Gene detection temperature control device

Abstract

The utility model belongs to the technical field of detection, and particularly relates to a gene detection temperature control device, which detects the temperature in a box body through a temperature detection module, displays the detected temperature in real time through a temperature display module, and controls the temperature of the box body according to the displayed temperature and the actually required temperature. The required temperature can be input by touching the liquid crystal display screen through the temperature display module, and the temperature adjusting module carries out heating or cooling according to the difference between the temperature display module and the liquid crystal display screen. In the temperature detection module, reference voltage generated by taking a reference voltage chip as a core is provided, current output by a temperature sensor is amplified through a first operational amplifier and converted into voltage, and errors caused by the fact that the current output by the temperature sensor is not enough for A / D conversion when the temperature change range is small are avoided. Therefore, the precision of temperature detection is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of detection, and specifically relates to a temperature control device for gene detection. Background Art

[0002] Genetic testing is a process of detecting and analyzing DNA or RNA sequences in the blood, other fluids or cells of the subject using technologies such as polymerase chain reaction (PCR), gene chips, and gene sequencing to obtain genetic information related to health, disease risk, and drug metabolism. Therefore, genetic testing is of great value in the diagnosis and prediction of diseases.

[0003] Genetic testing requires certain temperature conditions. In the prior art, during the genetic testing process, the temperature control device is not accurate enough in detecting temperature changes, which seriously affects the genetic testing results. Therefore, there is an urgent need for a genetic testing temperature control device to solve the above problems. Summary of the invention

[0004] In order to solve the technical problems existing in the above-mentioned background technology, the utility model provides a gene detection temperature control device, which is intended to help improve the temperature detection accuracy.

[0005] The specific steps of the utility model are as follows:

[0006] In order to realize the above technical solution, the utility model provides a gene detection temperature control device, including a box body, a temperature control system is arranged in the box body, and the temperature control system includes a temperature detection module, a central processing unit, a temperature adjustment module and a temperature display module;

[0007] The temperature detection module, the temperature adjustment module, the temperature display module are all connected to the central processing unit;

[0008] The temperature detection module includes a first power supply VCC1, the first power supply VCC1 is connected to the Vin pin of the reference voltage chip U2, and the GND pin of the reference voltage chip U2 is grounded; the Vout pin of the reference voltage chip U2 is connected to the first end of the fourth capacitor C4 and the first end of the sixth adjustable resistor R6, the output end of the temperature sensor T, the first end of the second resistor R2 and the negative electrode of the first operational amplifier U1; T of the temperature sensor is connected to the second power supply VCC2; the positive electrode of the first operational amplifier U1 is grounded through the fourth resistor R4.

[0009] The second end of the second resistor R2 is connected to the first end of the third adjustable resistor R3; the second end of the third adjustable resistor R3 is connected to the output end of the first operational amplifier U1 and the central processing unit.

[0010] Further, the temperature adjustment module includes: a seventh resistor R7, a first end of the seventh resistor R7 is connected to the central processing unit; a second end of the seventh resistor R7 is connected to the first end of the first capacitor C1, the negative electrode of the third operational amplifier U3 and the negative electrode of the fourth operational amplifier U4; the second end of the first capacitor C1 is grounded; the positive electrode of the third operational amplifier U3 is connected to the first end of the eighth resistor R8 and the first end of the ninth resistor R9; the output of the third operational amplifier U3 is connected to the gate of the first MOS tube Q1;

[0011] The second end of the eighth resistor R8 is grounded; the second end of the ninth resistor R9 is connected to the drain of the first MOS transistor Q1, the source of the second MOS transistor Q2 and one end of the semiconductor TEC piece U6; the source of the first MOS transistor Q1 is connected to the fifth power supply VCC5;

[0012] The positive electrode of the fourth operational amplifier U4 is connected to the first end of the eleventh resistor R12 and the first end of the second capacitor C2; the second end of the eleventh resistor R12 is connected to the fourth power supply VCC4; the second end of the second capacitor C2 is grounded; the output end of the fourth operational amplifier U4 is connected to the drain of the second MOS tube Q2; the drain of the second MOS tube is grounded;

[0013] The second end of the semiconductor TEC piece U6 is connected to the first end of the inductor L1 and the first end of the third capacitor C3; the second end of the third capacitor C3 is grounded; the second end of the inductor L1 is connected to the drain of the third MOS tube and the source of the fourth MOS tube;

