Die bonding mechanism
By introducing crystal flip modules and solid crystal correction modules into Gujing Bangding mechanism, the problem that the existing technology cannot perform chip flip-up solid crystal operation, achieving the satisfaction of diversified process requirements and improving the flexibility and efficiency of solid crystal operation.
Patent Information
- Application Number
- CN202420281641.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-05
- Publication Date
- 2025-04-22
- Estimated Expiration
- 2034-02-05
AI Technical Summary
The existing Gujing Bangding agency cannot perform flip-fill crystal solid operation of chips and cannot meet the requirements of diversified processes.
A kind of Gujing Binding mechanism is designed, including a crystal flip module and a solid crystal correction module. The crystal flip module absorbs the chip from the crystal flip station and flips it up and down. The solid crystal correction module corrects the chip angle and then transfers it to the solid crystal station.
The chip is flipped and solid crystal operation is realized, which meets the requirements of diversified processes and improves the flexibility and efficiency of solid crystal operation.
Smart Images
Figure CN222785261U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip solid crystal bonding, in particular to a solid crystal bonding mechanism. Background Art
[0002] The process of transferring the chip from the film to the support is called die bonding. Specifically, the mechanical structure that transfers the chip from the film to the support is called a die bonding mechanism.
[0003] The existing die bonding mechanism generally includes a rotating swing arm, a suction nozzle installed at one end of the rotating swing arm, and a swing arm motor that drives the rotating swing arm to rotate. After the swing arm motor drives the suction nozzle on the rotating swing arm to rotate to the crystal picking station to suck the chip, the swing arm motor then drives the suction nozzle on the rotating swing arm to rotate to the crystal bonding station to put the chip into the bracket, and the crystal bonding operation is completed.
[0004] The existing die bonding mechanism is only applicable to the upright process (ie, the chip does not need to be flipped 180° upside down before being loaded into the bracket), and cannot be applied to the flip-chip process (ie, the chip needs to be flipped 180° upside down before being loaded into the bracket).
[0005] Therefore, it is necessary to improve the existing die bonding mechanism to solve the problem that it is unable to perform flip-chip die bonding operation on the chip.
[0006] The above information disclosed in this Background section is included only for enhancement of understanding of the background of the present disclosure and therefore it may contain information that does not form the prior art that is currently known to a person of ordinary skill in the art. Utility Model Content
[0007] One purpose of the utility model is to provide a die bonding mechanism, which can perform flip-chip die bonding operations on chips, thereby helping to meet diverse process requirements.
[0008] To achieve the above purpose, the utility model provides a die-bonding mechanism, comprising:
[0009] A wafer flip module, which is used to flip the chip upside down after taking it from the wafer picking station;
[0010] The crystal bonding correction module is used to absorb the chip from the crystal taking and flipping module, perform angle correction on the chip, and then transfer the chip to the crystal bonding station.
[0011] Optionally, the crystal retrieval flip module includes a crystal retrieval connecting arm, a crystal retrieval nozzle installed at one end of the crystal retrieval connecting arm, and a flipping rotation drive mechanism installed at the other end of the crystal retrieval connecting arm and driving the crystal retrieval connecting arm to rotate around a horizontal axis.
[0012] Optionally, the crystal retrieval flip module further includes a flip front camera and a flip rear camera located above the crystal retrieval station and arranged side by side;
[0013] The flip front camera and the flip rear camera are symmetrically arranged with respect to a vertical plane where the horizontal axis is located.
[0014] Optionally, the crystal extraction connecting arm includes a solid portion located on one side of the vertical surface and a space-avoiding portion located on the other side of the vertical surface;
[0015] Wherein, the crystal taking nozzle is installed on the entity part.
[0016] Optionally, the wafer taking and flipping module further includes:
[0017] A crystal retrieval Z-direction linear drive mechanism, wherein the driving end of the crystal retrieval Z-direction linear drive mechanism is connected to the flipping rotary drive mechanism, and is used to drive the crystal retrieval nozzle to move up and down;
[0018] A crystal retrieval Y-direction linear drive mechanism, wherein the driving end of the crystal retrieval Y-direction linear drive mechanism is connected to the crystal retrieval Y-direction linear drive mechanism, and is used to drive the crystal retrieval nozzle to reciprocate along the Y direction.
[0019] Optionally, the crystal bonding correction module includes a crystal bonding support, a crystal bonding nozzle rotatably mounted on the crystal bonding support, and a correction rotation drive mechanism transmission-connected to the crystal bonding nozzle.
