Wafer positioning carrier and wafer testing equipment

Abstract

The utility model relates to a wafer positioning carrier and wafer testing equipment. A wafer positioning carrier comprises a positioning assembly which is provided with a positioning groove used for installing a wafer; the positioning block comprises a main body block and a positioning convex block, the main body block is connected to the positioning assembly in a sliding manner, the positioning convex block is arranged on the main body block in a convex manner, and the positioning convex block is used for being matched with the notch of the wafer so as to limit the wafer; the elastic piece is arranged between the main body block and the positioning assembly and is used for driving the positioning block to slide towards the interior of the positioning groove, so that the positioning convex block is inserted into the notch of the wafer; and the carrier connector is fixedly arranged on the positioning assembly and used for being detachably installed on an equipment connector to be matched with the equipment connector, so that the quick-change connector is formed. The wafer positioning carrier can be used for positioning all wafers with gaps, and can be quickly replaced on the wafer testing equipment.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer testing equipment, in particular to a wafer positioning carrier and wafer testing equipment. Background Art

[0002] In the wafer production process, many performance tests will be carried out. How to solve the positioning of the wafer is an important issue for performance testing equipment. Usually, the positioning method used by the test equipment is vision-guided positioning, and the wafer is positioned by a vision camera. However, due to the small field of view of the high-precision vision camera, the loading of the wafer needs to have good consistency and will not move during the transportation process. Therefore, it is necessary to add positioning tooling to the test equipment.

[0003] In addition, since wafers come in a variety of sizes, it is necessary to replace the positioning fixture that is suitable for the wafer size during testing. Usually, the positioning fixture is directly fixed to the test equipment through bolts and other connectors. Replacing the positioning fixture is complicated, time-consuming and labor-intensive, which increases the test cost. Utility Model Content

[0004] Based on this, it is necessary to provide a wafer positioning carrier and wafer testing equipment to address the problems of difficulty in positioning wafers and time-consuming and labor-intensive replacement of positioning tooling in existing wafer testing equipment.

[0005] A wafer positioning carrier, comprising:

[0006] A positioning assembly, wherein the positioning assembly has a positioning groove for mounting a wafer;

[0007] A positioning block, the positioning block comprising a main block slidably connected to the positioning assembly and a positioning protrusion protruding from the main block, the positioning protrusion being used to cooperate with the notch of the wafer to restrict the wafer;

[0008] an elastic member, the elastic member being disposed between the main block and the positioning assembly and being used for driving the positioning block to slide into the positioning groove so that the positioning protrusion is inserted into the notch of the wafer; and

[0009] The carrier connector is fixed to the positioning assembly and is used to be detachably mounted on the equipment connector to form a quick-change connector.

[0010] In one embodiment, the positioning assembly includes a positioning plate and a guide block, the positioning groove is opened on the positioning plate, the positioning plate has a slide groove connected to the positioning groove, the positioning block is slidably arranged in the slide groove, the guide block is fixed to the positioning plate, and the guide block at least partially covers the slide groove to restrict the positioning block in the slide groove.

[0011] In one embodiment, the positioning block further includes a sliding portion connected to both sides of the main block, and the positioning assembly includes two guide blocks, which are respectively fixed on both sides of the slide groove to respectively restrict the sliding portion within the slide groove.

[0012] In one of the embodiments, the sliding groove is arranged toward the center of the positioning groove.

[0013] In one embodiment, the positioning plate has a fixed groove, the sliding groove is opened at the bottom of the fixed groove, the guide block is fixed in the fixed groove, and the surface of the guide block close to the notch of the fixed groove is flush with the surface where the notch of the fixed groove is located.

[0014] In one embodiment, the positioning groove has an opening to form an arched structure, and the opening of the positioning groove passes through the positioning plate.

[0015] In one embodiment, the positioning plate has a holding opening, and the holding opening is located on one side of the positioning groove.

