Electrical contact device for electroplating

Abstract

The utility model provides an electric contact appliance for electroplating, which comprises an insulating substrate part and at least one electroplating contact structure, and is characterized in that the insulating substrate part comprises an insulating frame and an electroplating clamping area enclosed by the insulating frame; the electroplating contact structure comprises a conductive part and at least one electric contact point electrically connected with the conductive part, the conductive part is fixed to the insulating frame, the electric contact point extends to the electroplating clamping area, the to-be-electroplated part is electrically connected through the electric contact point, and electroplating of the to-be-electroplated part is achieved. The electric contact appliance can flexibly change the electroplating condition of the to-be-electroplated part to adapt to the electroplating requirements of different to-be-electroplated parts, and can also be used for testing the electroplating effect of the to-be-electroplated part under the conditions of different electric contact point numbers and contact areas to determine the electroplating condition required in the actual electroplating production of the to-be-electroplated part, so that the electroplating efficiency of the to-be-electroplated part is improved. And the production cost is reduced, and a better electroplating effect can be realized.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor manufacturing technology, and relates to a silicon wafer electroplating technology, and in particular to an electrical contact device for electroplating. Background Art

[0002] The silicon wafer electroplating process is to deposit a layer of metal film on the surface of the silicon wafer for the manufacture of electronic components. The metal film can provide good conductivity and adhesion, protecting the surface of the silicon wafer from environmental erosion and mechanical damage. In the prior art, the horizontal electroplating technology is generally used to achieve surface electroplating of silicon wafers: the silicon wafer is in contact with the plating solution, the silicon wafer is electrically connected to the negative pole of the power supply, and the plating solution is electrically connected to the positive pole of the power supply, forming a closed circuit loop, thereby achieving electroplating.

[0003] At present, the electrical connection between the silicon wafer and the negative pole of the power supply is generally achieved through a conductive roller. However, due to the line contact between the conductive roller and the silicon wafer, the current cannot be too large. Once it is too large, the local current will become high, the coating thickness will be extremely unstable, and the entire surface cannot be electroplated. In addition, the electric field formed on the surface of the silicon wafer is relatively complex, resulting in poor planarity of the final silicon wafer electroplating. At the same time, since the conductive roller will corrode the conductive roller itself when it contacts the plating solution, it is necessary to place the conductive roller separately in an isolation tank to avoid contact with the plating solution, which also makes the silicon wafer electroplating equipment larger and the effective plating distance is shortened, resulting in a higher cost for horizontal electroplating.

[0004] Therefore, how to make the horizontal electroplating coating of silicon wafers more uniform and of better quality is an urgent problem to be solved by those skilled in the art. Utility Model Content

[0005] The purpose of the present application is to provide an electrical contact device for electroplating, which is used to solve the problem that in the existing silicon wafer electroplating device, there is line contact between the conductive roller and the silicon wafer, which easily leads to poor uniformity of the electroplated coating.

[0006] In a first aspect, the present application provides an electrical contact device for electroplating, comprising an insulating substrate portion and at least one electroplating contact structure;

[0007] The insulating substrate portion includes an insulating frame and an electroplating clamping area surrounded by the insulating frame;

[0008] The electroplating contact structure includes a conductive member and at least one electrical contact point electrically connected to the conductive member, the conductive member is fixed on the insulating frame, and the electrical contact point extends to the electroplating clamping area.

[0009] In the present application, the workpiece to be electroplated is electrically connected to the negative pole of the power supply through the electrical contact points electrically connected to the conductive parts, thereby improving the electric field on the surface of the workpiece to be electroplated, avoiding the problem of complex surface electric field due to line contact and unstable coating thickness caused by high local current, improving the uniformity of the coating and the quality of the finished electroplating product, and achieving better electroplating effect.

[0010] In an embodiment of the present invention, the insulating frame extends a plurality of support portions toward the electroplating clamping area to support the workpiece to be electroplated in the electroplating clamping area.

[0011] In one embodiment of the utility model, the electroplating contact structure further includes a conductive contact sheet having a removable insulating film on the surface, the conductive contact sheet is electrically connected to the conductive member through a conductive column, and the conductive contact sheet extends a plurality of first electrical contact extensions toward the electroplating clamping area, wherein at least one of the first electrical contact extensions has the removable insulating film on the surface removed to serve as the electrical contact point. By removing the removable insulating film on the surface of the conductive contact sheet, the number of electrical contact points can be changed. As the number of electrical contact points increases, the edge effect of the electric field can be reduced, thereby improving the uniformity of the electric field on the surface of the member to be electroplated, and further improving the uniformity of the plating layer.

