FPC assembly capable of avoiding short circuit of FPC golden finger

Abstract

The utility model discloses an FPC assembly capable of avoiding short circuit of an FPC golden finger, which comprises a base film layer, a first copper layer arranged on the lower surface of the base film layer, a first PI layer arranged on the lower surface of the first copper layer, a second copper layer arranged on the upper surface of the base film layer, and a second PI layer arranged on the upper surface of the second copper layer. A plurality of first golden fingers are arranged on the edge of the upper surface of the base film layer, gaps among the first golden fingers are filled with the first PI layer, the thickness of the first PI layer is larger than that of the first golden fingers, a plurality of second golden fingers are arranged on the edge of the lower surface of the base film layer, and gaps among the second golden fingers are filled with the second PI layer. And the thickness of the second PI layer is greater than that of the first golden finger. When the solder paste is brushed, the PI layer is filled in the gap, and the characteristic of PI is repellent to the solder paste, so that the defect caused by short circuit of the adjacent golden finger PINs through the solder paste can be effectively avoided, and the yield of the FPC is effectively improved.

Description

Technical Field

[0001] The utility model relates to an FPC component, more specifically, to an FPC component for preventing a short circuit of an FPC gold finger. Background Art

[0002] Car screens are used in all aspects of life. When using car screens, flexible circuit boards FPC are used as the carrier of the circuit. When welding the PIN corners of the flexible circuit board FPC, the gold fingers on the FPC board are closely connected to each other, such as Figure 6 As shown, adjacent PIN pins 110 are easily short-circuited together, thereby causing functional abnormalities and resulting in functional damage to the sample.

[0003] Chinese utility model patent document CN215268952U discloses a gold-plated lead to avoid short circuit of gold fingers. The gold-plated lead is attached to the edge of the PCB board; it includes a fixed part and an extension part; the fixed part is located at the upper end of the extension part, the fixed part is the gold finger part and the connecting part, and the extension part is the first processing part and the second processing part; the gold finger part, the connecting part, the first processing part, and the second processing part are connected in sequence. The connecting part is a rectangular structure with a width of 12-20mil and is directly connected to the gold finger part. The first processing part is an isosceles trapezoidal structure, the lower bottom is directly connected to the connecting part, and the width is the same as the connecting part. The upper bottom of the isosceles trapezoidal structure is directly connected to the second processing part, and the width is the same as the second processing part. The width of the upper bottom of the isosceles trapezoidal structure is 1 / 2-2 / 3 of the width of the lower bottom. The second processing part is a rectangular structure, and the length extending toward the edge of the PCB board is 0.2-1.0mm. The rectangular structure of the second processing part has a direct contact part with the edge line of the PCB. The portion where the rectangular structure of the second processing portion directly contacts the edge line of the PCB is the cutting portion.

[0004] Obviously, the patent has an extension part connected to the fixed part, and the extension part is the first processing part and the second processing part. The width of the rectangular structure of the second processing part is relatively small, and the material quality of the gold-plated lead is also relatively small. When the cutting process is performed, the traction force of the cutting is not enough to break the adhesion between the connecting part and the PCB board, which can prevent the gold-plated lead from being torn off as a whole; thanks to the fact that the cutting traction force is not enough to overcome the adhesion in the connecting PCB board and the relatively small amount of residual lead pulled up, the overlap with the adjacent gold-plated lead or even the gold finger is avoided, thereby avoiding the short circuit and improving the quality yield. However, this method cannot solve the short circuit problem of the existing gold finger. Utility Model Content

[0005] Based on this, it is necessary to provide an FPC component that avoids short circuit of FPC gold fingers in view of the above technical problems. The FPC component that avoids short circuit of FPC gold fingers includes a base film layer, a first copper layer is provided on the lower surface of the base film layer, a first PI layer is provided on the lower surface of the first copper layer, a second copper layer is provided on the upper surface of the base film layer, a second PI layer is provided on the upper surface of the second copper layer, a plurality of first gold fingers are provided on the edge of the upper surface of the base film layer, the first PI layer fills the gaps between the first gold fingers, and the thickness of the first PI layer is greater than the thickness of the first gold fingers, a plurality of second gold fingers are provided on the edge of the lower surface of the base film layer, the second PI layer fills the gaps between the second gold fingers, and the thickness of the second PI layer is greater than the thickness of the first gold fingers. Since the first PI layer fills the gaps between the first gold fingers and the second PI layer fills the gaps between the second gold fingers, when applying solder paste, since the gaps are filled with the PI layer, and the characteristics of the PI itself repel the solder paste, it can effectively avoid the adjacent gold finger PIN feet from being short-circuited by the solder paste to cause defects, and effectively improve the yield rate of FPC.

