Anti-deviation multi-layer flexible board structure

Abstract

The utility model discloses an anti-deviation multilayer flexible board structure, which relates to the technical field of electronics and comprises an inner core board, first copper foil layers are symmetrically and fixedly arranged on two sides of the inner core board, a first prepreg is fixedly arranged on one side of each first copper foil layer, and a second copper foil layer is fixedly arranged on one side of each first prepreg. A second prepreg is fixedly arranged on one side of the second copper foil layer, and a third copper foil layer is fixedly arranged on one side of the second prepreg; according to the utility model, the wave-shaped electromagnetic shielding sheets are respectively embedded in the first prepreg, the second prepreg and the third prepreg, so that the electromagnetic shielding performance of the first prepreg, the second prepreg and the third prepreg can be remarkably improved, and the application range of the circuit board is enlarged; the nano waterproof coating is attached to the solder mask, so that the waterproof performance of the circuit board can be remarkably improved, the circuit board is prevented from being eroded by water, the circuit board is prevented from being eroded and damaged by water, the service life of the circuit board is prolonged, and the economic cost is reduced.

Description

Technical Field

[0001] The utility model relates to the field of electronic technology, in particular to an anti-deviation multi-layer soft board structure. Background Art

[0002] The names of circuit boards include: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, PCBs, ultra-thin circuit boards, ultra-thin circuit boards, printed (copper etching technology) circuit boards, etc. Circuit boards make circuits miniaturized and intuitive, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layouts. Circuit boards can be called printed circuit boards or printed circuit boards. The English names are (Printed Circuit Board) PCB, (Flexible Printed Circuitboard) FPC circuit boards (FPC circuit boards are also called flexible circuit boards. Flexible circuit boards are made of polyimide or polyester film as a substrate. They are highly reliable and extremely flexible printed circuit boards with high wiring density, light weight, thin thickness, and good bending properties) and reechas, Soft and hard The birth and development of combination plate)-FPC and PCB has given rise to a new product, the hard-flex combination plate. Therefore, the hard-flex combination plate is a circuit board with FPC characteristics and PCB characteristics formed by combining a flexible circuit board and a rigid circuit board through processes such as pressing and other processes according to relevant process requirements. The existing circuit boards have shortcomings. On the one hand, the electromagnetic shielding performance of the entire circuit board is poor and cannot adapt to the use in various situations. In addition, the surface is easily corroded by moisture, causing damage to the circuit board, reducing the service life of the circuit board and increasing the economic cost. In view of the above problems, the inventor proposes an anti-biased multi-layer soft board structure to solve the above problems. Utility Model Content

[0003] In order to solve the shortcomings of existing circuit boards, on the one hand, the electromagnetic shielding performance of the entire circuit board is poor and cannot adapt to use in various situations, and the surface is easily corroded by moisture, causing damage to the circuit board, reducing the service life of the circuit board and increasing economic costs; the purpose of the utility model is to provide an anti-deflection multi-layer soft board structure.

[0004] In order to solve the above technical problems, the utility model adopts the following technical scheme: an anti-misalignment multi-layer soft board structure, including an inner core board, a first copper foil layer is symmetrically fixed on both sides of the inner core board, a first semi-cured sheet is fixed on one side of the first copper foil layer, a second copper foil layer is fixed on one side of the first semi-cured sheet, a second copper foil layer is fixed on one side of the second copper foil layer, a third copper foil layer is fixed on one side of the second semi-cured sheet, a third copper foil layer is fixed on one side of the third copper foil layer, and a solder resist layer is fixed on one side of the third semi-cured sheet.

[0005] Preferably, the inner core board includes a base material film, a first adhesive layer is symmetrically fixed on both sides of the base material film, a glass fiber layer is fixed on one side of the first adhesive layer, a second adhesive layer is fixed on one side of the glass fiber layer, a pure copper layer is fixed on one side of the second adhesive layer, a third adhesive layer is fixed on one side of the pure copper layer, and an insulating layer is fixed on one side of the third adhesive layer.