[0016] In one embodiment, the positioning plate has a limiting groove connected to the slide groove, the limiting groove is located at one end of the slide groove away from the positioning groove, the positioning assembly further includes a limiting block fixed in the limiting groove, and the elastic member is arranged between the limiting block and the positioning block.

[0017] In one embodiment, the wafer positioning carrier further includes a handle, the handle includes a connecting portion and a gripping portion connected to the connecting portion, the limiting block has a through hole connected to the slide groove, the connecting portion is connected to the positioning block through the through hole, and the size of the gripping portion is larger than the size of the connecting portion.

[0018] A wafer testing device, comprising:

[0019] Equipment body;

[0020] A plurality of wafer positioning carriers as described above, each of the plurality of wafer positioning carriers having positioning grooves of different sizes; and

[0021] A device connector is fixedly mounted on the device body, and a carrier connector of the wafer positioning carrier is detachably connected to the device connector.

[0022] The above-mentioned wafer positioning carrier can be used to position all wafers with notches. By loading the wafer into the positioning groove, the positioning protrusion of the positioning block cooperates with the notch on the wafer, which can limit the rotation of the wafer, position the arrangement direction of the wafer, and keep the wafer in good consistency when loading. The elastic member can drive the positioning block so that the positioning block abuts against the wafer, fix the positioning protrusion in the notch of the wafer, and lock the wafer in the positioning groove to prevent the wafer from moving during transportation; in addition, the elastic member can also play a buffering role to avoid damage to the wafer. The carrier connector is a standard part and can be adapted to the equipment connector which is also a standard part to form a quick-change connector. The quick-change connector is a common working tool that can realize the rapid replacement of actuators or tools. The carrier connector can be directly inserted into the equipment connector or directly removed from the equipment connector without the need to use assembly tools such as screwdrivers and wrenches. Therefore, by connecting the carrier connector and the equipment connector, the wafer positioning carrier can be quickly replaced. In addition, the quick-change connector has good connection stability and can maintain smooth movement of the wafer positioning carrier when testing the wafer to improve positioning accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A three-dimensional schematic diagram of a wafer positioning carrier provided for one embodiment of the present application;

[0024] Figure 2 An enlarged schematic diagram of a positioning block of a wafer positioning carrier according to the above embodiment of the present application is shown;

[0025] Figure 3 A schematic plan view of a wafer positioning carrier according to the above embodiment of the present application is shown;

[0026] Figure 4 A schematic diagram of the matching between the carrier connector and the device connector of the wafer positioning carrier according to the above embodiment of the present application is shown.

[0027] : Illustration numerals: 10, wafer positioning carrier; 11, positioning assembly; 111, positioning groove; 1111, opening; 112, positioning plate; 113, guide block; 114, slide groove; 115, fixing groove; 116, holding opening; 117, limit groove; 118, limit block; 12, positioning block; 121, main block; 122, positioning protrusion; 123, sliding part; 13, elastic member; 14, carrier connector; 15, handle; 151, connecting part; 152, holding part; 20, equipment connector; 30, wafer; 31, notch. DETAILED DESCRIPTION

[0028] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.

[0029] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0031] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0033] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0034] In view of the difficulty in positioning wafers and the time-consuming and labor-intensive replacement of positioning tooling in existing wafer testing equipment, the present application provides a wafer positioning carrier and a wafer testing equipment. The wafer positioning carrier can be used to position all wafers with notches and can be quickly replaced on the wafer testing equipment.

[0035] For details, please refer to Figures 1 to 4 The wafer positioning carrier 10 may include a positioning assembly 11, a positioning block 12, an elastic member 13 and a carrier connector 14. The positioning assembly 11 has a positioning groove 111 for mounting a wafer 30. The positioning block 12 includes a main body block 121 slidably connected to the positioning assembly 11 and a positioning protrusion 122 protruding from the main body block 121. The positioning protrusion 122 is used to cooperate with the notch 31 of the wafer 30 to limit the wafer 30. The elastic member 13 is arranged between the main body block 121 and the positioning assembly 11, and is used to drive the positioning block 12 to slide into the positioning groove 111 so that the positioning protrusion 122 is inserted into the notch 31 of the wafer 30. The carrier connector 14 is fixed to the positioning assembly 11, and the carrier connector 14 is used to be detachably mounted on the device connector 20 to adapt to form a quick-change joint.