[0014] The source of the third MOS tube Q3 is connected to the fifth power supply VCC5; the gate of the third MOS tube Q3 is connected to the PWR pin of the switch driver chip U5; the drain of the fourth MOS tube Q4 is grounded; the gate of the fourth MOS tube Q4 is connected to the AUX pin of the switch driver chip U5;

[0015] The Vcc pin of the switch driving chip U5 is connected to the third power supply VCC3; the INPUT pin of the switch driving chip U5 is connected to the central processing unit; the T1 pin of the switch driving chip U5 is grounded via the tenth resistor R10; the T2 pin of the switch driving chip U5 is grounded via the eleventh resistor R11; and the GND pin of the switch driving chip U5 is grounded.

[0016] Furthermore, the reference voltage chip U2 adopts a MC1403 reference voltage chip; and the first operational amplifier U1 adopts an OP07 operational amplifier.

[0017] Furthermore, the switch driver chip adopts a UC1715 switch driver chip.

[0018] Furthermore, the temperature control system also includes a communication module, and the communication module is connected to the central processing unit.

[0019] Furthermore, the communication module adopts a ZigBee wireless communication module.

[0020] Furthermore, the central processing unit includes a microcontroller and an on-chip SOC chip.

[0021] The beneficial effects of the utility model are:

[0022] The temperature detection module detects the temperature inside the box, and displays the detected temperature in real time through the temperature display module. According to the displayed temperature and the actual required temperature, the required temperature can be input by touching the LCD screen through the temperature display module, and the temperature adjustment module performs heating or cooling according to the difference between the two. Among them, in the temperature detection module, by providing a reference voltage generated by a reference voltage chip as the core, the current output by the temperature sensor is amplified and converted into a voltage through the first operational amplifier, avoiding the error caused by the current output by the temperature sensor being insufficient for A / D conversion when the temperature variation range is small, thereby improving the accuracy of temperature detection.

[0023] Advantages of additional aspects of the present invention will be partially given in the following description, and partially become apparent from the following description, or be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The drawings in the specification, which constitute a part of the present invention, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention.

[0025] Figure 1 The present invention is an electrical schematic diagram of an embodiment of a temperature control device for gene detection according to the present invention.

[0026] Figure 2 This is a circuit diagram of the temperature detection module of the present utility model.

[0027] Figure 3 This is a circuit diagram of the temperature adjustment module of the utility model. DETAILED DESCRIPTION

[0028] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0029] It should be noted that the following detailed descriptions are all illustrative and are intended to provide further explanation of the present invention. Unless otherwise specified, each technical and scientific term used in this embodiment has the same meaning as commonly understood by ordinary maintenance personnel in the technical field to which the present invention belongs.

[0030] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the utility model. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0031] In the present invention, terms such as "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", "side", "bottom" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. They are relational words determined only for the convenience of describing the structural relationships of the various parts or elements of the present invention, and do not specifically refer to any part or element in the present invention and cannot be understood as limitations on the present invention.

[0032] In the present utility model, terms such as "fixed connection", "connected", "connection", etc. should be understood in a broad sense, indicating that it can be fixedly connected, integrally connected or detachably connected; it can be directly connected or indirectly connected through an intermediate medium. For relevant scientific research or maintenance personnel in this field, the specific meanings of the above terms in the present utility model can be determined according to specific circumstances, and they cannot be understood as limitations on the present utility model.

[0033] Embodiment 1:

[0034] like Figure 1 and Figure 2 As shown, this embodiment provides a gene detection temperature control device, including a box body, in which a temperature control system is arranged, and the temperature control system includes a temperature detection module 4, a central processing unit 1, a temperature adjustment module 5 and a temperature display module 3.

[0035] The central processing unit 1 and the temperature detection module 4 are used to control the temperature detection module 4 to detect the temperature inside the box.

[0036] The central processor 1 and the temperature display module 3 are used to control the temperature display module 3 to display the temperature detected by the temperature detection module 4 and receive the temperature set by the temperature display module 3. The temperature display module 3 adopts a touchable liquid crystal display screen.

[0037] The central processor 1 is connected to the temperature regulating module 5 so as to control the temperature regulating module to regulate the temperature in the box based on the detected temperature and the set temperature so as to reach the set temperature.

