Test device of memory device
By setting up the design of thermal insulation board and extended slots in the memory device test equipment, the problem of short service life of the test motherboard is solved, the service life of the test module is extended, and damage caused by temperature changes is avoided.
Patent Information
- Application Number
- CN202421606761.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-08
- Publication Date
- 2025-04-15
- Estimated Expiration
- 2034-07-08
AI Technical Summary
The service life of the memory device test motherboard is relatively short, mainly because the central processing unit (CPU) is greatly affected by temperature.
A test device for storage devices is designed. By setting a heat insulation board between the thermostat and the test module, and extending the slot of the memory device to be tested through the heat insulation board to the inside of the thermostat, the test module is not affected by the temperature inside the thermostat.
Extend the service life of the test module and avoid damage to the test motherboard and deficit due to temperature changes.
Smart Images
Figure CN222762664U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of storage devices, and in particular to a testing device for storage devices. Background Art
[0002] The memory device is usually tested by placing the memory device on a test motherboard inside a temperature chamber. Since the central processing unit (CPU) on the test motherboard is greatly affected by temperature, the service life of the test motherboard is short. Utility Model Content
[0003] In view of this, the present application provides a test device for a storage device, aiming to solve the problem of how to extend the service life of a test motherboard.
[0004] An embodiment of the present application provides a test device for a storage device, the test device comprising a control panel, an incubator, a test module, a power module and a control circuit. The power module is electrically connected to the control panel, the incubator, the test module and the control circuit, and the control panel, the incubator and the test module are electrically connected to the control circuit respectively. A heat insulation board is provided between the incubator and the test module. The test module provides a slot for the storage device to be tested. The slot passes through the heat insulation board and extends to the interior of the incubator. When the storage device to be tested is inserted into the slot, the test module is electrically connected to the storage device to be tested. The control panel adjusts the temperature inside the incubator through the control circuit, controls the test module to execute the test program, and controls the power supply module to supply power.
[0005] In this embodiment, the heat insulation board is used to isolate the incubator and the test module, and to prevent the test module from being affected by the temperature inside the incubator. The slot provided by the test module passes through the heat insulation board and extends to the inside of the incubator, so that the memory device to be tested can be placed inside the incubator. Only the slot provided by the test module is located inside the incubator, and the test module is not placed inside the incubator, so that the test module is not affected by the temperature inside the incubator, thereby extending the service life of the test module.
[0006] In one embodiment, the test module includes a test mainboard and an adapter board. The test mainboard includes a CPU and a mainboard slot, and the adapter board includes a mainboard interface and an adapter slot. The mainboard interface is used to insert into the mainboard slot, and the adapter slot is a slot for the memory device to be tested. The adapter slot passes through the heat insulation board and extends to the inside of the incubator. The adapter board is used to raise the distance between the test mainboard and the memory device to be tested to form a heat dissipation space. When the memory device to be tested is inserted into the adapter slot, the CPU is electrically connected to the memory device to be tested, and the CPU is used to read and write data from the memory device to be tested, and execute the test program.
[0007] In another embodiment, the test motherboard reserves an additional area of a certain size in the location area of the motherboard slot so that the test motherboard can adapt to other motherboard slots with a size different from that of the motherboard slot. The other motherboard slots are used to adapt to corresponding adapter boards and storage devices to be tested.
[0008] In another embodiment, the test device further includes an indicator light module. The indicator light module includes an indicator light circuit, and the indicator light circuit includes one or more indicator lights. The indicator light circuit is electrically connected to the control circuit and the power module, and the control circuit is electrically connected to the test module. The control circuit is used to control the indicator light circuit to light up the corresponding indicator light according to the test result from the test module.
[0009] In another embodiment, the indicator light module further includes a light guide column. The position of the light guide column corresponds to the position of the indicator light, and the light guide column is used to guide the light emitted by the indicator light.
