Wafer taking device suitable for silicon wafer

Abstract

The wafer taking device comprises a supporting rod and a moving mechanism used for driving the supporting rod to move, the supporting rod comprises a supporting rod body and a containing groove formed in the supporting rod body, and the containing groove is provided with a bottom face and inclined faces located on the two sides of the bottom face. The inclined surface inclines towards one side far away from the bottom surface from bottom to top; the minimum distance between the two inclined faces is smaller than the length or width of the silicon wafer, the maximum distance between the two inclined faces is larger than the length or width of the silicon wafer, and when the silicon wafer is located on the supporting rod, the edge of the silicon wafer makes contact with the inclined faces. According to the wafer taking device suitable for the silicon wafer, by adopting the supporting rod with a special structure, when the silicon wafer is taken and placed, the edge of the silicon wafer is propped against the inclined surface, and the front surface or the back surface of the silicon wafer cannot be contacted with the bottom of the accommodating groove, so that the process surface of the silicon wafer is prevented from being polluted and damaged.

Description

Technical Field

[0001] The utility model specifically relates to a wafer taking device suitable for silicon wafers used in solar cell wafers, which realizes contactless wafer taking. Background Art

[0002] During the processing of solar cells, due to the particularity of the new process, the front and back of the silicon wafer need to avoid contact with anything to prevent the process surface (the front and back of the silicon wafer) from being contaminated and damaged, which in turn affects the conversion efficiency and appearance of the final finished cell.

[0003] At present, conventional wafer discharging mechanisms all use belt transmission to lower the silicon wafers in the silicon wafer buffer mechanism onto the belt, and the silicon wafers are transferred out through the friction force of the belt contacting the silicon wafers. However, this wafer discharging method is bound to have an adverse effect on the process surface of the silicon wafer. Utility Model Content

[0004] In view of this, in order to solve the problems of the prior art, the utility model provides an improved wafer taking device, which can prevent contact with the process surface of the silicon wafer.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A wafer-taking device suitable for silicon wafers, comprising a supporting rod and a moving mechanism for driving the supporting rod to move, wherein the supporting rod comprises a supporting rod body and a receiving groove provided on the supporting rod body, wherein the receiving groove has a bottom surface and inclined surfaces located on both sides of the bottom surface, wherein the inclined surfaces are inclined from bottom to top toward a side away from the bottom surface; the minimum distance between the two inclined surfaces is less than the length or width of the silicon wafer, and the maximum distance between the two inclined surfaces is greater than the length or width of the silicon wafer, and when the silicon wafer is located on the supporting rod, the edge (edge) of the silicon wafer contacts the inclined surface. Preferably, the inclined surfaces on both sides are symmetrically arranged about the midpoint of the length direction of the bottom surface of the receiving groove.

[0007] According to some preferred implementation aspects of the utility model, the support rod extends in the horizontal direction; the wafer taking device is provided with two support rods corresponding to a silicon wafer, and the distance between the two support rods is less than the length or width of the silicon wafer. The support rod extending in the horizontal direction is used to extend into the silicon wafer cache mechanism to take and place the silicon wafer, and the spacing is less than the length or width of the silicon wafer to facilitate smoother taking and placing.

[0008] According to some preferred implementation aspects of the present invention, the accommodating groove has a blocking surface extending upward from a side of the inclined surface away from the bottom surface, so as to block the movement of the silicon wafer.

[0009] According to some preferred implementation aspects of the utility model, the angle between the inclined plane and the horizontal plane is 10-45°.

[0010] According to some preferred implementation aspects of the utility model, an air outlet is provided at the bottom of the support rod, an air inlet is provided at the top of the support rod, the air inlet is connected to the receiving groove and the air outlet, and the air outlet is connected to a vacuum pumping mechanism. The vacuum pumping mechanism is used to vacuumize the air inlet, so that a negative pressure is formed in the air inlet, thereby generating a certain suction force on the silicon wafer to prevent the silicon wafer from moving on the support rod.

[0011] According to some preferred implementation aspects of the utility model, the bottom of the receiving groove is evenly spaced with multiple air inlets. Preferably, the multiple air inlets are symmetrically arranged about the midpoint of the length direction of the bottom surface of the receiving groove to ensure balanced suction, uniform force on the silicon wafer, and prevent the silicon wafer from moving.