[0036] It is understandable that the wafer positioning carrier 10 can position the wafer 30. By placing the wafer 30 into the positioning groove 111, the positioning protrusion 122 of the positioning block 12 cooperates with the notch 31 on the wafer 30, which can limit the rotation of the wafer 30, position the arrangement direction of the wafer 30, and keep the wafer 30 in a better consistency when loading. The elastic member 13 can drive the positioning block 12 so that the positioning block 12 abuts against the wafer 30, fix the positioning protrusion 122 in the notch 31 of the wafer 30, and lock the wafer 30 in the positioning groove 111 to prevent the wafer 30 from moving during transportation; in addition, the elastic member 13 can also play a buffering role to avoid damage to the wafer 30.

[0037] The carrier connector 14 is a standard part, and can be matched with the device connector 20, which is also a standard part, to form a quick-change joint. The quick-change joint is a common working tool that can realize the rapid replacement of actuators or tools. The carrier connector 14 can be directly inserted into the device connector 20 or directly removed from the device connector 20 without the use of assembly tools such as screwdrivers and wrenches. Therefore, by connecting the carrier connector 14 and the device connector 20, the wafer positioning carrier 10 can be quickly replaced. In addition, the quick-change joint has good connection stability, and can also maintain the smooth movement of the wafer positioning carrier 10 when testing the wafer 30, so as to improve the accuracy of positioning.

[0038] For example, Figure 4 As shown, the carrier connector 14 may include a carrier connector and one or more connecting pins connected to the carrier connector, and the device connector 20 may include a device connector and one or more pin holes opened in the device connector, the pin holes are adapted to the connecting pins, and the carrier connector 14 and the device connector 20 can be fixedly connected by inserting the connecting pins into the pin holes, and the carrier connector 14 can be removed from the device connector 20 by pulling the connecting pins out of the pin holes.

[0039] More specifically, if Figure 1 , Figure 2 and Figure 3 As shown, in one embodiment, the positioning assembly 11 includes a positioning plate 112 and a guide block 113, the positioning groove 111 is opened in the positioning plate 112, the positioning plate 112 has a slide groove 114 connected to the positioning groove 111, the positioning block 12 is slidably arranged in the slide groove 114, the guide block 113 is fixed to the positioning plate 112, and the guide block 113 at least partially covers the slide groove 114 to limit the positioning block 12 in the slide groove 114. In this way, the guide block 113 can guide the positioning block 12, so that the positioning block 12 slides along the guide surface of the guide block 113, so that the positioning block 12 can slide more smoothly in the slide groove 114.

[0040] Optionally, in one embodiment, the positioning plate 112 can be fixedly connected to the carrier connector 14 by bolts and positioning pins.

[0041] Preferably, in one embodiment, the positioning component 11 and the positioning block 12 are made of 7075 aluminum plate, and the surfaces of the positioning component 11 and the positioning block 12 have a sub-black coating to prevent the surface reflection of the positioning component 11 and the positioning block 12 from affecting the performance test of the wafer 30. The sub-black coating can be formed by surface sub-black treatment.

[0042] Alternatively, if Figure 2 As shown, in one embodiment, the surface of the positioning protrusion 122 facing the positioning groove 111 is an arc surface. Since the notch 31 of the wafer 30 is generally arranged in a V shape, the arc surface can abut against two surfaces of the notch 31 respectively, increase the force points, and make the positioning of the wafer 30 more stable.

[0043] It is worth noting that in one embodiment, the slide groove 114 is arranged toward the center of the positioning groove 111. With such a configuration, when the positioning block 12 abuts against the wafer 30 under the action of the elastic member 13, the direction of the force applied to the wafer 30 passes through the center of the wafer 30, which can prevent the force from being offset and push the wafer 30 to be offset, thereby improving the accuracy of the wafer positioning carrier 10.

