Improved solder paste printing machine wiping module

Abstract

The utility model relates to the technical field of electronic assembly, in particular to an improved wiping module of a solder paste printing machine, and aims to solve the problem of residual tin powder on the back of a steel mesh. The wiping module comprises a fixing piece and a wiping piece, the fixing piece is made of aluminum alloy materials, a plurality of parallel installation grooves are formed in the fixing piece, the wiping piece comprises wiping strips, the number of the wiping strips is matched with that of the installation grooves, and each wiping strip is detachably installed in one installation groove. According to the wiping module, by increasing the wiping area, improving the wiping efficiency and achieving the detachable and replaceable design, the problem that tin powder remains on the back face of the steel mesh is effectively solved, the reject ratio is reduced, and the production efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of electronic assembly technology, and in particular to an improved solder paste printer wiping module, which is an improved wiping module designed to solve the problem of residual tin powder on the back of a steel mesh. Background Art

[0002] In the field of electronics, SMT refers to surface mount technology. This is an extremely popular, stable and mature process in the electronic assembly industry. It is mainly used to mount pinless or short-lead surface mount components (abbreviated as SMC / SMD, called chip components in Chinese) on the surface of printed circuit boards or other substrates, and then solder and assemble them through reflow soldering, wave soldering and other methods. SMT technology originated in the 1960s and gradually developed with the emergence of miniaturized electronic devices.

[0003] In the prior art, SMT technology usually consists of the following steps: printing solder paste, placing parts, welding and fixing, inspection and rework, etc. Among them, solder paste printing is one of the key steps, and its quality directly affects the subsequent mounting effect. In the prior art, the wiping module used in the solder paste printer has a small contact area with the steel mesh during wiping, and it is not easy to wipe off the residual tin powder on the back of the steel mesh, resulting in poor tinning on the gold surface and copper foil area of ​​the circuit board during the production process, increasing the defective rate and cost loss; and during use, the plastic wiping head is very easy to wear when contacting the steel mesh for wiping, but the existing wiping module is an integrated design, and the worn area cannot be replaced separately. The entire device needs to be replaced, and the replacement cost is high. Summary of the invention

[0004] The purpose of this application is to provide a modified solder paste printer wiping module, which effectively solves the problem of residual tin powder on the back of the steel mesh by increasing the wiping area, improving the wiping efficiency and realizing a detachable and replaceable design, thereby reducing the defective rate and improving production efficiency.

[0005] In the first aspect, the present application provides an improved solder paste printer wiping module, which is applied to the SMT process. The wiping module includes: a fixing part and a wiping part. The fixing part is made of an aluminum alloy material. A plurality of parallel mounting grooves are arranged on the fixing part. The wiping part includes wiping strips matching the number of the mounting grooves. Each of the wiping strips can be detachably installed in a mounting groove.

[0006] Furthermore, the wiping strip is made of a silicone material with a Shore hardness between 30A and 60A.

[0007] Furthermore, the length of the wiping strip is designed according to the length of the printed circuit board.

[0008] Furthermore, the width of the wiping strip is set between 3-8 mm.

[0009] Furthermore, the fixing member includes a fixing portion and a mounting portion, the mounting portion is protruding from the surface of the fixing portion, the fixing portion is detachably connected to the machine platform of the solder paste printer, and the mounting groove is provided in the mounting portion.

[0010] Furthermore, the number of the wiping strips is two.

[0011] Furthermore, the wiping module is connected to a pressure regulating mechanism, which can regulate the pressure of the wiping module on the steel mesh.

[0012] Furthermore, the wiping strip and the mounting groove are interference fit.

[0013] Furthermore, the fixing part is detachably mounted on the machine platform by screws.

[0014] Furthermore, the distance between two adjacent mounting grooves is 10-15 mm.

[0015] The beneficial effects of this application are:

[0016] 1. Improve wiping efficiency: Multiple wiping strips work simultaneously, which significantly increases the wiping area and improves wiping efficiency.

