Capacitor

Abstract

The utility model discloses a capacitor, which comprises a packaging shell, a capacitor core, a sealant, a heat dissipation plate and an extraction electrode, the capacitor core is arranged in the packaging shell; the sealant is encapsulated in the packaging shell so as to fix the capacitor core; the heat dissipation plate is installed on the packaging shell in an embedded mode. The lead-out electrode is connected with the capacitor core and led out of the packaging shell, the lead-out electrode comprises a welding spot area connected with the capacitor core, and the distance between the welding spot area and the heat dissipation plate is larger than the distance between a non-welding spot area of the lead-out electrode and the heat dissipation plate. Namely, the welding spot area and the non-welding spot area are connected in a bending manner and are positioned in different planes. According to the utility model, the heat dissipation performance of the capacitor can be improved, so that the current resistance of the capacitor is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of capacitors. Background Art

[0002] With the rapid development of power electronics technology, metallized film capacitors have been widely used in the field of new energy vehicles. However, with the continuous improvement of power density requirements in the field of new energy vehicles, the current resistance requirements of film capacitors are increasing. Moreover, in hybrid vehicles, the ambient temperature of film capacitors in the controller is more stringent, which puts higher requirements on the heat dissipation structure of film capacitors. The traditional film capacitor structure is gradually unable to meet the requirements.

[0003] In the related art, the metallized film capacitor includes a packaging shell, a capacitor core, an extraction electrode and a sealant; the capacitor core includes a plate, a dielectric and a metal layer sprayed on the two end faces of the plate, and the capacitor core is arranged in the packaging shell; the sealant is encapsulated in the packaging shell to fix the capacitor core, and the sealant is usually epoxy resin; the extraction electrode is connected to the capacitor core and is led out of the packaging shell, and the extraction electrode is generally a lead, a welding piece or a busbar. In the structure of the film capacitor, when the packaging shell is close to the waterway or the shell for cooling, due to the poor thermal conductivity outside the package, the internal heat is difficult to dissipate through the outside of the package, resulting in a high temperature of the capacitor core and the extraction electrode, which makes the current resistance ability low and is not suitable for hybrid vehicles.

[0004] In order to improve the heat dissipation performance of metallized film capacitors, relevant technologies disclose metallized film capacitors with cooling surfaces, including a packaging shell, a capacitor core, a lead electrode, a sealant and a heat sink; the capacitor core includes a plate, a dielectric and a metal layer sprayed on the two end faces of the plate, and the capacitor core is arranged in the packaging shell; the sealant is encapsulated in the packaging shell to fix the capacitor core, and the sealant is usually epoxy resin; the lead electrode is connected to the capacitor core and led out of the packaging shell, and the lead electrode is generally a lead, a welding piece or a busbar; the heat sink is bonded to the packaging shell or to the water channel, the heat sink is an aluminum plate, and the heat sink serves as a cooling surface. When the film capacitor with a cooling surface is cooled by placing the packaging shell close to a water channel or a shell, the current resistance capacity is improved compared to the traditional design due to the good thermal conductivity of the heat sink. However, since it is necessary to consider the risk of poor insulation caused by interference between the internal solder joints of the capacitor and the heat sink, it is necessary to ensure a large gap between the copper busbar and the heat sink. However, due to the large gap between the copper busbar and the heat sink, the thermal conductivity of the filling resin is poor, and the heat dissipation of the copper busbar is still insufficient under high current conditions. Utility Model Content

[0005] The utility model aims to solve one of the technical problems in the above-mentioned technology at least to a certain extent. To this end, one purpose of the utility model is to provide a capacitor to improve the heat dissipation performance of the capacitor, thereby improving the current resistance of the capacitor.

[0006] In order to achieve the above-mentioned object, the embodiment of the utility model provides a capacitor, comprising:

[0007] Encapsulation shell;

[0008] A capacitor core, the capacitor core being disposed in the packaging housing;

[0009] A sealant is poured into the packaging shell to fix the capacitor core;

[0010] A heat sink, the heat sink is embedded and mounted on the packaging shell;

[0011] A lead-out electrode is connected to the capacitor core and led out of the packaging shell, the lead-out electrode includes a solder point area connected to the capacitor core, the distance between the solder point area and the heat sink is greater than the distance between the non-solder point area of ​​the lead-out electrode and the heat sink, that is, the solder point area and the non-solder point area are bent and connected and are located in different planes.

[0012] According to a capacitor of an embodiment of the utility model, since the lead-out electrode includes a solder point area connected to the capacitor core, the distance between the solder point area and the heat sink is greater than the distance between the non-solder point area of ​​the lead-out electrode and the heat sink, the solder point area needs to consider the risk of poor insulation caused by interference with the heat sink, and the gap between the solder point area and the heat sink is larger, while the gap between the non-solder point area and the heat sink is smaller, that is, the non-solder point area is closer to the heat sink to enhance the heat dissipation performance of the lead-out electrode. Therefore, the utility model can improve the heat dissipation performance of the capacitor, thereby improving the current resistance of the capacitor.

[0013] In addition, a capacitor according to the above embodiment of the utility model may also have the following additional technical features:

[0014] Optionally, an insulating member is further included, and the insulating member is arranged between the heat sink and the capacitor core.