[0012] In one embodiment of the utility model, the electroplating contact structure further includes a plurality of connectors disposed on the insulating frame and electrically connected to the conductive member, and a conductive block detachably connected to the insulating frame through the connector, and the conductive block extends at least one second electrical contact extension toward the electroplating clamping area as the electrical contact point. The number of electrical contact points can be changed by removing or installing the conductive block, and the structure is simple and the operation is convenient, which is conducive to quickly and conveniently changing the number of electrical contact points, thereby improving the uniformity of the electric field on the surface of the workpiece to be electroplated, and further improving the uniformity of the plating layer.

[0013] In one embodiment of the utility model, it also includes a plurality of clamping parts fixed on the conductive part by an elastic unit, the clamping parts extend toward the electrical contact point, and the clamping parts and the electrical contact point form a clamping part under the action of the elastic unit. The clamping part can fix the workpiece to be plated on the electrical contact device, and can ensure good contact between the workpiece to be plated and the electrical contact point, thereby improving the electroplating effect; at the same time, since the elastic unit has a large compression and extension space, when the workpiece to be plated is impacted by external force, the elastic unit can provide a certain buffer space to avoid the workpiece to be plated from being broken, thereby improving the production yield of the workpiece to be plated.

[0014] In one embodiment of the present invention, an insulating coating is provided on the surface of the non-electrical contact point of the conductive block to prevent the conductive block from being corroded by the electroplating solution, thereby increasing the service life of the electrical contact device.

[0015] In an embodiment of the present invention, the material of the conductive element includes one or more of metal titanium, copper and nickel.

[0016] In an embodiment of the present invention, the material of the conductive pillar and the conductive contact sheet includes one or more of metal titanium, copper and nickel.

[0017] In one embodiment of the present invention, the insulating frame is made of polyvinyl chloride, which has a density greater than that of the electroplating liquid, so as to avoid floating in the liquid and affecting the electroplating effect.

[0018] In one embodiment of the present invention, the electrical contact points are arranged at equal intervals to further enhance the uniformity of the electric field and improve the quality of the coating.

[0019] As described above, the present application provides an electrical contact device for electroplating, which has a simple structure and is easy to operate. It is electrically connected to the negative pole of the power supply through the electrical contact point, thereby realizing the electroplating of the part to be electroplated. Compared with the line contact in the prior art, the electroplating of the point contact can obtain a more uniform electroplating coating. At the same time, by removing the removable insulating film on the surface of the conductive contact sheet or disassembling the conductive block, the number of electrical contact points can be changed. Due to the increase in the number of electrical contact points, the edge effect of the electric field can be reduced, thereby improving the uniformity of the electric field on the surface of the part to be electroplated, further improving the uniformity of the coating, and obtaining a better electroplating effect. At the same time, since the electrical contact device provided by the present application can change the number of electrical contact points, it can also be used to test the electroplating conditions of the part to be electroplated, so as to determine the number and area of ​​electrical contact points required in the actual production of the electroplating of the part to be electroplated, avoid wasting production materials, reduce production costs, and achieve better electroplating effects, which is conducive to the practical application of horizontal electroplating processes. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 Shown is a schematic diagram of the structure of an electrical contact device for electroplating described in an embodiment of the present application.

[0021] Figure 2 Shown is a side view of an electrical contact device structure for electroplating according to an embodiment of the present application.

[0022] Figure 3 Shown is a schematic diagram of the conductive block structure described in an embodiment of the present application.

[0023] Figure 4 Shown is a schematic diagram of the clamping member structure described in an embodiment of the present application.

[0024] Figure 5 Shown is a schematic diagram of the structure of another electrical contact device for electroplating described in an embodiment of the present application.

[0025] Figure 6Shown is a side view of another electrical contact device structure for electroplating described in an embodiment of the present application.

