Flexible circuit board and display device

Abstract

The embodiment of the utility model provides a flexible circuit board and a display device, relates to the technical field of display, and is used for improving the projection effect of projection equipment. The flexible circuit board comprises a circuit board body, wherein the circuit board body is provided with a binding area and a bending area which are connected with each other; the electrostatic discharge structure is located on one side of the circuit board body in the thickness direction, and the electrostatic discharge structure and the binding area are correspondingly arranged in the thickness direction. The flexible circuit board is used for the display device.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a flexible circuit board and a display device. Background Art

[0002] Flexible Printed Circuit (FPC) is a highly reliable and extremely flexible printed circuit board made of polyimide or polyester film as the substrate. It has the characteristics of high wiring density, light weight and thin thickness. It is mainly used in mobile phones, laptops, PDAs, digital cameras and other products.

[0003] During the application process, the flexible circuit board needs to be bent at some parts according to the actual use situation. However, during the use process after bending, there are problems such as insufficient bending performance of the flexible circuit board and large rebound stress after bending. Utility Model Content

[0004] An object of the embodiments of the present disclosure is to provide a flexible circuit board and a display device, so as to improve the bending performance of the flexible circuit board.

[0005] To achieve the above objectives, the embodiments of the present disclosure provide the following technical solutions:

[0006] In one aspect, a flexible circuit board is provided. The flexible circuit board comprises a circuit board body and an electrostatic release structure. The circuit board body comprises a binding area and a bending area connected to each other. The electrostatic release structure is located on one side of the circuit board body in a thickness direction, and the electrostatic release structure and the binding area are arranged correspondingly in the thickness direction.

[0007] In the above-mentioned flexible circuit board, the binding area of ​​the electrostatic release structure and the circuit board body is arranged correspondingly in the thickness direction of the circuit board body, and the electrostatic release structure and the part of the circuit board body located in the bending area are staggered, thereby solving the problem of large rebound force of the part of the flexible circuit board located in the bending area caused by the electrostatic release structure covering the part of the circuit board body located in the bending area, thereby improving the bending performance of the flexible circuit board; on the other hand, the area of ​​the electrostatic release structure is reduced, which can reduce the production cost of the flexible circuit board to a certain extent.

[0008] In some embodiments, the circuit board body also includes: a connection area located on a side of the bending area away from the binding area; the circuit board body includes: a substrate layer, the substrate layer having a first surface and a second surface opposite to each other in the thickness direction, and the substrate layer having a first conductive hole arranged in the binding area; a first wiring layer located on the first surface, the first wiring layer including a first copper leakage portion arranged in the binding area; a second wiring layer located on the second surface, the second wiring layer including a second copper leakage portion arranged in the connection area, and the second copper leakage portion is grounded; the electrostatic release structure is located on a side of the first wiring layer away from the substrate layer, and is electrically connected to the first copper leakage portion; the first copper leakage portion is electrically connected to the second copper leakage portion through the first conductive hole.

[0009] In some embodiments, the first copper leakage portion includes two sub-copper leakage portions, and the two sub-copper leakage portions are respectively located at two ends of the binding area along the length direction of the binding area; the substrate layer is provided with a plurality of the first conductive holes, and the plurality of the first conductive holes are respectively located at two ends of the binding area along the length direction of the binding area, and the sub-copper leakage portion is electrically connected to the electrostatic release structure through the first conductive holes located at the same end.

[0010] In some embodiments, the first copper leakage portion extends along a length direction of the binding region.

[0011] In some embodiments, the first copper leakage portion includes a plurality of sub-copper leakage portions, and the plurality of sub-copper leakage portions are sequentially arranged at intervals along the length direction of the binding area.

[0012] In some embodiments, the second wiring layer is further provided with a ground pin, the substrate layer is further provided with a second via hole, and the electrostatic release structure is electrically connected to the ground pin through the second via hole.

[0013] In some embodiments, the flexible circuit board further includes: an electromagnetic shielding layer, which is disposed on a side of the first wiring layer away from the substrate layer, and the electromagnetic shielding layer and the connection area are correspondingly disposed in a thickness direction of the circuit board body.

[0014] In some embodiments, the second wiring layer also includes a MIPI routing, and the MIPI routing extends from the binding area to the bending area; the electromagnetic shielding layer includes: a protrusion, the orthographic projection of the protrusion on the circuit board body is located in the bending area, and covers the portion of the MIPI routing located in the bending area.

