a transmission belt 44 for connecting the driving toothed disc 42 and the driven toothed disc 43 at the same time.

[0049] In addition, it should be noted that the rubber wheel assembly also includes a paving knife 33 provided on the two support frames 31 and used to scrape the glue on the rubber coating wheel 32. When the rubber coating wheel 32 is rotating, the paving knife 33 provided above the rubber coating wheel 32 scrapes the glue on the rubber coating wheel 32.

[0050] In order to prevent the colloid from flowing onto the support platform 1 during the gluing process, the rubber wheel assembly further includes a glue storage box 35 for collecting the colloid, which is arranged between the two support frames 31 and below the gluing wheel 32 .

[0051] On the basis of the above structure, in order to make the glue coating wheel 32 of this embodiment better fit the end angle of the silicon wafer, thereby improving the uniformity of glue coating on the edge of the silicon wafer, this embodiment also makes the following design:

[0052] The two ends of the glue coating surface 34 of the glue coating wheel 32 are respectively provided with annular portions 36; the outer diameter of the annular portion 36 is larger than the outer diameter of the glue coating surface 34. Furthermore, a tapered bevel transition portion 37 is provided between the annular portion 36 and the glue coating surface 34; and the small outer diameter portion of the tapered bevel transition portion 37 is connected to the glue coating surface 34, and the large outer diameter portion of the tapered bevel transition portion 37 is connected to the annular portion 36.

[0053] Regarding the deflection correction component of the present embodiment, the deflection correction component can optionally adopt a UVW three-dimensional adjustment platform structure. The UVW three-dimensional adjustment platform structure here can be any mature means in the prior art. As long as the support table 1 can be horizontally aligned and rotated relative to the silicon wafer, so that the support table 1 can adapt to the position state of the silicon wafer to adjust its gluing angle, the UVW three-dimensional adjustment platform structure meets the use requirements of the present embodiment, such as but not limited to a UVW three-dimensional adjustment platform disclosed by announcement number CN205951461U, or a UVW adjustment platform disclosed by announcement number CN213646638U. In the present embodiment, the use of the UVW three-dimensional adjustment platform structure can not only make the support table 1 adapt to the silicon wafer with a position offset to adjust the gluing angle, but also achieve approach and distance relative to the silicon wafer. In this way, for the rubber wheel mechanism of the present embodiment suitable for gluing the silicon wafer edge, there is no need to configure an additional linear motion mechanism for driving the rubber wheel mechanism to approach and move away from the silicon wafer during the process of gluing the silicon wafer.

[0054] In summary, regarding the first gluing mechanism and the second gluing mechanism of this embodiment, the specific implementation principles are as follows:

[0055] When the position of the silicon wafer deviates within a small range, the designed correction component is used to drive the support table 1 to deflect, thereby driving the rubber wheel assembly to move synchronously through the deflection movement of the support table 1, and then adjusting the gluing angle of the gluing surface 34 of the gluing wheel 32 relative to the silicon wafer, so that the gluing wheel 32 in the rubber wheel assembly adapts to the offset angle of the silicon wafer.

[0056] Based on the above situation, when the silicon wafer is coated with glue, the support table 1 is driven by the correction component to adapt to the silicon wafer to slightly adjust its coating angle, so that its coating angle adapts to the position and tilt angle of the silicon wafer, and the conical bevel transition portion 37 of the coating wheel 32 on one side of the silicon wafer fits with one end angle of the silicon wafer, and the conical bevel transition portion 37 of the coating wheel 32 on the other side of the silicon wafer fits with the other end angle of the silicon wafer, and the coating wheel 32 rolls to coat the diagonal and two side edges of the silicon wafer with glue.

[0057] Example 2: Based on the silicon wafer edge processing equipment of Example 1, the silicon wafer edge processing equipment provided in this example has the same general structure as that of Example 1, and the difference lies in the correction component used.

[0058] Specifically, the deflection correction assembly of this embodiment includes a circular ring gear disposed at the bottom of the support platform 1 of the rectangular structure, a gear meshing with the circular ring gear, and a micro motor for driving the gear to operate. In this structure, the micro motor drives the gear to rotate, thereby causing the circular ring gear to rotate, and in the process, the support platform 1 is driven to perform deflection motion.

