Cold compress machine for multiple chips

Abstract

The utility model discloses a cold compress machine for multi-chip relates to chip heat dissipation technical field, including main part and transport piece, the top surface of main part is equipped with heat exchange piece, the heat exchange piece is equipped with heat dissipation piece, the main part includes TEC refrigeration chip, the heat exchange piece includes heat pipe and heat conduction base, the heat pipe is omega channel heat pipe, and the heat conduction base is equipped with the heat dissipation piece. The heat conduction base is in a U shape, and the heat pipe is arranged at a notch of the U shape of the heat conduction base. According to the utility model, through the arrangement of the heat exchange piece, the problems of heat dissipation and cold displacement of a plurality of TEC refrigeration chips are solved, a simple and compact horizontal high-heat-flux heat dissipation structure is realized, the creation of a horizontal heat pipe is realized structurally, and the heat dissipation structure has the beneficial effects of small size, high power, light weight and the like, and can be applied to electronic products with relatively compact heat dissipation spaces; and the TEC refrigeration chip in the module dissipates heat.

Description

Technical Field

[0001] The utility model relates to the technical field of chip heat dissipation, in particular to a cold compress machine for multiple chips. Background Art

[0002] With the continuous development of science and technology, refrigeration technology has been widely used in various fields, especially in electronic equipment. An efficient heat dissipation system is crucial to maintaining the stability of the equipment and extending its service life. However, traditional heat dissipation solutions often have problems such as low heat dissipation efficiency, large size, and high energy consumption. It is difficult to meet the needs of modern electronic equipment for efficient and compact heat dissipation systems.

[0003] Among the existing refrigeration technologies, TEC refrigeration chips have attracted widespread attention for their advantages such as high efficiency, environmental protection and noiselessness. TEC refrigeration chips use thermoelectric effect to achieve refrigeration, and by controlling the direction of current, they can achieve the dual functions of cooling and heating.

[0004] However, as the injected current increases, the power of the TEC cooling chip increases, and the heat dissipation power also needs to increase accordingly. In compact electronic devices, the limitation of heat dissipation space makes it difficult to further improve the heat dissipation efficiency, which in turn leads to an increase in junction temperature. The increase in junction temperature will cause the performance of the TEC cooling chip to deteriorate.

[0005] In view of this, this application is hereby filed. Utility Model Content

[0006] The purpose of the utility model is to provide a multi-chip cold compress machine to solve the problems raised in the above background technology.

[0007] In order to solve the above technical problems, the utility model provides a multi-chip cold compress machine, including a main body and a conveying part, a heat exchange part is installed on the top surface of the main body, a heat dissipation part is arranged on the heat exchange part, the main body includes a TEC refrigeration chip, the heat exchange part includes a heat pipe and a heat conductive base, the heat pipe is an Ω groove heat pipe, the heat conductive base is U-shaped, and the heat pipe is arranged at the U-shaped notch of the heat conductive base.

[0008] Furthermore, the main body includes a base, a mounting plate is arranged in the base, there are multiple TEC cooling chips, all of which are installed in the mounting plate, and a protective shell that can wrap the outer side of the heat-conducting base is also arranged on the top surface of the main body.

[0009] Furthermore, a plurality of through grooves are opened in the middle of the heat pipe, fins are arranged in the through grooves, and the fins are wavy.

[0010] Furthermore, the interior of the heat-conducting base is hollowed out, and a side of the heat-conducting base in contact with the TEC cooling chip is provided with thermal grease.

[0011] Furthermore, the conveying member includes a pump body arranged on one side of the main body, the pump body is connected to a pipeline, a groove is opened in the base, and the pipeline passes through the groove.

[0012] Furthermore, a conducting member is arranged in the groove, heat conducting sheets adapted to the mounting plate are arranged on both sides of the top and bottom of the conducting member, a heat conducting pipe is arranged in the middle of the conducting member, and the pipe passes through the heat conducting pipe.

[0013] Furthermore, the heat sink includes a positive blade fan and a negative blade fan, and the positive blade fan and the negative blade fan are respectively installed on both sides of the protective shell, and the position where the positive blade fan and the negative blade fan are installed in the protective shell is connected to the interior of the protective shell.

[0014] Furthermore, a protective net is provided on the side of the positive blade fan and the negative blade fan away from the protective shell.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] By setting up heat exchange components, the problems of heat dissipation and cold capacity replacement of multiple TEC cooling chips are solved, and a simple and compact horizontal high heat flux density heat dissipation structure is realized. The structure realizes the creation of horizontal heat pipes, which has the beneficial effects of small size, high power and light weight. It can be applied to electronic products with relatively compact heat dissipation space, such as TEC cooling chip heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of a multi-chip cold compress machine;

[0018] Figure 2 It is a schematic diagram of the shelling structure of a multi-chip cold compress machine;

[0019] Figure 3 The bottom structure cross-sectional view of a multi-chip cold compress machine;

[0020] Figure 4 It is a schematic diagram of the structure of a mounting plate of a multi-chip cold compress machine;

[0021] Figure 5 The present invention is a schematic diagram of the connection structure between the heat sink and the main body of a multi-chip cold compress machine.

