Bare chip grinding clamp and bare chip grinding equipment

Abstract

The embodiment of the utility model provides a bare chip grinding clamp and bare chip grinding equipment, and relates to the technical field of bare chip grinding. The bare chip grinding clamp comprises a base module, a rotation adjusting module and a chip fixing module. When the rotation adjusting module rotates, the chip fixing module is driven to slide so as to drive the chip to move. The rotation adjusting module plays a role in accurate displacement, the rotation adjusting module converts large-amplitude rotation motion into small-amplitude sliding motion, an accurate positioning basis is provided for ion grinding of a bare chip, and the grinding amount is convenient to control.

Description

Technical Field

[0001] The present application relates to the technical field of bare chip grinding, and in particular to a bare chip grinding fixture and a bare chip grinding device. Background Art

[0002] As electronic products become smaller, more sophisticated and thinner, the size of semiconductor chips and devices is also getting smaller and finer. Therefore, the accuracy requirements for analyzing micro-nano chip structures are getting higher and higher. In chip quality control, failure analysis and competitive analysis, chip cross-sectional structure analysis is often required, and the quality of sample preparation of chip cross-section is very important. Conventional mechanical grinding and slicing causes obvious scratch damage, which often affects the analysis data.

[0003] Argon ion polishing and cutting, also known as ion milling CP (Cross-Section Polishing), ion milling can avoid scratches caused by mechanical milling. During the milling process, ion milling CP can avoid the influence of mechanical milling stress and ductile deformation of soft metals. Especially for samples with different hardness, ion milling CP can solve the ductility caused by stress in soft materials during the milling process. For example, SiC chips are made of hard materials. Placing the chips directly on the grinding table for grinding and polishing may result in poor polishing results and the inability to observe the true defect appearance.

[0004] The sample cross-section processed by ion milling CP is not affected by stress, so more accurate analysis of the material properties of the sample surface can be performed.

[0005] How to design a bare chip grinding fixture suitable for ion grinding CP is a technical problem to be solved in this application. Utility Model Content

[0006] The purpose of the present application is to provide a bare chip grinding fixture and a bare chip grinding device to solve the technical problem of how to design a bare chip grinding fixture suitable for ion grinding CP in the prior art.

[0007] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions.

[0008] In a first aspect, an embodiment of the present application provides a bare chip grinding fixture, comprising: a base module, a rotation adjustment module and a chip fixing module;

[0009] The rotation adjustment module comprises a first portion, a threaded portion, and a second portion, wherein the first portion, the threaded portion, and the second portion are connected in sequence;

[0010] The rotation adjustment module passes through the base module, and the threaded portion is connected to the first threaded hole of the base module;

[0011] The first part is used to receive external force and rotate;

[0012] The second part is connected to the chip fixing module;

[0013] The base module is provided with a sliding portion, and the chip fixing module is slidably connected to the sliding portion;

[0014] When the rotation adjustment module rotates, the second part drives the chip fixing module to slide on the sliding part;

[0015] The chip fixing module is used to fix the chip.

[0016] Optionally, the rotation adjustment module is a micrometer differential head.

[0017] Optionally, the base module includes an upper cover plate and a base, the first threaded hole is provided on the upper cover plate; the base is provided with a through hole;

[0018] The rotation adjustment module passes through the first threaded hole of the upper cover plate and the through hole of the base in sequence to connect with the chip fixing module.

[0019] Optionally, the chip fixing module is provided with a T-slot;

[0020] The second portion includes a cylindrical portion;

[0021] The cylindrical portion is located in the T-shaped slot to drive the chip fixing module to move.

[0022] Optionally, the base module is provided with a second threaded hole; the bare chip grinding fixture further includes a screw;

[0023] When the chip fixing module needs to be fixed on the sliding part, the screw passes through the second threaded hole to support the chip fixing module.

