Binding structure of FPC (Flexible Printed Circuit) and PCB (Printed Circuit Board)

Abstract

The utility model discloses a binding structure of an FPC (Flexible Printed Circuit) and a PCB (Printed Circuit Board), which comprises a PCB binding point arranged on the PCB and provided with a plurality of connecting points; the FPC connecting point positions are arranged at the ends of the FPC, and the FPC connecting point positions can be connected with the multiple connecting points at the same time to form binding points; according to the utility model, the connection between the FPC connection point and the PCB binding point can be pressed and limited through the pressure head, so that the probability of relative displacement between the PCB binding gold finger area and the FPC connection position can be reduced, and specifically, the FPC connection point and the PCB binding point can be directly guided to be connected, so that the production efficiency is improved, and the production cost is reduced. When the FPC connection point is connected with a plurality of connection points at the same time and forms a binding point, the binding point can be pressed and limited through the pressing head.

Description

Technical Field

[0001] The utility model relates to the field of liquid crystal displays, and in particular to a binding structure of an FPC and a PCB. Background Art

[0002] Mobile electronic communication devices, such as tablet computers and mobile phones, have been widely used in many fields and have become indispensable products in people's daily lives. However, low-end products have low profits, while mid-to-high-end products have high profits. Driven by profits, mid-to-high-end products account for an increasing proportion of the market, and mass consumption generally prefers mid-to-high-end products, and market competition is becoming increasingly fierce. Due to the high performance of mid-to-high-end products, the use of FPC flexible boards alone can no longer meet the design requirements. FPC and PCB must be used together to meet the design requirements of mid-to-high-end products. At present, gold fingers are set on one side of the PCB and connected to the FPC.

[0003] In the prior art, such as the patent document with application number CN202221973366.3, which discloses a PCB board binding circuit structure, which can effectively increase the adhesion of the ACF edge, prevent the edge of the attachment from warping, and avoid the problem of poor overlap of the ACF attached roll material by setting the Mark point outward to avoid the ACF coverage range, so as to ensure that the equipment can clearly grasp the position of the Mark point, improve the accuracy of grasping the mark, and reduce the risk of binding deviation; it can effectively improve the binding yield and equipment utilization rate, improve the product one-time pass rate, and reduce material loss.

[0004] However, the technical solution disclosed in the above patent document still has limitations in its specific implementation, because the contact surface between the PCB board binding gold finger area and the FPC connection position is mostly flat. In the absence of external stability, the PCB board binding gold finger area and the FPC connection position are prone to relative displacement during the connection process, resulting in reduced connection quality. Utility Model Content

[0005] Based on this, it is necessary to provide a binding structure between FPC and PCB to address the above technical problems.

[0006] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0007] A binding structure of an FPC and a PCB, comprising:

[0008] A PCB board binding point is arranged on the PCB board, and a plurality of connection points are arranged on the PCB board binding point;

[0009] FPC connection point, the FPC connection point is arranged at the end of the FPC, and the FPC connection point can be connected to multiple connection points at the same time to form a binding point;

[0010] A pressure head can press and limit the binding point when the binding point is formed.

[0011] Furthermore, the PCB board includes a component area and an ink area, a marking surface is provided in the ink area, and a plurality of the connection points are arranged in the ink area. When the binding point is formed, the marking surface in the ink area is removed.

[0012] Furthermore, the width of the identification surface is not less than the length of the connection point.

[0013] Furthermore, a plurality of windows are arranged on the FPC connection points, and each of the windows is arranged corresponding to each of the connection points.

[0014] Furthermore, the shape of each of the empty windows is matched with each of the corresponding connection points, and the length of the empty window is not less than the length of the connection point.

[0015] Furthermore, the length of the pressure head is not less than the length of the FPC connection point.

[0016] Furthermore, the pressure head is provided with a locking groove, and each of the locking grooves is respectively matched with each of the connection points.

[0017] Furthermore, the width of the positioning groove is greater than the width of the connection point.