[0022] In the figure: 1. Main body; 101. Base; 102. Mounting plate; 103. TEC refrigeration chip; 2. Conveying part; 201. Pump body; 202. Pipe; 203. Conducting part; 204. Mounting plate; 3. Heat exchange part; 301. Heat pipe; 302. Fin; 303. Thermal base; 304. Thermal grease; 4. Heat sink; 401. Positive blade fan; 402. Reverse blade fan; 403. Protective net. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] See also Figure 1-Figure 5 The utility model provides a technical solution: it includes a main body 1 and a conveying member 2, the main body 1 includes a base 101 and a TEC cooling chip 103, a mounting plate 102 is provided in the base 101, there are multiple TEC cooling chips 103, all of which are installed in the mounting plate 102, and a heat exchange member 3 is installed on the top surface of the main body 1.

[0025] By adopting the above design, a plurality of TEC cooling chips 103 can be installed in the mounting plate 102 during use, and the heat dissipation effect of the device can be improved by increasing the number of TEC cooling chips 103 .

[0026] The heat exchange element 3 includes a heat pipe 301 and a heat conductive base 303. The heat pipe 301 is an Ω-groove heat pipe 301. The heat conductive base 303 is U-shaped. The heat pipe 301 is arranged at the notch of the U-shape of the heat conductive base 303. A plurality of through grooves are opened in the middle of the heat pipe 301. Fins 302 are arranged in the through grooves. The fins 302 are wavy.

[0027] By providing the heat pipe 301 in the form of an Ω groove, the permeability of the coolant in the heat pipe 301 is increased, and the obstruction of the reverse flow of steam to the flow of the coolant in the groove can be effectively reduced, so that the steam pressure difference is much smaller than the liquid pressure difference, and the flow resistance of the steam and the coolant is reduced, thereby improving the heat transfer performance of the heat exchanger 3, making the structure of the device compact and suitable for heat dissipation occasions requiring small volume, high power and light weight.

[0028] A U-shaped heat-conducting base 303 is provided, and a heat pipe 301 is provided at the U-shaped notch of the heat-conducting base 303, so that the heat-conducting base 303 can replace the bottom of the heat pipe 301 to fully contact the multiple TEC cooling chips 103 in the mounting plate 102, and the two sides of the lower end of the heat pipe 301 can fully contact the inner two sides of the heat-conducting base 303, thereby making the contact area in the heat conversion process larger, thereby improving the heat exchange efficiency.

[0029] Moreover, the interior of the heat-conducting base 303 is hollowed out, and a surface of the heat-conducting base 303 in contact with the TEC cooling chip 103 is provided with heat-conducting silicone grease 304 .

[0030] By providing the thermal grease 304, the thermal grease 304 can be slightly deformed within a certain range, so that the two sides of the thermal grease 304 can be tightly attached to the bottom surface of the thermal base 303, as well as the top surfaces of the mounting plate 102 and the TEC cooling chip 103, thereby making the connection between the bottom surface of the thermal base 303 and the plurality of TEC cooling chips 103 on the mounting plate 102 tighter, which can further improve the heat exchange efficiency.

[0031] The top surface of the main body 1 is also provided with a protective shell that can wrap the outer side of the heat-conducting base 303 .

[0032] The protective shell can prevent dust and debris from entering the hollow portion of the heat-conducting base 303 , making it difficult to clean, and can also prevent dust from accumulating in the hollow portion and corroding the heat-conducting base 303 .

[0033] The conveying member 2 includes a pump body 201 arranged on one side of the main body 1, a mounting plate 204 is arranged on the pump body 201, a notch is opened on the mounting plate 204 for installing the conveying member 2, the pump body 201 is connected to the pipeline 202, a groove is opened in the base 101, a conducting member 203 is arranged in the groove, heat conducting plates adapted to the mounting plate 102 are arranged on both sides of the top and bottom of the conducting member 203, a heat conducting pipe 301 is arranged in the middle of the conducting member 203, and the pipeline 202 passes through the heat conducting pipe 301.

[0034] By adopting the above design, when the temperature of the TEC cooling chip 103 is transferred through the pump body 201, the conductive member 203 can replace the pipe 202 to contact the bottom surface of the TEC cooling chip 103. Because the conductive member 203 has a larger contact area, the heat exchange efficiency of the conductive member 203 can be higher, and the outer wall of the pipe 202 will be completely wrapped by the heat conduction pipe 301 in the conductive member 203, so that the contact area between the pipe 202 and the conductive member 203 is also larger, thereby making the heat exchange efficiency of the conveying member 2 higher, and improving the cooling effect of the TEC cooling chip 103 to a certain extent.

