Circuit board with heat dissipation effect
By designing a circuit board with heat dissipation effect, using the combination of frame structure, heat absorption plate, refrigeration plate and heat sink, the problem of difficulty in heat dissipation on the back of a single-sided circuit board is solved, and a more effective heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202420789745.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-17
- Publication Date
- 2025-04-18
- Estimated Expiration
- 2034-04-17
AI Technical Summary
The back of the single-sided circuit board generates heat when the electronic components are running, but it cannot effectively dissipate heat due to contact with the electronic device box or shell.
A circuit board with heat dissipation effect is designed, adopting a frame structure, with grooves and limiting mechanisms on the top surface, a heat dissipation groove on the bottom surface, and a heat sink, a heat dissipation plate and a refrigeration plate are fixedly installed. The heat absorption plate comes into contact with the refrigeration plate, and heat dissipation is dissipated by heat transfer from the refrigeration plate and the air flow of the heat sink.
Through this design, the heat generated by the electronic components on the circuit board body can be absorbed by the heat absorption plate, the refrigeration plate transfers heat, and through the structure of the heat sink and the heat dissipation plate, air flow allows heat to be effectively dissipated, improving the heat dissipation effect of the circuit board.
Smart Images
Figure CN222776474U_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the technical field of circuit boards, and specifically relates to a circuit board with heat dissipation effect. Background Art
[0002] A circuit board is a non-conductive substrate used to support and connect electronic components. It is usually made of insulating material and has conductive circuits printed on it. It is used to connect electronic components and transmit electrical signals. Circuit boards are widely used in electronic equipment and circuit board design, such as computer cases and household appliance housings. They can be made into various shapes and sizes to meet different application requirements.
[0003] The back of a single-sided circuit board will come into contact with the case or shell of an electronic device during installation. The front of the single-sided circuit board is generally used to install electronic components, which can be cooled by a heat dissipation structure or a fan installed inside the case or shell of the electronic device. However, the back of the single-sided circuit board will also generate a certain amount of heat when the electronic components are running. Since the back of the single-sided circuit board is in contact with the case or shell of the electronic device, it cannot dissipate heat well. Therefore, a circuit board with a heat dissipation effect is provided. Utility Model Content
[0004] The purpose of this application is to provide a circuit board with heat dissipation effect in order to solve the above-mentioned problems.
[0005] The technical solution adopted in the present application is as follows: a circuit board with heat dissipation effect, comprising a frame, a groove is provided on the top surface of the frame, a circuit board body is arranged inside the groove, a limiting mechanism connected to the circuit board body is arranged inside the groove, a heat dissipation groove is provided on the bottom surface of the frame, a heat sink is fixedly installed on the inner bottom surface of the groove, a heat sink is fixedly installed on the top of the heat sink, a cooling fin is fixedly installed on the top surface of the heat sink, a heat absorbing plate is fixedly installed on the bottom surface of the circuit board body, and the bottom surface of the heat absorbing plate is in contact with the top surface of the cooling fin.
[0006] In a preferred embodiment, the limiting mechanism includes a positioning column, a positioning hole and a threaded end. The inner bottom surface of the groove is fixedly mounted with a positioning column, the top surface of the circuit board body is provided with a positioning hole corresponding to the positioning column, the positioning column passes through the interior of the positioning hole, the outer surface of the positioning column is provided with an external thread, and one end of the positioning column is threadedly connected to a threaded end.
[0007] In a preferred embodiment, a mounting block is fixedly mounted on a side of the frame, and a fixing hole is formed on a top surface of the mounting block.
[0008] In a preferred embodiment, four positioning columns are fixedly installed on the inner bottom surface of the groove near the corners, and four positioning holes corresponding to the positioning columns are opened on the top surface of the circuit board body near the corners, and the inner diameter of the positioning hole is larger than the outer diameter of the positioning column.
[0009] In a preferred embodiment, two handles are symmetrically fixedly mounted on the sides of the frame.
[0010] In a preferred embodiment, a plurality of heat sinks are provided in a rectangular array on the inner bottom surface of the groove, and a heat sink plate is fixedly mounted on the top of each of the plurality of heat sinks.
