Tubular heating furnace in semiconductor heat treatment equipment

Abstract

The utility model discloses a tubular heating furnace in semiconductor heat treatment equipment, which comprises a lower furnace body, the top of the lower furnace body is rotatably connected with an upper furnace body, and the upper furnace body and the lower furnace body are internally provided with heating cavities; and the heating assembly comprises two ceramic chips, and the two ceramic chips are fixedly connected to the interior of the upper furnace body and the interior of the lower furnace body correspondingly. Firstly, the device is placed at a proper position, an object to be heated can be conveniently placed in the heating cavity through rotary connection between the upper furnace body and the lower furnace body, heating is achieved through heat generated by the heating wire, meanwhile, the overall convenience can be improved through the mother buckle, the son buckle and the handle, and when the whole device is placed, the device is convenient to use. And when uneven placement occurs, the adjusting bolt on the low-lying side of the whole device is rotated, so that the adjusting bolt slides up and down along the exterior of the threaded column, and the low-lying side is stably supported.

Description

Technical Field

[0001] The utility model relates to the technical field of heating furnaces, in particular to a tubular heating furnace in semiconductor heat treatment equipment. Background Art

[0002] Many products need to be heat treated in a heating furnace during production. For example, in semiconductor wafer manufacturing, photovoltaic cell coating, diffusion, oxidation, annealing of metal materials and other processes. As the core component of the reaction chamber of the heat treatment equipment, the tubular heating furnace provides a heat source for various processes of the silicon wafer in the process chamber. Many processes have strict requirements on the temperature of the silicon wafer surface in the reaction chamber, and it is necessary to ensure that the temperature of all silicon wafer surfaces in the reaction chamber is as uniform as possible. However, since the silicon wafer is placed on a carrier in the reaction chamber, the carrier may be made of graphite or quartz, and its thermal properties are quite different from those of the silicon wafer. In addition, since the carrier cannot be completely centered in the entire reaction chamber, and even the position of the silicon wafer in the reaction chamber is asymmetric, the heat provided by the tubular heating furnace cannot be completely and evenly transferred to each silicon wafer, resulting in the inability to maintain uniform surface temperature of the silicon wafer at different positions in the reaction chamber. In order to improve the uniformity of the surface temperature of the silicon wafer, there are many methods to improve the thermal field of the reaction chamber, such as adding high-intensity lamps or tubular heaters in the reaction chamber, increasing the thermal radiation and convection in the reaction chamber, to provide a compensating heat source. Alternatively, during the manufacturing process of the tubular heating furnace, the temperature of the silicon wafer surface inside the reaction chamber can be maintained uniform by changing the winding and layout of the furnace wire and changing the thermal field of the heating furnace itself.

[0003] A tubular heating furnace in a semiconductor heat treatment device with a publication number of CN219083781U includes a tubular heating furnace body, which includes several groups of heating modules and a furnace body shell. The heating modules are composed of an insulation layer and several groups of heating wires, and the heating wire groups include an upper group of heating wires, a lower group of heating wires, a left group of heating wires and a right group of heating wires. The utility model divides a tubular heating furnace body into several heating modules, each of which can be freely customized in length according to the length of the heating zone, and each temperature zone can independently control the temperature, thereby ensuring the uniformity of the overall temperature of the product in the furnace, and each partition can control its power through a thermocouple, so that the product in the furnace is in a uniform thermal field, thereby uniformly controlling the surface temperature of the silicon wafer, and the heating wire group is uniformly embedded in the heating module, which reduces the difficulty of production and manufacturing and facilitates mass production. Each heating module can be installed and replaced separately, which is easy to maintain. However, the tubular heating furnace in the above-mentioned semiconductor heat treatment equipment is not convenient to place the heated object inside for heating when in use, and it is also not convenient to take and place the entire device. At the same time, when placing it for heating, the object to be heated needs to be penetrated from one end to the middle for heating, which is not convenient when taking it out, and it is not convenient to quickly level the entire device for heating. Therefore, it is necessary to provide a new tubular heating furnace in semiconductor heat treatment equipment to solve the above-mentioned technical problems. Utility Model Content

[0004] The utility model aims to provide a tubular heating furnace in semiconductor heat treatment equipment, which has the advantages of convenient prevention and rapid leveling, and solves the problems in the background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a tubular heating furnace in a semiconductor heat treatment equipment, comprising: a lower furnace body, the top of the lower furnace body is rotatably connected to the upper furnace body, and the upper furnace body and the lower furnace body are both provided with a heating chamber; a heating component, the heating component comprises two ceramic plates, the two ceramic plates are respectively fixedly connected to the interior of the upper furnace body and the lower furnace body, and the two ceramic plates are both fixedly connected to the interior of the heating chamber. First, the device is placed in a suitable position, and the rotation connection between the upper furnace body and the lower furnace body can facilitate the placement of the object to be heated in the interior of the heating chamber, and the heating is achieved by generating heat through the heating wire. At the same time, the overall convenience can be improved through the mother buckle, the child buckle and the handle. When the overall device is placed, if it is not placed flat, the adjusting bolt on the low-lying side of the overall device is rotated, so that the adjusting bolt slides up and down along the outside of the threaded column to achieve stable support for the low-lying side.

