Vacuum adsorption manipulator for conveying wafers

Abstract

The utility model relates to the technical field of semiconductor processing equipment, in particular to a vacuum adsorption manipulator for conveying wafers, which comprises a substrate and a vacuum air passage arranged in the substrate, and the vacuum air passage comprises a first air passage and a second air passage; the first air channel and the second air channel are connected with an external vacuum source through a first air hole and a second air hole respectively for vacuum air exhaust. The substrate is provided with a first suction hole and a second suction hole which are respectively communicated with the first air passage and the second air passage; according to the utility model, the conveying requirements of different types of wafers are met, the overall vacuum adsorption area of the substrate to the wafers is increased, the adsorption stability of wafer operation is improved, and the wafer breaking risk in the production and processing process is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing equipment, in particular to a vacuum adsorption manipulator for transporting wafers. Background Art

[0002] Wafer refers to the silicon chip used in the production of silicon semiconductor integrated circuits. Because of its round shape, it is called a wafer. Wafer is the carrier used in the production of integrated circuits and is the most commonly used semiconductor material. It is divided into 6-inch and 8-inch specifications according to its diameter, and can be divided into standard wafers, thin wafers, and Taiko wafers according to its thickness.

[0003] Chinese invention patent CN117238821A, a mechanical adsorption part and adsorption part connecting part for transferring wafers, the invention provides a mechanical adsorption part and adsorption part connecting part for transferring wafers, the front end of the mechanical adsorption part is detachably connected with a sweeping element, which can sweep the wafer box by the sweeping element when the robot arm is extended, if there is no stacking or leakage of wafers in the wafer box, the wafer can be taken away by the robot arm, so as to achieve the purpose of monitoring the wafer status before transfer;

[0004] The above-mentioned existing technologies and most of the current vacuum adsorption robots are mainly used to transport wafers between a wafer box and a probe platform (chuck plate); however, as the thickness of the wafer decreases, the warping of the wafer will become larger and larger. When the vacuum adsorption robot of the existing probe platform transports thin wafers with warping, the vacuum cannot be adsorbed normally, resulting in interruption of the material transportation process. The wafer may easily slip from the robot if the vacuum cannot be adsorbed, and there is a risk of wafer breakage. Utility Model Content

[0005] The utility model aims to provide a vacuum adsorption manipulator with delicate structure, switchable adsorption points and stable adsorption and transportation.

[0006] In order to achieve the above-mentioned purpose, the utility model provides the following technical solutions:

[0007] A vacuum adsorption robot for transporting wafers includes a substrate and a vacuum air channel arranged inside the substrate, the vacuum air channel includes a first air channel and a second air channel; the first air channel and the second air channel respectively use a first air hole and a second air hole to connect to an external vacuum source for vacuum extraction; the substrate is provided with a first suction hole and a second suction hole respectively connected to the first air channel and the second air channel.

[0008] Furthermore, the substrate includes a mounting portion and an adsorption portion; the adsorption portion is provided with a functional groove for expansion installation; the first suction hole and the second suction hole are distributed on both sides of the functional groove;

[0009] Furthermore, a plurality of adsorption surfaces are provided on one end surface of the adsorption portion; the first adsorption hole and the second adsorption hole are provided in the adsorption surface;

[0010] Furthermore, the first suction hole is arranged on the outer side away from the functional groove, and the second suction hole is arranged on the inner side close to the functional groove;

[0011] Further, the first air channel includes a first adsorption air section arranged in the adsorption part and a first air extraction air section arranged in the mounting part; the second air channel includes a second adsorption air section arranged in the adsorption part and a second air extraction air section arranged in the mounting part;

[0012] Further, the second adsorption gas section and the first adsorption gas section are located at the same horizontal plane;

[0013] Furthermore, the first gas adsorption section and the first gas extraction section are located at the same horizontal plane and are connected;

[0014] Furthermore, the second adsorption gas section is located below the second air extraction gas section, and the second adsorption gas section is connected with the second air extraction gas section through the sinking gas section;

[0015] Furthermore, a positioning hole is provided on one end of the mounting portion away from the adsorption portion, and the positioning hole is used to connect the substrate to an external robot arm;