[0012] According to some preferred implementation aspects of the utility model, the moving mechanism includes a vertical moving assembly for driving the support rod to move in a vertical direction, the vertical moving assembly includes a vertical guide rail, a vertical slider and a vertical driver, the vertical driver is used to drive the vertical slider to slide on the vertical guide rail, and the vertical slider is used to be connected to the support rod.

[0013] According to some preferred implementation aspects of the utility model, the moving mechanism includes a horizontal moving assembly for driving the support rod to move in a horizontal direction, the horizontal moving assembly includes a horizontal guide rail, a horizontal slider and a horizontal driver, the horizontal driver is used to drive the horizontal slider to slide on the horizontal guide rail, and the horizontal slider is used to connect with the vertical moving assembly.

[0014] The vertical moving component is used to rise and hold the silicon wafer in the cache mechanism, and to lower the silicon wafer and place it on the silicon wafer transmission device for transmission; the horizontal moving component is used to drive the support rod to enter and exit the cache mechanism horizontally.

[0015] According to some preferred implementation aspects of the utility model, a connecting mechanism is included for connecting the support rod and the moving mechanism, the connecting mechanism includes a connecting plate and a connecting rod connecting the two connecting plates, the connecting rod is connected to the vertical slider. Both connecting plates are fixed on the connecting rod and are driven to move by the moving mechanism through the connecting rod.

[0016] According to some preferred implementation aspects of the utility model, the connecting plate includes a horizontal part and a vertical part, the lower part of the vertical part is connected to the vertical moving assembly, the upper part of the vertical part is connected to the horizontal part, and one end of the horizontal part away from the vertical part is connected to the support rod.

[0017] Compared with the prior art, the utility model is advantageous in that the wafer taking device suitable for silicon wafers of the utility model adopts a support rod with a special structure, so that when the silicon wafer is taken and placed, the edge (edge) of the silicon wafer contacts the inclined surface, and the front or back side of the silicon wafer does not contact the bottom of the receiving groove, thereby avoiding contamination and damage to the process surface of the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of a contactless conveying device for silicon wafers used in solar cells according to an embodiment of the present invention;

[0020] Figure 2 It is a schematic diagram of the three-dimensional structure of the transmission device and the film taking device in the embodiment of the present invention;

[0021] Figure 3 A schematic diagram of the three-dimensional structure of a transmission device in an embodiment of the present invention;

[0022] Figure 4 is a schematic diagram of the three-dimensional structure of the transmission device in another viewing angle in an embodiment of the present invention;

[0023] Figure 5 Schematic diagram of the exploded structure of the steam floating plate assembly in an embodiment of the present invention;

[0024] Figure 6 It is a perspective structural diagram of a steam floating plate assembly in an embodiment of the present invention;

[0025] Figure 7 It is a schematic diagram of the three-dimensional structure of the auxiliary suspension mechanism in an embodiment of the present invention;

[0026] Figure 8 A schematic diagram of the cross-sectional structure of the auxiliary suspension mechanism in an embodiment of the present invention;

[0027] Fig. 9 It is a schematic diagram of the structure of the air outlet holes on the top plate of the steam floating plate assembly according to an embodiment of the present invention;

[0028] Fig.10 It is a schematic diagram of the three-dimensional structure of the film taking device in an embodiment of the present invention;

[0029] Fig.11 It is a schematic diagram of the three-dimensional structure of the support rod in the embodiment of the present invention;

[0030] Fig.12 It is a schematic diagram of the cross-sectional structure of the support rod in an embodiment of the present invention;

[0031] In the attached drawings, silicon wafer 1, first cache mechanism 2, second cache mechanism 3, supporting block 31, transmission device 4, mounting plate 41, movable groove 411, steam flotation plate assembly 42, top plate 421, air outlet 4211, side plate 422, bottom plate 423, air inlet 4231, transverse partition plate 424, through hole 4241, first pressure stabilizing chamber 425, second pressure stabilizing chamber 426, vertical partition plate 427, driving mechanism 43, transmission crawler 431, block 432, driving wheel 433, driven wheel 434, driver 435, connecting shaft 436, main driving wheel 437, slave driving wheel 438, mounting hole 439, positioner -4310, auxiliary suspension mechanism-44, suspension block body-441, auxiliary air inlet hole-442, auxiliary air outlet hole-443, auxiliary flow channel-444, film taking device-5, support rod-51, support rod body-511, accommodating groove-512, bottom surface-513, inclined surface-514, blocking surface-515, air suction port-516, air suction port-517, air suction channel-518, vertical moving component-52, vertical guide rail-521, vertical slider-522, vertical driver-523, horizontal moving component-53, horizontal guide rail-531, horizontal slider-532, horizontal driver-533, connecting plate-54, horizontal part-541, vertical part-542, connecting rod-55. DETAILED DESCRIPTION