[0010] In another embodiment, the test device further comprises a heat dissipation module which is electrically connected to the power module and is used to dissipate heat from the CPU on the test mainboard.
[0011] In another embodiment, the heat dissipation module includes a liquid cooling head, a liquid cooling medium pipe and a radiator. The liquid cooling head is arranged on the surface of the CPU. The liquid cooling medium pipe connects the liquid cooling head and the radiator, and the liquid cooling medium pipe is sealed with a liquid cooling medium, and the liquid cooling medium flows inside the liquid cooling medium pipe to take away the heat generated by the CPU from the liquid cooling head. The radiator includes a cold row and a fan, and the heat generated by the CPU is brought to the cold row through the liquid cooling medium pipe, and then discharged to the outside of the test equipment by the fan.
[0012] In another embodiment, the control panel includes a display screen, a button and an indicator light, and the display screen, the button and the indicator light are electrically connected to the control circuit respectively. The display screen is used to display the test information of the memory device to be tested, and the test information includes the test time, test conditions, test progress and test results of the memory device to be tested. The buttons include a switch button, a test button and a temperature adjustment button. The switch button is used to trigger the power module to start or stop powering. The test button is used to trigger the test module to start executing the test program or stop executing the test program. The temperature adjustment button is used to trigger the incubator to adjust the internal temperature. The indicator light is used to indicate the working status of the test equipment.
[0013] In another embodiment, the control panel further includes a hidden button, and the hidden button is used to trigger the display screen to switch to a corresponding display channel.
[0014] In another embodiment, the test device further includes a network interface, a bus interface and a power interface. The network interface and the bus interface are electrically connected to the test module respectively, and the power interface is electrically connected to the power module. The network interface is used to connect the test module to the network to download or update the test program from the network. The bus interface is used to connect the test module to an external device to communicate and interact with the external device. The power interface is used to connect the power module to a power grid or an energy storage device to supply power to the power module. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a structural schematic diagram of a testing device provided in one embodiment of the present application.
[0016] Figure 2 yes Figure 1 Front view of the test equipment shown.
[0017] Figure 3 yes Figure 1 A cross-sectional view of the test apparatus is shown.
[0018] Figure 4 yes Figure 1 Left side view of the test equipment shown.
[0019] Figure 5 yes Figure 1 A top view of the test equipment is shown.
[0020] Figure 6 yes Figure 1 Right side view of the test equipment shown.
[0021] Main component symbols
[0022] Test equipment 10; control panel 100; temperature box 200; heat dissipation module 300; test module 400;
[0023] Power module 500; upper cover 210; handle 211; rotating arm 220; heat shield 700;
[0024] Test mainboard 410; adapter board 420; mainboard slot 411; mainboard interface 421; adapter slot 422;
[0025] Indicator light circuit 610; light guide column 620; control circuit 800; liquid cooling medium tube 310;
[0026] Radiator 320; display screen 110; button 120; indicator light 130; hidden button 140;
[0027] Network interface 910 ; bus interface 920 ; power interface 930 . DETAILED DESCRIPTION
[0028] It should be noted that in the embodiments of the present application, "plurality" refers to two or more than two. The terms "first", "second", "third", etc. in the specification, claims and drawings of the present application are used to distinguish similar objects, rather than to describe a specific order or sequence.
[0029] In the description of the embodiments of the present application, the terms "up", "left", "right", "horizontal", "top", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the embodiments of the present application.
[0030] Unless otherwise clearly specified and limited, the terms "connection", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.
[0031] In the embodiment of the present application, the storage device includes a dual in-line memory module (DIMM) and a solid state drive (SSD). Among them, DIMM includes, but is not limited to, registered DIMM (RDIMM), small outline DIMM (SODIMM) and unbuffered DIMM (UDIMM).
[0032] Figure 1 It is a structural schematic diagram of a testing device provided in one embodiment of the present application.
