Camera heat dissipation structure
By designing a detachable heat dissipation plate, thermal column and heat dissipation fin structure in the camera, the existing camera's poor heat dissipation effect and difficult maintenance are solved, and better heat dissipation effect and more convenient maintenance operations are achieved.
Patent Information
- Application Number
- CN202420860919.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-24
- Publication Date
- 2025-04-18
- Estimated Expiration
- 2034-04-24
AI Technical Summary
The existing cameras have poor heat dissipation effect, resulting in shortening of service life, and the heat sink is difficult to disassemble and difficult to maintain and operate.
A camera heat dissipation structure including a heat dissipation plate, a heat conduction column and a heat dissipation fin is designed. The heat dissipation plate is detachably connected to the PCB board through the connecting member, and the heat conduction column and a heat dissipation fin are provided on the heat dissipation plate to increase the heat conduction area and the heat dissipation area.
It improves the overall heat dissipation effect of PCBA, extends the service life of the camera, and makes the post-cleaning and maintenance operation more convenient.
Smart Images
Figure CN222776271U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of cameras, in particular to a camera heat dissipation structure. Background Art
[0002] Most existing cameras are composed of a housing, a shooting module, a PCBA and a heat sink, wherein the PCBA includes a PCB board and multiple electronic components welded in the middle of the PCB board. When in use, the heat sink is attached to the PCB board to increase the heat dissipation area of the PCB board during operation, and then the heat dissipation effect is achieved through multiple heat dissipation holes set on the housing.
[0003] However, in actual applications, since electronic components form multiple uneven protrusions in the middle of the PCB board, the heat conduction area where the heat sink can contact the PCB board is very small. Most heat sinks can only contact and conduct heat with the electronic components with the highest protrusions, resulting in poor overall heat dissipation effect of the PCBA and shortening the service life of the camera. In addition, since dust enters the casing through the heat dissipation holes, it is easy to adhere to the PCBA, and most heat sinks are fixed to the PCB board by welding or bonding and are difficult to remove, resulting in considerable difficulty in the subsequent cleaning and maintenance of the PCBA and poor practicality. Utility Model Content
[0004] The purpose of the utility model is to provide a camera heat dissipation structure to address the above-mentioned deficiencies, which can not only increase the heat conduction area between the PCB board and the heat sink, so that the overall heat dissipation effect of the PCBA is better, but also facilitate loading and unloading onto the PCB board, making the subsequent cleaning and maintenance operations of the PCBA more convenient and more practical.
[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0006] A camera heat dissipation structure comprises a shell, a shooting module and a PCBA installed in the shell, wherein the shooting end of the shooting module is arranged on the front side of the shell, and the PCBA comprises a PCB board and a plurality of electronic components, and is characterized in that: the shell is a shell with an opening on the back side, a heat sink is arranged in the opening of the shell, the heat sink is detachably connected to the PCB board through a connecting piece, a plurality of heat-conducting columns abutting the PCB board and the electronic components are arranged on the heat sink, and a plurality of heat-dissipating fins are arranged on the back side of the heat sink.
[0007] Furthermore, grooves are respectively provided at the left and right ends of the heat dissipation plate; the connecting member includes two L-shaped clips symmetrically arranged on the left and right, a plurality of telescopic rods arranged in the groove, a spring 1 sleeved on the telescopic rod and a slider slidably connected to the groove, the two ends of the telescopic rod are respectively connected to the groove bottom and the slider of the groove, the two ends of the spring 1 are respectively connected to the groove bottom and the slider of the groove, the end of the lateral portion of the L-shaped clip extends into the groove to connect the slider, and the vertical portions of the two L-shaped clips are arranged opposite to each other.
[0008] Furthermore, the vertical portion of the L-shaped clip is provided with a plurality of notches, and the opening ends of the notches extend to the end portion of the vertical portion of the L-shaped clip.
[0009] Furthermore, the heat sink is provided with a plurality of through holes, the thermally conductive column is slidably connected in the through holes, an abutment block is provided at the front end of the thermally conductive column, a second spring is sleeved on the thermally conductive column, the starting end and the end of the second spring are respectively connected to the heat sink and the abutment block, and the abutment block and the thermally conductive column are both made of high thermal conductivity materials.
[0010] Furthermore, a gap is arranged between adjacent heat dissipation fins, and the through hole is arranged opposite to the gap.
[0011] Furthermore, the heat sink includes a first U-shaped ladder layer, a second U-shaped ladder layer and a rear ladder layer, the front and rear sides of the second U-shaped ladder layer are respectively connected to the first U-shaped ladder layer and the rear ladder layer, the connecting piece is arranged on the first U-shaped ladder layer, and the thermal conductive column and the heat dissipation fins are both arranged on the rear ladder layer.