[0015] Specifically, the insulating member is insulating paper.

[0016] Optionally, the soldering point region and the non-soldering point region of the lead-out electrode are connected via an inclined plane and are located in different planes.

[0017] Optionally, the lead-out electrode includes a positive lead-out electrode and a negative lead-out electrode, the positive lead-out electrode is connected to one end of the capacitor core, and the negative lead-out electrode is connected to the other end of the capacitor core.

[0018] Optionally, the capacitor core is a metallized film capacitor core. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A three-dimensional combination diagram of an embodiment of the utility model;

[0020] Figure 2 A three-dimensional combination diagram of another angle of the embodiment of the utility model;

[0021] Figure 3 It is a cross-sectional view of an embodiment of the utility model.

[0022] Description of symbols

[0023] Package shell 1, capacitor core 2, sealant 3, heat sink 4, lead electrode 5, solder joint area 51, non-solder joint area 52, inclined surface 53, insulating member 6. DETAILED DESCRIPTION

[0024] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0025] In order to better understand the above technical solution, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0026] like Figures 1 to 3 As shown, a capacitor according to an embodiment of the utility model includes a packaging shell 1, a capacitor core 2, a sealant 3, a heat sink 4, an extraction electrode 5 and an insulating member 6.

[0027] The capacitor core 2 is arranged in the packaging shell 1. Optionally, the capacitor core 2 is a metallized film capacitor core, which includes a plate, a dielectric and a metal layer sprayed on two end surfaces of the plate; the packaging shell 1 can be a plastic shell or a metal shell.

[0028] The sealant 3 is filled in the packaging shell 1 to fix the capacitor core 2. The sealant 3 is usually epoxy resin.

[0029] The heat sink 4 is embedded and installed on the packaging shell 1 ; the heat sink 4 may be an aluminum plate, which is connected to an external radiator, and the aluminum plate is embedded in the packaging shell 1 and is opposite to the end surface of the capacitor core 2 .

[0030] Optionally, the insulating member 6 is disposed between the heat sink 4 and the capacitor core 2, and the insulating member 6 insulates the heat sink 4 from the capacitor core 2. Specifically, the insulating member 6 is insulating paper.

[0031] The lead-out electrode 5 is connected to the capacitor core 2 and led out of the packaging shell 1. The lead-out electrode 5 includes a solder point area 51 connected to the capacitor core 2. The distance between the solder point area 51 and the heat sink 4 is greater than the distance between the non-solder point area 52 of the lead-out electrode 5 and the heat sink 2, that is, the solder point area 51 and the non-solder point area 52 are bent and connected and are located in different planes.

[0032] Optionally, the soldering point region 51 and the non-soldering point region 52 of the lead-out electrode 5 are connected by an inclined surface 53 and are located in different planes.

[0033] A capacitor according to an embodiment of the utility model has a lead-out electrode 5 including a solder point area 51 connected to a capacitor core 2, and a distance between the solder point area 51 and a heat sink 4 is greater than a distance between a non-solder point area 52 of the lead-out electrode 5 and the heat sink 4. The solder point area 51 needs to consider the risk of poor insulation due to interference with the heat sink 4. The gap between the solder point area 51 and the heat sink 4 is larger, while the gap between the non-solder point area 52 and the heat sink 4 is smaller, that is, the non-solder point area 52 is closer to the heat sink 4 and the heat dissipation performance of the lead-out electrode 5 is enhanced. Therefore, the utility model can improve the heat dissipation performance of the capacitor, thereby improving the current resistance of the capacitor.

[0034] Optionally, the lead-out electrode 5 includes a positive lead-out electrode and a negative lead-out electrode, the positive lead-out electrode is connected to one end of the capacitor core 2 , and the negative lead-out electrode is connected to the other end of the capacitor core 2 .

[0035] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0036] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0037] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0039] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms should not be understood as necessarily being directed to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification.

[0040] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A capacitor, characterized in that: include: Encapsulation shell; A capacitor core, the capacitor core being disposed in the packaging housing; A sealant is poured into the packaging shell to fix the capacitor core; A heat sink, the heat sink is embedded and mounted on the packaging shell; A lead-out electrode is connected to the capacitor core and led out of the packaging shell, the lead-out electrode includes a solder point area connected to the capacitor core, the distance between the solder point area and the heat sink is greater than the distance between the non-solder point area of ​​the lead-out electrode and the heat sink, that is, the solder point area and the non-solder point area are bent and connected and are located in different planes.

2. A capacitor according to claim 1, characterized in that: An insulating member is also included, and the insulating member is disposed between the heat sink and the capacitor core.

3. A capacitor according to claim 2, characterized in that: The insulating member is insulating paper.

4. A capacitor according to claim 1, characterized in that: The welding point area and the non-welding point area of ​​the lead-out electrode are connected by an inclined surface and are located in different planes.

5. A capacitor according to claim 1, characterized in that: The lead-out electrode includes a positive lead-out electrode and a negative lead-out electrode. The positive lead-out electrode is connected to one end of the capacitor core, and the negative lead-out electrode is connected to the other end of the capacitor core.

6. A capacitor according to claim 1, characterized in that: The capacitor core is a metallized film capacitor core.

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