[0033] like Figure 1 As shown, the test device 10 includes a control panel 100, a temperature box 200, a heat dissipation module 300, a test module 400, a power module 500 and a control circuit (not shown). The temperature box 200 and the test module 400 are arranged between the control panel 100 and the heat dissipation module 300, the temperature box 200 is arranged above the test module 400, and the heat dissipation module 300 and the test module 400 are arranged above the power module 500 and the control circuit.
[0034] The control panel 100 is electrically connected to the control circuit, and the control panel 100 is used to respond to user operations to enable the control circuit to generate control instructions, wherein the control instructions are used to instruct the incubator 200, the test module 400 or the power module 500 to perform corresponding operations.
[0035] Exemplarily, the control instructions include a power-on instruction, a power-off instruction, a start test instruction, a stop test instruction, and a temperature adjustment instruction. Among them, the power-on instruction is used to instruct the power module 500 to start supplying power. The power-off instruction is used to instruct the power module 500 to stop supplying power. The start test instruction is used to instruct the test module 400 to start executing the test program. The stop test instruction is used to instruct the test module 400 to stop executing the test program. The temperature adjustment instruction is used to instruct the incubator 200 to adjust the internal temperature.
[0036] It can be understood that the test program is used to test the memory device to be tested. Testing the memory device to be tested may include aging test and functional test, and the embodiment of the present application does not limit the test method.
[0037] The incubator 200 is electrically connected to the control circuit, and the incubator 200 is used to receive temperature adjustment instructions from the control circuit, and adjust the temperature inside the incubator 200 according to the temperature adjustment instructions. The incubator 200 includes an upper cover 210, and the upper cover 210 is provided with a handle 211. The upper cover 210 is connected to the heat dissipation module 300 through a rotating arm 220. Among them, the rotating arm 220 includes a movable end and a fixed end, the movable end of the rotating arm 220 is connected to the upper cover 210, and the fixed end of the rotating arm 220 is connected to the heat dissipation module 300. When the handle 211 is subjected to force, the movable end of the rotating arm 200 is driven to rotate around the fixed end of the rotating arm 220, so that the upper cover 210 is opened, thereby the storage device to be tested can be placed inside the incubator 200.
[0038] The heat dissipation module 300 is used to dissipate heat from the testing module 400 .
[0039] The test module 400 is electrically connected to the control circuit, and is used to receive a start test instruction or a stop test instruction from the control circuit, and to start executing a test program according to the start test instruction, or to stop executing a test program according to the stop test instruction. The test module 400 provides a slot (not shown) for the memory device to be tested, and the slot extends into the interior of the incubator 200. When the memory device to be tested is inserted into the slot, the test module 400 is electrically connected to the memory device to be tested.
[0040] The power module 500 is electrically connected to the control panel 100, the temperature box 200, the heat dissipation module 300, the test module 400 and the control circuit. The power module 500 is used to receive a power-on command or a power-off command from the control circuit, and start supplying power to each component according to the power-on command, or stop supplying power to each component according to the power-off command.
[0041] In this embodiment, only the slot provided by the test module 400 is located inside the incubator 200, and the test module 400 is not set inside the incubator 200, so that the test module 400 is not affected by the internal temperature of the incubator 200, thereby extending the service life of the test module 400.
[0042] Figure 2 yes Figure 1 Front view of the test equipment shown.
[0043] like Figure 2 As shown, a heat insulation board 700 is provided between the incubator 200 and the test module 400. The heat insulation board 700 is used to isolate the incubator 200 and the test module 400, and to prevent the test module 400 from being affected by the temperature inside the incubator 200. The slot provided by the test module 400 passes through the heat insulation board 700 and extends to the inside of the incubator 200, so that the memory device to be tested can be placed inside the incubator 200.
[0044] Figure 3 yes Figure 1 A cross-sectional view of the test apparatus is shown.