[0016] Furthermore, the substrate is made of ceramic integral molding;

[0017] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0018] The utility model provides a vacuum adsorption robot for transporting wafers. In the specific implementation process of the utility model, a double vacuum air channel design of a first air channel and a second air channel is adopted in the substrate. The first air channel and the second air channel are connected to an external vacuum source and a solenoid valve through a first air hole and a second air hole. The warping of the wafer usually occurs in two situations: convex and concave. The solenoid valve can be used for switching. The first air channel and the second air channel are adsorbed. The machine judges and switches the solenoid valve according to the adsorption situation, and then switches the first suction hole and the second suction hole in different positions for air suction, so as to achieve the situation of adsorbing wafers with different warpages. After the adsorption is completed, the robot follows the movement of the mechanical arm to transport the wafer to the corresponding mechanical position. The transportation requirements of wafer slices of different models are met, the vacuum adsorption area of ​​the substrate to the wafer as a whole is increased, the adsorption stability of the wafer operation is improved, and the risk of fragmentation during the production and processing process is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0020] Figure 2It is a front oblique view schematic diagram of the utility model;

[0021] Figure 3 It is a schematic oblique back view of the utility model. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0023] refer to Figure 1-3 As shown, a vacuum adsorption robot for transporting wafers comprises a substrate 1 and a vacuum air channel arranged inside the substrate 1, wherein the vacuum air channel comprises a first air channel 3 and a second air channel 4; the first air channel 3 and the second air channel 4 respectively use a first air hole 7 and a second air hole 8 to connect to an external vacuum source for vacuum extraction; the substrate 1 is provided with a first suction hole 5 and a second suction hole 6 respectively connected to the first air channel 3 and the second air channel 4;

[0024] During the specific implementation of the utility model, a double vacuum air channel design of the first air channel 3 and the second air channel 4 is adopted in the substrate 1. The first air channel 3 and the second air channel 4 are connected to an external vacuum source and a solenoid valve through the first air hole 7 and the second air hole 8. The warping of the wafer usually occurs in two situations: convex and concave. The adsorption switching of the first air channel 3 and the second air channel 4 can be performed through the solenoid valve. The machine judges and switches the solenoid valve according to the adsorption situation, and then switches the first suction hole 5 and the second suction hole 6 at different positions for suction, so as to achieve the situation of adsorbing wafers with different warpages. After the adsorption is completed, the manipulator follows the movement of the manipulator arm to transport the wafer to the corresponding mechanical position; the transportation requirements of wafer slices of different models are met, the vacuum adsorption area of ​​the substrate 1 to the entire wafer is increased, the adsorption stability of the wafer operation is improved, and the risk of fragmentation during the production and processing process is reduced.

[0025] In this embodiment, the substrate 1 includes a mounting portion 11 and an adsorption portion 12; the adsorption portion 12 is provided with a functional groove 13 for expansion installation; the first suction hole 5 and the second suction hole 6 are distributed on both sides of the functional groove 13; the first air duct 3 and the second air duct 4 are both Y-shaped, and are arranged inside the mounting portion 11 and the adsorption portion 12; the adsorption portion 12 adopts a double-fork design, and a functional groove 13 is reserved in the middle for installing other sensors and detection devices; the first air duct 3 and the second air duct 4 are Y-shaped, ensuring that the first suction hole 5 and the second suction hole 6 are distributed on the adsorption portion as much as possible.

[0026] In this embodiment, a plurality of adsorption tables 14 are provided on one end face of the adsorption portion 12; the first suction hole 5 and the second suction hole 6 are arranged in the adsorption table 14; the first suction hole 5 is arranged on the outer side away from the functional groove 13, and the second suction hole 6 is arranged on the inner side close to the functional groove 13; each adsorption portion is provided with at least two adsorption tables higher than the end face of the adsorption portion 12, and both are provided with the first suction hole 5 and the second suction hole 6. The raised adsorption table 14 can adapt to wafer sheets with curvature and warping, ensuring that the first suction hole 5 and the second suction hole 6 can better fit the wafer sheet to complete the adsorption action.