[0044] Preferably, if Figure 2 and Figure 3 As shown, in one embodiment, the positioning block 12 further includes a sliding portion 123 connected to both sides of the main block 121, and the positioning assembly 11 includes two guide blocks 113, which are respectively fixed on both sides of the slide groove 114 to respectively restrict the sliding portion 123 in the slide groove 114. In this way, the two guide blocks 113 respectively guide the two sliding portions 123 of the positioning block 12, so that the positioning block 12 can slide more smoothly in the slide groove 114.

[0045] Preferably, if Figure 2 and Figure 3As shown, in one embodiment, the positioning plate 112 has a fixing groove 115, the sliding groove 114 is opened at the bottom of the fixing groove 115, the guide block 113 is fixed in the fixing groove 115, and the surface of the guide block 113 close to the notch of the fixing groove 115 is flush with the surface where the notch of the fixing groove 115 is located. In this way, the guide block 113 is embedded in the fixing groove 115, which can make the surface of the positioning component 11 smoother and the structure of the positioning component 11 more beautiful on the one hand, and can reduce the overall height of the positioning component 11 on the other hand, making the structure of the positioning component 11 more compact.

[0046] Furthermore, if Figure 2 and Figure 3 As shown, in one embodiment, the positioning plate 112 has a limiting groove 117 connected to the slide groove 114, the limiting groove 117 is located at one end of the slide groove 114 away from the positioning groove 111, and the positioning assembly 11 further includes a limiting block 118 fixed in the limiting groove 117, and the elastic member 13 is arranged between the limiting block 118 and the positioning block 12. In this way, the elastic member 13 can push the positioning block 12 to slide along the slide groove 114, so that the positioning block 12 abuts against the wafer 30. The elastic member 13 can be implemented as one or more compression springs.

[0047] Preferably, if Figure 2 and Figure 3 As shown, in one embodiment, the wafer positioning carrier 10 further includes a handle 15, the handle 15 includes a connecting portion 151 and a gripping portion 152 connected to the connecting portion 151, the limit block 118 has a through hole (not shown) connected to the slide groove 114, the connecting portion 151 passes through the through hole to connect to the positioning block 12, and the size of the gripping portion 152 is larger than the size of the connecting portion 151. In this way, by grasping the gripping portion 152, a pulling force is applied to the positioning block 12 away from the positioning groove 111, which can overcome the elastic force of the elastic member 13, drive the positioning block 12 away from the wafer 30, and make the positioning protrusion 122 disengage from the notch 31 of the wafer 30, so as to remove the wafer 30 from the positioning groove 111. In addition, the gripping portion 152 can also play a limiting role. When the gripping portion 152 is not subjected to external force, the elastic member 13 pushes the positioning block 12 to slide toward the positioning groove 111, so that the gripping portion 152 abuts against the limiting block 118, thereby preventing the positioning block 12 from sliding out of the sliding groove 114.

[0048] In particular, if Figure 1 and Figure 3As shown, in one embodiment, the positioning groove 111 has an opening 1111 to form an arched structure, and the opening 1111 of the positioning groove 111 passes through the positioning plate 112. The arch is a larger part of the remaining shape after the circle is cut along a chord. Such a configuration can reduce the area of ​​the positioning groove 111 and reduce the space occupied by the positioning plate 112, thereby reducing the size of the positioning groove 111. The opening 1111 can provide an operating space for taking and placing the wafer 30, making it easier to take and place the wafer 30, and making the wafer positioning carrier 10 easier to operate.

[0049] Preferably, if Figure 1 As shown, in one embodiment, the positioning plate 112 has a gripping opening 116, and the gripping opening 116 is located on one side of the positioning slot 111. The gripping opening 116 runs through the positioning plate 112, and the operator can grasp the positioning plate 112 through the gripping opening 116 to provide convenience when disassembling and assembling the positioning plate 112.