[0032] In order to enable those skilled in the art to better understand the technical solution of the present invention, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0033] like Figure 1-Figure 12As shown, the contactless conveying device for silicon wafers 1 for solar cells of this embodiment is used to take the wafer from the first cache mechanism 2, perform contactless transmission of the silicon wafer 1, and then put the wafer into the second cache mechanism 3. In other embodiments, it can also be used only for contactless transmission of the silicon wafer 1 after taking the wafer from the first cache mechanism 2, or for putting the wafer into the second cache mechanism 3 after contactless transmission of the silicon wafer 1. The second cache mechanism 3 in this embodiment is provided with a supporting block 31 for supporting the silicon wafer 1. The supporting block 31 is conical and is used to contact with the edge of the silicon wafer 1 to avoid contact with the process surface of the silicon wafer 1. The silicon wafer 1 in the present invention is rectangular, such as 210mm×210mm, 182mm×182mm, etc., with a thickness of 110 to 130um.

[0034] The contactless conveying device in this embodiment includes a transmission device 4 and a wafer taking device 5 located between the first buffer mechanism 2 and the second buffer mechanism 3. The transmission device 4 is used to realize contactless transmission. The wafer taking device 5 is arranged close to the first buffer mechanism 2 and is used to take out the silicon wafer 1 in the first buffer mechanism 2 and place it on the transmission device 4. The following is a detailed description of each component:

[0035] The transmission device 4 includes a mounting plate 41, a pneumatic suspension mechanism and a driving mechanism 43 arranged on the mounting plate 41, wherein the pneumatic suspension mechanism includes a pneumatic suspension plate assembly 42. Further preferably, an auxiliary suspension mechanism 44 is provided between the pneumatic suspension mechanism and the driving mechanism 43. The driving mechanism 43 includes a conveying crawler 431 and a driving assembly for driving the conveying crawler 431 to move, and a stopper 432 is provided on the conveying crawler 431 to contact the side of the silicon wafer 1.

[0036] The steam flotation plate assembly 42 includes a bottom plate 423, a side plate 422, a top plate 421, and a transverse partition plate 424 disposed between the bottom plate 423 and the top plate 421. The bottom plate 423 is provided with an air inlet hole 4231, and the top plate 421 is provided with an air outlet hole 4211 for gas to flow out. The transverse partition plate 424 is provided with a through hole 4241; a first pressure stabilizing chamber 425 is formed between the transverse partition plate 424 and the bottom plate 423, and a second pressure stabilizing chamber 426 is formed between the transverse partition plate 424 and the top plate 421. By providing two pressure stabilizing chambers, the air pressure can be further stabilized. The air inlet hole 4231 is connected to a high-pressure gas source to deliver high-pressure gas to the pressure stabilizing chamber.

[0037] Preferably, a vertical partition plate 427 is provided between the horizontal partition plate 424 and the top plate 421 to separate the second pressure stabilizing chamber 426; a through hole 4241 corresponding to each of the separated second pressure stabilizing chambers 426 is provided on the horizontal partition plate 424 to further stabilize the air pressure. In each steam floating plate assembly 42, the area of ​​the air inlet hole 4231 is larger than the area of ​​all the through holes 4241; the area of ​​all the through holes 4241 is larger than the area of ​​all the air outlet holes 4211, so as to ensure the continuous and stable output of the air pressure and avoid the reduction of the air pressure.

[0038] Furthermore, in the present embodiment, an air inlet hole 4231 is provided on the bottom plate 423 of each steam floating plate assembly 42, and the air inlet hole 4231 is located at the center of the bottom plate 423. The steam floating plate assembly 42 has four second pressure stabilizing chambers 426 separated by vertical partition plates 427, and there is no overlapping part between the projections of the air inlet hole 4231 and the through hole 4241 on the horizontal plane, so as to prevent excessive air pressure from directly flowing out through the through hole 4241 and the air outlet hole 4211, causing unstable air pressure.