[0012] The beneficial effects of the utility model are:
[0013] In practical applications, a plurality of heat-conducting columns abutting against the PCB and electronic components are arranged on the heat dissipation plate to increase the heat conduction area between the PCB and the heat dissipation plate, so that the overall heat dissipation effect of the PCBA is better; the heat dissipation plate can be detachably connected to the PCB through the connecting piece, so that the later cleaning and maintenance operations of the PCBA are more convenient and more practical; the utility model can increase the heat conduction area between the PCB and the heat sink, so that the overall heat dissipation effect of the PCBA is better, and it is also easy to load and unload onto the PCB, so that the later cleaning and maintenance operations of the PCBA are more convenient and more practical. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a schematic diagram of the structure of the utility model when in use;
[0015] Figure 2 It is a schematic diagram of the structure of the heat dissipation plate, heat-conducting column and heat dissipation fins in the utility model;
[0016] Figure 3It is a rear view of the heat dissipation plate, heat-conducting column and heat dissipation fins in the utility model;
[0017] Figure 4 yes Figure 3 The cross-sectional view at AA in the middle;
[0018] Figure numerals: housing 1; shooting module 2; PCB board 31; electronic components 32; heat sink 4; groove 401; through hole 402; first U-shaped ladder 41; second U-shaped ladder 42; rear ladder 43; heat-conducting column 5; abutment block 51; spring two 52; L-shaped clip 61; notch 611; telescopic rod 62; spring one 63; slider 64; heat sink fin 7. DETAILED DESCRIPTION
[0019] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, a camera heat dissipation structure comprises a housing 1, a shooting module 2 and a PCBA installed in the housing 1, wherein the shooting end of the shooting module 2 is arranged on the front side of the housing 1, and the PCBA comprises a PCB board 31 and a plurality of electronic components 32, characterized in that: the housing 1 is a shell with an opening at the back side, a heat sink 4 is arranged in the opening of the housing 1, the heat sink 4 is detachably connected to the PCB board 31 through a connecting piece, a plurality of heat-conducting columns 5 abutting against the PCB board 31 and the electronic components 32 are arranged on the heat sink 4, and a plurality of heat-dissipating fins 7 are arranged on the back side of the heat sink 4.
[0020] When in use, a plurality of heat-conducting columns 5 abutting against the PCB board 31 and the electronic components 32 are arranged on the heat dissipation plate 4 to increase the heat conduction area between the PCB board 31 and the heat dissipation plate 4, and a plurality of heat dissipation fins 7 are used to increase the heat dissipation area of the heat dissipation plate 4, so that the overall heat dissipation effect of the PCBA is better; the heat dissipation plate 4 can be conveniently detachably connected to the PCB board 31 through the connecting piece, so that the later cleaning and maintenance operations of the PCBA are more convenient and more practical; the utility model can increase the heat conduction area between the PCB board 31 and the heat sink, so that the overall heat dissipation effect of the PCBA is better, and it is also convenient to load and unload onto the PCB board 31, so that the later cleaning and maintenance operations of the PCBA are more convenient and more practical.
[0021] like Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, the left and right ends of the heat sink 4 are respectively provided with grooves 401; the connecting member includes two L-shaped clips 61 symmetrically arranged on the left and right, a plurality of telescopic rods 62 arranged in the groove 401, a spring 63 sleeved on the telescopic rod 62 and a slider 64 slidably connected to the groove 401, the two ends of the telescopic rod 62 are respectively connected to the groove bottom of the groove 401 and the slider 64, the two ends of the spring 63 are respectively connected to the groove bottom of the groove 401 and the slider 64, and the transverse end of the L-shaped clip 61 extends into the groove The slider 64 is connected inside 401, and the vertical parts of the two L-shaped clips 61 are arranged opposite to each other; in this embodiment, during installation, the vertical parts of the two L-shaped clips 61 are moved away from each other, the slider 64 slides along the groove 401, the spring 1 63 and the telescopic rod 62 are stretched, and the left and right ends of the PCB board 31 are respectively placed between the vertical parts of the two L-shaped clips 61, and the L-shaped clip 61 is released. The slider 64 is driven to return to the original position along the groove 401 by the restoring force of the spring 1 63, so that the left and right ends of the PCB board 31 are clamped between the vertical parts of the two L-shaped clips 61.
[0022] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the vertical portion of the L-shaped clip 61 is provided with a plurality of notches 611, and the open ends of the notches 611 extend to the end of the vertical portion of the L-shaped clip 61; in this embodiment, by providing a plurality of notches 611 in the vertical portion of the L-shaped clip 61, it is convenient to fix the PCB board 31 in the housing 1.
