Spot welding mechanism for packaging integrated circuit chip

Abstract

The utility model discloses a spot welding mechanism for packaging an integrated circuit chip, which is characterized by comprising a box body, the turntable is in bearing connection with the top plate of the box body, the turntable is fixedly connected with a vertical shaft, and the vertical shaft is in bearing connection with the bottom plate of the box body; the device comprises a rotating disc, a set of clamping assemblies and a set of clamping assemblies, the rotating disc is fixedly connected with the set of clamping assemblies, each clamping assembly comprises a circular groove plate, the circular groove plate is fixedly connected with the rotating disc, the circular groove plate is provided with a set of straight grooves, each straight groove is internally provided with an inverted-T-shaped rod, and each inverted-T-shaped rod is fixedly connected with a clamping plate. The utility model relates to the technical field of chip packaging, in particular to a spot welding mechanism for packaging an integrated circuit chip. The technical problem to be solved by the utility model is to provide the spot welding mechanism for packaging the integrated circuit chip, which is favorable for realizing the packaging of the integrated circuit chip.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, and more specifically, to a spot welding mechanism for integrated circuit chip packaging. Background Technology

[0002] Integrated circuit packaging has advanced alongside the development of integrated circuits. With the continuous development of various industries such as aerospace, aviation, machinery, light industry, and chemical engineering, complete systems are also changing towards multi-functionality and miniaturization. This demands increasingly higher integration levels and more complex functions in integrated circuits. Correspondingly, this requires increasingly higher packaging density, more leads, smaller size, lighter weight, and faster product updates. The rationality and scientific nature of the packaging structure directly affect the quality of integrated circuits.

[0003] Currently, integrated circuit chip packaging uses a linear pipeline method. A circular pipeline method is still lacking to facilitate integrated circuit clamping and subsequent soldering. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide a spot welding mechanism for integrated circuit chip packaging, which is beneficial to realizing integrated circuit chip packaging.

[0005] This utility model achieves its invention objective using the following technical solution:

[0006] A spot welding mechanism for integrated circuit chip packaging, characterized in that it comprises: a housing; a turntable, a top plate of the housing connected to the turntable by a bearing, the turntable being fixedly connected to a vertical shaft, and the vertical shaft being connected to the bottom plate of the housing by a bearing; a set of clamping assemblies evenly distributed on the turntable, the turntable being fixedly connected to the set of clamping assemblies, each clamping assembly including a circular groove plate, the circular groove plate being fixedly connected to the turntable, the circular groove plate being provided with a set of straight grooves, each straight groove being provided with an inverted T-bar, and each inverted T-bar being fixedly connected to a clamping plate.

[0007] As a further limitation of this technical solution, the circular groove plate is fixedly connected to the motor, the output shaft of the motor is fixedly connected to the screw, the screw is threadedly connected to the movable circular block, the movable circular block is fixedly connected to a set of guide cylinders, each guide cylinder is provided with a guide rod, and each guide rod is fixedly connected to the corresponding inverted T-rod.

[0008] As a further limitation of this technical solution, the circular groove plate is fixedly connected to the inclined groove plate for each of the straight grooves, and the circular block of each inverted T-bar is respectively set in the inclined groove of the corresponding inclined groove plate.

[0009] As a further limitation of this technical solution, the housing is fixedly connected to a power motor, the output shaft of the power motor is fixedly connected to a half gear, the vertical shaft is fixedly connected to a large gear, and the large gear matches the half gear.

[0010] As a further limitation of this technical solution, the bottom plate of the housing is connected to a rotating shaft bearing, the rotating shaft is fixedly connected to a pinion, and the pinion is matched with the half gear.

[0011] As a further limitation of this technical solution, the rotating shaft is fixedly connected to the driving bevel gear, the driving bevel gear meshes with the driven bevel gear, the driven bevel gear is fixedly connected to the central shaft of the rotating wheel, the central shaft of the rotating wheel is bearing connected to the housing, a round block is fixedly connected to the edge of the rotating wheel, the round block is set in the slide groove, the slide groove is fixedly connected to the L mounting rod, and the L mounting rod is fixedly connected to the placement cylinder.

[0012] As a further limitation of this technical solution, the box body is fixedly connected to the guide vertical rod, the guide vertical rod passes through the lifting block, and the slide groove is fixedly connected to the lifting block.

[0013] As a further limitation of this technical solution, the circular groove plate is fixedly connected to the placement block.

[0014] Compared with related technologies, the spot welding mechanism for integrated circuit chip packaging provided by this utility model has the following advantages:

[0015] (1) This device adopts a circular production line, which facilitates the welding of integrated circuits and reduces the floor space required;

[0016] (2) The clamping plate of this device can swing from bottom to outside to top to inside, which facilitates the clamping of integrated circuits;

[0017] (3) This device uses a circular block placed in a chute to achieve the reciprocating motion of the placement cylinder, which facilitates the placement and removal of the welding torch during manual welding. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 1 .