[0039] The pneumatic suspension mechanism includes a first suspension mechanism close to the first cache mechanism 2 and a second suspension mechanism close to the second cache mechanism 3. It further includes an intermediate suspension mechanism located between the first suspension mechanism and the second suspension mechanism. The air outlet holes 4211 on the first suspension mechanism, the second suspension mechanism, and the intermediate suspension mechanism are vertically or inclinedly arranged.

[0040] In this embodiment, the air outlet 4211 on the first suspension mechanism is inclined from bottom to top toward the second cache mechanism 3, and the air outlet 4211 on the second suspension mechanism is inclined from bottom to top toward the first cache mechanism 2. Through the inclined setting of the air outlet 4211 of the first suspension mechanism, the silicon wafer 1 can have an initial forward movement state to avoid collision caused by backward movement; through the inclined setting of the air outlet 4211 of the second suspension mechanism, the movement speed of the silicon wafer 1 is slowed down, and its speed when entering the wafer is reduced to avoid speeding up and touching other objects and damaging the silicon wafer 1. When the air outlet 4211 on the middle suspension mechanism adopts the same inclined setting as the second suspension mechanism, the suspension and forward movement of the silicon wafer 1 can be achieved by relying on the airflow of the suspension mechanism. At this time, the block 432 on the conveying crawler 431 is mainly used to separate the front and rear silicon wafers 1 to prevent collision between the silicon wafers 1 and cause damage.

[0041] Seen from the cross section perpendicular to the transmission direction of the silicon wafer 1, the air outlet holes 4211 on each steam floating plate assembly 42 are inclined from bottom to top toward the middle position of the steam floating plate assembly 42, that is, inclined inward, so as to ensure the centering of the silicon wafer 1 during the transmission process and prevent the silicon wafer 1 from moving outward and contacting the conveying crawler 431. Preferably, seen from the cross section perpendicular to the transmission direction of the silicon wafer 1, the angle between the outlet air flow direction of the air outlet holes 4211 on the top plate 421 and the horizontal plane gradually increases from the side close to the middle position of the steam floating plate assembly 42 to the side close to the edge position of the steam floating plate assembly 42. Specifically, the angle between the side wall of the air outlet hole 4211 close to the middle position of the steam floating plate assembly 42 and the horizontal plane gradually increases from the side close to the middle position of the steam floating plate assembly 42 to the side close to the edge position of the steam floating plate assembly 42, so as to ensure the transmission effect and centering, such as Fig. 9 Preferably, the angle between the side wall of the air outlet 4211 away from the middle of the steam floating plate assembly 42 and the horizontal plane remains unchanged, so that the outlet size of the air outlet 4211 remains unchanged, and the inlet size gradually increases from the side close to the middle of the steam floating plate assembly 42 to the side close to the edge of the steam floating plate assembly 42.

[0042] That is, the air outlet 4211 on the pneumatic suspension mechanism can have two-dimensional tilt directions, one is parallel to the transmission direction of the silicon wafer 1, which is used to assist (speed up or slow down) the transmission of the silicon wafer 1, and the other is perpendicular to the transmission direction of the silicon wafer 1, which is used to center the silicon wafer 1 during transmission.

[0043] The auxiliary suspension mechanism 44 includes a suspension block body 441, an auxiliary air inlet 442 provided on the bottom of the suspension block body 441, an auxiliary air outlet 443 provided on the top of the suspension block body 441, and an auxiliary flow channel 444 provided inside the suspension block body 441. The auxiliary air inlet 442 and the auxiliary air outlet 443 are connected through the auxiliary flow channel 444, and the auxiliary air inlet 442 is connected to the high-pressure gas source. The auxiliary air outlet 443 is vertically arranged or inclined. There is no overlap of the projections of the auxiliary air outlet 443 and the auxiliary air inlet 442 on the horizontal plane, and the connection through the auxiliary flow channel 444 ensures the balance and stability of the air pressure of each auxiliary air outlet 443.