[0018] Furthermore, an oblique guide groove is provided at an opening edge of the positioning groove, and a groove width of the oblique guide groove is greater than a groove width of the positioning groove.

[0019] Furthermore, the surface of the pressure head is provided with an avoidance groove connected to all the positioning grooves.

[0020] Compared with the prior art, the utility model has the following beneficial effects:

[0021] The utility model can press and limit the connection between the FPC connection point and the PCB board binding point through a pressure head, so as to reduce the probability of relative displacement between the PCB board binding gold finger area and the FPC connection position. Specifically, the FPC connection point can be directly guided to connect with the PCB board binding point. When the FPC connection point is connected to multiple connection points at the same time to form a binding point, the binding point can be pressed and limited by the pressure head. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A schematic diagram of the pressure head structure provided by the utility model;

[0023] Figure 2 This is a schematic diagram of the FPC connection point structure provided by the utility model;

[0024] Figure 3 A schematic diagram of the component area structure provided by the utility model;

[0025] Figure 4 A schematic diagram of the empty window structure provided by the utility model;

[0026] Figure 5 A schematic diagram of the structure of the clamping slot provided by the utility model;

[0027] Figure 6 This is a schematic diagram of the avoidance groove structure provided by the utility model.

[0028] The markings in the figure are as follows:

[0029] 1. PCB board binding point; 2. FPC connection point; 3. Press head; 4. Component area; 5. Ink area; 6. Empty window; 7. Positioning slot; 8. Avoidance slot; 9. Oblique guide slot. DETAILED DESCRIPTION

[0030] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0031] As described in the background technology, since the contact surface between the PCB board binding gold finger area and the FPC connection position is mostly flat, in the absence of external stability, relative displacement between the PCB board binding gold finger area and the FPC connection position is likely to occur during the connection process, resulting in reduced connection quality.

[0032] In order to solve this technical problem, the utility model provides a binding structure of an FPC and a PCB.

[0033] Specifically, please refer to Figure 1-6 The binding structure of the FPC and the PCB includes: a PCB board binding point 1, which is arranged on the PCB board, and a plurality of connection points are arranged on the PCB board binding point 1;

[0034] FPC connection point 2, FPC connection point 2 is set at the end of the FPC, and FPC connection point 2 can be connected to multiple connection points at the same time to form a binding point;

[0035] The pressing head 3 can press and limit the binding point when the binding point is formed.

[0036] The utility model can press and limit the connection between the FPC connection point 2 and the PCB board binding point 1 through the pressure head 3, so as to reduce the probability of relative displacement between the PCB board binding gold finger area and the FPC connection position. Specifically, the FPC connection point 2 can be directly guided to connect with the PCB board binding point 1. When the FPC connection point 2 is connected to multiple connection points at the same time and a binding point is formed, the binding point can be pressed and limited by the pressure head 3.

[0037] Generally, the pressure head 3 adopts a unified binding pressure head design, such as the width can be designed according to the common width of ACF 1.0mm / 1.5mm / 2.0mm, and the length can be designed according to 30mm / 60mm / 100mm / 150mm / 200mm. Avoid designing one for each project, which will result in multiple binding pressure heads, waste of materials, and difficulty in finding.

[0038] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiments of the utility model will be clearly and completely described below in conjunction with the accompanying drawings.

[0039] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions in the embodiments may be combined with each other.

[0040] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0041] Example 1

[0042] Please refer to Figure 1-3 The binding structure of the FPC and the PCB includes: a PCB board binding point 1, which is arranged on the PCB board, and a plurality of connection points are arranged on the PCB board binding point 1;

[0043] FPC connection point 2, FPC connection point 2 is set at the end of the FPC, and FPC connection point 2 can be connected to multiple connection points at the same time to form a binding point;

[0044] The pressing head 3 can press and limit the binding point when the binding point is formed.