[0006] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0007] An FPC component for preventing a short circuit of an FPC gold finger, characterized in that the FPC component for preventing a short circuit of an FPC gold finger comprises a base film layer, a first copper layer is provided on the lower surface of the base film layer, a first PI layer is provided on the lower surface of the first copper layer, a second copper layer is provided on the upper surface of the base film layer, and a second PI layer is provided on the upper surface of the second copper layer.

[0008] A plurality of first gold fingers are arranged on the edge of the upper surface of the base film layer, the first PI layer fills the gaps between the first gold fingers, and the thickness of the first PI layer is greater than the thickness of the first gold fingers.

[0009] A plurality of second gold fingers are arranged at the edge of the lower surface of the base film layer, the second PI layer fills the gaps between the second gold fingers, and the thickness of the second PI layer is greater than the thickness of the first gold fingers.

[0010] As a preferred implementation of the FPC assembly for avoiding short circuit of FPC gold fingers provided by the utility model, an IC back steel sheet reinforcement layer is provided on the upper surface of the second PI layer.

[0011] As a preferred implementation of the FPC assembly for preventing the short circuit of the FPC gold finger provided by the utility model, a double-sided adhesive layer on the back side of the IC back steel sheet is provided on the upper surface of the IC back steel sheet reinforcement layer.

[0012] As a preferred implementation of the FPC assembly for preventing the FPC gold finger from short-circuiting provided by the utility model, the thickness of the first PI layer is twice the thickness of the first gold finger.

[0013] As a preferred implementation of the FPC assembly for preventing the FPC gold finger from short-circuiting provided by the utility model, the thickness of the second PI layer is twice the thickness of the second gold finger.

[0014] As a preferred implementation of the FPC assembly for avoiding short circuit of FPC gold fingers provided by the utility model, the thickness of the first PI layer is equal to the thickness of the second PI layer.

[0015] As a preferred implementation of the FPC assembly for avoiding short circuit of FPC gold fingers provided by the utility model, the tops of the first PI layer and the second PI layer are provided with protruding portions protruding outwards.

[0016] As a preferred implementation of the FPC assembly for preventing FPC gold finger short circuit provided by the utility model, the height of the raised portion is one third of the thickness of the first PI layer.

[0017] As a preferred implementation of the FPC assembly for preventing the short circuit of the FPC gold finger provided by the utility model, the tops of the first PI layer and the second PI layer are provided with inwardly recessed portions.

[0018] As a preferred implementation of the FPC assembly for preventing FPC gold finger short circuit provided by the utility model, the height of the recessed portion is one third of the thickness of the first PI layer.

[0019] Compared with the prior art, the utility model has the following beneficial effects:

[0020] The utility model provides an FPC component for preventing short circuit of FPC gold fingers. Since a first PI layer fills the gap between the first gold fingers and a second PI layer fills the gap between the second gold fingers, when applying solder paste, since the gap is filled with the PI layer and the characteristics of the PI itself repel the solder paste, it can effectively prevent adjacent gold finger PIN feet from being short-circuited by the solder paste to cause defects, thereby effectively improving the yield rate of the FPC.

[0021] In addition, the top of the first PI layer and the second PI layer can be provided with a protruding portion protruding outward. The height of the protruding portion is one third of the thickness of the first PI layer. By using the protruding protruding portion, when brushing solder paste, the solder paste can be quickly flowed on the protruding portion, further avoiding the defect caused by the short circuit of adjacent gold finger PIN pins through the solder paste, and further improving the yield rate of FPC.

[0022] In addition, the top of the first PI layer and the second PI layer can be provided with an inwardly concave recessed portion. The height of the recessed portion is one third of the thickness of the first PI layer. By using the inwardly concave recessed portion, when applying solder paste, excess solder paste can be deposited at the bottom of the recessed portion, thereby avoiding defects caused by short-circuiting of adjacent gold finger PIN pins through solder paste, and further improving the yield rate of FPC. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the scheme in the utility model, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 It is a structural schematic diagram of an FPC assembly for preventing a short circuit of an FPC gold finger according to the utility model;

[0025] Figure 2 for Figure 1 The structural diagram of the FPC assembly to prevent the FPC gold finger from short-circuiting is shown from another perspective.