[0026] Component number description

[0027] 100 Insulation substrate

[0028] 101 Insulation frame

[0029] 102 Electroplating clamping area

[0030] 103 Support

[0031] 200 Electroplated contact structure

[0032] 210 Conductive block

[0033] 211 Conductive screw hole

[0034] 213 second electrical contact extension

[0035] 220 Conductive parts

[0036] 230 Conductive Column

[0037] 240 Clamping parts

[0038] 241 elastic unit

[0039] 242 Clamping part

[0040] 250 Conductive contact sheet

[0041] 251 first electrical contact extension DETAILED DESCRIPTION

[0042] The following describes the embodiments of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. The present application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict.

[0043] It should be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present application, and thus the drawings only show components related to the present application rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed at will, and the component layout may also be more complicated.

[0044] The following embodiments of the present application provide an electrical contact device for electroplating, which realizes electrical connection between the workpiece to be electroplated and the negative electrode of the power supply through multiple electrical contact points, so as to realize electroplating of the workpiece to be electroplated. The workpiece to be electroplated is electrically connected to the negative electrode of the power supply by point contact, which can improve the electric field on the surface of the workpiece to be electroplated and avoid the problem of excessive local current caused by line contact, thereby making the electroplated coating more uniform and improving the electroplating effect.

[0045] The principle and implementation of an electric contact device for electroplating of this embodiment will be described in detail below in conjunction with the accompanying drawings, so that those skilled in the art can understand the electric contact device for electroplating of this embodiment without creative work.

[0046] like Figure 1 As shown, the present application provides an electrical contact device for electroplating, including an insulating substrate portion 100 and at least one electroplating contact structure 200. The insulating substrate portion 100 includes an insulating frame 101 and an electroplating clamping area 102 surrounded by the insulating frame 101. When in use, the workpiece to be electroplated is placed in the electroplating clamping area 102. When the workpiece to be electroplated is electroplated, the workpiece to be electroplated arranged in the electroplating clamping area 102 can contact the electroplating solution, and a closed circuit can be realized when the workpiece to be electroplated is electroplated. The insulating frame 101 is preferably polyvinyl chloride, and its density is greater than the electroplating solution, so as to prevent the insulating substrate portion 100 from floating in the water and affecting the electroplating effect. The electroplating contact structure 200 is electrically connected to the negative pole of the power supply during electroplating, and is electrically connected to the workpiece to be electroplated through the electrical contact point, so that the workpiece to be electroplated can be electrically connected to the negative pole of the power supply.

[0047] like Figure 1 As shown, specifically, the electroplating contact structure 200 includes a conductive member 220 fixed on the insulating frame 101, a connector disposed inside the insulating frame 101 and the conductive block 210, and a conductive block 210 fixed on the insulating frame 101 through the connector. Specifically, the conductive member 220, the connector and the conductive block 210 are all made of conductive materials; the conductive member 220 can be electrically connected to the negative electrode of the power supply through a graphite brush or a metal brush, or the conductive member 220 is provided with an electrical plug hole and is electrically connected to the negative electrode of the power supply through a wire. The insulating frame 101 also includes a through hole, through which the connector is electrically connected to the conductive member 220; the conductive block 210 has a conductive through hole 211, which is detachably fixed and electrically connected to the connector through the conductive through hole, and is electrically contacted with the conductive member 220 through the connector.

[0048] Optionally, the conductive through hole 211 is a threaded hole, and the connecting member is a metal screw with corresponding threads, and the conductive block 210 is fixed by tightening the screw in the threaded hole; or, the conductive through hole 211 is a smooth through hole, and the connecting member is a metal screw with a nut, and the nut is located below the conductive block 210, and the conductive block 210 is fixed by tightening the screw and the nut. Figure 2As shown, this embodiment may also include a plurality of conductive blocks 210, which are detachably fixed to the insulating frame 101 through a plurality of connectors, and the plurality of conductive blocks 210 are on the same horizontal plane. The plurality of conductive blocks 210 can provide the workpiece to be electroplated with a plurality of electrical contact points. The increase in the number of electrical contact points of the workpiece to be electroplated can reduce the edge effect of the electric field, making the electric field on the surface of the workpiece to be electroplated more uniform, further improving the uniformity of the plating layer, and obtaining a higher quality plating layer.

[0049] Preferably, the plurality of conductive blocks 210 are arranged at equal intervals to further improve the uniformity of the electric field on the surface of the workpiece to be electroplated.