[0024] Optionally, the chip fixing module includes a first screw, a second screw, a sample holder and a fixing block;

[0025] The sample holder is used for bonding with the chip;

[0026] The fixing block is provided with a dovetail groove;

[0027] The first screw is provided with a third threaded hole; the sample holder is provided with a second through hole;

[0028] The first screw has a head that matches the dovetail groove, and the second screw is connected to the third threaded hole through the second through hole, so that the head of the first screw is pressed tightly against the dovetail groove.

[0029] Optionally, the bare chip grinding fixture further includes a lower cover plate;

[0030] When the chip is plane-ground, the ground surface of the chip protrudes from the lower cover plate and is parallel to the bottom surface of the lower cover plate.

[0031] Optionally, the base module is provided with four pillars, and the bottom surfaces of the pillars are located in the same plane, so that the base module can be placed flat on the grinding table through the bottom surfaces of the pillars.

[0032] Optionally, the rotation adjustment module is installed in the middle of the base module.

[0033] In a second aspect, an embodiment of the present application provides a bare chip grinding device, wherein the bare chip grinding device includes the bare chip grinding fixture of the first aspect.

[0034] Compared with the prior art, this application has the following beneficial effects:

[0035] In the bare chip grinding fixture provided in the embodiment of the present application, the rotation adjustment module plays a role of precise displacement, and a large-scale rotational movement is converted into a smaller-scale sliding movement, which is convenient for controlling the grinding amount and provides a precise positioning basis for the ion grinding of the bare chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0037] Figure 1 A schematic diagram of a bare chip grinding fixture provided in an embodiment of the present application;

[0038] Figure 2 A schematic diagram of a rotation adjustment module provided in an embodiment of the present application;

[0039] Figure 3 A schematic diagram of a micrometer differential head provided in an embodiment of the present application;

[0040] Figure 4 A schematic diagram of a chip fixing module provided in an embodiment of the present application with a T-slot;

[0041] Figure 5 A schematic diagram of the connection between a cylindrical portion and a T-slot of a rotation adjustment module provided in an embodiment of the present application;

[0042] Figure 6A schematic diagram of a chip fixing module provided in an embodiment of the present application includes a sample holder and a fixing block;

[0043] Figure 7 A schematic diagram of a fixed block provided with a dovetail groove according to an embodiment of the present application;

[0044] Figure 8 A schematic diagram of a sample holder and a first screw provided in an embodiment of the present application;

[0045] Fig. 9 A schematic diagram of a sliding connection between a base module and a chip fixing module provided in an embodiment of the present application;

[0046] Fig.10 A schematic diagram of a base module consisting of an upper cover plate and a base provided in an embodiment of the present application;

[0047] Fig.11 A schematic diagram of a large through hole on a base provided in an embodiment of the present application for easy installation;

[0048] Fig.12 A schematic diagram of assembling a bare chip grinding fixture for cross-section grinding provided in an embodiment of the present application;

[0049] Fig.13 A schematic diagram of a bottom support of a base module provided in an embodiment of the present application;

[0050] Fig.14 A schematic diagram of the assembly of a bare chip grinding fixture for surface grinding provided in an embodiment of the present application.

[0051] Description of reference numerals:

[0052] 101 Base module

[0053] 1011 Grooved Guide Rail

[0054] 1012 Second threaded hole

[0055] 1013 Upper cover

[0056] 1014 Base

[0057] 1015 First threaded hole

[0058] 1016 Second through hole

[0059] 1017 Pillar

[0060] 102 Rotation adjustment module

[0061] 1021 Part 1

[0062] 1022 Part 2

[0063] 1023 Part 3

[0064] 1024 Cylindrical part

[0065] 103 Chip fixing module

[0066] 1031 T-slot

[0067] 1032 Fixed block

[0068] 1033 Sample tray

[0069] 1034 Dovetail Groove

[0070] 1035 First through hole

[0071] 1036 First Screw

[0072] 1037 Guide

[0073] 1038 Surface grinding fixed block

[0074] 1039 Lower cover

[0075] 104 Chip DETAILED DESCRIPTION

[0076] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. The described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described in the drawings here can be arranged and designed in various different configurations.