[0026] Figure 3 for Figure 1 A schematic diagram of the local structure of an FPC assembly to prevent short circuits in FPC gold fingers;

[0027] Figure 4 It is a structural schematic diagram of another embodiment of the FPC assembly for preventing the short circuit of the FPC gold finger of the utility model;

[0028] Figure 5 It is a structural schematic diagram of another embodiment of the FPC assembly for preventing the FPC gold finger from short-circuiting according to the utility model;

[0029] Figure 6 It is a schematic diagram of the structure of the C gold finger of the existing FP;

[0030] The markings in the figure are as follows: 1, base film layer; 11, first gold finger; 12, second gold finger; 2, first copper layer; 3, first PI layer; 4, second copper layer; 5, second PI layer; 6, IC back steel sheet reinforcement layer; 61, raised part; 7, double-sided adhesive layer on the back of the IC back steel sheet; 71, recessed part. DETAILED DESCRIPTION

[0031] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0032] As described in the background technology, the prior art is for vehicle-mounted screens. Vehicle-mounted screens are used in all aspects of life. When using vehicle-mounted screens, flexible circuit boards FPC are used as circuit carriers. When soldering the PIN corners of the flexible circuit boards FPC, since the gold fingers on the FPC board are closely connected, adjacent PIN pins are easily short-circuited together, causing functional abnormalities and resulting in functional damage to the sample.

[0033] In order to solve this technical problem, the utility model provides an FPC component for preventing short circuit of FPC gold fingers, comprising a base film layer 1, a first copper layer 2 is provided on the lower surface of the base film layer 1, a first PI layer 3 is provided on the lower surface of the first copper layer 2, a second copper layer 4 is provided on the upper surface of the base film layer 1, and a second PI layer 5 is provided on the upper surface of the second copper layer 4. A plurality of first gold fingers 11 are provided on the edge of the upper surface of the base film layer 1, the first PI layer 3 fills the gaps between the first gold fingers 11, and the thickness of the first PI layer 3 is greater than the thickness of the first gold fingers 11. A plurality of second gold fingers 12 are provided on the edge of the lower surface of the base film layer 1, the second PI layer 5 fills the gaps between the second gold fingers 12, and the thickness of the second PI layer 5 is greater than the thickness of the first gold fingers 11. An IC back steel sheet reinforcement layer 6 is provided on the upper surface of the second PI layer 5. An IC back steel sheet back double-sided adhesive layer 7 is provided on the upper surface of the IC back steel sheet reinforcement layer 6.

[0034] Through the above structural design, since the first PI layer 3 fills the gap between the first gold fingers 11, and the second PI layer 5 fills the gap between the second gold fingers 12, when brushing solder paste, since the gap is filled with the PI layer, and the characteristics of PI itself repel the solder paste, it can effectively avoid the defects caused by the short circuit of adjacent gold finger PIN pins through the solder paste, and effectively improve the yield rate of FPC.

[0035] In order to enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0036] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions in the embodiments may be combined with each other.

[0037] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0038] Example 1

[0039] like Figure 1 , Figure 2 and Figure 3 As shown, the FPC component for preventing FPC gold finger short circuit includes a base membrane layer 1, a first copper layer 2 is provided on the lower surface of the base membrane layer 1, a first PI layer 3 is provided on the lower surface of the first copper layer 2, a second copper layer 4 is provided on the upper surface of the base membrane layer 1, and a second PI layer 5 is provided on the upper surface of the second copper layer 4.

[0040] A plurality of first gold fingers 11 are disposed on the edge of the upper surface of the base film layer 1 , and the first PI layer 3 fills the gaps between the first gold fingers 11 , and the thickness of the first PI layer 3 is greater than the thickness of the first gold fingers 11 .

[0041] A plurality of second gold fingers 12 are disposed at the edge of the lower surface of the base film layer 1 . The second PI layer 5 fills the gaps between the second gold fingers 12 , and the thickness of the second PI layer 5 is greater than that of the first gold fingers 11 .

[0042] It should be noted that an IC back steel sheet reinforcement layer 6 is provided on the upper surface of the second PI layer 5. An IC back steel sheet back double-sided adhesive layer 7 is provided on the upper surface of the IC back steel sheet reinforcement 6.

[0043] In addition, the thickness of the first PI layer 3 is twice the thickness of the first gold finger 11 . The thickness of the second PI layer 5 is twice the thickness of the second gold finger 12 .

[0044] In addition, the thickness of the first PI layer 3 is equal to the thickness of the second PI layer 5 .

[0045] The working mode of this embodiment is described below.

[0046] Since the first PI layer 3 fills the gap between the first gold fingers 11, and the second PI layer 5 fills the gap between the second gold fingers 12, when applying solder paste, since the gap is filled with the PI layer and the characteristics of PI itself repel the solder paste, it can effectively avoid the defects caused by the short circuit of adjacent gold finger PIN pins through the solder paste, and effectively improve the yield rate of FPC.