[0006] Preferably, the heating assembly also includes a heating wire, which is evenly and fixedly connected to the inside of the two ceramic sheets, and the outside of the two ceramic sheets is provided with heat conduction holes. The working principle of the heating wire is based on the Joule effect, that is, when current passes through the conductor, the conductor will generate heat, and this heat can be used to heat the air, water or other media.

[0007] Preferably, the outer part of the upper furnace body is fixedly connected with a sub-buckle and a control panel, and the outer part of the lower furnace body is fixedly connected with a mother buckle, and the sub-buckle and the mother buckle are used to limit the upper furnace body and the lower furnace body, so as to realize quick access to the entire device.

[0008] Preferably, two mounting seats are fixedly connected to the top of the upper furnace body, and a handle is rotatably connected to the top of the two mounting seats together. The handle can facilitate the extraction of the entire device and improve portability.

[0009] Preferably, lithium batteries are fixedly connected to the interior of the lower furnace body and the upper furnace body, and a charging interface is provided on the exterior of the lower furnace body. The lithium battery can provide electrical energy to the heating wire during operation, thereby avoiding outdoor operation when it is inconvenient to connect the power cord.

[0010] Preferably, four threaded columns are fixedly connected to the bottom of the lower furnace body, and the outsides of the four threaded columns are rotatably connected with adjusting bolts. The adjusting bolts can slide up and down along the outsides of the threaded columns by rotating to provide stable support for the low-lying side of the overall device.

[0011] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0012] 1. The utility model first places the device in a suitable position. Through the rotation connection between the upper furnace body and the lower furnace body, the object to be heated can be conveniently placed inside the heating chamber, and the heating wire generates heat to achieve heating. At the same time, the mother buckle, the child buckle and the handle can improve the overall convenience.

[0013] 2. According to the utility model, when the overall device is placed unevenly, the adjusting bolt on the low-lying side of the overall device is rotated so that the adjusting bolt slides up and down along the outside of the threaded column to achieve stable support for the low-lying side. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the internal structure of a tubular heating furnace in a semiconductor heat treatment device of the utility model;

[0015] Figure 2 This is a schematic diagram of the external structure of a tubular heating furnace in a semiconductor heat treatment device of the utility model;

[0016] Figure 3It is a schematic diagram of the internal structure of a ceramic sheet of a tubular heating furnace in a semiconductor heat treatment device of the utility model;

[0017] Figure 4 The utility model is a schematic diagram of the cross-sectional structure of a tubular heating furnace in a semiconductor heat treatment device.

[0018] In the figure: 1. Lower furnace body; 2. Upper furnace body; 3. Ceramic sheet; 4. Heat conduction hole; 5. Mounting seat; 6. Handle; 7. Mother buckle; 8. Child buckle; 9. Control panel; 10. Threaded column; 11. Adjusting bolt; 12. Heating wire; 13. Lithium battery. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] See also Figures 1 to 4 The utility model provides a technical solution: a tubular heating furnace in a semiconductor heat treatment equipment, comprising: a lower furnace body 1, the top of the lower furnace body 1 is rotatably connected to an upper furnace body 2, and a heating chamber is opened in the upper furnace body 2 and the lower furnace body 1; a heating component, the heating component comprises two ceramic sheets 3, the two ceramic sheets 3 are respectively fixedly connected to the interior of the upper furnace body 2 and the lower furnace body 1, and the two ceramic sheets 3 are fixedly connected to the interior of the heating chamber. First, the device is placed in a suitable position, and the rotation connection between the upper furnace body 2 and the lower furnace body 1 can facilitate the placement of the object to be heated in the interior of the heating chamber, and the heating is achieved by generating heat through the heating wire 12. At the same time, the overall convenience can be improved through the mother buckle 7, the child buckle 8 and the handle 6. When the overall device is placed, if it is not placed flat, the adjusting bolt 11 on the low-lying side of the overall device is rotated, so that the adjusting bolt 11 slides up and down along the outside of the threaded column 10, so as to achieve a stable support for the low-lying side.