[0006] Preferably, the first prepreg, the second prepreg and the third prepreg all comprise glass fiber cloth, and a resin layer is fixedly provided on the surface of the glass fiber cloth.

[0007] Preferably, a buried hole is provided between the two third prepreg sheets.

[0008] Preferably, electromagnetic shielding sheets are fixedly provided inside the first prepreg, the second prepreg and the third prepreg.

[0009] Preferably, the electromagnetic shielding sheet is configured to be wavy in shape.

[0010] Preferably, a nano waterproof coating is fixedly provided on one side of the solder resist layer.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] 1. The utility model utilizes a wavy electromagnetic shielding sheet to be buried in the first prepreg, the second prepreg and the third prepreg respectively, which can significantly increase the electromagnetic shielding performance of the first prepreg, the second prepreg and the third prepreg, and expand the application range of the circuit board;

[0013] 2. The utility model utilizes a nano waterproof coating attached to the solder resist layer, which can significantly improve the waterproof performance of the circuit board, prevent moisture from corroding the circuit board, avoid the circuit board being damaged by moisture, extend the service life of the circuit board, and reduce economic costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0015] Figure 1 It is a schematic diagram of the cross-sectional structure of the utility model.

[0016] Figure 2 This is a schematic diagram of the cross-sectional structure of the inner core plate of the utility model.

[0017] Figure 3 It is a schematic diagram of the cross-sectional structure of the first semi-cured sheet of the utility model.

[0018] In the figure: 1. inner core board; 2. first copper foil layer; 3. first semi-cured sheet; 4. second copper foil layer; 5. second semi-cured sheet; 6. third copper foil layer; 7. third semi-cured sheet; 8. solder mask layer; 9. base film; 10. first adhesive layer; 11. glass fiber layer; 12. second adhesive layer; 13. pure copper layer; 14. third adhesive layer; 15. insulating layer; 16. glass fiber cloth; 17. resin layer; 18. electromagnetic shielding sheet; 19. nano waterproof coating; 20. buried hole. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] Example: Figure 1-3 As shown, the utility model provides an anti-biased multi-layer soft board structure, including an inner core board 1, a first copper foil layer 2 is symmetrically fixed on both sides of the inner core board 1, a first semi-cured sheet 3 is fixed on one side of the first copper foil layer 2, a second copper foil layer 4 is fixed on one side of the first semi-cured sheet 3, a second copper foil layer 4 is fixed on one side of the second copper foil layer 4, a second semi-cured sheet 5 is fixed on one side of the second semi-cured sheet 5, a third copper foil layer 6 is fixed on one side of the third copper foil layer 6, a third semi-cured sheet 7 is fixed on one side of the third semi-cured sheet 7, and a solder resist layer 8 is fixed on one side of the third semi-cured sheet 7.

[0021] The inner core board 1 includes a base film 9, a first adhesive layer 10 is symmetrically fixed on both sides of the base film 9, a glass fiber layer 11 is fixed on one side of the first adhesive layer 10, a second adhesive layer 12 is fixed on one side of the glass fiber layer 11, a pure copper layer 13 is fixed on one side of the second adhesive layer 12, a third adhesive layer 14 is fixed on one side of the pure copper layer 13, and an insulating layer 15 is fixed on one side of the third adhesive layer 14.

[0022] By adopting the above technical solution, the base material film 9 can complete the functions of conduction, support and insulation under the joint action of the glass fiber layer 11, the glass fiber layer 11 and the insulating layer 15.

[0023] The first prepreg 3 , the second prepreg 5 and the third prepreg 7 all include a glass fiber cloth 16 , and a resin layer 17 is fixedly disposed on the surface of the glass fiber cloth 16 .

[0024] By adopting the above technical solution, the glass fiber cloth 16 and the resin layer 17 can be made into the first prepreg 3, the second prepreg 5 and the third prepreg 7 that meet the requirements.