[0044] The auxiliary suspension mechanism 44 includes a first auxiliary mechanism close to the first cache mechanism 2 and a second auxiliary mechanism close to the second cache mechanism 3. The auxiliary air outlet holes 443 on the first auxiliary mechanism and the second auxiliary mechanism are inclined in opposite directions. The air outlet holes 4211 on the first auxiliary mechanism are inclined from bottom to top toward the second cache mechanism 3; the air outlet holes 4211 on the second auxiliary mechanism are inclined from bottom to top toward the first cache mechanism 2.

[0045] Preferably, the suspension block body 441 is provided with multiple rows of auxiliary air outlet holes 443, and the auxiliary air outlet holes 443 are inclined from bottom to top toward the steam flotation plate assembly 42 in a cross section perpendicular to the transmission direction of the silicon wafer 1, so as to ensure the centering of the silicon wafer 1 during the transmission process and avoid contact with the conveying crawler 431.

[0046] More preferably, the angle between the outlet air flow direction of the multiple rows of auxiliary air outlet holes 443 and the horizontal plane gradually increases from the side close to the steam floating plate assembly 42 to the side away from the steam floating plate assembly 42. Specifically, the angle between the side wall of the auxiliary air outlet hole 443 close to the suspension mechanism and the horizontal plane gradually increases from the side close to the pneumatic suspension mechanism to the side away from the pneumatic suspension mechanism, ensuring the transmission effect and centering. Preferably, the angle between the side wall of the auxiliary air outlet hole 443 away from the steam floating plate assembly and the horizontal plane remains unchanged, so that the outlet size of the auxiliary air outlet hole 443 remains unchanged, and the inlet size gradually increases from the side close to the pneumatic suspension mechanism to the side away from the pneumatic suspension mechanism.

[0047] That is, the auxiliary air outlet 443 has two-dimensional tilt directions, one is parallel to the transmission direction of the silicon wafer 1, used to assist (accelerate or slow down) the transmission of the silicon wafer 1, and the other is perpendicular to the transmission direction of the silicon wafer 1, used to center the silicon wafer 1 during transmission.

[0048] The auxiliary air outlet 443 of the auxiliary suspension mechanism 44 and the air outlet 4211 of the pneumatic suspension mechanism are rectangular or conical. The conical air outlet 4211 can increase the air flow of the exhaust and facilitate suspension. When the air outlet 4211 on the pneumatic suspension mechanism and the auxiliary suspension mechanism 44 are both inclined, the two functions are similar, and one or a combination is selected to achieve the corresponding function. In this embodiment, the auxiliary air outlet 443 on the auxiliary suspension mechanism 44 is preferably inclined to achieve auxiliary transmission and centering, and the air outlet 4211 on the pneumatic suspension mechanism is vertical and rectangular. At the same time, the auxiliary suspension mechanism 44 and the pneumatic suspension mechanism are independently connected to two high-pressure air sources for easy control. At this time, the conveying crawler 431 and the block 432 thereon play a blocking and limiting role to prevent the silicon wafer 1 from deviating from the predetermined track. The block 432 is used to block between the front and rear two silicon wafers 1 to avoid collision between the front and rear two silicon wafers 1. The width of the block 432 in the up and down direction is greater than the total thickness of the two silicon wafers 1.

[0049] Furthermore, the apertures of the air outlet holes 4211 and the auxiliary air outlet holes 443 are 1.0-3.0 mm, preferably 1.5 mm, with a hole spacing of 20-30 mm, and an input air pressure of more than 6 bar, which is set by the pressure reducing valve and the flow valve, and the corresponding air outlet pressure is adjusted according to the weight of silicon wafers of different specifications.

[0050] The auxiliary suspension mechanism 44 and the pneumatic suspension mechanism in this embodiment are modularly designed and can be connected in series according to different transmission lengths, and are convenient for installation, disassembly and maintenance. The upper and lower double pressure chambers of the pneumatic suspension mechanism are designed to stabilize the silicon wafer 1 and ensure that the front and back of the silicon wafer 1 do not touch any object.

[0051] Furthermore, the auxiliary air outlet 443 of the auxiliary suspension mechanism 44 and the air outlet 4211 of the pneumatic suspension mechanism are both arranged at an angle, so as to better realize the suspension and forward movement of the silicon wafer 1 .