[0045] The utility model can press and limit the connection between the FPC connection point 2 and the PCB board binding point 1 through the pressure head 3, so as to reduce the probability of relative displacement between the PCB board binding gold finger area and the FPC connection position. Specifically, the FPC connection point 2 can be directly guided to connect with the PCB board binding point 1. When the FPC connection point 2 is connected to multiple connection points at the same time and a binding point is formed, the binding point can be pressed and limited by the pressure head 3.

[0046] Generally, the pressure head 3 adopts a unified binding pressure head design, such as the width can be designed according to the common width of ACF 1.0mm / 1.5mm / 2.0mm, and the length can be designed according to 30mm / 60mm / 100mm / 150mm / 200mm. Avoid designing one for each project, which will result in multiple binding pressure heads, waste of materials, and difficulty in finding.

[0047] In some specific embodiments, the PCB board includes a component area 4 and an ink area 5, a marking surface is provided in the ink area 5, and multiple connection points are arranged in the ink area 5. When the binding point is formed, the marking surface in the ink area 5 is removed.

[0048] In some specific embodiments, the width of the identification surface is not less than the length of the connection point.

[0049] Specifically, the marking surface may be made of marking ink, which can be erased by itself. The ink area 5 is also provided to facilitate the connection between the FPC connection point 2 and the PCB board binding point 1 to prevent the original center position from shifting when the two are connected.

[0050] Example 2

[0051] The binding structure of the FPC and the PCB provided in Example 1 is further optimized. The binding structure of the FPC and the PCB includes: a PCB board binding point 1, which is arranged on the PCB board, and a plurality of connection points are arranged on the PCB board binding point 1;

[0052] FPC connection point 2, FPC connection point 2 is set at the end of the FPC, and FPC connection point 2 can be connected to multiple connection points at the same time to form a binding point;

[0053] The pressing head 3 can press and limit the binding point when the binding point is formed.

[0054] The utility model can press and limit the connection between the FPC connection point 2 and the PCB board binding point 1 through the pressure head 3, so as to reduce the probability of relative displacement between the PCB board binding gold finger area and the FPC connection position. Specifically, the FPC connection point 2 can be directly guided to connect with the PCB board binding point 1. When the FPC connection point 2 is connected to multiple connection points at the same time and a binding point is formed, the binding point can be pressed and limited by the pressure head 3.

[0055] Generally, the pressure head 3 adopts a unified binding pressure head design, such as the width can be designed according to the common width of ACF 1.0mm / 1.5mm / 2.0mm, and the length can be designed according to 30mm / 60mm / 100mm / 150mm / 200mm. Avoid designing one for each project, which will result in multiple binding pressure heads, waste of materials, and difficulty in finding.

[0056] In some specific embodiments, the PCB board includes a component area 4 and an ink area 5, a marking surface is provided in the ink area 5, and multiple connection points are arranged in the ink area 5. When the binding point is formed, the marking surface in the ink area 5 is removed.

[0057] In some specific embodiments, the width of the identification surface is not less than the length of the connection point.

[0058] Specifically, the marking surface may be made of marking ink, which can be erased by itself. The ink area 5 is also provided to facilitate the connection between the FPC connection point 2 and the PCB board binding point 1 to prevent the original center position from shifting when the two are connected.

[0059] In some specific embodiments, a plurality of windows 6 are provided on the FPC connection point 2, and each window 6 is provided corresponding to each connection point. The window 6 is provided to prevent the height difference between the surface of the FPC connection point 2 and the PCB board binding point 1 due to the existence of the connection point when the FPC connection point 2 is connected to multiple connection points at the same time to form a binding point, and the plurality of windows 6 are provided to make the multiple connection points respectively match and connect with the plurality of windows 6 one by one.

[0060] In some specific embodiments, the shape of each window 6 is matched with each corresponding connection point, and the length of the window 6 is not less than the length of the connection point. This is set so that when multiple connection points are matched with multiple windows 6 one by one, the connection point will not be unable to enter the window 6.

[0061] In some specific embodiments, the length of the pressure head 3 is not less than the length of the FPC connection point 2. This setting is to enable the pressure head 3 to fully press the FPC connection point 2 and the PCB board binding point 1 to avoid the phenomenon of warping at the edge of the FPC connection point 2.