[0050] It should be noted that the conductive block 210 includes a second electrical contact extension portion 213 extending to the electroplating clamping area 102, so that when the workpiece to be electroplated is placed on the electrical contact device for electroplating, the workpiece to be electroplated contacts the conductive block 210. Specifically, Figure 3 As shown, the conductive block 210 has an L-shaped second electrical contact extension 213, wherein the upper surface of the second electrical contact extension 213 is conductive. When the workpiece to be electroplated is placed on the electrical contact device, the L-shaped second electrical contact extension 213 holds the workpiece to be electroplated and makes point contact with the workpiece to be electroplated, thereby achieving electrical connection between the workpiece to be electroplated and the negative pole of the power supply. Based on this, the conductive block 210 can provide an electrical contact point on the surface of the workpiece to be electroplated to achieve electroplating of the workpiece to be electroplated. Optionally, the conductive block 210 extending to the electroplating clamping area 102 can also be in other shapes, such as a straight shape, a U-shape, or other shapes, as long as it extends to the electroplating clamping area 102 to hold the workpiece to be electroplated. This embodiment is not specifically limited here.

[0051] It should be noted that the number and contact area of ​​electrical contact points on the surface of the workpiece to be electroplated will have a significant impact on the effect of electroplating. Since the conductive block 210 is detachably fixed to the insulating frame 101 through a connector, the number of electrical contact points on the surface of the workpiece to be electroplated can be changed by removing or installing the conductive block 210, or by replacing different conductive blocks 210, for example, with electrical contact surfaces of different sizes, the area of ​​the conductive area on the surface of the workpiece to be electroplated and the shape of different electrical contact points can be changed. This is convenient and easy to operate, and can meet different electroplating requirements of the workpiece to be electroplated, thereby improving the electroplating effect of the workpiece to be electroplated.

[0052] It should be noted that, in order to ensure that the workpiece to be plated maintains good contact with the second electrical contact extension 213 of the conductive block 210 during the electroplating process, the electroplating contact structure 200 further includes a clamping member 240. Figure 4As shown, the clamping member 240 includes a clamping portion 242 and an elastic unit 241. The elastic unit 241 on the clamping portion 242 is fixed on the conductive member 220, and the lower end overlaps or partially overlaps with the second electrical contact extension 213 in the vertical direction, that is, the clamping portion 242 extends toward the electrical contact point. When the workpiece to be electroplated is placed on the second electrical contact extension 213 of the conductive block 210, the clamping portion 242 is located above the workpiece to be electroplated, and squeezes the workpiece to be electroplated under the action of the elastic unit 241 to fix the position of the workpiece to be electroplated, so that the workpiece to be electroplated maintains good contact with the second electrical contact extension 213, thereby improving the electroplating quality and stability of the workpiece to be electroplated.

[0053] It should be noted that the upper end of the elastic unit 241 is fixedly connected to the conductive member 220. When the workpiece to be plated is placed on the second electrical contact extension 213 of the conductive block 210, the elastic unit 241 is actually in a compressed state. The clamping portion 242 squeezes the workpiece to be plated through the force generated by the compression of the elastic unit 241 to fix the position of the workpiece to be plated. Furthermore, since the elastic unit 241 has a large compression and extension space, when the workpiece to be plated is impacted by an external force, the elastic unit 241 can provide a certain buffer space to avoid the workpiece to be plated from being broken, thereby improving the production yield of the workpiece to be plated. Specifically, the elastic unit 241 is a spring or an elastic rubber pad.

[0054] Furthermore, an insulating coating is provided on the surface of the non-electrical contact point in the conductive block 210, that is, the insulating coating is sprayed on the portion other than the upper surface of the second electrical contact extension 213, so as to prevent the conductive block 210 from being corroded by the electroplating solution while achieving electroplating, thereby improving the service life of the electrical contact device. Electroplating is avoided on the surface of the electroplated contact structure 200, reducing the production cost of electroplating the electroplated parts, and no additional isolation groove is required, which greatly reduces the volume of the equipment under the same effective electroplating length. Specifically, the insulating coating can be a polytetrafluoroethylene coating.

[0055] Optionally, the material of the conductive member 220 includes one or more of metal titanium, copper and nickel.

[0056] Optionally, the power source connected to the electroplated contact structure 200 is a constant current source to provide a stable current magnitude.