[0052] In this embodiment, the driving mechanism 43 is located on both sides of the length or width direction of the silicon wafer 1, and the conveying crawler 431 rotates in a horizontal plane; the distance between the two conveying crawlers 431 is greater than the length or width of the silicon wafer 1. The conveying crawlers 431 on both sides of the silicon wafer 1 rotate in opposite directions, and a space for accommodating the silicon wafer 1 is formed between the corresponding blocks 432 on the two conveying crawlers 431 and pushing the silicon wafer 1 forward, and the distance between two adjacent blocks 432 on each conveying crawler 431 is less than the length or width of the silicon wafer 1.

[0053] The stopper 432 is used to block between the front and rear silicon wafers 1 to prevent the front and rear silicon wafers 1 from touching each other; the stopper 432 on the conveyor belt 431 extends toward the silicon wafer 1, and the direction is parallel to the plane where the silicon wafer 1 is located. That is, the stopper 432 extends horizontally from the conveyor belt 431 located outside the side of the silicon wafer 1 toward the direction close to the silicon wafer 1. The mounting plate 41 has a positioner 4310 for monitoring the position of the stopper 432.

[0054] The driving assembly includes a driving wheel 433 and a driven wheel 434 arranged in the conveying crawler 431, and a driver 435 for driving the driving wheel 433 to rotate. The driver 435 is installed below the mounting plate 41, a connecting shaft 436 is arranged between the driving wheel 433 and the driver 435, and a mounting hole 439 is opened on the mounting plate 41 for the connecting shaft 436 to pass through.

[0055] Preferably, the two driving mechanisms 43 on both sides of the silicon wafer 1 are driven by a driver 435. Specifically, a main driving wheel 437 and a slave driving wheel 438 in contact with each other are provided below the mounting plate 41. The main driving wheel 437 is driven by a belt to the output shaft of the driver 435, and the slave driving wheel 438 is driven by a belt to the connecting shaft 436 below the driving wheel 433 of another driving component. That is, two sets of conveyor belts 431 are driven to move by one driver 435, which saves cost and space, and can ensure the synchronous movement of the two conveyor belts 431.

[0056] More preferably, the mounting hole 439 on the mounting plate 41 is a waist-shaped hole, which is opened perpendicular to the length direction of the conveying crawler 431 to adjust the spacing between the two conveying crawlers 431, suitable for silicon wafers 1 of different specifications. At the same time, the two driving components are adjusted synchronously to keep the silicon wafer 1 in the middle during transmission, avoiding instability in the transmission of the silicon wafer 1.

[0057] The wafer taking device 5 in this embodiment includes a supporting rod 51 and a moving mechanism for driving the supporting rod 51 to move. The supporting rod 51 includes a supporting rod body 511 and a receiving groove 512 opened on the supporting rod body 511. The receiving groove 512 has a bottom surface 513, inclined surfaces 514 located on both sides of the bottom surface 513, and a blocking surface 515 extending upward from the inclined surface 514 away from the bottom surface 513 to block the movement of the silicon wafer 1.

[0058] The inclined surface 514 is inclined from bottom to top toward the side away from the bottom surface 513; the angle between the inclined surface 514 and the horizontal plane is 10-45°, preferably 10-15°. The minimum distance between the two inclined surfaces 514 is less than the length or width of the silicon wafer 1, and the maximum distance between the two inclined surfaces 514 is greater than the length or width of the silicon wafer 1. When the silicon wafer 1 is located on the supporting rod 51, the edge (edge) of the silicon wafer 1 is in line contact with the inclined surface 514. Preferably, the inclined surfaces 514 on both sides are symmetrically arranged about the midpoint of the length direction of the bottom surface 513 of the receiving groove 512.

[0059] The supporting rod 51 extends in the horizontal direction; the wafer taking device 5 is provided with two supporting rods 51 corresponding to one silicon wafer 1, and the distance between the two supporting rods 51 is less than the length or width of the silicon wafer 1. The supporting rod 51 extending in the horizontal direction is used to extend into the first buffer mechanism 2 of the silicon wafer 1 to take out the silicon wafer 1, and the spacing is less than the length or width of the silicon wafer 1 for more stable taking and placing; the distance between the two supporting rods 51 is greater than the distance between the outer sides of the two auxiliary suspension mechanisms 44, so as to facilitate moving outside the auxiliary suspension mechanism 44 to take and place the silicon wafer 1.