[0047] Example 2

[0048] like Figure 4 As shown, the FPC assembly for preventing the FPC gold finger from short-circuiting provided in Example 1 is further optimized. Specifically, the tops of the first PI layer 3 and the second PI layer 5 are provided with protruding portions 61 protruding outward.

[0049] The height of the protrusion 61 is one third of the thickness of the first PI layer 3 .

[0050] The working mode of this embodiment is described below.

[0051] By utilizing the outwardly protruding raised portion 61, when applying solder paste, the solder paste can be quickly diverted at the raised portion 61, further avoiding defects caused by short-circuiting of adjacent gold finger PIN pins by the solder paste, and further improving the yield rate of the FPC.

[0052] Example 3

[0053] like Figure 5 As shown, the FPC assembly for preventing the FPC gold finger from short-circuiting provided in Example 1 or 2 is further optimized. Specifically, the top of the first PI layer 3 and the second PI layer 5 is provided with an inwardly recessed portion 71 .

[0054] The height of the recessed portion 7 is one third of the thickness of the first PI layer 3 .

[0055] The working mode of this embodiment is described below.

[0056] By utilizing the inwardly recessed recess 71, when applying solder paste, excess solder paste can be deposited at the bottom of the recess 7, thereby preventing adjacent gold finger PIN pins from being short-circuited by the solder paste and causing defects, thereby further improving the yield rate of the FPC.

[0057] The terms "coupling" and "coupling" involved in the embodiments of the present application should be understood in a broad sense. For example, they may refer to a direct physical connection, or an indirect connection achieved through electronic devices, such as a connection achieved through resistors, inductors, capacitors or other electronic devices.

[0058] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0059] Obviously, the embodiments described above are only some embodiments of the present application, rather than all embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to replace some of the technical features therein with equivalents. Any equivalent structure made using the contents of the specification and drawings of this application, directly or indirectly used in other related technical fields, is similarly within the scope of patent protection of this application.

Claims

1. An FPC assembly for preventing short circuit of FPC gold fingers, characterized in that: The FPC component for preventing FPC gold finger short circuit comprises a base film layer (1), a first copper layer (2) is provided on the lower surface of the base film layer (1), a first PI layer (3) is provided on the lower surface of the first copper layer (2), a second copper layer (4) is provided on the upper surface of the base film layer (1), a second PI layer (5) is provided on the upper surface of the second copper layer (4), a plurality of first gold fingers (11) are provided on the edge of the upper surface of the base film layer (1), the first PI layer (3) fills the gaps between the first gold fingers (11), and the thickness of the first PI layer (3) is greater than the thickness of the first gold fingers (11), and a plurality of second gold fingers (12) are provided on the edge of the lower surface of the base film layer (1), the second PI layer (5) fills the gaps between the second gold fingers (12), and the thickness of the second PI layer (5) is greater than the thickness of the first gold fingers (11).

2. The FPC assembly for preventing FPC gold finger short circuit according to claim 1, characterized in that: An IC back steel sheet reinforcement layer (6) is provided on the upper surface of the second PI layer (5).

3. The FPC assembly for preventing FPC gold finger short circuit according to claim 2, characterized in that: A double-sided adhesive layer (7) is provided on the upper surface of the IC back steel sheet reinforcement layer (6).

4. The FPC assembly for preventing FPC gold finger short circuit according to claim 1, characterized in that: The thickness of the first PI layer (3) is twice the thickness of the first gold finger (11).

5. The FPC assembly for preventing FPC gold finger short circuit according to claim 1, characterized in that: The thickness of the second PI layer (5) is twice the thickness of the second gold finger (12).

6. The FPC assembly for preventing FPC gold finger short circuit according to claim 1, characterized in that: The thickness of the first PI layer (3) is equal to the thickness of the second PI layer (5).

7. The FPC assembly for preventing FPC gold finger short circuit according to claim 1, characterized in that: The tops of the first PI layer (3) and the second PI layer (5) are provided with protruding portions (61) protruding outwards.

8. The FPC assembly for preventing FPC gold finger short circuit according to claim 7, characterized in that: The height of the raised portion (61) is one third of the thickness of the first PI layer (3).

9. The FPC assembly for preventing FPC gold finger short circuit according to claim 1, characterized in that: The tops of the first PI layer (3) and the second PI layer (5) are provided with inwardly recessed recesses (71).

10. The FPC assembly for preventing FPC gold finger short circuit according to claim 9, characterized in that: The height of the recessed portion (71) is one third of the thickness of the first PI layer (3).

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