[0021] The heating assembly also includes a heating wire 12, which is evenly and fixedly connected to the inside of the two ceramic sheets 3. The outside of the two ceramic sheets 3 is provided with heat conducting holes 4. The working principle of the heating wire 12 is based on the Joule effect, that is, when current passes through the conductor, the conductor will generate heat, and this heat can be used to heat the air, water or other media.

[0022] The upper furnace body 2 is fixedly connected to the outside with a sub-clip 8 and a control panel 9, and the lower furnace body 1 is fixedly connected to the outside with a mother clip 7. The sub-clip 8 and the mother clip 7 are used to limit the position between the upper furnace body 2 and the lower furnace body 1, so that the entire device can be quickly taken away.

[0023] Two mounting seats 5 are fixedly connected to the top of the upper furnace body 2, and handles 6 are rotatably connected to the tops of the two mounting seats 5. The handles 6 can facilitate the extraction of the entire device and improve portability.

[0024] The lower furnace body 1 and the upper furnace body 2 are both fixedly connected with lithium batteries 13, and the outer side of the lower furnace body 1 is provided with a charging interface. The lithium battery 13 can provide power to the heating wire 12 during operation, avoiding outdoor operation when it is inconvenient to connect the power line.

[0025] When the tubular heating furnace in the semiconductor heat treatment equipment is used, the device is first placed in a suitable position. Through the rotational connection between the upper furnace body 2 and the lower furnace body 1, the object to be heated can be conveniently placed inside the heating chamber, and the heating wire 12 generates heat to achieve heating. At the same time, the mother buckle 7, the child buckle 8 and the handle 6 can improve the overall convenience.

[0026] See also Figures 1 to 4 The utility model provides a technical solution: a tubular heating furnace in a semiconductor heat treatment device, wherein four threaded columns 10 are fixedly connected to the bottom of a lower furnace body 1, and the outsides of the four threaded columns 10 are rotatably connected to adjusting bolts 11. The adjusting bolts 11 can be rotated and slid up and down along the outside of the threaded columns 10 to stably support the low-lying side of the overall device.

[0027] When the tubular heating furnace in the semiconductor heat treatment equipment is in use, when the entire device is placed and it is not placed flat, the adjusting bolt 11 on the low-lying side of the entire device is rotated so that the adjusting bolt 11 slides up and down along the outside of the threaded column 10 to achieve stable support for the low-lying side.

[0028] The standard parts used in this embodiment can be purchased directly from the market, and the non-standard structural components recorded in the specification and the drawings can also be directly processed according to the existing technical common sense. At the same time, the connection method of each component adopts the mature conventional means in the prior art, and the machinery, parts and equipment all adopt the conventional models in the prior art, so no specific description will be given here.

[0029] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A tubular heating furnace in a semiconductor heat treatment device, characterized in that: include: A lower furnace body (1), the top of which is rotatably connected to an upper furnace body (2), and a heating chamber is provided inside the upper furnace body (2) and the lower furnace body (1); A heating component, the heating component comprising two ceramic sheets (3), the two ceramic sheets (3) being fixedly connected to the interior of an upper furnace body (2) and a lower furnace body (1) respectively.

2. The tubular heating furnace in the semiconductor heat treatment equipment according to claim 1, characterized in that: The heating assembly further comprises a heating wire (12), wherein the heating wire (12) is evenly and fixedly connected to the inside of two ceramic sheets (3), and the outside of the two ceramic sheets (3) is provided with a heat conduction hole (4).

3. The tubular heating furnace in the semiconductor heat treatment equipment according to claim 1, characterized in that: The exterior of the upper furnace body (2) is fixedly connected with a sub-clip (8) and a control panel (9), and the exterior of the lower furnace body (1) is fixedly connected with a female clip (7).

4. The tubular heating furnace in the semiconductor heat treatment equipment according to claim 1, characterized in that: Two mounting seats (5) are fixedly connected to the top of the upper furnace body (2), and a handle (6) is rotatably connected to the tops of the two mounting seats (5).

5. The tubular heating furnace in the semiconductor heat treatment equipment according to claim 1, characterized in that: The interior of the lower furnace body (1) and the upper furnace body (2) are both fixedly connected with lithium batteries (13), and the exterior of the lower furnace body (1) is provided with a charging interface.

6. The tubular heating furnace in the semiconductor heat treatment equipment according to claim 1, characterized in that: Four threaded columns (10) are fixedly connected to the bottom of the lower furnace body (1), and the outsides of the four threaded columns (10) are rotatably connected to adjusting bolts (11).

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