[0038] The central processing unit 1 is connected to the communication module 2 to communicate with the external device through the communication module 2. The communication module 2 may be a wireless communication module.

[0039] The temperature detection module 4 includes a first power supply VCC1, the first power supply VCC1 is connected to the Vin pin of the reference voltage chip U2, and the GND pin of the reference voltage chip U2 is grounded; the Vout pin of the reference voltage chip U2 is connected to the first end of the fourth capacitor C4 and the first end of the sixth adjustable resistor R6, the output end of the temperature sensor T, the first end of the second resistor R2 and the negative electrode of the first operational amplifier U1; T of the temperature sensor is connected to the second power supply VCC2; the positive electrode of the first operational amplifier U1 is grounded through the fourth resistor R4.

[0040] The second end of the second resistor R2 is connected to the first end of the third adjustable resistor R3; the second end of the third adjustable resistor R3 is connected to the output end of the first operational amplifier U1 and the central processing unit. The reference voltage chip U2 adopts the MC1403 reference voltage chip; the first operational amplifier U1 adopts the OP07 operational amplifier.

[0041] When in use, the temperature detection module detects the temperature in the box, and displays the detected temperature in real time through the temperature display module. According to the displayed temperature and the actual required temperature, the required temperature can be input by touching the LCD screen through the temperature display module, and the temperature adjustment module performs heating or cooling according to the difference between the two. Among them, in the temperature detection module, by providing a reference voltage generated by the reference voltage chip U2 as the core, the current output by the temperature sensor is amplified and converted through the first operational amplifier, avoiding the error caused by the current output by the temperature sensor being insufficient for A / D conversion when the temperature variation range is small, thereby improving the accuracy of temperature detection.

[0042] Furthermore, if Figure 3 As shown, the central processor 1 generates a control voltage (for the sake of convenience, the generated control voltage is recorded as V0), the control voltage V0 is filtered by the filter circuit composed of the seventh resistor R7 and the first capacitor C1 and enters the negative electrode of the third operational amplifier U3, the output end of the third operational amplifier is connected to the gate of the first MOS tube Q1, the source of the first MOS tube Q1 is connected to the fifth power supply VCC5, and the drain of the first MOS tube Q1 is connected to the semiconductor TEC chip U6, therefore, the drain voltage of the first MOS tube Q1 is the input voltage of the semiconductor TEC chip U6; the input voltage of the semiconductor TEC chip U6 is input to the positive electrode of the third operational amplifier U3 after being divided by the ninth resistor R9 and the eighth resistor R8, thereby forming a closed-loop feedback.

[0043] The switch driving chip U5 receives the PWM signal sent by the central processor 1, the PWR pin of the switch driving chip U5 is connected to the gate of the third MOS tube, the AUX pin of the switch driving chip U5 is connected to the gate of the fourth MOS tube, the source of the third MOS tube Q3 is connected to the fifth power supply VCC5; the drain of the fourth MOS tube Q4 is grounded, the drain of the third MOS tube Q3 is connected to the source of the fourth MOS tube Q4 as the output end and is connected to the semiconductor TEC piece through the inductor L1; the semiconductor TEC piece is also grounded through the third capacitor C3.

[0044] When working, the central processing unit outputs a control voltage V0, which is filtered by the seventh resistor R7 and the first capacitor C1, and then input to the negative electrode of the third operational amplifier U3. The output of the third operational amplifier is connected to the first MOS tube Q1. The level of the output voltage of the third operational amplifier U3 determines the output of the drain voltage of the first MOS tube Q1, and is fed back to the positive electrode of the third operational amplifier after voltage division by the eighth resistor R8 and the ninth resistor R9. Thus, a closed-loop feedback is formed, and the feedback voltage at the positive input end of the third operational amplifier U3 is equal to the voltage at the negative input end of the third operational amplifier U3. At this time, the drain voltage of the first MOS tube Q1 remains stable, and the output control voltage of the central processing unit is changed to adjust the drain voltage of the first MOS tube Q1 to be stable, that is, the magnitude of the drain voltage of the first MOS tube Q1 is controlled by the output voltage of the central processing unit.