[0015] In another aspect, a display device is provided, comprising: a display panel, and a flexible circuit board as described in any one of the above embodiments; the flexible circuit board is electrically connected to the display panel.

[0016] In some embodiments, the display device further includes a driving chip, the driving chip is electrically connected to the display panel, and the electrostatic release structure on the flexible circuit board is in contact with the driving chip.

[0017] The above display device has the same structure and beneficial technical effects as the flexible circuit board provided in some of the above embodiments, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the products involved in the embodiments of the present disclosure.

[0019] Figure 1 is a structural diagram of a display device according to some embodiments;

[0020] Figure 2 is a structural diagram of another display device according to some embodiments;

[0021] Figure 3 is a structural diagram of a flexible circuit board according to some embodiments;

[0022] Figure 4 is a structural diagram of another display device according to some embodiments;

[0023] Figure 5 is a structural diagram of another flexible circuit board according to some embodiments;

[0024] Figure 6 for Figure 5 A top view of the flexible circuit board when the flexible circuit board is placed on a plane and the first surface is located above the second surface;

[0025] Figure 7 for Figure 6 A partial enlarged view of the middle area A;

[0026] Figure 8 for Figure 5 A top view of the flexible circuit board when the flexible circuit board is placed on a plane and the first surface is located below the second surface;

[0027] Fig. 9 is a structural diagram of another flexible circuit board according to some embodiments;

[0028] Fig.10 For along Fig. 9 The cross-sectional structure diagram of the flexible circuit board 400 along the A'-A direction is shown;

[0029] Fig.11 is a structural diagram of another flexible circuit board according to some embodiments;

[0030] Fig.12 is a structural diagram of another flexible circuit board according to some embodiments;

[0031] Fig.13 for Fig.11 A partial enlarged view of area B in the middle. DETAILED DESCRIPTION

[0032] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0033] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as an open, inclusive meaning, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics described may be included in any one or more embodiments or examples in any appropriate manner.

[0034] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0035] “At least one of A, B, and C” has the same meaning as “at least one of A, B, or C” and both include the following combinations of A, B, and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B, and C.

[0036] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0037] As used herein, the term "if" is optionally interpreted to mean "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrases "if it is determined that" or "if [a stated condition or event] is detected" are optionally interpreted to mean "upon determining that" or "in response to determining that" or "upon detecting [a stated condition or event]" or "in response to detecting [a stated condition or event]," depending on the context.

[0038] The use of "adapted to" or "configured to" herein is meant to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0039] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0040] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of variation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0041] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism may be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity may also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality may be, for example, the difference between the two equalities is less than or equal to 5% of either one.

[0042] It will be understood that when a layer or an element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present between the layer or element and the other layer or substrate.

[0043] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of the layers and the area of ​​the regions are exaggerated for clarity. Therefore, variations in the shapes relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shapes of the regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0044] Some embodiments of the present disclosure provide a display device, which can be any display device that displays images, whether in motion (e.g., video) or fixed (e.g., still images), and whether text or text. More specifically, it is expected that the display device of the embodiments can be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, television monitors, flat panel displays, computer monitors, automotive displays (e.g., odometer displays, etc.), navigators, cockpit controls and / or displays, displays of camera views (e.g., displays of rear-view cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., displays of images of a piece of jewelry), etc.

[0045] Figure 1 FIG. 1 is a structural diagram of a display device according to some embodiments. Figure 1 As shown, the display device 1000 includes a frame 100, a cover plate 200, a display panel 300, a flexible circuit board 400 and other electronic components.

[0046] like Figure 1 As shown, the longitudinal section of the frame 100 is U-shaped, the display panel 300, the flexible circuit board 400 and other electronic accessories are arranged in the frame 100, the flexible circuit board 400 is located between the display panel 300 and the frame 100, and the cover plate 200 is located on the side of the display panel 300 away from the flexible circuit board 400.

[0047] Exemplarily, the flexible circuit board 400 is located on the non-light emitting side of the display panel 300, and the flexible circuit board 400 is electrically connected to the display panel 300, and the flexible circuit board 400 is used to provide a driving signal for the display panel 300, thereby ensuring the normal display of the display panel 300. Among them, the side of the display panel 300 used to display the picture is the light emitting side, and the non-light emitting side of the display panel 300 is the side of the display panel 300 opposite to the light emitting side.

[0048] Exemplarily, the above-mentioned display panel 300 can be: an organic light emitting diode (OLED) display panel, a quantum dot light emitting diode (QLED) display panel, a micro light emitting diode (Micro LED) display panel, etc., and the present disclosure does not make any specific limitations on this.