[0011] In summary, due to the adoption of the above technical solution, the beneficial effects of this application are:
[0012] 1. In the present application, due to the adoption of the above-mentioned scheme, when the circuit board body is running, the electronic components installed thereon will generate heat. At this time, the heat absorbing plate is provided to facilitate the absorption of the heat generated by the electronic components on the circuit board body. The heat absorbing plate is made of metal materials such as (aluminum, copper), etc., which is convenient for rapid absorption of heat. When the heat absorbing plate absorbs heat, the cooling plate is energized and operated. When the current passes through the cooling plate, the heat is transferred from one side to the other side, one side absorbs the heat, and the other side releases the heat. When the heat is transferred to the heat sink and the heat sink plate, the open structure on both sides of the heat dissipation groove allows the air to flow quickly, which is convenient for heat dissipation of the heat sink. The device can effectively dissipate the heat generated by the operation of the electronic components on the circuit board body and improve the heat dissipation effect of the circuit board body. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 This is a schematic diagram of the overall structure of this application;
[0014] Figure 2 It is a schematic diagram of a partial explosion structure of this application;
[0015] Figure 3 This is a schematic diagram of the heat sink structure of this application.
[0016] Markings in the figure: 1. frame; 2. groove; 3. circuit board body; 4. limit mechanism; 5. heat dissipation groove; 6. heat sink; 7. heat sink; 8. cooling plate; 9. heat absorbing plate; 10. positioning column; 11. positioning hole; 12. threaded end; 13. mounting block; 14. fixing hole; 15. handle. DETAILED DESCRIPTION
[0017] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be described clearly and completely in combination with the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.
[0018] refer to Figure 1 , Figure 2 and Figure 3 A circuit board with heat dissipation effect includes a frame 1, a groove 2 is opened on the top surface of the frame 1, a circuit board body 3 is arranged inside the groove 2, and a limiting mechanism 4 connected to the circuit board body 3 is arranged inside the groove 2; the circuit board body 3 is conveniently installed through the arranged groove 2, and the circuit board body 3 is conveniently limited and fixed through the arranged limiting mechanism 4, thereby improving its stability.
[0019] refer to Figure 1 , Figure 2 A mounting block 13 is fixedly installed on the side of the frame 1, and a fixing hole 14 is opened on the top surface of the mounting block 13. Two handles 15 are symmetrically fixedly installed on the side of the frame 1; through the provided mounting block 13 and the fixing hole 14, it is convenient for personnel to use screws to install the circuit board body 3 inside the electronic device box or shell, and through the provided handle 15, it is convenient for personnel to take the frame 1, thereby improving convenience.
[0020] refer to Figure 2 A heat dissipation groove 5 is provided on the bottom surface of the frame 1, a heat sink 6 is fixedly installed on the inner bottom surface of the groove 2, a heat sink plate 7 is fixedly installed on the top of the heat sink 6, and a plurality of heat sinks 6 are provided on the inner bottom surface of the groove 2 in a rectangular array, and a heat sink plate 7 is fixedly installed on the top of the plurality of heat sinks 6; the plurality of heat sinks 6 are provided to facilitate the installation and fixation of the heat sink plate 7.
[0021] refer to Figure 1 , Figure 2A cooling sheet 8 is fixedly mounted on the top surface of the heat sink 7, and a heat absorbing plate 9 is fixedly mounted on the bottom surface of the circuit board body 3, and the bottom surface of the heat absorbing plate 9 is in contact with the top surface of the cooling sheet 8; the cooling sheet 8 is composed of a pair of semiconductor Peltier sheets of different types, the cooling end is attached to the heat absorbing plate 9, and the heating end is attached to the heat sink 6. When current passes through the cooling sheet 8, heat is transferred from one side to the other side, one side absorbs heat and the other side releases heat. When heat is transferred to the heat sink 6 and the heat sink 7, the heat dissipation groove 5 is provided with an open structure on both sides, which is convenient for heat dissipation of the heat sink 6 and improves the heat dissipation effect of the circuit board body 3. The heat absorbing plate 9 can be made of metal materials (such as aluminum, copper), etc. Metal has excellent thermal conductivity and can quickly absorb and conduct heat.