[0045] like Figure 3 As shown, the test module 400 includes a test mainboard 410 and an adapter board 420. The test mainboard 410 includes a CPU (not shown) and a mainboard slot 411. The adapter board 420 includes a mainboard interface 421 and an adapter slot 422. The mainboard interface 421 is used to insert into the mainboard slot 411, and the adapter slot 422 is a slot for the memory device to be tested. The adapter slot 422 passes through the heat insulation board 700 and extends to the inside of the incubator 200.
[0046] The adapter plate 420 is used to raise the distance between the test mainboard 410 and the memory device to be tested, forming a heat dissipation space, so that the surface of the test mainboard 410 can flow through the heat dissipation airflow, thereby cooling the test mainboard 410. In addition, using the adapter slot 422 of the adapter plate 420 as the slot of the memory device to be tested can reduce the number of times the mainboard slot 411 is plugged in and out, thereby reducing the plug-in wear of the mainboard slot 411, thereby extending the service life of the mainboard slot 411.
[0047] When the memory device to be tested is inserted into the adapter slot 422, the CPU is electrically connected to the memory device to be tested, and the CPU is used to read and write data from the memory device to be tested, and to start executing the test program in response to a start test instruction, or to stop executing the test program in response to a stop test instruction.
[0048] In this embodiment, the test mainboard 410 reserves an additional area of a certain size in the area where the mainboard slot 411 is located, so as to facilitate the replacement of mainboard slots 411 of different sizes and the corresponding adapter boards 420, so that the test mainboard 410 can adapt to more types of storage devices to be tested. Therefore, when replacing different types of storage devices to be tested, it is only necessary to replace the mainboard slot 411 and the corresponding adapter board 420 of the test mainboard 410 without replacing the entire test mainboard 410, thereby reducing the testing cost.
[0049] The test device 10 also includes an indicator light module. The indicator light module includes an indicator light circuit 610 and a light guide column 620. The indicator light circuit 610 includes one or more indicator lights. The indicator light circuit 610 is electrically connected to the control circuit 800 and the power module 500. The indicator light circuit 610 is used to receive a lighting instruction from the control circuit 800 and light up the corresponding indicator light according to the lighting instruction.
[0050] In this embodiment, the control circuit 800 is electrically connected to the test mainboard 410 , and the control circuit 800 is used to receive the test result from the test mainboard 410 , and generate a corresponding light-on instruction according to the test result.
[0051] The light guide column 620 is disposed between the control panel 100 and the temperature box 200 and passes through the heat insulation board 700. The position of the light guide column 620 corresponds to the position of the indicator light, and the light guide column 620 is used to guide the light emitted by the indicator light so that the light emitted by the indicator light is easy to observe. The cross section of the light guide column 620 in the horizontal direction can cover the light emitted by one or more indicator lights.
[0052] Exemplarily, the indicator light circuit 610 includes a first indicator light and a second indicator light. The first indicator light is used to indicate that the test result is a test success, and the second indicator light is used to indicate that the test result is a test failure. The first indicator light and the second indicator light have different luminous colors, for example, the first indicator light emits green light, and the second indicator light emits red light.
[0053] In this embodiment, the heat dissipation module 300 includes a liquid cooling head (not shown), a liquid cooling fluid pipe 310 and a radiator 320. The liquid cooling head is arranged on the surface of the CPU on the test motherboard 410. The liquid cooling fluid pipe 310 connects the liquid cooling head and the radiator 320. The liquid cooling fluid pipe 310 is sealed with a liquid cooling medium. The liquid cooling medium flows inside the liquid cooling fluid pipe 310 and takes away the heat generated by the CPU from the liquid cooling head. The radiator 320 includes a cold row (not shown) and a fan (not shown). The heat generated by the CPU is brought to the cold row through the liquid cooling fluid pipe 310, and then discharged to the outside of the test device 10 by the fan.
[0054] Figure 4 yes Figure 1 Left side view of the test equipment shown.