[0049] Exemplarily, the shape of the display panel 300 is substantially circular or rectangular, and the embodiments of the present disclosure do not limit the shape of the display panel 300. The following embodiments are described by taking the shape of the display panel 300 as a rectangle as an example.

[0050] In addition, the display panel 300 may be a flexible display panel. In the case where the display panel 300 is a flexible display panel, the display device 1000 is a flexible display device.

[0051] For example, the type of the flexible circuit board 400 can be set according to actual conditions. The flexible circuit board 400 can be a main flexible circuit board (MFPC) for driving the display panel 300 to realize the display function; the flexible circuit board 400 can also be a touch flexible circuit board (TFPC) for driving the display panel 300 to realize the touch function. The embodiment of the present disclosure does not specifically limit the type of the flexible circuit board 400. The following embodiments are described by taking the flexible circuit board 400 as MFPC as an example.

[0052] In some examples, the display device 1000 further includes a driving chip that is electrically connected to the display panel 300 .

[0053] Exemplarily, the display panel 300 includes a substrate (e.g., a glass substrate). The above-mentioned driving chip and the flexible circuit board can be disposed on the substrate of the display panel 300 in a stacked manner. For example, the driving chip is disposed on the flexible circuit board 400, and the flexible circuit board 400 is further disposed on the substrate of the display panel 300; or the driving chip is disposed on the substrate of the display panel 300, and the flexible circuit board 400 covers the driving chip and is disposed on the substrate of the display panel 300. The embodiments of the present disclosure are limited to this.

[0054] In some examples, combined Figure 2 and Figure 3 As shown, the flexible circuit board 400 includes a circuit board body 1. The circuit board body 1 has a binding area 11 and a bending area 12 connected to each other.

[0055] The portion of the circuit board body 1 located in the binding area 11 is bound and connected to the display panel 300 , so that the flexible circuit board 400 can provide a driving signal for the display panel 300 , thereby ensuring the normal display of the display panel 300 .

[0056] Among them, Figure 2 As shown, the shape of the portion of the circuit board body 1 located in the binding area 11 can be a long strip extending along the first direction X.

[0057] In one implementation, combining Figure 2 and Figure 3 As shown, the flexible circuit board 400 further includes an electrostatic discharge structure 2. The electrostatic discharge structure 2 has the functions of preventing ESD discharge (Electro-Static Discharge, ie electrostatic discharge) and electromagnetic shielding.

[0058] Among them, combined Figure 2 and Figure 3 As shown, the orthographic projection of the electrostatic release structure 2 on the circuit board body 1 is located at both the binding area 11 and the bending area 12 of the circuit board body 1 .

[0059] It is understandable that one end of the flexible circuit board 400 is electrically connected to the display panel 300, and the other end of the flexible circuit board 400 is bent to the back of the display panel 300. When the frame of the display device 1000 is narrow, the bending radius of the flexible circuit board 400 is small. When the bending radius of the flexible circuit board 400 is small, the rebound force of the portion of the flexible circuit board 400 located in the bending area 12 is large, which will have a greater impact on the light effect of the display device 1000. When the orthographic projection of the electrostatic release structure 2 on the circuit board body 1 covers the portion of the circuit board body 1 located in the bending area 12, the rebound force of the portion of the flexible circuit board 400 located in the bending area 12 will be further increased.

[0060] Based on this, the flexible circuit board 400 provided in the embodiment of the present disclosure is as follows: Figure 4 As shown, the electrostatic release structure 2 is located on one side of the circuit board body 1 in the thickness direction, and the electrostatic release structure 2 and the binding area 11 are correspondingly arranged in the thickness direction of the circuit board body 1 .

[0061] Exemplarily, the electrostatic discharge structure 2 is conductive, and its material may be a conductive material with conductivity, such as metal, alloy, or transparent conductive material such as indium tin oxide (ITO). For example, the material of the electrostatic discharge structure 2 includes copper foil.

[0062] In addition, the electrostatic discharge structure 2 can be grounded, thereby achieving the effect of electrostatic discharge, thereby reducing the risk of damage to the electrical components on the flexible circuit board 400 due to electrostatic breakdown.

[0063] Exemplarily, the orthographic projection of the electrostatic release structure 2 on the circuit board body 1 is located in the binding area 11 of the circuit board body 1 , and the electrostatic release structure 2 is staggered with a portion of the circuit board body 1 located in the bending area 12 .

