Integrated circuit test die for SMT (Surface Mount Technology) packaging product

Abstract

The utility model discloses an integrated circuit test die for SMT packaging products, and belongs to the technical field of circuit test. An integrated circuit test die for SMT packaging products comprises a base, a top plate is movably arranged at the top of the base, a die is installed on the top surface of the top plate, an ejector pin is installed in the middle of the die in a penetrating mode, a plug is installed on the vertical side wall of the base, and a wire harness is electrically connected between the plug and the ejector pin. The ejector pin and the wire harness can be exposed when the ejector plate is lifted backwards. By optimizing the overall structure, the mounting cavity is formed in the upper portion of the base, the top plate serves as a testing platform and has a horizontal position state and a vertical position state, when the top plate is in the horizontal state, the top plate seals an opening in the top of the mounting cavity, the wire harness is sealed and protected in the mounting cavity, and when the top plate is in the horizontal state, the ejector pin and the wire harness can be exposed. And at the moment, the ejector pin moves in the direction far away from the plug to open and straighten the wire harness, so that the wire harness can be distinguished conveniently and the wire can be checked and replaced quickly.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit testing, and more particularly to an integrated circuit testing mold for SMT packaged products. Background Art

[0002] SMT is the abbreviation of surface mount technology, which is the most popular technology and process in the electronic assembly industry. After production, the operation of the connectors and chips needs to be tested to ensure that the finished products are working properly. When the circuit test mold is used to test the integrated circuit board, the integrated circuit board is placed in the mold. The ejector pins on the bottom of the mold will press and contact with the pins of the integrated circuit board to complete the conduction. The test harness is connected to the connector of the integrated circuit board for power supply and signal detection to complete the test.

[0003] Existing circuit test molds require electrical connection between ejector pins and integrated circuit boards. After multiple tests and disassembly, the ends of the ejector pins will wear out or lose their elasticity, and need to be replaced regularly. Because the existing molds use an integrated tester, when the ejector pins are damaged, they cannot be replaced individually, resulting in high maintenance costs. In view of this, we propose an integrated circuit test mold for SMT packaged products. Utility Model Content

[0004] 1. Technical solution

[0005] An integrated circuit test mold for SMT packaged products comprises a base, a top plate movably provided on the top of the base, a mold mounted on the top surface of the top plate, an ejector pin installed through the middle of the mold, a plug mounted on a vertical side wall of the base, a wiring harness electrically connected between the plug and the ejector pin, and the top plate can be lifted backward to expose the ejector pin and the wiring harness.

[0006] Preferably, the base includes a frame, the frame is provided with a rear end plate, a slide is installed on the rear end plate, and the end of the top plate is provided with a slide rod vertically slidably connected to the slide.

[0007] Preferably, the ejector plate comprises a plate body, the plate body is provided with a through hole cooperating with an ejector pin at the mold, and the ejector pin is movably plugged into the plate body via the through hole.

[0008] Preferably, a hook is installed on the bottom surface of the plate body near the slide rod, and the hook is vertically connected to the rear end plate when the plate body is in a vertical state.

[0009] Preferably, a mounting bracket is installed on the top surface of the plate body near the mold, and the mounting bracket includes a vertically arranged bracket. A rubber sleeve is installed on the bracket directly above the mold, and a pressure plate is slidably installed in the rubber sleeve.

[0010] Preferably, the pressing plate includes a main board, which is arranged parallel to the mold. A vertical rod that cooperates with the rubber sleeve is installed on the top surface of the main board, and equidistantly arranged pressing rods are installed at the edge of the bottom surface of the main board.

[0011] Preferably, a meter is installed at the edge of the top surface of the top plate, and the meter is electrically connected to the ejector pin and the plug via a wiring harness.

[0012] 2.Beneficial effects:

[0013] Through the optimization of the overall structure, an installation cavity is formed at the upper part of the base, and the top plate serves as a test platform with two position states: horizontal and vertical. When the top plate is in the horizontal state, the top plate seals the top opening of the installation cavity and protects the wiring harness in the installation cavity. When the top plate is in the horizontal state, the ejector pin and wiring harness can be exposed, and at this time the ejector pin moves away from the plug to stretch and straighten the wiring harness, making it easy to distinguish the wiring harness and perform quick wire checking and replacement. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a three-dimensional schematic diagram of the utility model;

[0015] Figure 2 This is a structural diagram of the utility model from another angle;

[0016] Figure 3 This is a schematic diagram of the overall structure of the utility model;

[0017] Figure 4 This is a schematic diagram of the position of the utility model in the maintenance state.