[0020] Optionally, the die bonding correction module further includes:
[0021] A Z-direction linear drive mechanism for bonding crystals, wherein a driving end of the Z-direction linear drive mechanism for bonding crystals is connected to the bonding crystal support and is used to drive the bonding crystal nozzle to move up and down;
[0022] A Y-direction linear drive mechanism for bonding crystals, wherein a driving end of the Y-direction linear drive mechanism for bonding crystals is connected to the Z-direction linear drive mechanism for bonding crystals, and is used to drive the bonding crystal suction nozzle to reciprocate along the Y direction;
[0023] A crystal bonding X-direction linear driving mechanism, wherein a driving end of the crystal bonding X-direction linear driving mechanism is connected to the crystal bonding Y-direction linear driving mechanism, and is used to drive the crystal bonding nozzle to reciprocate along the X direction.
[0024] Optionally, the crystal bonding correction module further includes a crystal bonding camera, a camera Z-direction linear module for driving the crystal bonding camera to move up and down, and a camera Y-direction linear drive mechanism for driving the crystal bonding camera to reciprocate along the Y direction.
[0025] The beneficial effect of the utility model is that it provides a die bonding mechanism, wherein a die flipping module takes the chip from the die taking station and flips the chip upside down, and then a die bonding correction module takes the chip from the die flipping module and performs an angle correction operation on the chip, and finally the chip is transferred to the die bonding station, thereby completing the flip-chip die bonding operation of the chip and meeting various process requirements. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0027] Figure 1 A schematic diagram of the structure of a die-bonding mechanism provided in an embodiment;
[0028] Figure 2 for Figure 1 A local enlarged schematic diagram of the middle A;
[0029] Figure 3 A schematic diagram of the structure of a die bonding correction module provided in an embodiment.
[0030] In the figure:
[0031] 1. Crystal taking and flipping module;
[0032] 101, crystal extraction connecting arm; 1011, horizontal axis; 1012, vertical surface; 1013, solid part; 1014, air-avoiding part;
[0033] 102. Crystal taking nozzle;
[0034] 103. Rotation drive mechanism for turning over;
[0035] 104. A linear drive mechanism for crystal retrieval in the Z direction; 105. A linear drive mechanism for crystal retrieval in the Y direction;
[0036] 106. Flip the front camera; 107. Flip the rear camera;
[0037] 2. Crystal bonding correction module;
[0038] 201. Crystal fixing bracket;
[0039] 202. Crystal bonding nozzle;
[0040] 203. Rotary drive mechanism for calibration;
[0041] 204, a straight-line driving mechanism for solid crystal in Z direction; 205, a straight-line driving mechanism for solid crystal in Y direction; 206, a straight-line driving mechanism for solid crystal in X direction;
[0042] 207, solid crystal camera;
[0043] 208. Camera Z-direction linear drive mechanism;
[0044] 209. Camera Y-axis linear drive mechanism. DETAILED DESCRIPTION
[0045] In order to make the purpose, features and advantages of the utility model more obvious and easy to understand, the technical scheme in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the embodiment described below is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0046] In the description of the present utility model, it is to be understood that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time. When a component is considered to be "set on" another component, it may be directly set on the other component or there may be a centrally arranged component at the same time.
[0047] In addition, terms such as "long", "short", "inside" and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings and are only used to facilitate the description of the present invention. They do not indicate or imply that the device or component referred to must have this specific direction or operate with a specific direction structure, and should not be understood as a limitation of the present invention.
[0048] The present invention will be described in detail below in conjunction with the specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, methodological, or functional changes made by a person skilled in the art based on these embodiments are all within the scope of protection of the present invention.
[0049] The utility model provides a die bonding mechanism, which is suitable for a die bonding transfer operation scenario in which a chip is transferred from a film to a bracket. The mechanism can perform a flip-chip die bonding operation on the chip, which is conducive to meeting diverse process requirements.
[0050] See also Figure 1 The die bonding mechanism provided in this embodiment includes a die flipping module 1 and a die bonding correction module 2 .
[0051] The wafer pickup and flipping module 1 is used to flip the chip upside down after picking up the chip from the wafer pickup station.
[0052] See also Figure 2 In this embodiment, the crystal retrieval flip module 1 includes a crystal retrieval connecting arm 101, a crystal retrieval nozzle 102 installed at one end of the crystal retrieval connecting arm 101, a flipping rotation drive mechanism 103 installed at the other end of the crystal retrieval connecting arm 101 and driving the crystal retrieval connecting arm 101 to rotate around a horizontal axis 1011, a crystal retrieval Z-direction linear drive mechanism 104 whose driving end is connected to the flipping rotation drive mechanism 103 and drives the crystal retrieval nozzle 102 to move up and down, and a crystal retrieval Y-direction linear drive mechanism 105 whose driving end is connected to the crystal retrieval Y-direction linear drive mechanism 105 and drives the crystal retrieval nozzle 102 to reciprocate along the Y direction.