[0035] A heat sink 4 is provided on the heat exchanger 3, and the heat sink 4 includes a positive blade fan 401 and a negative blade fan 402. The positive blade fan 401 and the negative blade fan 402 are respectively installed on both sides of the protective shell, and the position where the positive blade fan 401 and the negative blade fan 402 are installed on the protective shell is connected to the interior of the protective shell, and a protective net 403 is provided on the side of the positive blade fan 401 and the negative blade fan 402 away from the protective shell.

[0036] By setting the positive blade fan 401 and the reverse blade fan 402, the positive blade fan 401 can guide the air to flow into the heat exchanger 3, and then the reverse blade fan 402 will lead it out of the heat exchanger 3, so as to form an air duct, so that the air can pass through the heat exchanger 3 quickly in one direction, thereby making the heat dissipation effect of the heat exchanger 3 better.

[0037] In addition, a protective net 403 is provided on the side of the positive blade fan 401 and the reverse blade fan 402 away from the protective shell. When the positive blade fan 401 and the reverse blade fan 402 guide the air, the protective net 403 can block out the debris and dust guided by the air duct, thereby improving the cleanliness of the heat conductive base 303 and preventing debris from colliding with the blades of the positive blade fan 401 and the reverse blade fan 402, causing damage to the blades.

[0038] Working principle:

[0039] When the TEC cooling chip 103 generates heat, the heat will be transferred to the heat-conducting base 303 through the thermal grease 304, and then a part of the heat will be dissipated through the hollow in the heat-conducting base 303, and then transferred to the lower end of the heat pipe 301. When the heat is transferred to the lower end of the heat pipe 301, the coolant therein will evaporate and absorb heat, and then rise and condense to dissipate heat, thereby dissipating the heat when the TEC cooling chip 103 generates heat.

[0040] Moreover, during the heat dissipation process, the air can be guided into the heat exchanger 3 by starting the positive blade fan 401, and then led out of the heat exchanger 3 by the negative blade fan 402, thereby forming an air duct, allowing the air to pass quickly in one direction through the heat exchanger 3, thereby making the heat dissipation effect of the heat exchanger 3 even better.

Claims

1. A multi-chip cold compress machine, comprising a main body (1) and a conveying member (2), a heat exchange member (3) being installed on the top surface of the main body (1), a heat sink (4) being arranged on the heat exchange member (3), characterized in that: The main body (1) comprises a TEC refrigeration chip (103), the heat exchange element (3) comprises a heat pipe (301) and a heat conductive base (303), the heat pipe (301) is an Ω groove heat pipe (301), the heat conductive base (303) is U-shaped, and the heat pipe (301) is arranged at a U-shaped notch of the heat conductive base (303).

2. A multi-chip cold compress machine as claimed in claim 1, characterized in that: The main body (1) comprises a base (101), a mounting plate (102) is arranged in the base (101), a plurality of TEC cooling chips (103) are arranged, and all are mounted in the mounting plate (102), and a protective shell capable of wrapping the outer side of the heat-conducting base (303) is also arranged on the top surface of the main body (1).

3. A multi-chip cold compress machine as claimed in claim 2, characterized in that: A plurality of through slots are provided in the middle of the heat pipe (301), and fins (302) are arranged in the through slots. The fins (302) are wavy in shape.

4. A multi-chip cold compress machine as claimed in claim 3, characterized in that: The interior of the heat-conducting base (303) is hollowed out, and a surface of the heat-conducting base (303) in contact with the TEC refrigeration chip (103) is provided with heat-conducting silicone grease (304).

5. A multi-chip cold compress machine as claimed in claim 4, characterized in that: The conveying member (2) comprises a pump body (201) arranged on one side of the main body (1); the pump body (201) is connected to a pipeline (202); a groove is provided in the base (101), and the pipeline (202) passes through the groove.

6. A multi-chip cold compress machine as claimed in claim 5, characterized in that: A conducting member (203) is arranged in the groove, and heat conducting plates adapted to the mounting plate (102) are arranged on both sides of the top and bottom of the conducting member (203), and a heat conducting pipe (301) is arranged in the middle of the conducting member (203), and the pipe (202) passes through the heat conducting pipe (301).

7. A multi-chip cold compress machine as claimed in claim 6, characterized in that: The heat sink (4) comprises a positive blade fan (401) and a negative blade fan (402), wherein the positive blade fan (401) and the negative blade fan (402) are respectively installed on two sides of the protective shell, and the position where the positive blade fan (401) and the negative blade fan (402) are installed on the protective shell is connected to the interior of the protective shell.

8. A multi-chip cold compress machine as claimed in claim 7, characterized in that: A protective net (403) is provided on the side of the positive blade fan (401) and the negative blade fan (402) away from the protective shell.

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