[0064] In addition, the orthographic projection of the electrostatic release structure 2 on the circuit board body 1 can completely cover the binding area 11 of the circuit board body 1, that is, the boundary of the orthographic projection of the electrostatic release structure 2 on the circuit board body 1 completely overlaps with the boundary of the binding area 11 of the circuit board body 1; the orthographic projection of the electrostatic release structure 2 on the circuit board body 1 can also cover a part of the binding area 11 of the circuit board body 1, that is, the orthographic projection of the electrostatic release structure 2 on the circuit board body 1 is located in the binding area 11 of the circuit board body 1, and there is a gap between the boundary of the orthographic projection of the electrostatic release structure 2 on the circuit board body 1 and the boundary of the binding area 11 of the circuit board body 1. The embodiments of the present disclosure are not limited to this.

[0065] In addition, the shape of the electrostatic release structure 2 can be the same as the shape of the portion of the circuit board body 1 located in the binding area 11. For example, the shape of the electrostatic release structure 2 can be a long strip extending along the length direction (that is, the first direction X) of the portion of the circuit board body 1 located in the binding area 11.

[0066] In this embodiment, the electrostatic release structure 2 and the binding area 11 of the circuit board body 1 are arranged correspondingly in the thickness direction of the circuit board body 1, and the electrostatic release structure 2 and the part of the circuit board body 1 located in the bending area 12 are staggered, thereby solving the problem of large rebound force of the part of the flexible circuit board 400 located in the bending area 12 caused by the electrostatic release structure 2 covering the part of the circuit board body 1 located in the bending area 12, thereby improving the bending performance of the flexible circuit board 400; on the other hand, compared with the orthographic projection of the electrostatic release structure 2 on the circuit board body 1 located in the binding area 11 and the bending area 12 of the circuit board body 1, the area of ​​the electrostatic release structure 2 is reduced, which can reduce the production cost of the flexible circuit board 400 to a certain extent.

[0067] In addition, when the display device 1000 further includes a driving chip, the electrostatic discharge structure 2 is in contact with the driving chip.

[0068] Exemplarily, the orthographic projection of the electrostatic release structure 2 on the circuit board body 1 at least partially overlaps with the orthographic projection of the driver chip on the circuit board body 1 .

[0069] Therefore, the static electricity generated during the operation of the driver chip can be discharged through the electrostatic release structure 2, thereby reducing the risk of the driver chip being damaged by static electricity. On the other hand, the electrostatic shielding effect of the electrostatic release structure 2 helps to shield the electromagnetic radiation of the high-frequency signal of the driver chip to other electronic components and the electromagnetic interference of the external circuit to the driver chip, thereby improving the protection capability and electromagnetic shielding capability of the flexible circuit board and improving the quality of the product.

[0070] In some embodiments, Figure 5 and Figure 6 As shown, the circuit board body 1 further includes: a connection area 13 located on a side of the bending area 12 away from the binding area 11 .

[0071] Exemplarily, the connection area 13 can be used to set electronic components. The electronic components can be integrated devices integrated on the circuit board body 1, or external devices, external capacitors, external resistors or chips connected by welding, plugging or patching, and the embodiments of the present disclosure are not limited to this.

[0072] Exemplary, combined Figure 5 , Figure 6 , Figure 7 as well as Figure 8 As shown, Figure 6 for Figure 5 The flexible circuit board 400 shown is placed on a plane, and the first surface aa is located above the second surface bb, and is a top view of the flexible circuit board 400; Figure 7 for Figure 6 A partial enlarged view of the middle area A; Figure 8for Figure 5 The flexible circuit board 400 shown is placed on a plane, and the first surface aa is located below the second surface bb, and is a top view of the flexible circuit board 400. The circuit board body 1 includes: a substrate layer 10, a first wiring layer 20, and a second wiring layer 30. The substrate layer 10 has a first surface aa and a second surface bb opposite to each other in the thickness direction; the first wiring layer 20 is located on the first surface aa of the substrate layer 10, and the second wiring layer 30 is located on the second surface bb of the substrate layer 10. The substrate layer 10 has a first conductive hole 101 arranged in the binding area 11, the first wiring layer 20 includes a first copper leakage portion 201 arranged in the binding area 11, and the second wiring layer 30 includes a second copper leakage portion 301 arranged in the connection area 13, and the second copper leakage portion 301 is grounded. The electrostatic release structure 2 is located on the side of the first wiring layer 20 away from the substrate layer 10, and is electrically connected to the first copper leakage portion 201; the first copper leakage portion 201 is electrically connected to the second copper leakage portion 301 through the first conductive hole 101.