[0019] Figure 2 This is a partially cut-away three-dimensional structural diagram of the present invention.

[0020] Figure 3 This is a schematic diagram of the three-dimensional structure of the clamping component of this utility model. Figure 1 .

[0021] Figure 4 This is a schematic diagram of the three-dimensional structure of the clamping component of this utility model. Figure 2 .

[0022] Figure 5 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 2 .

[0023] In the diagram: 1. Box body, 2. Turntable, 3. Large gear, 4. Vertical shaft, 5. Half gear, 6. Power motor, 7. Rotating shaft, 8. Driving bevel gear, 9. Small gear, 10. Driven bevel gear, 11. Rotating wheel, 12. Round block, 13. Slide groove, 14. Guide vertical rod, 15. Lifting block, 16. L-mounting rod, 17. Placement cylinder, 18. Round groove plate, 19. Inverted T-bar, 20. Straight groove, 21. Inclined groove plate, 22. Motor, 23. Screw, 24. Moving round block, 25. Guide cylinder, 26. Guide rod, 27. Clamping plate, 28. Placement block. Detailed Implementation

[0024] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0025] Example 1: A spot welding mechanism for integrated circuit chip packaging, comprising: a housing 1; a turntable 2, the top plate of the housing 1 being connected by a bearing, the turntable 2 being fixedly connected to a vertical shaft 4, the vertical shaft 4 being connected to the bottom plate of the housing 1 by a bearing; a set of clamping components, evenly distributed on the turntable 2, the turntable 2 being fixedly connected to the set of clamping components, the clamping components including a circular groove plate 18, the circular groove plate 18 being fixedly connected to the turntable 2, the circular groove plate 18 being provided with a set of straight grooves 20, each of the straight grooves 20 being provided with an inverted T-bar 19, each of the inverted T-bars 19 being fixedly connected to a clamping plate 27.

[0026] The circular groove plate 18 is fixedly connected to the motor 22, the output shaft of the motor 22 is fixedly connected to the screw 23, the screw 23 is threadedly connected to the movable circular block 24, the movable circular block 24 is fixedly connected to a set of guide cylinders 25, each guide cylinder 25 is provided with a guide rod 26, and each guide rod 26 is fixedly connected to the corresponding inverted T rod 19.

[0027] The motor 22 is model RH100.

[0028] The circular groove plate 18 is fixedly connected to the inclined groove plate 21 for each of the straight grooves 20, and the circular block of each inverted T rod 19 is respectively set in the inclined groove of the corresponding inclined groove plate 21.

[0029] The housing 1 is fixedly connected to the power motor 6, the output shaft of the power motor 6 is fixedly connected to the half gear 5, the vertical shaft 4 is fixedly connected to the large gear 3, and the large gear 3 is matched with the half gear 5.

[0030] The circular groove plate 18 is fixedly connected to the placement block 28.

[0031] The working principle of the spot welding mechanism for integrated circuit chip packaging provided by this utility model is as follows:

[0032] The rotation of the power motor 6 drives the half gear 5 to rotate. When the half gear 5 meshes with the large gear 3, it drives the large gear 3, the rotating shaft 4, and the turntable 2 to rotate. The turntable 2 drives the clamping assembly to rotate. The integrated circuit board is placed on the placement block 28, and the control motor 22 rotates. The motor 22 drives the screw 23 to rotate, and the screw 23 drives the moving block 24, the guide cylinder 25, the guide rod 26, and the inverted T-rod 19 to move. The inverted T-rod 19 moves along the inclined groove of the inclined plate 21, and the inverted T-rod 19 drives the guide rod 26 to move along the guide cylinder 25. The inverted T-rod 19 drives the clamping plate 27 to move, so that the clamping plate 27 clamps the integrated circuit board. After the chip is placed, soldering begins.

[0033] Compared with related technologies, the spot welding mechanism for integrated circuit chip packaging provided by this utility model has the following advantages:

[0034] This device utilizes a circular production line, which facilitates the soldering of integrated circuits and reduces the floor space required.

[0035] The clamping plate 27 of this device can swing from bottom to outside to top to inside, making it convenient to clamp integrated circuits.

[0036] Example 2: This example is a further elaboration based on Example 1. The bottom plate bearing of the housing 1 is connected to the rotating shaft 7, the rotating shaft 7 is fixedly connected to the pinion 9, and the pinion 9 is matched with the half gear 5.