[0053] Optionally, the crystal retrieval connecting arm 101 includes a solid portion 1013 located on one side of the vertical surface 1012 and a space-avoiding portion 1014 located on the other side of the vertical surface 1012 ; wherein the crystal retrieval nozzle 102 is mounted on the solid portion 1013 .
[0054] Furthermore, the crystal retrieval flip module 1 also includes a flip front camera 106 and a flip rear camera 107 located above the crystal retrieval station and arranged side by side; the flip front camera 106 and the flip rear camera 107 are symmetrically arranged about the vertical plane 1012 where the horizontal axis 1011 is located.
[0055] The die bonding correction module 2 is used to absorb the chip from the die taking and flipping module 1 and perform angle correction on the chip before transferring the chip to the die bonding station.
[0056] See also Figure 3 In this embodiment, the crystal bonding correction module 2 includes a crystal bonding bracket 201, a crystal bonding nozzle 202 rotatably mounted on the crystal bonding bracket 201, a correction rotation drive mechanism 203 transmission-connected to the crystal bonding nozzle 202, a crystal bonding Z-direction linear drive mechanism 204 whose driving end is connected to the crystal bonding bracket 201 and drives the crystal bonding nozzle 202 to move up and down, a crystal bonding Y-direction linear drive mechanism 205 whose driving end is connected to the crystal bonding Z-direction linear drive mechanism 204 and drives the crystal bonding nozzle 202 to reciprocate along the Y direction, and a crystal bonding X-direction linear drive mechanism 206 whose driving end is connected to the crystal bonding Y-direction linear drive mechanism 205 and drives the crystal bonding nozzle 202 to reciprocate along the X direction.
[0057] Optionally, the die bonding correction module 2 further includes a die bonding camera 207 , a camera Z-direction linear module for driving the die bonding camera 207 to move up and down, and a camera Y-direction linear drive mechanism 209 for driving the die bonding camera 207 to reciprocate along the Y direction.
[0058] When the chip on the die bonding station is lifted up by the ejector mechanism to be separated from the film, the working process of the die bonding mechanism provided in this embodiment is as follows:
[0059] S10: The Z-direction linear drive mechanism 104 and the Y-direction linear drive mechanism 105 cooperate to drive the wafer pickup nozzle 102 to move up, down, left, and right to the wafer pickup station to pick up the chip;
[0060] It should be noted that, at this time, the flip front camera 106 is located directly above the entity portion 1013, and the flip rear camera 107 is located directly above the air-avoiding portion 1014;
[0061] S20: The turning rotation drive mechanism 103 drives the wafer taking connecting arm 101 and the wafer taking suction nozzle 102 to turn up and down 180°;
[0062] After flipping upside down:
[0063] On the one hand, the air-avoiding portion 1014 rotates to the position directly below the flip front camera 106, so that the flip front camera 106 will not be disturbed by the solid portion 1013, and can smoothly visually locate the next chip to be sucked, so that the next time the wafer taking nozzle 102 can accurately take the wafer;
[0064] On the other hand, the entity part 1013 is rotated to the position directly below the flip rear camera 107, and the wafer taking nozzle 102 is set upward, the bottom surface of the chip is facing upward and directly facing the flip rear camera 107. At this time, the flip rear camera 107 can obtain the placement angle of the flipped chip, so as to correct the placement angle of the chip later.
[0065] S30: The X-direction linear drive mechanism 206, the Y-direction linear drive mechanism 205, and the Z-direction linear drive mechanism 204 cooperate to drive the bonding nozzle 202 to move forward, backward, left, right, up and down to the top of the wafer extraction nozzle 102, and suck up the inverted chip, so that the chip is separated from the wafer extraction nozzle 102;
[0066] S40: the calibration rotation drive mechanism 203 drives the die bonding nozzle 202 to rotate a certain angle according to the visual information obtained by the flip rear camera 107, so that the chip rotates to a preset angle state;
[0067] S50: The Y-axis linear drive mechanism 205 drives the bonding camera 207 to move to the top of the bracket that needs to be bonded, and visually locates the bracket machine;
[0068] S60: The X-axis linear drive mechanism, the Y-axis linear drive mechanism 205 and the Z-axis linear drive mechanism 204 cooperate to drive the bonding nozzle 202 to place the inverted chip into the bracket to be bonded, thereby completing the flip-chip bonding operation.