[0057] In the first embodiment of the present invention, the surface of the workpiece to be electroplated is electrically connected to the negative electrode of the power supply through the electrical contact point through the conductive block 210, thereby realizing the electroplating of the workpiece to be electroplated. Compared with line contact, point contact electroplating can obtain a more uniform electroplating layer. At the same time, by setting a plurality of conductive blocks 210, the uniformity of the electric field on the surface of the workpiece to be electroplated is further improved, thereby enhancing the uniformity of the electroplating layer, and by removing, installing or replacing the conductive blocks 210, the number and contact area of ​​the electrical contact points contacted by the workpiece to be electroplated are changed to achieve different electroplating requirements, improve the flexibility of the electroplating device for the workpiece to be electroplated, and achieve better electroplating effects. At the same time, the electroplating contact structure 200 also includes a clamping portion 242 for fixing the workpiece to be electroplated, and provides a buffer space for the workpiece to be electroplated when subjected to external force through the elastic unit 241, so as to avoid the workpiece to be electroplated from being broken, and improve the production yield of the workpiece to be electroplated, and the surface of the non-electrical contact point of the conductive block 210 is provided with an insulating coating, and no additional isolation groove is required. While improving the service life of the electroplating contact structure 200, the volume of the electroplating device for the workpiece to be electroplated is greatly reduced.

[0058] It should be noted that the electrical contact device provided in the above embodiments of the present application is the same as the electrical contact device for electroplating the workpiece to be electroplated, and can flexibly adapt to the needs of electroplating of various workpieces to be electroplated by changing the number and contact area of ​​the electrical contact points contacted by the surface of the workpiece to be electroplated. At the same time, since the number and contact area of ​​the electrical contact points contacted by the surface of the workpiece to be electroplated have a great influence on the effect of electroplating of the workpiece to be electroplated, the electrical contact device provided in the present application can also be used to test the electroplating effect of the workpiece to be electroplated. The specific method of using the electrical contact device provided in the present application to test the electroplating effect of the workpiece to be electroplated will be specifically described below through the electrical contact device in Example 1:

[0059] Step 1: Install at least one conductive block 210 on the electrical contact device, place the part to be electroplated on the electrical contact device and fix it by the clamping part 240 .

[0060] It should be noted that the conductive blocks 210 are connected to the electrical contact device through connectors to achieve electrical connection. In order to achieve a better electroplating effect, the connectors are arranged on the insulating frame 101 at equal intervals so that the conductive blocks 210 are evenly distributed. Figure 1 As shown, the insulating frame 101 is a square frame, and four conductive blocks 210 are arranged at equal intervals on each side.

[0061] Preferably, in order to ensure the quality of the coating on the parts to be electroplated and improve the efficiency of the test, two conductive blocks 210 are installed in step one, which are located on two opposite sides of the insulating frame 101 and are centrally symmetrical. For example, two conductive blocks 210 are installed on a diagonal line so that the parts to be electroplated can be placed stably on the electrical contact device and the electric field on the surface of the parts to be electroplated is relatively uniform.

[0062] Step 2: Place the electrical contact device with the parts to be plated into the electroplating tank, connect the power supply and conduct the electroplating test. It should be noted that the electroplating tank used for the test can be the electroplating tank used in the actual electroplating production of the parts to be plated, or it can also be a test electroplating tank that simulates the electroplating environment, and can be specifically set according to the actual test requirements and conditions.

[0063] Preferably, the power source is a constant current source to ensure a stable current.

[0064] Step 3: Remove the plated parts and test the quality of the coating obtained. Specifically, the quality of the coating of the parts can be judged by observing whether the surface of the parts is burnt or oxidized, the thickness and uniformity of the coating, etc., or the plating conditions can be judged according to the specific requirements of the coating. It should be noted that in order to make the test results more accurate, the plating can be repeated multiple times and the coating quality can be tested.

[0065] Step 4: Add conductive blocks 210 to the electrical contact device, and repeat the above steps 2 and 3 to perform the electroplating test. It should be noted that in order to ensure the quality of the coating on the part to be electroplated and improve the efficiency of the test, the conductive blocks 210 added each time are distributed more evenly. For example, two conductive blocks 210 distributed on a diagonal line are installed during the first electroplating test, and two conductive blocks 210 on another diagonal line are added for the second time, and two conductive blocks 210 that are symmetrical to the center are added each time thereafter to achieve the test of the number of electrical contact points contacting the surface of the part to be electroplated.