[0073] The substrate layer 10 can provide a supporting basis for the first wiring layer 20 and the second wiring layer 30 .

[0074] For example, the material of the substrate layer 10 can be at least one of polyethersulfone, polyarylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, cellulose triacetate and cellulose acetate propionate, which are not listed one by one in the embodiments of the present disclosure. For example, the material of the substrate layer 10 is polyimide.

[0075] Exemplarily, the second wiring layer 30 includes a plurality of binding pins located in the binding area 11, and the display panel 300 is electrically connected to the flexible circuit board 400 through the plurality of binding pins. Thus, the electrical connection between the display panel 300 and the flexible circuit board 400 is achieved, and the flexible circuit board 400 can transmit a driving signal to the display panel 300 through at least part of the binding pins to achieve normal display of the display panel 300.

[0076] Exemplarily, the material of the second wiring layer 30 may include a metal material, such as copper Cu, or other suitable materials. When the material of the second wiring layer 30 includes copper, the second wiring layer 30 may be a copper foil.

[0077] Exemplarily, the flexible circuit board 400 further includes a plurality of signal lines, which are arranged in the first wiring layer 20 and / or the second wiring layer 30. The plurality of signal lines may include, for example, signal lines for transmitting power signals, signal lines for transmitting touch signals, signal lines for transmitting communication protocols, signal lines for transmitting data signals, and the like.

[0078] Exemplarily, the material of the first wiring layer 20 and the material of the second wiring layer 30 may be the same or different, which is not limited in the embodiments of the present disclosure.

[0079] In addition, in order to make the flexible circuit board 400 have better bending performance, the portion of the first wiring layer 20 located in the bending area 12 is removed, that is, the portion of the first wiring layer 20 located in the binding area 11 is disconnected from the portion of the first wiring layer 20 located in the connection area 13, such as Figure 5 shown.

[0080] In some examples, such as Figure 5 As shown, the circuit board body 1 further includes: a first protective layer 40 disposed on the side of the first wiring layer 20 away from the substrate layer 10 and a second protective layer 50 disposed on the side of the second wiring layer 30 away from the substrate layer 10. The first protective layer 40 and the second protective layer 50 are used to protect the first wiring layer 20 and the second wiring layer 30, prevent the first wiring layer 20 and the second wiring layer 30 from being exposed to the air, and prevent the signal lines disposed in the first wiring layer 20 and the second wiring layer 30 from being oxidized.

[0081] Exemplarily, the first protective layer 40 may be a single-layer structure, a double-layer structure, or a multi-layer structure. The embodiments of the present disclosure are not limited to this. For example, the first protective layer 40 is a single-layer structure composed of a polyimide (PI) layer.

[0082] The structure of the second protective layer 50 may be the same as or different from that of the first protective layer 40. For example, the structure of the second protective layer 50 is the same as that of the first protective layer 40. Both the second protective layer 50 and the first protective layer 40 are single-layer structures composed of a PI layer.

[0083] In addition, if Figure 5 As shown, the circuit board body 1 further includes: a first adhesive layer 60 disposed between the first protection layer 40 and the first wiring layer 20, and a second adhesive layer 70 disposed between the second wiring layer 30 and the second protection layer 50. Thus, the first protection layer 40 and the first wiring layer 20 are connected via the first adhesive layer 60, and the second wiring layer 30 and the second protection layer 50 are connected via the second adhesive layer 70.

[0084] In the case where the circuit board body 1 includes the first protective layer 40 and the second protective layer 50, the first protective layer 40 is located in a portion of the binding area 11, and the first protective layer 40 in a partial area is removed, so that a portion of the first wiring layer 20 is exposed, thereby forming a first copper leakage portion 201. The second protective layer 50 is located in a portion of the binding area 11, and the second protective layer 50 in a partial area is removed, so that a portion of the second wiring layer 30 is exposed, thereby forming a second copper leakage portion 301.

[0085] Exemplarily, the first via hole 101 is filled with a conductive material, for example, the conductive material may be conductive ink, so that the first copper leakage portion 201 is electrically connected to the second copper leakage portion 301 through the first via hole 101 .