[0022] refer to Figure 1 , Figure 2 The limiting mechanism 4 includes a positioning column 10, a positioning hole 11 and a threaded end 12. The positioning column 10 is fixedly installed on the inner bottom surface of the groove 2. The top surface of the circuit board body 3 is provided with a positioning hole 11 corresponding to the positioning column 10. The positioning column 10 passes through the inside of the positioning hole 11. Four positioning columns 10 are fixedly installed on the inner bottom surface of the groove 2 near the corners. Four positioning holes 11 corresponding to the positioning columns 10 are provided on the top surface of the circuit board body 3 near the corners. The inner diameter of the positioning hole 11 is larger than the outer diameter of the positioning column 10. By setting the inner diameter of the positioning hole 11 larger than the outer diameter of the positioning column 10, it is convenient for the positioning column 10 to pass through the inside of the positioning hole 11 to position and install the circuit board body 3.
[0023] refer to Figure 1 , Figure 2 The outer surface of the positioning column 10 is provided with an external thread, and one end of the positioning column 10 is threadedly connected with a threaded end 12; By setting, it is convenient to install and fix the circuit board body 3 inside the frame 1.
[0024] The implementation principle of a circuit board embodiment with heat dissipation effect of the present application is as follows: the user first positions the circuit board body 3 through the provided limiting mechanism 4 and installs it inside the frame 1. At this time, the user installs the frame 1 inside the electronic equipment box or shell by passing the screws through the fixing holes 14. When the circuit board body 3 is running, the electronic components installed thereon will generate heat. At this time, the provided heat absorbing plate 9 is convenient for absorbing the heat generated by the electronic components on the circuit board body 3. The heat absorbing plate 9 is made of metal materials (such as aluminum, copper), etc., which is convenient for quickly absorbing heat. When the heat absorbing plate 9 absorbs heat, the cooling plate 8 is powered on and runs. When the current passes through the cooling plate 8, the heat is transferred from one side to the other side, one side absorbs the heat, and the other side releases the heat. When the heat is transferred to the heat sink 6 and the heat sink 7, the two sides of the heat dissipation groove 5 are open structures, so that the air can flow quickly, which is convenient for heat dissipation of the heat sink 6. The device has a simple structure and is easy to operate, and can effectively dissipate the heat generated by the operation of the electronic components on the circuit board body 3, thereby improving the heat dissipation effect of the circuit board body 3.
[0025] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.
Claims
1. A circuit board with heat dissipation effect, comprising a frame (1), characterized in that: The top surface of the frame (1) is provided with a groove (2), a circuit board body (3) is arranged inside the groove (2), a limit mechanism (4) connected to the circuit board body (3) is arranged inside the groove (2), a heat dissipation groove (5) is provided on the bottom surface of the frame (1), a heat sink (6) is fixedly installed on the bottom surface of the groove (2), a heat dissipation plate (7) is fixedly installed on the top of the heat sink (6), a cooling plate (8) is fixedly installed on the top surface of the heat dissipation plate (7), a heat absorbing plate (9) is fixedly installed on the bottom surface of the circuit board body (3), and the bottom surface of the heat absorbing plate (9) is in contact with the top surface of the cooling plate (8).
2. A circuit board with heat dissipation effect as claimed in claim 1, characterized in that: The limiting mechanism (4) comprises a positioning column (10), a positioning hole (11) and a threaded end (12); the positioning column (10) is fixedly mounted on the inner bottom surface of the groove (2); a positioning hole (11) corresponding to the positioning column (10) is provided on the top surface of the circuit board body (3); the positioning column (10) passes through the interior of the positioning hole (11); an external thread is provided on the outer surface of the positioning column (10); and one end of the positioning column (10) is threadedly connected to the threaded end (12).
3. A circuit board with heat dissipation effect as claimed in claim 1, characterized in that: A mounting block (13) is fixedly mounted on the side of the frame (1), and a fixing hole (14) is provided on the top surface of the mounting block (13).
4. A circuit board with heat dissipation effect as claimed in claim 1, characterized in that: Four positioning columns (10) are fixedly installed on the inner bottom surface of the groove (2) near the corners, and four positioning holes (11) corresponding to the positioning columns (10) are opened on the top surface of the circuit board body (3) near the corners, and the inner diameter of the positioning hole (11) is larger than the outer diameter of the positioning column (10).
5. A circuit board with heat dissipation effect as claimed in claim 1, characterized in that: Two handles (15) are symmetrically fixedly mounted on the sides of the frame (1).
6. A circuit board with heat dissipation effect as claimed in claim 1, characterized in that: The inner bottom surface of the groove (2) is provided with a plurality of heat sinks (6) in a rectangular array, and a heat sink plate (7) is fixedly mounted on the top of each of the plurality of heat sinks (6).