[0077] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application. In the absence of conflict, the following embodiments and features in the embodiments may be combined with each other.

[0078] In the description of this application, it should be noted that relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. The term "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium.

[0079] like Figure 1An embodiment of the present application provides a bare chip grinding fixture, including a base module 101, a rotation adjustment module 102 and a chip fixing module 103.

[0080] like Figure 2 The rotation adjustment module 102 includes a first portion 1021, a threaded portion 1022 and a second portion 1023, and the first portion 1021, the threaded portion 1022 and the second portion 1023 are connected in sequence.

[0081] The rotation adjustment module 102 passes through the base module 101. Figure 1 A first threaded hole is set at the position where the rotation adjustment module 102 passes through the base module 101, and the threaded portion 1022 is located in the first threaded hole of the base module 101. Therefore, when the threaded portion 1022 rotates in the first threaded hole, the rotation adjustment module 102 moves up and down.

[0082] The first portion 1021 of the rotation adjustment module 102 is used to receive an external force to rotate, and the second portion 1023 is connected to the chip fixing module 103 .

[0083] The base module is provided with a sliding portion, Figure 1 The contact plane between the middle base module 101 and the chip fixing module 103 is a sliding part, and the chip fixing module 103 is slidably connected to the sliding part. The chip fixing module 103 is used to fix the chip, and the chip can be fixed to one surface of the chip fixing module 103 by gluing.

[0084] When the rotation adjustment module 102 rotates, the second part 1023 drives the chip fixing module 103 to slide on the sliding part. In the bare chip grinding fixture provided by the embodiment of the present application, the rotation adjustment module plays a role of precise displacement, and a large-scale rotational motion is converted into a small-scale sliding motion, which is convenient for controlling the grinding amount and provides a precise positioning basis for the ion grinding of the bare chip.

[0085] The rotation adjustment module 102 may be installed in the middle of the base module 101 , thereby providing a left-right balanced thrust or pull force to the base module 101 .

[0086] The rotation adjustment module 102 may be a micrometer head, such as Figure 3 The handle of the micrometer differential head is used as the first part 1021, and the other end of the micrometer differential head can be installed with a structure for connecting the base module. The ratchet device at the tail end of the micrometer is turned to control the feed amount of the chip fixing module, and the feed amount of the chip cross section or plane can be controlled to achieve the purpose of controlling the grinding thickness.

[0087] like Figure 4 The chip fixing module 103 may be provided with a T-shaped slot 1031. Figure 3The second portion 1023 may be provided with a cylindrical portion 1024, and the cylindrical portion 1024 cooperates with the T-slot 1031 and is connected as shown in FIG. Figure 5 The cylindrical portion 1024 is located in the T-slot to drive the chip fixing module 103 to move.

[0088] The chip can be fixed with the help of a sample holder, such as Figure 6 The chip fixing module 103 may include a sample holder 1033 and a fixing block 1032. The chip 104 may be attached to the sample holder 1033 by glue. The fixing block 1032 serves as a medium for connecting the sample holder 1033 and the rotation adjustment module 102, thereby facilitating the fixing and replacement of the chip. When the chip needs to be replaced, the sample holder 1033 may be removed without removing the fixing block 1032 or disassembling the connection between the fixing block 1032 and the rotation adjustment module 102.

[0089] like Figure 7 The fixing block 1032 may be provided with a dovetail groove 1034, and the sample holder 1033 may be connected via the dovetail groove 1034. Figure 8 A first through hole 1035 can be set in the sample holder 1033, and a first screw 1036 with the same shape as the dovetail groove 1034 is placed above the first through hole 1035 of the sample holder. A third threaded hole can be set below the first screw 1036, and a second screw entering below the first through hole 1035 can be connected to the third threaded hole, thereby providing a downward locking force for the first screw 1036, pressing the first screw 1036 against the surface of the dovetail groove 1034, and at the same time, the upper surface of the sample holder 1033 and the surface of the fixed block 1032 are pressed tightly, so as to achieve the effect of firmly connecting the fixed block 1032 and the sample holder 1033 together.