[0017] 2. Improve wiping effect: The softness and wear resistance of the silicone material are combined to effectively avoid damage to the steel mesh while ensuring the thorough removal of residual tin powder.

[0018] 3. Reduce maintenance costs: The detachable and replaceable wiping strip design facilitates maintenance and reduces the overall maintenance cost.

[0019] 4. Reduce the defective rate: Improve the wiping effect, significantly reduce the problem of poor tinning of circuit boards caused by residual tin powder, and reduce the defective rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 According to some embodiments of the present application, a schematic diagram of the matching structure of the magnetic carrier and the FPC sheet is shown;

[0021] Figure 2 According to some embodiments of the present application, a schematic structural diagram of the carrier body in the magnetic carrier is shown. DETAILED DESCRIPTION

[0022] The following is a more detailed description of the technical features and advantages of the present application in conjunction with the accompanying drawings, so that the advantages and features of the present application can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0023] It should be noted that, in the description of the present application, terms such as "up", "down", "left", "right", "inside", and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings. This is merely for the convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be understood as a limitation on the present invention.

[0024] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the importance of the technical features shown.

[0025] In addition, it should be noted that in the description of this application, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] See also Figure 1-Figure 2 The embodiment of the present application provides an improved solder paste printer wiping module applied to the SMT process. The wiping module includes: a fixing member 1 and a wiping member 2. The technical solution adopted in this embodiment is as follows:

[0027] Design of the fixing member 1: The fixing member 1 can be made of aluminum alloy material, which has high strength and corrosion resistance and is suitable for bearing mechanical stress during the wiping process for a long time. A plurality of mounting grooves are arranged in parallel on the fixing member 1 for installing the wiping member 2 to ensure a stable connection between the wiping module and the solder paste printer. Specifically, the fixing member 1 may include a fixing portion 101 and a mounting portion 102. The fixing portion 101 is used to connect the machine platform of the solder paste printer and can be fixed on the machine platform by screws. The fixing portion 101 and the mounting portion 102 may be an integrated structure or a split structure, and are fixedly connected by bolt connection or welding. In order to ensure the connection strength, a first threaded mounting hole 103 and a second threaded mounting hole 104 may be arranged at both ends of the fixing portion 101. If the extension length of the fixing member 1 is long, at least one third threaded mounting hole 105 may be further arranged between the first threaded mounting hole 103 and the second threaded mounting hole 104. The third threaded mounting hole 105 may be arranged on the mounting portion 102, and the fixing member 1 may be fixedly mounted on the machine platform by at least two bolt connection structures. Considering the long extension length of the fixing member 1, in order to reduce the impact of processing errors on installation difficulty, at least one of the first threaded mounting hole 103 and the second threaded mounting hole 104 can be designed as a waist hole, so that the installation position of the bolt can be adjusted to a certain extent, reducing the installation difficulty.

[0028] Design of wiping member 2: The wiping member 2 is composed of a plurality of wiping strips made of silicone material, and each wiping strip is designed to be detachably mounted in the mounting groove of the fixing member 1. The silicone material has good softness and wear resistance, which can effectively avoid damage to the surface of the steel mesh during the wiping process, while improving the wiping effect. In one wiping action, multiple wiping strips contact the surface of the steel mesh at the same time and move with the steel mesh to wipe. By increasing the wiping area and wiping points, the wiping efficiency and effect are significantly improved, and the residual tin powder on the back of the steel mesh is effectively removed. The wiping strip and the fixing member 1 are designed to be detachably mounted. When a wiping strip is severely worn, it can be taken out and replaced with a new one separately without replacing the entire wiping module, which reduces maintenance costs and extends the service life of the wiping module.

[0029] When choosing the silicone material used for the wiping strip, you need to consider multiple factors, including wiping effect, wear resistance, degree of damage to the steel mesh, and cost. Specifically, you can focus on the hardness range (such as Shore hardness) and wear resistance index of the silicone material to ensure that it is both soft and durable.