[0037] The rotating shaft 7 is fixedly connected to the driving bevel gear 8, which meshes with the driven bevel gear 10. The driven bevel gear 10 is fixedly connected to the central shaft of the rotating wheel 11. The central shaft of the rotating wheel 11 is bearing connected to the housing 1. A round block 12 is fixedly connected to the edge of the rotating wheel 11. The round block 12 is set in the slide groove 13. The slide groove 13 is fixedly connected to the L-mounting rod 16. The L-mounting rod 16 is fixedly connected to the placement cylinder 17.

[0038] The housing 1 is fixedly connected to the guide vertical rod 14, the guide vertical rod 14 passes through the lifting block 15, and the slide groove 13 is fixedly connected to the lifting block 15.

[0039] The working principle of the spot welding mechanism for integrated circuit chip packaging provided by this utility model is as follows:

[0040] When half gear 5 meshes with pinion 9, it drives pinion 9 to rotate. Pinion 9 drives shaft 7 and drive bevel gear 8 to rotate. Drive bevel gear 8 drives driven bevel gear 10 and wheel 11 to rotate. Wheel 11 drives block 12 to swing along slide groove 13. Block 12 drives slide groove 13 to move. Slide groove 13 drives lifting block 15 to move along guide vertical rod 14. Slide groove 13 drives L mounting rod 16 and placement cylinder 17 to reciprocate. During welding, placement cylinder 17 is at the lowest end of its stroke, which facilitates welding.

[0041] Compared with related technologies, the spot welding mechanism for integrated circuit chip packaging provided by this utility model has the following advantages:

[0042] This device uses a circular block 12 placed in a chute 13 to achieve the reciprocating motion of the placement cylinder 17, which facilitates the placement and removal of the welding torch during manual welding.

[0043] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A spot welding mechanism for integrated circuit chip packaging, characterized in that: include: Box body (1); A turntable (2) having a bearing connected to the top plate of the box body (1); the turntable (2) is fixedly connected to a vertical shaft (4); and the vertical shaft (4) has a bearing connected to the bottom plate of the box body (1); A group of clamping assemblies are evenly distributed on the rotating disk (2), the rotating disk (2) is fixedly connected to the group of clamping assemblies, the clamping assemblies include a circular groove plate (18), the circular groove plate (18) is fixedly connected to the rotating disk (2), the circular groove plate (18) is provided with a group of straight grooves (20), each straight groove (20) is respectively provided with an inverted T-bar (19), and each inverted T-bar (19) is respectively fixedly connected to a clamping plate (27).

2. The spot welding mechanism for integrated circuit chip packaging according to claim 1, characterized in that: The circular groove plate (18) is fixedly connected to a motor (22), the output shaft of the motor (22) is fixedly connected to a screw rod (23), the screw rod (23) is threadedly connected to a moving round block (24), the moving round block (24) is fixedly connected to a group of guide cylinders (25), each of the guide cylinders (25) is respectively provided with a guide rod (26), and each of the guide rods (26) is respectively fixedly connected to the corresponding inverted T rod (19).

3. The spot welding mechanism for integrated circuit chip packaging according to claim 2, characterized in that: The circular groove plate (18) is respectively fixedly connected to the inclined groove plate (21) corresponding to each of the straight grooves (20), and the round block of each inverted T-bar (19) is respectively arranged in the corresponding inclined groove of the inclined groove plate (21).

4. The spot welding mechanism for integrated circuit chip packaging according to claim 1, characterized in that: The box body (1) is fixedly connected to a power motor (6), the output shaft of the power motor (6) is fixedly connected to a half gear (5), the vertical shaft (4) is fixedly connected to a large gear (3), and the large gear (3) matches the half gear (5).

5. The spot welding mechanism for integrated circuit chip packaging according to claim 4, characterized in that: The bottom plate bearing of the box body (1) is connected to the rotating shaft (7), the rotating shaft (7) is fixedly connected to the pinion gear (9), and the pinion gear (9) matches the half gear (5).

6. The spot welding mechanism for integrated circuit chip packaging according to claim 5, characterized in that: The rotating shaft (7) is fixedly connected to a driving bevel gear (8), the driving bevel gear (8) meshes with a driven bevel gear (10), the driven bevel gear (10) is fixedly connected to the central axis of a rotating wheel (11), the central axis bearing of the rotating wheel (11) is connected to the housing (1), the edge of the rotating wheel (11) is fixedly connected to a round block (12), the round block (12) is arranged in a slide groove (13), the slide groove (13) is fixedly connected to an L mounting rod (16), and the L mounting rod (16) is fixedly connected to a placement cylinder (17).

7. The spot welding mechanism for integrated circuit chip packaging according to claim 6, characterized in that: The box body (1) is fixedly connected to a guide vertical rod (14), the guide vertical rod (14) passes through a lifting block (15), and the slide groove (13) is fixedly connected to the lifting block (15).

8. The spot welding mechanism for integrated circuit chip packaging according to claim 1, characterized in that: The circular groove plate (18) is fixedly connected to the placement block (28).

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