[0018] Description of the numbers in the figure:

[0019] Base 1; frame 11; rear end plate 12; mold 2; ejector pin 3; pressure plate 4; main board 41; vertical rod 42; pressure rod 43; plug 5; instrument 6; mounting bracket 7; rubber sleeve 71; bracket 72; slide 8; top plate 9; plate body 91; slide rod 92; hook 93; through hole 94; wiring harness 10. DETAILED DESCRIPTION

[0020] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "provided with," "mounted / connected," and "connected" should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be internal communication between two components. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to the specific circumstances.

[0021] This embodiment provides an integrated circuit test mold for SMT packaged products. Figure 1 , including a base 1, the base 1 serves as a fixed frame, and a mounting cavity is formed on the upper part. A top plate 9 is movably provided on the top of the base 1. The top plate 9 serves as a test platform and has two position states, horizontal and vertical. When the top plate 9 is in the horizontal state, the top plate 9 seals the top opening of the mounting cavity, because a mold 2 is installed on the top surface of the top plate 9. The mold 2 is used to carry the packaged integrated circuit board, and an ejector pin 3 is installed through the middle of the mold 2. The welding point at the bottom of the integrated circuit board can be pressed on the position of the ejector pin 3 to achieve electrical connection. At this time, a plug 5 is installed on the vertical side wall of the base 1. At the same time, the electrical connection between the plug 5 and the ejector pin 3 is achieved. A wiring harness 10 is connected, and a test data line is connected at the position of the plug 5, which can provide power for the integrated circuit board and input and output signals to detect the working status of the integrated circuit board. After the front end of the top plate 9 is lifted backward, the top plate 9 is in a horizontal state. At this time, the top plate 9 opens the top opening of the installation cavity. The top plate 9 is lifted backward to expose the ejector pin 3 and the wiring harness 10. Because the ejector pin 3 is electrically connected to the wiring harness 10 using an electrical connector, when the ejector pin 3 needs to be replaced, it is only necessary to separate the wiring harness 10 and pull it out from the top plate 9 to complete the replacement of the ejector pin 3, which makes it convenient to maintain the worn ejector pin 3 in the later stage.

[0022] Reference Figure 2 and Figure 4 In order to optimize the stability of the top plate 9 in the vertical state, the base 1 includes a frame 11, wherein the frame 11 is provided with a rear end plate 12, and a slide 8 is installed at the rear edge of the rear end plate 12, and the slide 8 is provided with a rectangular slide hole along the height direction. At the same time, a slide rod 92 is provided at the end of the top plate 9 for vertical sliding connection with the slide 8. When the top plate 9 is vertically erected, the top plate 9 will be lifted upward around the slide rod 92 at the rear end, and then the slide rod 92 will slide downward along the slide hole. At this time, the top plate 9 will be vertically attached to the position of the rear end plate 12, fully opening the top opening of the installation cavity, and at this time the ejector pin 3 moves away from the plug 5, stretching and straightening the wiring harness 10, making it convenient to distinguish the wiring harness and perform quick wire checking and replacement.

[0023] Reference Figure 4 A hook 93 is installed on the bottom surface of the plate body 91 near the slide bar 92. When the top plate 9 is in a vertical state, the hook 93 will hang on the top of the rear end plate 12, that is, when the plate body 91 is in a vertical state, the hook 93 is vertically connected to the rear end plate 12, which can prevent the top plate 9 from continuing to swing backward. At this time, the top plate 9 can be loosened and the wiring harness 10 and the thimble 3 can be replaced with both hands, which is more convenient for maintenance.

[0024] Reference Figure 4The top plate 9 includes a plate body 91, which is an insulating flat plate. When in use, the plate body 91 is located at the mold 2 and is provided with a through hole 94 that cooperates with the ejector pin 3. The ejector pin 3 is movably connected to the plate body 91 through the through hole 94, and the ejector pin 3 is fixed by welding with an electrical connector. After the ejector pin 3 is inserted into the through hole 94, the electrical connector can be fixed to the plate body 91. The fixing method can be bolted or glued. The specific connection method can be selected by yourself, and it is subject to detachable and replaceable.

[0025] Reference Figure 2 During the test, the top plate 9 is in a horizontal state. At this time, a mounting bracket 7 is installed on the top surface of the plate body 91 near the mold 2, and the mounting bracket 7 includes a vertically arranged bracket 72. At this time, the bracket 72 is located just above the mold 2 and is installed with a rubber sleeve 71. After the integrated circuit board is installed on the template 2, a pressure plate 4 is slidably installed in the rubber sleeve 71. The pressure plate 4 can press down the integrated circuit board, effectively pressing the ejector pin 3 against the solder joint at the bottom of the integrated circuit board. Because the ejector pin 3 is a spring ejector, it can effectively ensure electrical connection and prevent false detection caused by poor conduction.