[0062] Example 3

[0063] The binding structure of the FPC and the PCB provided in Embodiment 1 or 2 is further optimized, and the binding structure of the FPC and the PCB comprises: a PCB board binding point 1, which is arranged on the PCB board, and a plurality of connection points are arranged on the PCB board binding point 1;

[0064] FPC connection point 2, FPC connection point 2 is set at the end of the FPC, and FPC connection point 2 can be connected to multiple connection points at the same time to form a binding point;

[0065] The pressing head 3 can press and limit the binding point when the binding point is formed.

[0066] The utility model can press and limit the connection between the FPC connection point 2 and the PCB board binding point 1 through the pressure head 3, so as to reduce the probability of relative displacement between the PCB board binding gold finger area and the FPC connection position. Specifically, the FPC connection point 2 can be directly guided to connect with the PCB board binding point 1. When the FPC connection point 2 is connected to multiple connection points at the same time and a binding point is formed, the binding point can be pressed and limited by the pressure head 3.

[0067] Generally, the pressure head 3 adopts a unified binding pressure head design, such as the width can be designed according to the common width of ACF 1.0mm / 1.5mm / 2.0mm, and the length can be designed according to 30mm / 60mm / 100mm / 150mm / 200mm. Avoid designing one for each project, which will result in multiple binding pressure heads, waste of materials, and difficulty in finding.

[0068] In some specific embodiments, the PCB board includes a component area 4 and an ink area 5, a marking surface is provided in the ink area 5, and multiple connection points are arranged in the ink area 5. When the binding point is formed, the marking surface in the ink area 5 is removed.

[0069] In some specific embodiments, the width of the identification surface is not less than the length of the connection point.

[0070] Specifically, the marking surface may be made of marking ink, which can be erased by itself. The ink area 5 is also provided to facilitate the connection between the FPC connection point 2 and the PCB board binding point 1 to prevent the original center position from shifting when the two are connected.

[0071] In some specific embodiments, a plurality of windows 6 are provided on the FPC connection point 2, and each window 6 is provided corresponding to each connection point. The window 6 is provided to prevent the height difference between the surface of the FPC connection point 2 and the PCB board binding point 1 due to the existence of the connection point when the FPC connection point 2 is connected to multiple connection points at the same time to form a binding point, and the plurality of windows 6 are provided to make the multiple connection points respectively match and connect with the plurality of windows 6 one by one.

[0072] In some specific embodiments, the shape of each window 6 is matched with each corresponding connection point, and the length of the window 6 is not less than the length of the connection point. This is set so that when multiple connection points are matched with multiple windows 6 one by one, the connection point will not be unable to enter the window 6.

[0073] In some specific embodiments, the length of the pressure head 3 is not less than the length of the FPC connection point 2. This setting is to enable the pressure head 3 to fully press the FPC connection point 2 and the PCB board binding point 1 to avoid the phenomenon of warping at the edge of the FPC connection point 2.

[0074] In some specific embodiments, the pressure head 3 is provided with a clamping slot 7, and each clamping slot 7 is respectively matched with each connection point. Since the pressure head 3 needs to fully press the FPC connection point 2 and the PCB board binding point 1 together, in order to prevent the height difference between the pressure head 3 and the FPC connection point 2, the clamping slot 7 is used to limit the protruding part, that is, multiple connection points are respectively matched with multiple clamping slots 7 one by one, so that the edge area of ​​the clamping slot 7 can fully press the FPC connection point 2 and the PCB board binding point 1.

[0075] In some specific embodiments, the width of the positioning groove 7 is greater than the width of the connection point. This arrangement is to enable the positioning groove 7 to fully cooperate with the connection point.

[0076] In some specific embodiments, an oblique guide groove 9 is provided at the opening edge of the positioning groove 7, and the groove width of the oblique guide groove 9 is greater than the groove width of the positioning groove 7. This is arranged to guide the positioning groove 7 to fully cooperate with the connection point through the oblique guide groove 9, and to prevent the edge of the positioning groove 7 from scratching the connection point when the pressing head 3 is just pressed.