[0060] The bottom of the supporting rod body 511 is provided with an air extraction port 516, the top of the supporting rod body 511 is provided with an air suction port 517, and the supporting rod body 511 is provided with an air extraction flow channel 518 connecting the air extraction port 516 and the air suction port 517. The air suction port 517 connects the receiving groove 512 and the air extraction port 516, and the air extraction port 516 is connected to the vacuum pumping mechanism. The vacuum pumping mechanism is used to vacuumize the air suction port 517, so that the air suction port 517 is under negative pressure, thereby generating a certain suction force on the silicon wafer 1 to prevent the silicon wafer 1 from moving on the supporting rod 51. And there is no overlap between the projections of the air suction port 517 and the air extraction port 516 on the horizontal plane to ensure the balance and stability of the air pressure. The bottom of the receiving groove 512 is evenly spaced with multiple air suction ports 517. Preferably, the multiple air suction ports 517 are symmetrically arranged about the midpoint of the length direction of the bottom surface 513 of the receiving groove 512 to ensure the balance of the suction force, the uniform force on the silicon wafer 1, and the movement of the silicon wafer 1.

[0061] The moving mechanism in this embodiment includes a vertical moving assembly 52 for driving the support rod 51 to move in the vertical direction, a horizontal moving assembly 53 for driving the support rod 51 to move in the horizontal direction, and a connecting mechanism for connecting the support rod 51 and the moving mechanism. The vertical moving assembly 52 includes a vertical guide rail 521, a vertical slider 522 and a vertical driver 523. The vertical driver 523 is used to drive the vertical slider 522 to slide on the vertical guide rail 521, and the vertical slider 522 is used to connect with the connecting mechanism. The horizontal moving assembly 53 includes a horizontal guide rail 531, a horizontal slider 532 and a horizontal driver 533. The horizontal driver 533 is used to drive the horizontal slider 532 to slide on the horizontal guide rail 531, and the horizontal slider 532 is used to connect with the vertical moving assembly 52. ​​The vertical moving assembly 52 is used to rise and hold the silicon wafer 1 in the cache mechanism, and to lower the silicon wafer 1 and place it on the silicon wafer 1 transmission device 4 for transmission; the horizontal moving assembly 53 is used to drive the support rod 51 to enter and exit the cache mechanism horizontally.

[0062] The connecting mechanism includes a connecting plate 54 and a connecting rod 55 connecting the two connecting plates 54, and the connecting rod 55 is connected to the vertical slider 522. The two connecting plates 54 are fixed on the two ends of the connecting rod 55, and are driven to move by the moving mechanism through the connecting rod 55. The connecting plate 54 includes a horizontal portion 541 and a vertical portion 542, the lower portion of the vertical portion 542 is connected to the vertical moving component 52, the upper portion of the vertical portion 542 is connected to the horizontal portion 541, and the end of the horizontal portion 541 away from the vertical portion 542 is connected to the support rod 51. The mounting plate 41 of the transmission device 4 close to the first cache mechanism 2 is provided with a movable groove 411 for the connecting plate 54 and the support rod 51 of the film-taking device 5 to move.

[0063] The following briefly describes the working process of the contactless conveying device for the silicon wafer 1 for solar cells in this embodiment:

[0064] After the silicon wafer 1 is loaded, the first buffer mechanism 2 moves to a suitable position.

[0065] The initial position of the support rod 51 of the wafer taking device 5 is below the mounting plate 41. The support rod 51 of the wafer taking device 5 enters the first cache mechanism 2 under the drive of the horizontal moving component 53 and is located below the silicon wafer 1 at the bottom of the first cache mechanism 2. The vertical moving component 52 drives the support rod 51 to rise, and the silicon wafer 1 is separated from the support position of the card slot in the first cache mechanism 2, so that the silicon wafer 1 is completely separated from the first cache mechanism 2. At the same time, under the action of the vacuum mechanism, the silicon wafer 1 is adsorbed on the support rod 51 to prevent the silicon wafer 1 from moving during the lateral movement. The silicon wafer 1 contacts the inclined surface 514 of the support rod 51 through the edge of the silicon wafer 1 on the support rod 51, so as to prevent the front and back of the silicon wafer 1 from contacting any object.