[0069] In summary, the die bonding mechanism provided in this embodiment has the following advantages:
[0070] ① After the wafer flip module 1 takes the chip from the wafer taking station and flips it upside down, the die bonding correction module 2 takes the chip from the wafer flip module 1 and performs angle correction on the chip, and finally transfers the chip to the die bonding station, thereby completing the flip-chip die bonding operation of the chip, thereby meeting various process requirements;
[0071] ② The crystal retrieval connecting arm 101 is provided with a solid part 1013 and a void-avoiding part 1014, and is adapted to be provided with a front flip camera 106 and a rear flip camera 107, which is beneficial for obtaining the placement angle of the flipped chip while also visually locating the non-flipped chip, thereby reducing waiting time and improving production efficiency.
[0072] It should be noted that the linear drive mechanism mentioned in the present invention can be a cylinder, a hydraulic cylinder, an electric cylinder or a motor screw linear module, etc., and the rotary drive mechanism mentioned can be a brushed motor, a brushless motor, or a rotary cylinder, etc. The present invention does not limit the specific structural forms of the linear drive mechanism and the rotary drive mechanism.
[0073] It should be understood that although this specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each implementation mode may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.
[0074] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the utility model. They are not intended to limit the protection scope of the utility model. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the utility model should be included in the protection scope of the utility model.
Claims
1. A die bonding mechanism, characterized in that: include: A wafer taking and flipping module (1), wherein the wafer taking and flipping module (1) is used to take the chip from the wafer taking station and flip the chip upside down; A crystal bonding correction module (2), the crystal bonding correction module (2) is used to absorb the chip from the crystal taking and flipping module (1) and perform an angle correction operation on the chip, and then transfer the chip to the crystal bonding station; in, The crystal taking flip module (1) comprises a crystal taking connecting arm (101), a crystal taking suction nozzle (102) installed at one end of the crystal taking connecting arm (101), a flipping rotation drive mechanism (103) installed at the other end of the crystal taking connecting arm (101) and driving the crystal taking connecting arm (101) to rotate around a horizontal axis (1011), and a flip front camera (106) and a flip rear camera (107) located above the crystal taking station and arranged side by side; The flip front camera (106) and the flip rear camera (107) are symmetrically arranged with respect to a vertical plane (1012) where the horizontal axis (1011) is located.
2. The die bonding mechanism according to claim 1, characterized in that: The crystal extraction connecting arm (101) comprises a solid portion (1013) located on one side of the vertical surface (1012) and a clearance portion (1014) located on the other side of the vertical surface (1012); Wherein, the crystal extraction nozzle (102) is installed on the entity part (1013).
3. The die bonding mechanism according to claim 1, characterized in that: The crystal extraction and flipping module (1) further comprises: A crystal retrieval Z-direction linear drive mechanism (104), wherein a driving end of the crystal retrieval Z-direction linear drive mechanism (104) is connected to the flipping rotation drive mechanism (103) and is used to drive the crystal retrieval nozzle (102) to move up and down; A crystal retrieval Y-direction linear drive mechanism (105), wherein a driving end of the crystal retrieval Y-direction linear drive mechanism (105) is connected to the crystal retrieval Y-direction linear drive mechanism (105) and is used to drive the crystal retrieval nozzle (102) to reciprocate along the Y direction.
4. The die bonding mechanism according to claim 1, characterized in that: The crystal bonding correction module (2) comprises a crystal bonding support (201), a crystal bonding nozzle (202) rotatably mounted on the crystal bonding support (201), and a correction rotation drive mechanism (203) drivingly connected to the crystal bonding nozzle (202).
5. The die bonding mechanism according to claim 4, characterized in that: The die bonding correction module (2) further comprises: A crystal bonding Z-direction linear drive mechanism (204), wherein a driving end of the crystal bonding Z-direction linear drive mechanism (204) is connected to the crystal bonding support (201) and is used to drive the crystal bonding nozzle (202) to move up and down; A crystal bonding Y-direction linear drive mechanism (205), wherein a driving end of the crystal bonding Y-direction linear drive mechanism (205) is connected to the crystal bonding Z-direction linear drive mechanism (204) and is used to drive the crystal bonding nozzle (202) to reciprocate along the Y direction; A crystal bonding X-direction linear drive mechanism (206), wherein a driving end of the crystal bonding X-direction linear drive mechanism (206) is connected to the crystal bonding Y-direction linear drive mechanism (205) and is used to drive the crystal bonding nozzle (202) to reciprocate along the X direction.
6. The die bonding mechanism according to claim 4, characterized in that: The crystal bonding correction module (2) further comprises a crystal bonding camera (207), a camera Z-direction linear module for driving the crystal bonding camera (207) to move up and down, and a camera Y-direction linear drive mechanism (209) for driving the crystal bonding camera (207) to reciprocate along the Y direction.