[0066] It should be noted that the present application can also test the effect of the contact area of ​​the electrical contact point on the electroplating of the workpiece to be plated. Specifically, the upper surface area of ​​the second electrical contact extension 213 of different conductive blocks 210 is different. By replacing the conductive block 210, the area of ​​the electrical contact point can be changed, and the appropriate area of ​​the electrical contact point can be obtained by testing. Furthermore, the effect of the contact area on the electroplating of the workpiece to be plated can be tested together with the number of electrical contact points, for example, testing the plating quality of different numbers of electrical contact points under the same contact area, or testing the plating quality of different contact areas under the same number of electrical contact points, so as to obtain a combination of conductive blocks 210 with better electroplating effect.

[0067] The present embodiment provides an electrical contact device for electroplating. Through the above method, suitable electroplating conditions in actual production can be tested to avoid waste due to poor electroplating effect in the production process, which is beneficial to reducing the electroplating production cost of the electroplated parts and achieving better electroplating effect.

[0068] like Figure 5 As shown, the second embodiment provides another electrical contact device for electroplating. The difference from the previous embodiment is that the second embodiment is electrically connected to the workpiece to be electroplated through a conductive contact sheet 250.

[0069] Specifically, the electrical contact device for electroplating includes an insulating frame 101 and an electroplating contact structure 200 fixed on the insulating frame 101. The electroplating contact structure 200 includes a conductive member 220, a conductive column 230 and a conductive contact sheet 250, such as Figure 6 As shown, the conductive member 220 is fixed on the insulating frame 101, and the conductive member 220 and the conductive contact sheet 250 are electrically connected through the conductive column 230. Specifically, the conductive column 230 penetrates the conductive member 220 and the conductive contact sheet 250 to achieve electrical connection, or the conductive column is welded between the conductive member 220 and the conductive contact sheet 250 to achieve electrical connection.

[0070] The conductive contact sheet 250 includes at least one first electrical contact extension 251, which extends to the electroplating clamping area 102 surrounded by the insulating frame 101, so as to achieve contact between the first electrical contact extension 251 and the workpiece to be electroplated. It should be noted that the surface of the conductive contact sheet 250 has a removable insulating film, and by removing or restoring the insulating film, it can be realized whether the first electrical contact extension 251 is electrically connected to the workpiece to be electroplated. Specifically, the surface of the first electrical contact extension 251 is sprayed with a plastic coating, and the plastic coating can be removed by grinding to change the number of first electrical contact extensions 251 electrically connected to the workpiece to be plated; or, the surface of the first electrical contact extension 251 is provided with a rubber film or a silicone film, and the side of the rubber film or the silicone film that is in contact with the first electrical contact extension 251 has a certain degree of adhesion. When the rubber film or the silicone film is peeled off, the first electrical contact extension 251 is electrically connected to the workpiece to be plated, and the rubber film or the silicone film is glued back to the first electrical contact extension 251 to restore the insulation between the first electrical contact extension 251 and the workpiece to be plated. Preferably, the surface of the first electrical contact extension 251 is sprayed with a plastic coating to make the thickness of the removable insulating film thinner to ensure that the multiple electroplating contact structures 251 are in the same horizontal plane.

[0071] Furthermore, the plastic coating on a partial area of ​​the surface of the first electrical contact extension portion 251 is polished, and the area of ​​the electrical connection between the first electrical contact extension portion 251 and the workpiece to be electroplated is changed by the area of ​​the polished area; or, a plurality of rubber films or silicone films are arranged on the surface of the first electrical contact extension portion 251 in partitions, and the area of ​​the electrical connection between the first electrical contact extension portion 251 and the workpiece to be electroplated is changed by peeling off the number of rubber films or silicone films.

[0072] Furthermore, in this embodiment, the insulating frame 101 includes a support portion 103 extending below the first electrical contact extension portion 251 to provide sufficient supporting force so that the first electrical contact extension portion 251 holds the workpiece to be electroplated and supports the workpiece to be electroplated in the electroplating clamping area 102 .