[0050] Furthermore, a wafer 30 testing device provided in the present application may include a device body, a plurality of wafer positioning carriers 10 as described in any of the above, and a device connector 20, wherein the plurality of wafer positioning carriers 10 respectively have positioning grooves 111 of different sizes, for example, the diameters of the positioning grooves 111 are 4 inches, 6 inches, and 8 inches, respectively, and the wafer positioning carrier 10 can be adapted to 4-inch, 6-inch, and 8-inch wafers 30, respectively. The device connector 20 is fixed to the device body, and the carrier connector 14 of the wafer positioning carrier 10 is detachably connected to the device connector 20. When wafers 30 of other sizes need to be tested, the carrier connector 14 can be directly removed from the device connector 20, and the wafer positioning carrier 10 adapted to the size of the wafer 30 can be directly replaced. The entire replacement process does not require the use of tools, and the operation is simple and quick, saving time and effort.

[0051] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0052] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A wafer positioning carrier, characterized in that: include: A positioning assembly, wherein the positioning assembly has a positioning groove for mounting a wafer; A positioning block, the positioning block comprising a main block slidably connected to the positioning assembly and a positioning protrusion protruding from the main block, the positioning protrusion being used to cooperate with the notch of the wafer to restrict the wafer; an elastic member, the elastic member being disposed between the main block and the positioning assembly and being used for driving the positioning block to slide into the positioning groove so that the positioning protrusion is inserted into the notch of the wafer; as well as The carrier connector is fixed to the positioning assembly and is used to be detachably mounted on the equipment connector to form a quick-change connector.

2. The wafer positioning carrier according to claim 1, characterized in that: The positioning assembly includes a positioning plate and a guide block, the positioning groove is opened on the positioning plate, the positioning plate has a slide groove connected to the positioning groove, the positioning block can be slidably arranged in the slide groove, the guide block is fixed to the positioning plate, and the guide block at least partially covers the slide groove to restrict the positioning block in the slide groove.

3. The wafer positioning carrier according to claim 2, characterized in that: The positioning block further includes sliding parts connected to both sides of the main block, and the positioning assembly includes two guide blocks, which are respectively fixed on both sides of the slide groove to respectively limit the sliding part in the slide groove.

4. The wafer positioning carrier according to claim 2, characterized in that: The sliding groove is arranged toward the center of the positioning groove.

5. The wafer positioning carrier according to claim 2, characterized in that: The positioning plate has a fixed groove, the sliding groove is opened at the groove bottom of the fixed groove, the guide block is fixed in the fixed groove, and the surface of the guide block close to the groove opening of the fixed groove is flush with the surface where the groove opening of the fixed groove is located.

6. The wafer positioning carrier according to claim 2, characterized in that: The positioning groove has an opening to form an arched structure, and the opening of the positioning groove passes through the positioning plate.

7. The wafer positioning carrier according to claim 2, characterized in that: The positioning plate has a holding opening, and the holding opening is located at one side of the positioning groove.

8. The wafer positioning carrier according to any one of claims 2 to 7, characterized in that: The positioning plate has a limiting groove connected to the slide groove, the limiting groove is located at one end of the slide groove away from the positioning groove, the positioning assembly further includes a limiting block fixed in the limiting groove, and the elastic member is arranged between the limiting block and the positioning block.

9. The wafer positioning carrier according to claim 8, characterized in that: The wafer positioning carrier further includes a handle, which includes a connecting portion and a gripping portion connected to the connecting portion, the limiting block has a through hole connected to the slide groove, the connecting portion is connected to the positioning block through the through hole, and the size of the gripping portion is larger than the size of the connecting portion.

10. A wafer testing device, characterized in that: include: Equipment body; A plurality of wafer positioning carriers as claimed in any one of claims 1 to 9, wherein the plurality of wafer positioning carriers have positioning grooves of different sizes; and A device connector is fixedly mounted on the device body, and a carrier connector of the wafer positioning carrier is detachably connected to the device connector.

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