[0059] Based on the above situation, since the correction component used in this embodiment can only realize the deflection movement of the support table 1, but cannot realize its linear movement away from and approaching the silicon wafer, it can be understood that for the silicon wafer edge processing equipment of this embodiment, in order to meet the use requirements of the two rubber wheel mechanisms respectively used by the first gluing mechanism and the second gluing mechanism to make linear movements relative to the silicon wafer, a linear screw module such as but not limited to a linear screw module can be further provided at the bottom of the support base plate 2 to drive the entire support base plate 2 and the related structures provided on the support base plate 2 to make linear movements.

[0060] In summary, for the silicon wafer hemming processing equipment of this embodiment, the linear screw module at the bottom of the supporting base plate 2 is used in conjunction with the deviation correction component so that the glue coating wheel 32 adapts to the position and angle of the silicon wafer to meet the use requirements for uniform glue coating on the side edges of the silicon wafer.

[0061] The above specific embodiments further illustrate the purpose, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above are only specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

[0062] In the description of the present invention, it is necessary to understand that the terms indicating orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0063] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0064] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the utility model product is usually placed when in use, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0065] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0066] In the present utility model, unless otherwise clearly specified and limited, the first feature being above or below the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through another feature between them. Moreover, the first feature being above, above, and above the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being below, below, and below the second feature includes the first feature being directly below and obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

Claims

1. A silicon wafer edge processing equipment, characterized in that: include: The gluing unit comprises a first gluing mechanism and a second gluing mechanism which are sequentially distributed and perpendicular to each other; A silicon wafer positioning information collection unit, comprising a first silicon wafer positioning information collection mechanism arranged in cooperation with the first gluing mechanism and a second silicon wafer positioning information collection mechanism arranged in cooperation with the second gluing mechanism; A silicon wafer transfer unit, which is used to transfer the silicon wafer so that the silicon wafer flows between the first glue coating mechanism and the second glue coating mechanism; in The first gluing mechanism and the second gluing mechanism both include two rubber wheel mechanisms arranged in pairs; each of the rubber wheel mechanisms includes: Support table; The rubber wheel assembly comprises two supporting frames arranged in pairs above the supporting platform, a rubber coating wheel disposed between the two supporting frames and suitable for self-rotation, and a driving structure connected to the rubber coating wheel for driving the rubber coating wheel to self-rotate; The deflection correction component is arranged below the support platform to drive the support platform to perform deflection movement.

2. The silicon wafer hemming processing equipment according to claim 1, characterized in that: The first silicon wafer positioning information collection mechanism and the second silicon wafer positioning information collection mechanism both include at least a camera for positioning and photographing the silicon wafer.

3. The silicon wafer hemming processing equipment according to claim 1 or 2, characterized in that: The silicon wafer transfer unit includes a first silicon wafer sliding transport component for cooperating with a first gluing mechanism, a second silicon wafer sliding transport component for cooperating with a second gluing mechanism, and a silicon wafer transfer component for transferring silicon wafers from the first silicon wafer sliding transport component to the second silicon wafer sliding transport component.

4. The silicon wafer edge processing equipment according to claim 3, characterized in that: The running track of the first silicon wafer sliding transport assembly is perpendicular to the running track of the second silicon wafer sliding transport assembly.

5. The silicon wafer edge processing equipment according to claim 3, characterized in that: The first silicon wafer sliding transport assembly and the second silicon wafer sliding transport assembly both include a slide rail and a carrier suitable for moving on the slide rail and for carrying silicon wafers.

6. The silicon wafer edge processing equipment according to claim 1, characterized in that: The driving structure comprises a driving motor and a pulley structure for connecting the driving motor and one end of the rubber coating wheel.

7. The silicon wafer edge processing equipment according to claim 1 or 6, characterized in that: The rubber wheel assembly also includes a paving knife which is arranged on two support frames and is used for scraping the glue on the rubber coating wheel.

8. The silicon wafer hemming processing equipment according to claim 1, characterized in that: The two ends of the glue coating surface of the glue coating wheel are also provided with annular parts respectively; the outer diameter of the annular part is larger than the outer diameter of the glue coating surface; A tapered transition portion is provided between the annular portion and the rubber coating surface; and The small outer diameter portion of the tapered bevel transition portion is connected to the glue coating surface, and the large outer diameter portion of the tapered bevel transition portion is connected to the annular portion.

9. The silicon wafer hemming processing equipment according to claim 1, characterized in that: The rubber wheel assembly also includes a glue storage box for collecting colloid, which is arranged between the two support frames and located below the rubber coating wheel.

10. The silicon wafer hemming processing equipment according to claim 1, characterized in that: The deviation correction component adopts a UVW three-dimensional adjustment platform structure.

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