[0030] First of all, the Shore hardness of silicone material is an indicator to measure its hardness and softness. The lower the Shore hardness value, the softer the silicone; the higher the Shore hardness value, the harder the silicone. In the SMT process, the wiping strip needs to have a certain degree of softness to better fit the steel mesh surface, while maintaining sufficient wear resistance to cope with long-term wiping operations.

[0031] Secondly, considering that the wiping strip needs to be in close contact with the surface of the steel mesh and move to wipe, if the silicone material is too hard, it may scratch or damage the surface of the steel mesh; if it is too soft, it may not be able to effectively remove the residual tin powder. Therefore, it is necessary to select a Shore hardness range that can ensure the wiping effect without easily damaging the steel mesh.

[0032] Taking all the above factors into consideration, it is recommended to use high-quality silicone material with moderate Shore hardness, good softness and wear resistance for the wiper of solder paste printer in SMT process. Specifically, the Shore hardness value can be selected between 30A and 60A. The silicone material within this range can meet the requirements of wiping effect and maintain low damage to the steel mesh surface.

[0033] In order to verify the effect of the technical solution of the utility model in practical application, especially the optimization of wiping effect and work efficiency, the applicant designed an embodiment of a wiping module including 1-3 wiping strips for testing to achieve efficient and thorough removal of residual tin powder on the back of the steel mesh. After a large number of tests by the applicant, it was found that when the number of wiping strips is designed to be two, the comprehensive effect is the best. At this time, the wiping module not only improves the wiping effect, but also ensures the stability of production efficiency. Please refer to Figure 1During the wiping process of the solder paste printer, the first wiping strip 201 and the second wiping strip 202 contact the back of the steel mesh at the same time, and wipe in a straight line or arc path as the steel mesh moves. The wiping speed can be adjusted according to actual conditions to ensure a balance between wiping effect and work efficiency. In some embodiments, the wiping module can also be equipped with a pressure regulating mechanism (such as a spring, a pneumatic cylinder, etc.). The pressure regulating mechanism can be set between the fixing part 1 and the wiping part 2 to adjust the wiping pressure of the wiping strip on the steel mesh, ensuring that the surface of the steel mesh is not excessively damaged during the wiping process, and the residual tin powder can be effectively removed.

[0034] The wiping strip can be fixed in the installation operation through an interference fit structure, without the need to set up an additional connection structure, so as to facilitate installation and maintenance.

[0035] In the description of this specification, the description with reference to the terms "some embodiments", "some examples", "exemplarily", "example", "preferably", or "further" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0036] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An improved solder paste printer wiping module, applied to SMT process, characterized in that: It comprises a fixing part and a wiping part, wherein the fixing part is made of aluminum alloy material and is provided with a plurality of parallel mounting grooves, and the wiping part comprises wiping strips matching the number of the mounting grooves, and each of the wiping strips is detachably mounted in a mounting groove.

2. The wiping module according to claim 1, characterized in that: The wiping strip is made of a silicone material with a Shore hardness between 30A and 60A.

3. The wiping module according to claim 1, characterized in that: The length of the wiping strip is designed according to the length of the printed circuit board.

4. The wiping module according to claim 2, characterized in that: The width of the wiping strip is set between 3-8 mm.

5. The wiping module according to claim 1, characterized in that: The fixing member comprises a fixing portion and a mounting portion, wherein the mounting portion is protruding from the surface of the fixing portion, the fixing portion is detachably connected to the machine platform of the solder paste printer, and the mounting groove is provided in the mounting portion.

6. The wiping module according to claim 1, characterized in that: The number of the wiping strips is two.

7. The wiping module according to claim 1, characterized in that: The wiping module is connected to a pressure regulating mechanism, which can regulate the pressure of the wiping module on the steel mesh.

8. The wiping module according to claim 1, characterized in that: The wiping strip is interference-fitted with the mounting groove.

9. The wiping module according to claim 5, characterized in that: The fixing part is detachably mounted on the machine platform by screws.

10. The wiping module according to claim 1, characterized in that: The distance between two adjacent installation grooves is 10-15mm.

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