[0086] With the above arrangement, the electrostatic release structure 2 is electrically connected to the first copper leakage part 201, and the first copper leakage part 201 is electrically connected to the second copper leakage part 301 through the first conductive hole 101, thereby providing a channel for electrostatic release for the electrostatic release structure 2. The electrostatic charge accumulated on the electrostatic release structure 2 can be conducted to other components of the display device 1000 (for example, a housing, a frame, etc.) through the first copper leakage part 201, the conductive material filled in the first conductive hole 101 (for example, the above-mentioned conductive ink), and the second copper leakage part 301, thereby achieving the effect of electrostatic derivation, and minimizing the risk of damage to the electronic components on the flexible circuit board 400 due to electrostatic breakdown. In addition, the electrostatic charge generated during the operation of the flexible circuit board 400 can be conducted to other components of the display device 1000 through the second copper leakage part 301, thereby achieving the derivation of static electricity.

[0087] In some embodiments, in combination Figure 5 , Figure 6 as well as Figure 7 As shown, the first copper leakage part 201 includes two sub-copper leakage parts 2011, and the two sub-copper leakage parts 2011 are respectively located at the two ends of the binding area 11 along the length direction of the binding area 11; the substrate layer 10 is provided with a plurality of first conductive holes 101. The plurality of first conductive holes 101 are respectively located at the two ends of the binding area 11 along the length direction of the binding area 11, and the sub-copper leakage part 2011 is electrically connected to the electrostatic release structure 2 through the first conductive holes 101 located at the same end.

[0088] Exemplarily, the shape of the sub-drain copper portion 2011 can be set according to actual conditions. In this embodiment, the sub-drain copper portion 2011 is substantially rectangular.

[0089] When the first wiring layer 20 includes signal lines, the signal lines on the first wiring layer 20 are mainly distributed in the middle area, and the first wiring layer 20 is generally not provided with signal lines at both ends of the binding area 11 along the length direction of the binding area 11 .

[0090] Therefore, by setting sub-copper leakage portions 2011 at both ends of the binding area 11 along the length direction of the binding area 11 in the portion of the first wiring layer 20 located in the binding area 11, the sub-copper leakage portions 2011 will not occupy the routing space, and the electrostatic release structure 2 can be electrically connected to the first copper leakage portion 201, so that the electrostatic charge accumulated on the electrostatic release structure 2 can be conducted to other components of the display device 1000 (for example, a housing, a frame, etc.) through the first copper leakage portion 201, the conductive material filled in the first conductive hole 101 (for example, the above-mentioned conductive ink), and the second copper leakage portion 301, thereby conducting static electricity out and preventing ESD from entering the flexible circuit board 400, thereby better protecting the electronic components arranged on the flexible circuit board 400.

[0091] In some embodiments, Fig. 9 As shown, the first copper leakage portion 201 extends along the length direction of the binding area 11 .

[0092] In some examples, in the first wiring layer 20 located in the binding area 11, part of the first wiring layer 20 is exposed to form the first copper leakage portion 201. In other examples, the part of the first wiring layer 20 located in the binding area 11 is exposed as a whole to form the first copper leakage portion 201. The embodiments of the present disclosure are not limited to this.

[0093] When the portion of the first wiring layer 20 located in the binding area 11 is entirely exposed to form the first copper leakage portion 201, the portion of the first protection layer 40 located in the binding area 11 is removed, so that the portion of the first wiring layer 20 located in the binding area 11 is entirely exposed.

[0094] Specifically, Fig.10 As shown, Fig.10 For along Fig. 9 The cross-sectional structure diagram of the flexible circuit board 400 along the A′-A direction is shown. The first wiring layer 20 is not provided in the binding area 11 of the circuit board body 1 .

[0095] In this embodiment, the first copper leakage portion 201 extends along the length direction of the binding area 11, and the area of ​​the first copper leakage portion 201 is relatively large, so that the contact area between the electrostatic release structure 2 and the first copper leakage portion 201 is larger, and the conductivity between the electrostatic release structure 2 and the first copper leakage portion 201 is better, which is conducive to the static electricity on the electrostatic release structure 2 being conducted to other components of the display device 1000 (for example, the housing, frame, etc.) through the first copper leakage portion 201, the conductive material filled in the first conductive hole 101 (for example, the above-mentioned conductive ink), and the second copper leakage portion 301, thereby conducting the static electricity on the electrostatic release structure 2, and further reducing the risk of electronic components on the flexible circuit board 400 being damaged by electrostatic breakdown.

[0096] In some embodiments, Fig.11 As shown, the first copper leakage portion 201 includes a plurality of sub-copper leakage portions 2011 , and the plurality of sub-copper leakage portions 2011 are sequentially arranged at intervals along the length direction of the binding area 11 .