[0026] Reference Figure 3 The pressing plate 4 includes a main board 41. The main board 41 is made of acrylic board, which is light-transmissive and convenient for observing the status of the integrated circuit board. When pressing the integrated circuit board, the main board 41 is arranged parallel to the mold 2, and equidistantly arranged pressing rods 43 are installed at the edge of the bottom surface of the main board 41, which can ensure that the integrated circuit board is pressed horizontally, and the contact point area of ​​the duck liver 43 with the integrated circuit board is small, which can effectively avoid the electronic components soldered in the middle of the integrated circuit board. In addition, a vertical rod 42 is installed on the top surface of the main board 41 to cooperate with the rubber sleeve 71. The outer wall of the vertical rod 42 is squeezed and contacted with the rubber sleeve 71. After manual pressing, the rubber sleeve 71 fixes the vertical rod 42 in the release position by friction, which can ensure stable pressing. When disassembly is required, the vertical rod 42 is manually lifted until the top dead point. At this time, the hand is released, and the friction of the rubber sleeve 71 on the vertical rod 42 can prevent the main board 41 from falling. The integrated circuit board can be taken out and placed and aligned with both hands, which is more stable to use.

[0027] Reference Figure 1 and Figure 3 A meter 6 is installed at the edge of the top surface of the top plate 9. The meter 6 uses an integrated voltmeter and ammeter. The meter 6 is electrically connected to the thimble 3 and the plug 5 via the wiring harness 10. During the test, the voltage and current conditions can be displayed in real time. For simple circuit on and off, visual detection can be performed directly. For functional detection, a special tester needs to be connected through the plug 5.

[0028] Those skilled in the art should understand that the present invention is not limited to the above-described embodiments. The above-described embodiments and descriptions are merely preferred examples of the present invention and are not intended to limit the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and improvements fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. An integrated circuit test mold for SMT packaged products, comprising a base (1), characterized in that: A top plate (9) is movably provided on the top of the base (1), a mold (2) is installed on the top surface of the top plate (9), an ejector pin (3) is installed through the middle of the mold (2), a plug (5) is installed on the vertical side wall of the base (1), a wiring harness (10) is electrically connected between the plug (5) and the ejector pin (3), and the top plate (9) can be lifted backwards to expose the ejector pin (3) and the wiring harness (10).

2. The integrated circuit test mold for SMT packaged products according to claim 1, characterized in that: The base (1) comprises a frame (11), the frame (11) is provided with a rear end plate (12), a slide frame (8) is installed at the rear end plate (12), and a slide rod (92) vertically slidably connected with the slide frame (8) is provided at the end of the top plate (9).

3. The integrated circuit test mold for SMT packaged products according to claim 2, characterized in that: The top plate (9) comprises a plate body (91), and the plate body (91) is provided with a through hole (94) cooperating with the ejector pin (3) at the mold (2), and the ejector pin (3) is movably plugged into the plate body (91) via the through hole (94).

4. The integrated circuit test mold for SMT packaged products according to claim 3, characterized in that: A hook (93) is installed on the bottom surface of the plate body (91) near the slide rod (92), and the hook (93) is vertically connected to the rear end plate (12) when the plate body (91) is in a vertical state.

5. The integrated circuit test mold for SMT packaged products according to claim 4, characterized in that: A mounting frame (7) is installed on the top surface of the plate body (91) near the mold (2), and the mounting frame (7) includes a vertically arranged bracket (72). The bracket (72) is located directly above the mold (2) and is equipped with a rubber sleeve (71), and a pressure plate (4) is slidably installed in the rubber sleeve (71).

6. The integrated circuit test mold for SMT packaged products according to claim 5, characterized in that: The pressing plate (4) comprises a main board (41), the main board (41) is arranged parallel to the mold (2), a vertical rod (42) matched with a rubber sleeve (71) is installed on the top surface of the main board (41), and pressing rods (43) arranged equidistantly are installed at the edge of the bottom surface of the main board (41).

7. The integrated circuit test mold for SMT packaged products according to claim 6, characterized in that: A meter (6) is installed at the edge of the top surface of the top plate (9), and the meter (6) is electrically connected to the ejector pin (3) and the plug (5) via a wiring harness (10).

Images