[0090] The sliding part of the base module 101 can be set in the form of a guide rail, such as Fig. 9 Groove guide rails 1011 are provided on both sides of the base module 101, and correspondingly, guide parts 1037 can be provided on both sides of the chip fixing module 103. The guide parts 1037 are slidably connected with the groove guide rails 1011, which can ensure the stability of the movement of the chip fixing module 103.

[0091] like Fig. 9 A second threaded hole 1012 may be provided on one side of the base module 101, and a screw may be screwed into the second threaded hole 1012. When the chip fixing module 103 needs to be fixed on the sliding part, the chip fixing module 103 may be supported by the screw to fix the chip fixing module 103.

[0092] like Fig.10 In order to facilitate the fixing of the rotation adjustment module, the base module 101 may include an upper cover plate 1013 and a base 1014, and the first threaded hole 1015 is provided on the upper cover plate 1013. Fig.11 A second through hole 1016 may be provided at a position of the base 1014 corresponding to the first threaded hole 1015, and the size of the second through hole 1016 is larger than the size of the first threaded hole. The rotation adjustment module 102 passes through the first threaded hole 1015 of the upper cover plate 1013 and the through hole of the base 1014 in sequence to connect the chip fixing module 103. A screw hole may also be provided on the side of the upper cover plate 1013, where a screw may be used to lock the threaded portion of the rotation adjustment module.

[0093] When the rotary adjustment module is a differential micrometer, the differential micrometer side lock can be locked to lock the grinding position to prevent the feed amount from increasing or decreasing during grinding, affecting the grinding thickness. Especially for the metal grinding thickness on the back of the chip, it needs to be controlled within micron accuracy. The above locking method can meet the requirements. The upper cover plate 1013 can increase the height of the differential micrometer side lock from the base to facilitate the turning of the side lock.

[0094] Thus, the position of the upper cover plate 1013 can be slightly adjusted to adjust the left and right positions of the rotation adjustment module and the left and right positions of the chip fixing module, so that the guide portion of the chip fixing module is installed in the groove guide rail.

[0095] Fig.12 The figure shows an assembly diagram of a bare chip grinding fixture for cross-section grinding. The lower surface of the chip 104 is the cross-section that needs to be ground. The chip 104 can be moved up and down by adjusting the rotary adjustment module, thereby accurately positioning the grinding amount.

[0096] Fig.13 The bottom surface of the base module 101 is shown. The base module 101 can be provided with four pillars 1017 , and the bottom surfaces of the pillars 1017 are located in the same plane, so that the base module 101 can be placed flat on the grinding table through the bottom surfaces of the pillars 1017 .

[0097] like Fig.14 , Fig.14 The following is a schematic diagram of the assembly of a bare chip grinding fixture for plane grinding, which is used for grinding the front or back of the chip, especially for back grinding of metal thinning on the back of the chip, which can effectively control the thinning amount. Fig.12 The base 1014, the upper cover plate 1013, and the rotation adjustment module 102 are replaced by the fixed block 1032 and the sample holder 1033 with the plane grinding fixed block 1038, and a lower cover plate 1039 can be provided. When the chip is plane ground, the chip plane protrudes from the lower cover plate to facilitate grinding. The lower cover plate 1039 and the plane grinding fixed block 1038 constitute a chip fixing module. Since the bottom surface of the lower cover plate 1039 is a plane, the chip plane is controlled to be parallel during grinding, which can enhance the flatness during plane grinding.

[0098] Based on the above embodiments, the embodiments of the present application further provide a bare chip grinding device, and the bare chip grinding device includes the above bare chip grinding fixture.