[0073] Based on this, in the second embodiment, an electrical contact point is formed on the workpiece to be electroplated through the first electrical contact extension 251, thereby improving the uniformity of the electroplated coating. At the same time, a removable insulating film is provided on the surface of the first electrical contact extension 251, which can change the conductivity or insulation of the first electrical contact extension 251, further change the number of electrical contact points contacted by the workpiece to be electroplated, reduce the edge effect of the electric field, and make the electric field on the surface of the workpiece to be electroplated more uniform; by changing the area of ​​the electrical contact point contacted by the workpiece to be electroplated by removing the insulating film on the surface of the first electrical contact extension 251, different electroplating requirements are met, the flexibility of the electroplating device for the workpiece to be electroplated is improved, and a better electroplating effect is achieved. It should be noted that this embodiment also has other structures and settings as in the first embodiment to further achieve a better electroplating effect, which will not be repeated here.

[0074] In summary, the electric contact device for electroplating provided by the present application can flexibly adapt to the electroplating requirements of various parts to be electroplated by changing the number of electric contact points and the contact area on the electroplating contact structure 200, so as to achieve a better electroplating effect. At the same time, the electric contact device provided by the present application fixes the part to be electroplated by the clamping member 240, which can not only ensure the stable contact between the part to be electroplated and the second electric contact extension 213, but also avoid the fragmentation of the part to be electroplated, thereby improving the production yield of the part to be electroplated, and the surface of the non-electrical contact point in the conductive block 210 is provided with an insulating coating, which improves the service life of the electric contact device and can reduce the volume of the electroplating device of the part to be electroplated. Furthermore, the electric contact device provided by the present application can also be used for testing the electroplating conditions of the part to be electroplated to determine the number and area of ​​electric contact points required in the actual production of the electroplating of the part to be electroplated, thereby avoiding the waste of production materials, reducing production costs, and achieving a better electroplating effect.

[0075] The descriptions of the processes or structures corresponding to the above-mentioned figures have different emphases. For parts that are not described in detail in a certain process or structure, please refer to the relevant descriptions of other processes or structures.

[0076] The above embodiments are merely illustrative of the principles and effects of the present application and are not intended to limit the present application. Anyone familiar with the technology may modify or change the above embodiments without violating the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed in the present application shall still be covered by the claims of the present application.

Claims

1. An electrical contact device for electroplating, characterized in that: comprising an insulating substrate portion and at least one plated contact structure; The insulating substrate portion includes an insulating frame and an electroplating clamping area surrounded by the insulating frame; The electroplating contact structure includes a conductive member and at least one electrical contact point electrically connected to the conductive member, the conductive member is fixed on the insulating frame, and the electrical contact point extends to the electroplating clamping area.

2. The electrical contact device according to claim 1, characterized in that: The insulating frame extends a plurality of supporting parts toward the electroplating clamping area to support the workpiece to be electroplated in the electroplating clamping area.

3. The electrical contact device according to claim 2, characterized in that: The electroplating contact structure also includes a conductive contact sheet having a removable insulating film on its surface, wherein the conductive contact sheet is electrically connected to the conductive member via a conductive column, and the conductive contact sheet extends a plurality of first electrical contact extensions toward the electroplating clamping area, wherein at least one of the first electrical contact extensions removes the removable insulating film on its surface to serve as the electrical contact point.

4. The electrical contact device according to claim 1, characterized in that: The electroplating contact structure also includes a plurality of connectors disposed on the insulating frame and electrically connected to the conductive member, and a conductive block detachably connected to the insulating frame via the connectors, wherein the conductive block extends at least one second electrical contact extension portion toward the electroplating clamping area to serve as the electrical contact point.

5. The electrical contact device according to any one of claims 3 or 4, characterized in that: It also includes a plurality of clamping parts fixed on the conductive member through an elastic unit, wherein the clamping parts extend toward the electrical contact points, and the clamping parts and the electrical contact points form a clamping member under the action of the elastic unit.

6. The electrical contact device according to claim 4, characterized in that: The surface of the non-electrical contact point in the conductive block is provided with an insulating coating.

7. The electrical contact device according to claim 1, characterized in that: The material of the conductive member includes one or more of metal titanium, copper and nickel.

8. The electrical contact device according to claim 3, characterized in that: The conductive pillar and the conductive contact sheet are made of one or more of metals selected from titanium, copper and nickel.

9. The electrical contact device according to claim 1, characterized in that: The material of the insulating frame is polyvinyl chloride.

10. The electrical contact device according to claim 1, characterized in that: The electrical contact points are arranged at equal intervals.

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