[0055] like Figure 4 As shown, the control panel 100 includes a display screen 110, a button 120 and an indicator light 130. The display screen 110, the button 120 and the indicator light 130 are electrically connected to the control circuit respectively. Among them, the display screen 110 is used to display the test information of the memory device to be tested. The test information may include the test time, test conditions, test progress and test results of the memory device to be tested.
[0056] The button 120 is used to trigger the corresponding function. Exemplarily, the button 120 includes a switch button, a test button, and a temperature adjustment button. Among them, the switch button is used to trigger the control circuit to generate a power-on command so that the power module 500 starts to supply power, or trigger the control circuit to generate a shutdown command so that the power module 500 stops supplying power. The test button is used to trigger the control circuit to generate a start test command so that the test module 400 starts to execute the test program, or trigger the control circuit to generate a stop test command so that the test module 400 stops executing the test program. The temperature adjustment button is used to trigger the control circuit to generate a temperature adjustment command so that the incubator 200 adjusts the internal temperature.
[0057] The indicator light 130 is used to indicate the working state of the test device 10. Exemplarily, when the test device 10 is in the test state, the indicator light 130 is illuminated. When the test device 10 is in the non-test state, the indicator light 130 is not illuminated.
[0058] It can be understood that the control panel 100 may further include more indicator lights, and different indicator lights respectively indicate the working status of different components in the testing device 10 .
[0059] Figure 5 yes Figure 1 A top view of the test equipment is shown.
[0060] like Figure 5As shown, a hidden button 140 is provided on the top of the control panel 100. The hidden button 140 is used to trigger the display screen 110 to switch to the corresponding display channel. Different hidden buttons 140 correspond to different display channels of the display screen 110. Exemplarily, the display screen 110 includes a first display channel, a second display channel and a third display channel. The first display channel is used to display the test information of the memory device to be tested. The second display channel is used to display the status information of the test mainboard 410. The third display channel is used to display the status information of the power module 500. Among them, the status information of the component may include the voltage, current, power, temperature and fault information of the component.
[0061] In this embodiment, since the display channel of the display screen 110 usually remains unchanged, the hidden button 110 is designed to be embedded to prevent it from being triggered by mistake.
[0062] Figure 6 yes Figure 1 Right side view of the test equipment shown.
[0063] like Figure 6 As shown, the backplane of the test device 10 includes a network interface 910, a bus interface 920 and a power interface 930. The network interface 910 and the bus interface 920 are electrically connected to the test mainboard 410, respectively, and the power interface 930 is electrically connected to the power module 500. Among them, the network interface 910 is used to connect the CPU on the test mainboard 410 to the network to download or update the test program from the network. The bus interface 920 is used to connect the CPU on the test mainboard 410 to an external device to communicate and interact with the external device. The power interface 930 is used to connect the power module 500 to a power grid or an energy storage device, so as to supply power to the power module 500.
[0064] It can be understood that this embodiment does not limit the interface types of the network interface 910, the bus interface 920, and the power interface 930. Exemplarily, the network interface 910 is a Registered Jack 45 (RJ45) interface, the bus interface 920 is a Universal Serial Bus (USB) interface, and the power interface 930 is a Direct Current (DC) power interface.
[0065] The embodiments of the present application are described in detail above in conjunction with the accompanying drawings, but the present application is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present application.
Claims
1. A test device for a storage device, characterized in that: The test equipment comprises a control panel, a temperature box, a test module, a power module and a control circuit; the power module is electrically connected to the control panel, the temperature box, the test module and the control circuit, and the control panel, the temperature box and the test module are electrically connected to the control circuit respectively; Wherein, a heat insulation board is arranged between the temperature box and the test module; the test module provides a slot for the memory device to be tested; the slot passes through the heat insulation board and extends to the inside of the temperature box; when the memory device to be tested is inserted into the slot, the test module is electrically connected to the memory device to be tested; The control panel is used to adjust the temperature inside the incubator through the control circuit, control the test module to execute a test program, and control the power supply module to supply power.