[0066] Driven by the horizontal moving assembly 53, the supporting rod 51 of the wafer taking device 5 drives the silicon wafer 1 to withdraw from the first buffer mechanism 2. After withdrawing to a suitable position, driven by the vertical moving assembly 52, the supporting rod 51 descends, and the vacuum pumping mechanism corresponding to the supporting rod 51 is closed, and the silicon wafer 1 is placed above the steam floating plate assembly 42. Under the action of the steam floating plate assembly 42 and / or the auxiliary suspension mechanism 44, the silicon wafer 1 is suspended and moves forward. At the same time, the first buffer mechanism 2 drives the silicon wafer 1 to move downward a fixed distance to ensure that the horizontal height position of each wafer taking remains unchanged.

[0067] After the support rod 51 of the film taking device 5 drops to the specified position, it reenters the first buffer mechanism 2 under the drive of the horizontal moving assembly 53 to take the film, and the film taking height remains the same. This is repeated to continuously take the film.

[0068] When the silicon wafer 1 moves to the vicinity of the second cache mechanism 3 under the action of the steam floating plate assembly 42 and the auxiliary suspension mechanism 44, the speed of the silicon wafer 1 is reduced under the action of the second suspension mechanism and / or the second auxiliary mechanism, and the silicon wafer 1 enters the second cache mechanism 3 and falls on the supporting block 31. The edge of the silicon wafer 1 is in line contact with the supporting block 31, and the wafer is inserted.

[0069] In some embodiments, the film taking device 5 in this embodiment can also perform a film inserting action, and its action process is opposite to the film taking process, which will not be repeated here.

[0070] The above embodiments prepared by the method of the present invention are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit and essence of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer removal device suitable for silicon wafers, characterized in that: It includes a supporting rod and a moving mechanism for driving the supporting rod to move, the supporting rod includes a supporting rod body and a receiving groove opened on the supporting rod body, the receiving groove has a bottom surface and inclined surfaces located on both sides of the bottom surface, and the inclined surfaces are inclined from bottom to top toward a side away from the bottom surface; the minimum distance between the two inclined surfaces is less than the length or width of the silicon wafer, and the maximum distance between the two inclined surfaces is greater than the length or width of the silicon wafer, and when the silicon wafer is located on the supporting rod, the edge of the silicon wafer contacts the inclined surface.

2. The film taking device according to claim 1, characterized in that: The supporting rod extends in the horizontal direction; the wafer taking device is provided with two supporting rods corresponding to one silicon wafer, and the distance between the two supporting rods is smaller than the length or width of the silicon wafer.

3. The film taking device according to claim 1, characterized in that: The accommodating groove has a blocking surface extending upward from a side of the inclined surface away from the bottom surface.

4. The film taking device according to claim 1, characterized in that: The angle between the inclined plane and the horizontal plane is 10-45°.

5. The film taking device according to claim 1, characterized in that: An air outlet is provided at the bottom of the support rod, an air inlet is provided at the top of the support rod, the air inlet is connected to the containing groove and the air outlet, and the air outlet is connected to the vacuum pumping mechanism.

6. The film taking device according to claim 5, characterized in that: The bottom of the containing tank is evenly spaced with a plurality of air inlets.

7. The film taking device according to any one of claims 1 to 6, characterized in that: The moving mechanism includes a vertical moving component for driving the support rod to move in the vertical direction. The vertical moving component includes a vertical guide rail, a vertical slider and a vertical driver. The vertical driver is used to drive the vertical slider to slide on the vertical guide rail, and the vertical slider is used to connect with the support rod.

8. The film taking device according to claim 7, characterized in that: The moving mechanism includes a horizontal moving component for driving the support rod to move in the horizontal direction. The horizontal moving component includes a horizontal guide rail, a horizontal slider and a horizontal driver. The horizontal driver is used to drive the horizontal slider to slide on the horizontal guide rail. The horizontal slider is used to connect with the vertical moving component.

9. The film taking device according to claim 8, characterized in that: It comprises a connecting mechanism for connecting the supporting rod and the moving mechanism, wherein the connecting mechanism comprises a connecting plate and a connecting rod connecting the two connecting plates, and the connecting rod is connected to the vertical sliding block.

10. The film taking device according to claim 9, characterized in that: The connecting plate comprises a horizontal part and a vertical part, the lower part of the vertical part is connected to the vertical moving assembly, the upper part of the vertical part is connected to the horizontal part, and one end of the horizontal part away from the vertical part is connected to the supporting rod.

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