[0027] In this embodiment, the first air duct 3 includes a first adsorption air section 32 arranged in the adsorption part 12 and a first exhaust air section 31 arranged in the mounting part 11; the second air duct 4 includes a second adsorption air section 42 arranged in the adsorption part 12 and a second exhaust air section 41 arranged in the mounting part 11; the second adsorption air section 42 and the first adsorption air section 32 are located in the same horizontal plane; the second adsorption air section 42 and the first adsorption air section 32 are both U-shaped air sections, distributed in the adsorption part 12, and the second adsorption air section 42 and the first adsorption air section 32 are located in the same horizontal plane, which can ensure that under the same vacuum exhaust state, the adsorption force on the wafer will not cause a large difference due to the problem of the air duct, thereby further improving the stability of adsorption.

[0028] In the present embodiment, the first adsorption air section 32 and the first air extraction air section 31 are located at the same horizontal plane and are directly connected; the second adsorption air section 42 is lower than the second air extraction air section 41, and the second adsorption air section 42 and the second air extraction air section 41 are connected through the sinking air section 43; because the second adsorption air section 42 and the first adsorption air section 32 are located at the same horizontal plane, in order to ensure that the airway designs do not interfere with each other, the first adsorption air section 32 and the first air extraction air section 31 are located at the same horizontal plane and are directly connected, and the second air extraction air section 41 is higher than the second adsorption air section 41, thereby ensuring the smoothness and stability of the vacuum adsorption action.

[0029] In this embodiment, a positioning hole 2 is formed at one end of the mounting portion 11 away from the adsorption portion 12, and the positioning hole 2 is used to connect the substrate 1 to an external robot arm;

[0030] In this embodiment, the substrate 1 is made of ceramic integral molding;

[0031] The specific embodiments described herein are merely examples of the spirit of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in similar ways, but they will not deviate from the scope defined by the spirit of the present invention.

Claims

1. A vacuum adsorption robot for transporting wafers, comprising a substrate (1) and a vacuum air channel arranged inside the substrate (1), characterized in that: The vacuum air channel comprises a first air channel (3) and a second air channel (4); the first air channel (3) and the second air channel (4) are connected to an external vacuum source by using a first air hole (7) and a second air hole (8) respectively to perform vacuum extraction; the substrate (1) is provided with a first suction hole (5) and a second suction hole (6) respectively connected to the first air channel (3) and the second air channel (4); The base plate (1) comprises a mounting portion (11) and an adsorption portion (12); the adsorption portion (12) is provided with a functional groove (13) for expansion installation; the first suction hole (5) and the second suction hole (6) are distributed on both sides of the functional groove (13); The first air channel (3) comprises a first air adsorption section (32) arranged in the adsorption part (12) and a first air extraction section (31) arranged in the mounting part (11); the second air channel (4) comprises a second air adsorption section (42) arranged in the adsorption part (12) and a second air extraction section (41) arranged in the mounting part (11); The second adsorption air section (42) is located below the second air extraction air section (41), and the second adsorption air section (42) is connected to the second air extraction air section (41) via a downward air section (43).

2. A vacuum adsorption robot for transporting wafers according to claim 1, characterized in that: A plurality of adsorption surfaces (14) are provided on one end surface of the adsorption portion (12); the first adsorption hole (5) and the second adsorption hole (6) are arranged in the adsorption surface (14).

3. The vacuum adsorption robot for transporting wafers according to claim 1, characterized in that: The first suction hole (5) is arranged on the outer side away from the functional groove (13), and the second suction hole (6) is arranged on the inner side close to the functional groove (13).

4. The vacuum adsorption robot for transporting wafers according to claim 1, characterized in that: The second adsorption gas section (42) and the first adsorption gas section (32) are located on the same horizontal plane.

5. The vacuum adsorption robot for transporting wafers according to claim 1, characterized in that: The first air adsorption section (32) and the first air extraction section (31) are located on the same horizontal plane and are connected.

6. The vacuum adsorption robot for transporting wafers according to claim 1, characterized in that: A positioning hole (2) is provided on one end of the mounting portion (11) away from the adsorption portion (12), and the positioning hole (2) is used to connect the substrate (1) to an external robot arm.

7. A vacuum adsorption robot for transporting wafers according to any one of claims 1 to 6, characterized in that: The substrate (1) is made of ceramic in one piece.

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