[0023] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the heat sink 4 is provided with a plurality of through holes 402, the heat-conducting column 5 is slidably connected in the through holes 402, the front end of the heat-conducting column 5 is provided with an abutting block 51, the heat-conducting column 5 is sleeved with a second spring 52, the beginning and the end of the second spring 52 are respectively connected to the heat sink 4 and the abutting block 51, and the abutting block 51 and the heat-conducting column 5 are both made of high thermal conductivity materials; in this embodiment, the heat-conducting column 5 is slidably connected in the through hole 402 by the second spring 52, so that the front end of the abutting block 51 abuts against the PCB board 31 or the electronic component 32, and then the heat-conducting column 5 with the height adjusted is bonded and fixed to the heat sink 4 by the thermal conductive glue, so that the heat conduction area between the PCB board 31 and the heat sink can be increased, so that the overall heat dissipation effect of the PCBA is better and the service life of the camera is longer.
[0024] like Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, a gap is provided between adjacent heat dissipation fins 7, and the through hole 402 is provided opposite to the gap; in this embodiment, when the through hole 402 is provided opposite to the gap, no interference will occur between the heat dissipation fins 7 and the thermal conductive column 5.
[0025] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the heat sink 4 includes a first U-shaped ladder layer 41, a second U-shaped ladder layer 42 and a rear ladder layer 43, the front and rear sides of the second U-shaped ladder layer 42 are respectively connected to the first U-shaped ladder layer 41 and the rear ladder layer 43, the connecting piece is arranged on the first U-shaped ladder layer 41, and the thermal conductive column 5 and the heat dissipation fins 7 are both arranged on the rear ladder layer 43; in this embodiment, by setting the heat sink 4 into a structure of a first U-shaped ladder layer 41, a second U-shaped ladder layer 42 and a rear ladder layer 43, the heat dissipation area of the heat sink 4 is increased, and the heat dissipation effect is better.
[0026] The specific embodiments described herein are merely examples of the spirit of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in similar ways, but they will not deviate from the scope defined by the spirit of the present invention.
Claims
1. A camera heat dissipation structure, comprising a housing (1), a shooting module (2) and a PCBA installed in the housing (1), wherein a shooting end of the shooting module (2) is arranged on the front side of the housing (1), and the PCBA comprises a PCB board (31) and a plurality of electronic components (32), characterized in that: The shell (1) is a shell having an opening at the back, a heat sink (4) is arranged in the opening of the shell (1), the heat sink (4) is detachably connected to the PCB board (31) via a connecting piece, a plurality of heat-conducting columns (5) abutting against the PCB board (31) and the electronic components (32) are arranged on the heat sink (4), and a plurality of heat-dissipating fins (7) are arranged on the back of the heat sink (4).
2. A camera heat dissipation structure according to claim 1, characterized in that: The left and right ends of the heat dissipation plate (4) are respectively provided with grooves (401); the connecting member comprises two L-shaped clips (61) symmetrically arranged on the left and right, a plurality of telescopic rods (62) arranged in the groove (401), a spring (63) sleeved on the telescopic rod (62), and a slider (64) slidably connected in the groove (401); the two ends of the telescopic rod (62) are respectively connected to the groove bottom of the groove (401) and the slider (64); the two ends of the spring (63) are respectively connected to the groove bottom of the groove (401) and the slider (64); the end of the transverse portion of the L-shaped clip (61) extends into the groove (401) to connect to the slider (64); and the vertical portions of the two L-shaped clips (61) are arranged opposite to each other.
3. A camera heat dissipation structure according to claim 2, characterized in that: The vertical portion of the L-shaped clip (61) is provided with a plurality of notches (611), and the opening ends of the notches (611) extend to the ends of the vertical portion of the L-shaped clip (61).
4. The camera heat dissipation structure according to claim 1, characterized in that: The heat dissipation plate (4) is provided with a plurality of through holes (402), the heat-conducting column (5) is slidably connected in the through holes (402), a contact block (51) is provided at the front end of the heat-conducting column (5), a second spring (52) is sleeved on the heat-conducting column (5), the starting end and the end of the second spring (52) are respectively connected to the heat dissipation plate (4) and the contact block (51), and the contact block (51) and the heat-conducting column (5) are both made of high thermal conductivity materials.
5. A camera heat dissipation structure according to claim 4, characterized in that: A gap is provided between adjacent heat dissipation fins (7), and the through hole (402) is arranged opposite to the gap.
6. The camera heat dissipation structure according to claim 1, characterized in that: The heat sink (4) comprises a first U-shaped ladder layer (41), a second U-shaped ladder layer (42) and a rear ladder layer (43); the front and rear sides of the second U-shaped ladder layer (42) are respectively connected to the first U-shaped ladder layer (41) and the rear ladder layer (43); the connecting piece is arranged on the first U-shaped ladder layer (41); and the heat conducting column (5) and the heat dissipation fin (7) are both arranged on the rear ladder layer (43).