[0097] Exemplarily, the shapes of the plurality of copper sub-drain portions 2011 may be the same or different, which is not limited in the embodiments of the present disclosure. For example, the shapes of the plurality of copper sub-drain portions 2011 are the same and are all approximately rectangular.

[0098] In this embodiment, the first copper leakage portion 201 includes a plurality of sub-copper leakage portions 2011, and the electrostatic release structure 2 is electrically connected to the plurality of sub-copper leakage portions 2011. The contact area between the electrostatic release structure 2 and the first copper leakage portion 201 is large, and the conductivity between the electrostatic release structure 2 and the first copper leakage portion 201 is better, which is more conducive to the static electricity on the electrostatic release structure 2 being conducted to other components of the display device 1000 (for example, a housing, a frame, etc.) through the first copper leakage portion 201, the conductive material filled in the first conductive hole 101 (for example, the above-mentioned conductive ink), and the second copper leakage portion 301, thereby conducting the static electricity on the electrostatic release structure 2, and further reducing the risk of damage to electronic components on the flexible circuit board 400 due to electrostatic breakdown.

[0099] In some embodiments, in combination Fig.11 and Fig.12 As shown, the second wiring layer 30 is further provided with a ground pin 302 , and the substrate layer 10 is further provided with a second via hole 102 , and the electrostatic release structure 2 is electrically connected to the ground pin 302 through the second via hole 102 .

[0100] Exemplarily, the ground pin 302 is connected to ground.

[0101] Exemplarily, the ground pin 302 may be electrically connected to the second copper leakage portion 301 through a signal line in the second wiring layer 30 .

[0102] Exemplarily, the second via hole 102 is filled with a conductive material, for example, the conductive material may be conductive ink, so that the first copper leakage portion 201 is electrically connected to the ground pin 302 through the first via hole 101 .

[0103] With the above arrangement, the electrostatic charge accumulated on the electrostatic release structure 2 can be released by conduction through the first copper leakage part 201, the conductive material (for example, the conductive ink) filled in the first conductive hole 101, and the second copper leakage part 301; it can also be released by conduction through the first copper leakage part 201, the conductive material (for example, the conductive ink) filled in the second conductive hole 102, and the ground pin 302; it can also be released by conduction through the first copper leakage part 201, the conductive material (for example, the conductive ink) filled in the second conductive hole 102, the ground pin 302, and the second copper leakage part 301. That is, in this embodiment, the flexible circuit board 400 provides multiple channels for electrostatic release for the electrostatic release structure 2, which is more conducive to the conduction and release of the static electricity on the electrostatic release structure 2 and the static electricity generated during the operation of the flexible circuit board 400, and further reduces the risk of damage to the electronic components on the flexible circuit board 400 due to electrostatic breakdown.

[0104] In some embodiments, Fig. 9 , Fig.10 as well as Fig.11 As shown, the flexible circuit board 400 further includes: an electromagnetic shielding layer 3 , which is disposed on a side of the first wiring layer 20 away from the substrate layer 10 , and the electromagnetic shielding layer 3 and the connection area 13 are disposed correspondingly in the thickness direction of the circuit board body 1 .

[0105] Exemplarily, the electromagnetic shielding layer 3 is isolated from the first wiring layer 20. For example, an insulating layer is provided between the electromagnetic shielding layer 3 and the first wiring layer 20, and the insulating layer isolates the electromagnetic shielding layer 3 from the first wiring layer 20. In the case where the flexible circuit board 400 includes the first protective layer 40, the first protective layer 40 can isolate the electromagnetic shielding layer 3 from the first wiring layer 20. Thus, the short circuit problem caused by the connection between the electromagnetic shielding layer 3 and the first wiring layer 20 can be prevented.

[0106] For example, the electromagnetic shielding layer 3 may include copper (Cu), nickel (Ni), ferrite, silver (Ag), or an alloy thereof.

[0107] For another example, the electromagnetic shielding layer 3 may be one or more of conductive rubber, conductive cloth, conductive foam and conductive shielding glue.

[0108] In this embodiment, by providing the electromagnetic shielding layer 3 , interference of external signals on signals transmitted by various signal lines on the flexible circuit board 1000 can be shielded.

[0109] In some embodiments, the second wiring layer 30 further includes a MIPI trace, and the MIPI trace extends from the binding area 11 to the bending area 12. Fig.13 As shown, Fig.13 for Fig.11The partial enlarged view of the middle area B shows that the electromagnetic shielding layer 3 includes a protrusion 03 . The orthographic projection of the protrusion 03 on the circuit board body 1 is located in the bending area 12 and covers the portion of the MIPI trace located in the bending area 12 .