[0045] The central processing unit is connected to the switch driving chip U5. The central processing unit generates PWM to control the switch driving chip U5. The switch driving chip U5 drives the switches of the third MOS tube Q3 and the fourth MOS tube Q4 to generate output voltage. The first inductor L1 and the second capacitor C2 are energy storage elements. Changing the duty cycle of PWM can change the output voltage.

[0046] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0047] The above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. For maintenance personnel in this field, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A gene detection temperature control device, comprising a box, characterized in that: A temperature control system is provided in the box, and the temperature control system includes a temperature detection module, a central processing unit, a temperature adjustment module and a temperature display module; The temperature detection module, the temperature adjustment module, the temperature display module are all connected to the central processing unit; The temperature detection module includes a first power supply VCC1, the first power supply VCC1 is connected to the Vin pin of the reference voltage chip U2, and the GND pin of the reference voltage chip U2 is grounded; the Vout pin of the reference voltage chip U2 is connected to the first end of the fourth capacitor C4 and the first end of the sixth adjustable resistor R6, the output end of the temperature sensor T, the first end of the second resistor R2 and the negative electrode of the first operational amplifier U1; the T of the temperature sensor is connected to the second power supply VCC2; the positive electrode of the first operational amplifier U1 is grounded through the fourth resistor R4; The second end of the second resistor R2 is connected to the first end of the third adjustable resistor R3; the second end of the third adjustable resistor R3 is connected to the output end of the first operational amplifier U1 and the central processing unit.

2. The gene detection temperature control device according to claim 1, characterized in that: The temperature adjustment module includes: a seventh resistor R7, a first end of the seventh resistor R7 is connected to the central processing unit; a second end of the seventh resistor R7 is connected to the first end of the first capacitor C1, the negative electrode of the third operational amplifier U3 and the negative electrode of the fourth operational amplifier U4; the second end of the first capacitor C1 is grounded; the positive electrode of the third operational amplifier U3 is connected to the first end of the eighth resistor R8 and the first end of the ninth resistor R9; the output end of the third operational amplifier U3 is connected to the gate of the first MOS tube Q1; The second end of the eighth resistor R8 is grounded; the second end of the ninth resistor R9 is connected to the drain of the first MOS transistor Q1, the source of the second MOS transistor Q2 and one end of the semiconductor TEC piece U6; the source of the first MOS transistor Q1 is connected to the fifth power supply VCC5; The positive electrode of the fourth operational amplifier U4 is connected to the first end of the eleventh resistor R12 and the first end of the second capacitor C2; the second end of the eleventh resistor R12 is connected to the fourth power supply VCC4; the second end of the second capacitor C2 is grounded; the output end of the fourth operational amplifier U4 is connected to the drain of the second MOS tube Q2; the drain of the second MOS tube is grounded; The second end of the semiconductor TEC piece U6 is connected to the first end of the inductor L1 and the first end of the third capacitor C3; the second end of the third capacitor C3 is grounded; the second end of the inductor L1 is connected to the drain of the third MOS tube and the source of the fourth MOS tube; The source of the third MOS tube Q3 is connected to the fifth power supply VCC5; the gate of the third MOS tube Q3 is connected to the PWR pin of the switch driver chip U5; the drain of the fourth MOS tube Q4 is grounded; the gate of the fourth MOS tube Q4 is connected to the AUX pin of the switch driver chip U5; The Vcc pin of the switch driving chip U5 is connected to the third power supply VCC3; the INPUT pin of the switch driving chip U5 is connected to the central processing unit; the T1 pin of the switch driving chip U5 is grounded via the tenth resistor R10; the T2 pin of the switch driving chip U5 is grounded via the eleventh resistor R11; and the GND pin of the switch driving chip U5 is grounded.

3. The gene detection temperature control device according to claim 1, characterized in that: The reference voltage chip U2 adopts the MC1403 reference voltage chip; the first operational amplifier U1 adopts the OP07 operational amplifier.

4. The gene detection temperature control device according to claim 2, characterized in that: The switch driver chip adopts the UC1715 switch driver chip.

5. The gene detection temperature control device according to claim 1, characterized in that: The temperature control system also includes a communication module, which is connected to the central processing unit.

6. The gene detection temperature control device according to claim 5, characterized in that: The communication module adopts a ZigBee wireless communication module.

7. The gene detection temperature control device according to claim 1, characterized in that: The central processing unit includes a microcontroller and an on-chip SOC chip.

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