[0099] In general, the present application proposes a bare chip grinding fixture and a bare chip grinding device, which can achieve the following beneficial effects:

[0100] 1. The bare chip grinding fixture is used for chip ion beam grinding. The sample holder of the equipment is installed through the dovetail groove on the fixed block. The chip is pasted on the sample holder, which can grind the cross section and plane, solving the problems of uneven stress and uneven surface caused by manual grinding of chip cross section and plane in the past.

[0101] 2. The rotary adjustment module, such as the differential micrometer structure, can control the grinding thickness, which can effectively solve the problem of thinning the metal thickness on the back of the chip during plane grinding.

[0102] 3. The bare chip grinding fixture can make the sample preparation before ion beam grinding to be smoother and flatter, shortening the time for ion beam grinding of the sample.

[0103] The above-described device and system embodiments are merely illustrative, and some or all of the modules may be selected according to actual needs to achieve the purpose of the present embodiment. A person skilled in the art may understand and implement the present embodiment without creative effort.

[0104] The above are only preferred specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by any technician familiar with the technical field within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A bare chip grinding fixture, characterized in that: include: Base module, rotation adjustment module and chip fixing module; The rotation adjustment module comprises a first portion, a threaded portion, and a second portion, wherein the first portion, the threaded portion, and the second portion are connected in sequence; The rotation adjustment module passes through the base module, and the threaded portion is connected to the first threaded hole of the base module; The first part is used to receive external force and rotate; The second part is connected to the chip fixing module; The base module is provided with a sliding portion, and the chip fixing module is slidably connected to the sliding portion; When the rotation adjustment module rotates, the second part drives the chip fixing module to slide on the sliding part; The chip fixing module is used to fix the chip.

2. The bare chip grinding fixture according to claim 1, characterized in that: The rotation adjustment module includes a micrometer differential head.

3. The bare chip grinding fixture according to claim 1, characterized in that: The base module includes an upper cover plate and a base, the first threaded hole is provided on the upper cover plate; the base is provided with a through hole; The rotation adjustment module passes through the first threaded hole of the upper cover plate and the through hole of the base in sequence to connect with the chip fixing module.

4. The bare chip grinding fixture according to claim 1, characterized in that: The chip fixing module is provided with a T-shaped slot; The second portion includes a cylindrical portion; The cylindrical portion is located in the T-shaped slot to drive the chip fixing module to move.

5. The bare chip grinding fixture according to claim 1, characterized in that: The base module is provided with a second threaded hole; the bare chip grinding fixture further comprises a screw; When the chip fixing module needs to be fixed on the sliding part, the screw passes through the second threaded hole to support the chip fixing module.

6. The bare chip grinding fixture according to claim 1, characterized in that: The chip fixing module comprises a first screw, a second screw, a sample holder and a fixing block; The sample holder is used for bonding with the chip; The fixing block is provided with a dovetail groove; The first screw is provided with a third threaded hole; the sample holder is provided with a second through hole; The first screw has a head that matches the dovetail groove, and the second screw is connected to the third threaded hole through the second through hole, so that the head of the first screw is pressed tightly against the dovetail groove.

7. The bare chip grinding fixture according to claim 1, characterized in that: The bare chip grinding fixture also includes a lower cover plate; When the chip is plane-ground, the ground surface of the chip protrudes from the lower cover plate and is parallel to the bottom surface of the lower cover plate.

8. The bare chip grinding fixture according to claim 1, characterized in that: The base module is provided with four pillars, and the bottom surfaces of the pillars are located in the same plane, so that the base module can be placed flat on the grinding table through the bottom surfaces of the pillars.

9. The bare chip grinding fixture according to claim 1, characterized in that: The rotation adjustment module is installed in the middle of the base module.

10. A bare chip grinding device, characterized in that: The bare chip grinding equipment comprises the bare chip grinding fixture according to any one of claims 1 to 9.

Images