[0110] It should be noted that MIPI (Mobile Industry Processor Interface) routing is a transmission line for transmitting high-speed data signals. One of the key parameters of the routing on the flexible circuit board 400 (including the above-mentioned MIPI routing) is its characteristic impedance. The characteristic impedance of the routing on the flexible circuit board 400 is an important indicator for measuring the design of high-speed circuit boards. The impedance of the high-speed signal routing must be consistent with the characteristic impedance required by the device or signal. Impedance discontinuity will seriously affect signal quality and system performance.

[0111] In this embodiment, the electromagnetic shielding layer 3 includes: a protrusion 03, the orthographic projection of the protrusion 03 on the circuit board body 1 is located in the bending area 12, and covers the part of the MIPI routing located in the bending area 12, thereby avoiding the difference in routing environment between the part of the MIPI routing located in the bending area 12 and the part of the MIPI routing located in the connection area 13, resulting in impedance discontinuity between the part of the MIPI routing located in the bending area 12 and the part of the MIPI routing located in the connection area 13. It can also shield the interference of external signals on the high-speed data signal on the MIPI routing, thereby improving the accuracy of the high-speed data signal transmitted by the MIPI routing and improving the reliability of the flexible circuit board 400.

[0112] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be thought of by any person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A flexible circuit board, characterized in that: The flexible circuit board comprises: A circuit board body, wherein the circuit board body has a binding area and a bending area connected to each other; The electrostatic release structure is located on one side of the circuit board body in the thickness direction, and the electrostatic release structure and the binding area are correspondingly arranged in the thickness direction.

2. The flexible circuit board according to claim 1, characterized in that: The circuit board body further comprises: a connection area located on a side of the bending area away from the binding area; The circuit board body comprises: A substrate layer, the substrate layer having a first surface and a second surface opposite to each other in the thickness direction, and the substrate layer having a first via hole disposed in the binding area; A first wiring layer located on the first surface, the first wiring layer comprising a first copper leakage portion arranged in the binding area; A second wiring layer located on the second surface, the second wiring layer comprising a second copper leakage portion arranged in the connection area, the second copper leakage portion being grounded; The electrostatic release structure is located on a side of the first wiring layer away from the substrate layer, and is electrically connected to the first copper leakage portion; the first copper leakage portion is electrically connected to the second copper leakage portion through the first via.

3. The flexible circuit board according to claim 2, characterized in that: The first copper leakage portion includes two sub-copper leakage portions, and the two sub-copper leakage portions are respectively located at two ends of the binding area along the length direction of the binding area; The substrate layer is provided with a plurality of the first conductive holes, which are respectively located at two ends of the binding area along the length direction of the binding area, and the sub-leakage copper portion is electrically connected to the electrostatic release structure through the first conductive holes located at the same end.

4. The flexible circuit board according to claim 2, characterized in that: The first copper leakage portion extends along a length direction of the binding area.

5. The flexible circuit board according to claim 2, characterized in that: The first copper leakage portion includes a plurality of sub-copper leakage portions, and the plurality of sub-copper leakage portions are sequentially arranged at intervals along the length direction of the binding area.

6. The flexible circuit board according to claim 2, characterized in that: The second wiring layer is further provided with a ground pin, the substrate layer is further provided with a second via hole, and the electrostatic release structure is electrically connected to the ground pin through the second via hole.

7. The flexible circuit board according to claim 2, characterized in that: The flexible circuit board further includes an electromagnetic shielding layer, which is arranged on a side of the first wiring layer away from the substrate layer, and the electromagnetic shielding layer and the connection area are arranged correspondingly in the thickness direction of the circuit board body.

8. The flexible circuit board according to claim 7, characterized in that: The second wiring layer further includes a MIPI routing line, and the MIPI routing line extends from the binding area to the bending area; The electromagnetic shielding layer includes: a protruding portion, the orthographic projection of the protruding portion on the circuit board body is located in the bending area, and covers the portion of the MIPI routing located in the bending area.

9. A display device, characterized in that: include: Display panel; The flexible circuit board according to any one of claims 1 to 8, wherein the flexible circuit board is electrically connected to the display panel.

10. The display device according to claim 9, characterized in that: It also includes a driving chip, which is electrically connected to the display panel, and the electrostatic release structure on the flexible circuit board is in contact with the driving chip.

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