[0077] Example 4

[0078] Further limit embodiment 3

[0079] In some specific embodiments, the surface of the pressure head 3 is provided with an avoidance groove 8 connected to all the locking grooves 7. The avoidance groove 8 exists to allow the connection point to be fully inserted into the locking groove 7, and in the process of inserting into the locking groove 7, the avoidance groove 8 can serve as an area to accommodate the protrusions of some connection points to prevent the locking groove 7 from incorrectly docking with the connection point, thereby causing the PCB board binding point 1 to be crushed.

[0080] After the avoidance groove 8 is provided, the two ends of the connection point can be limited by the positioning grooves 7 at both ends of the avoidance groove 8, which not only improves the stability, but also improves the fault tolerance during pressing.

[0081] The use process of the binding structure of FPC and PCB provided by the utility model is as follows: the utility model can press and limit the connection between the FPC connection point 2 and the PCB board binding point 1 through the pressure head 3, so as to reduce the probability of relative displacement between the PCB board binding gold finger area and the FPC connection position. Specifically, the FPC connection point 2 can be directly guided to connect with the PCB board binding point 1. When the FPC connection point 2 is connected to multiple connection points at the same time to form a binding point, the binding point can be pressed and limited by the pressure head 3.

[0082] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0083] Obviously, the embodiments described above are only some embodiments of the utility model, rather than all embodiments. The preferred embodiments of the utility model are given in the accompanying drawings, but they do not limit the patent scope of the utility model. The utility model can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the utility model more thorough and comprehensive. Although the utility model is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to replace some of the technical features therein with equivalents. Any equivalent structure made using the contents of the utility model specification and the accompanying drawings, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the utility model.

Claims

1. A binding structure of FPC and PCB, characterized in that: include: A PCB board binding point (1), which is arranged on the PCB board, and a plurality of connection points are arranged on the PCB board binding point (1); An FPC connection point (2), the FPC connection point (2) being arranged at an end of the FPC, and the FPC connection point (2) being capable of connecting to a plurality of connection points simultaneously to form a binding point; A pressing head (3), wherein the pressing head (3) can press and limit the binding point when the binding point is formed.

2. The binding structure of FPC and PCB according to claim 1, characterized in that: The PCB board comprises a component area (4) and an ink area (5), wherein a marking surface is provided in the ink area (5), and a plurality of connection points are arranged in the ink area (5), and when a binding point is formed, the marking surface in the ink area (5) is removed.

3. The binding structure of FPC and PCB according to claim 2, characterized in that: The width of the marking surface is not less than the length of the connection point.

4. The binding structure of FPC and PCB according to claim 2 or 3, characterized in that: A plurality of empty windows (6) are arranged on the FPC connection point (2), and each of the empty windows (6) is arranged corresponding to each of the connection points.

5. The binding structure of FPC and PCB according to claim 4, characterized in that: The shape of each of the empty windows (6) is respectively matched with each of the corresponding connection points, and the length of the empty windows (6) is not less than the length of the connection point.

6. The binding structure of FPC and PCB according to claim 5, characterized in that: The length of the pressure head (3) is not less than the length of the FPC connection point (2).

7. The binding structure of FPC and PCB according to claim 6, characterized in that: The pressure head (3) is provided with a locking groove (7), and each of the locking grooves (7) is respectively arranged to match each of the connection points.

8. The binding structure of FPC and PCB according to claim 7, characterized in that: The width of the locking groove (7) is greater than the width of the connection point.

9. The binding structure of FPC and PCB according to claim 7, characterized in that: An oblique guide groove (9) is provided at the opening edge of the locking groove (7), and the groove width of the oblique guide groove (9) is greater than the groove width of the locking groove (7).

10. The binding structure of FPC and PCB according to claim 9, characterized in that: The surface of the pressure head (3) is provided with an avoidance groove (8) which is in communication with all the positioning grooves (7).

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