[0025] A buried hole 20 is provided between the two third prepreg sheets 7 .

[0026] By adopting the above technical solution, the buried via 20 can prevent the layers from being offset during the production of the circuit board.

[0027] An electromagnetic shielding sheet 18 is fixedly disposed inside the first prepreg 3 , the second prepreg 5 and the third prepreg 7 .

[0028] By adopting the above technical solution, the electromagnetic shielding sheet 18 can enhance the electromagnetic shielding performance of the circuit board.

[0029] The electromagnetic shielding sheet 18 is configured to have a wave-like shape.

[0030] By adopting the above technical solution, the contact area between the first prepreg 3, the second prepreg 5 and the third prepreg 7 and the electromagnetic shielding sheet 18 is increased.

[0031] A nano waterproof coating 19 is fixedly provided on one side of the solder resist layer 8 .

[0032] By adopting the above technical solution, the nano waterproof coating 19 can prevent the circuit board from being corroded by water.

[0033] Working principle: In the process of producing the circuit board, the wavy electromagnetic shielding sheet 18 is respectively buried in the first prepreg 3, the second prepreg 5 and the third prepreg 7, which can significantly increase the electromagnetic shielding performance of the first prepreg 3, the second prepreg 5 and the third prepreg 7, and expand the use range of the circuit board;

[0034] During the production process of the circuit board, the nano waterproof coating 19 is attached to the solder mask 8, which can significantly improve the waterproof performance of the circuit board, prevent moisture from corroding the circuit board, avoid the circuit board being damaged by moisture, extend the service life of the circuit board, and reduce economic costs.

[0035] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. An anti-deflection multi-layer soft board structure, comprising an inner core board (1), characterized in that: The inner core board (1) is symmetrically fixed with a first copper foil layer (2) on both sides, a first prepreg (3) is fixedly provided on one side of the first copper foil layer (2), a second copper foil layer (4) is fixedly provided on one side of the first prepreg (3), a second copper foil layer (4) is fixedly provided on one side of the second copper foil layer (4), a third copper foil layer (6) is fixedly provided on one side of the second prepreg (5), a third copper foil layer (6) is fixedly provided on one side of the third copper foil layer (6), and a solder resist layer (8) is fixedly provided on one side of the third prepreg (7).

2. The anti-deflection multi-layer soft board structure according to claim 1, characterized in that: The inner core board (1) comprises a substrate film (9), a first adhesive layer (10) is symmetrically fixed on both sides of the substrate film (9), a glass fiber layer (11) is fixed on one side of the first adhesive layer (10), a second adhesive layer (12) is fixed on one side of the glass fiber layer (11), a pure copper layer (13) is fixed on one side of the second adhesive layer (12), a third adhesive layer (14) is fixed on one side of the pure copper layer (13), and an insulating layer (15) is fixed on one side of the third adhesive layer (14).

3. The anti-deflection multi-layer soft board structure according to claim 1, characterized in that: The first prepreg (3), the second prepreg (5) and the third prepreg (7) all comprise glass fiber cloth (16), and a resin layer (17) is fixedly provided on the surface of the glass fiber cloth (16).

4. The anti-deviation multi-layer soft board structure according to claim 1, characterized in that: A buried hole (20) is provided between the two third prepreg sheets (7).

5. The anti-deviation multi-layer soft board structure according to claim 1, characterized in that: Electromagnetic shielding sheets (18) are fixedly arranged inside the first prepreg sheet (3), the second prepreg sheet (5) and the third prepreg sheet (7).

6. The anti-deviation multi-layer soft board structure according to claim 5, characterized in that: The shape of the electromagnetic shielding sheet (18) is set to be wavy.

7. The anti-deviation multi-layer soft board structure according to claim 1, characterized in that: A nano waterproof coating (19) is fixedly provided on one side of the solder resist layer (8).

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