2. The memory device test apparatus according to claim 1, wherein: The test module includes a test mainboard and an adapter board; the test mainboard includes a CPU and a mainboard slot, and the adapter board includes a mainboard interface and an adapter slot; the mainboard interface is used to insert into the mainboard slot, and the adapter slot is a slot of the memory device to be tested; the adapter slot passes through the heat insulation board and extends to the interior of the incubator; The adapter plate is used to increase the distance between the test mainboard and the memory device to be tested to form a heat dissipation space; When the memory device to be tested is inserted into the adapter slot, the CPU is electrically connected to the memory device to be tested, and the CPU is used to read and write data from the memory device to be tested, and execute the test program.
3. The memory device test apparatus according to claim 2, wherein: The test mainboard reserves an additional area of a certain size in the location area of the mainboard slot, so that the test mainboard can adapt to other mainboard slots with different sizes from the mainboard slot. The other mainboard slots are used to adapt to corresponding adapter boards and storage devices to be tested.
4. The memory device test device according to any one of claims 1 to 3, characterized in that: The test device further comprises an indicator light module; the indicator light module comprises an indicator light circuit, and the indicator light circuit comprises one or more indicator lights; The indicator light circuit is electrically connected to the control circuit and the power module, the control circuit is electrically connected to the test module, and the control circuit is used to control the indicator light circuit to light up the corresponding indicator light according to the test result from the test module.
5. The memory device test apparatus according to claim 4, characterized in that: The indicator light module further includes a light guide column; the position of the light guide column corresponds to the position of the indicator light, and the light guide column is used to guide the light emitted by the indicator light.
6. The memory device test device according to claim 2 or 3, characterized in that: The test device also includes a heat dissipation module; the heat dissipation module is electrically connected to the power module, and the heat dissipation module is used to dissipate heat from the CPU on the test mainboard.
7. The memory device test apparatus according to claim 6, wherein: The heat dissipation module includes a liquid cooling head, a liquid cooling medium tube and a radiator; the liquid cooling head is arranged on the surface of the CPU; the liquid cooling medium tube connects the liquid cooling head and the radiator, the liquid cooling medium tube is sealed with a liquid cooling medium, and the liquid cooling medium flows inside the liquid cooling medium tube to take away the heat generated by the CPU from the liquid cooling head; The radiator includes a cold row and a fan. The heat generated by the CPU is brought to the cold row through the liquid cooling medium pipe and then discharged to the outside of the test equipment by the fan.
8. The memory device testing device according to any one of claims 1 to 3, characterized in that: The control panel includes a display screen, buttons and indicator lights, and the display screen, buttons and indicator lights are electrically connected to the control circuit respectively; The display screen is used to display test information of the memory device to be tested, wherein the test information includes test time, test conditions, test progress and test results of the memory device to be tested; The buttons include a switch button, a test button and a temperature adjustment button; the switch button is used to trigger the power module to start or stop supplying power; the test button is used to trigger the test module to start or stop executing the test program; the temperature adjustment button is used to trigger the incubator to adjust the internal temperature; The indicator light is used to indicate the working status of the testing device.
9. The memory device test apparatus according to claim 8, wherein: The control panel also includes a hidden button, and the hidden button is used to trigger the display screen to switch to a corresponding display channel.
10. The memory device testing device according to any one of claims 1 to 3, characterized in that: The test device further comprises a network interface, a bus interface and a power interface; the network interface and the bus interface are electrically connected to the test module respectively, and the power interface is electrically connected to the power module; The network interface is used to connect the test module to a network so as to download or update the test program from the network; The bus interface is used to connect the test module to an external device so as to communicate and interact with the external device; The power interface is used to connect the power module to a power grid or an energy storage device, thereby supplying power to the power module.