Integrated circuit board with module stacking design
By packaging the core functional modules into independent components and stacking and soldering them to the integrated circuit board, the problem of repeated design and large number of board layers in circuit design is solved, and design efficiency and cost reduction is achieved.
Patent Information
- Application Number
- CN202421616931.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-10
- Publication Date
- 2025-04-25
- Estimated Expiration
- 2034-07-10
AI Technical Summary
In circuit design, related devices of certain functions are used on multiple boards, but they need to be redesigned every time they design different boards, resulting in increased design complexity. Due to the dense pins of the processor chip, the number of boards is large, which increases the design difficulty and cost.
The core functional module is designed separately into a module, packaged into independent components, and then stacked and soldered to the integrated circuit board. It is in a SOP-like package and is mounted using reflow soldering.
Reduces repetitive design work, reduces the probability of circuit errors, reduces the number of board layers, reduces the cost, facilitates the overall replacement and disassembly of components, and the packaged independent components can be tested directly without adding test points.
Smart Images
Figure CN222803108U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of integrated circuit board design, in particular to an integrated circuit board with a module stacking design. Background Art
[0002] In circuit design, we often encounter related devices with certain functions (such as the smallest system module of the processor, including the processor chip, clock chip, memory chip, resistor and capacitor, etc.) that are used on multiple boards. The functions and layout wiring are the same, but they need to be redesigned every time a different board is designed. At the same time, because some processor chips have dense pins, they require more layers, resulting in more layers on boards using this chip.
[0003] The traditional way is to integrate the core components into functional modules, lead out the pins related to the components of the functional modules from the periphery and weld them to the integrated circuit board, and use resin and other organic binders for sealing. The core or key components are integrated into functional modules, which reduces the difficulty of welding with the integrated circuit board to a certain extent. However, when there are too many pins led out of such functional modules, the area of the functional modules increases, and the wiring difficulty of the integrated circuit board increases. In addition, if multiple modules need to be stacked, the design difficulty and module area will increase, and independent pads need to be led out for testing and debugging, which is not conducive to the miniaturization and high-integration design of the integrated circuit board. Summary of the invention
[0004] In view of the shortcomings of the prior art, the utility model provides an integrated circuit board with a module stacking design, in which the core function module is designed as a module separately, which is packaged into independent components and then stacked and welded to the integrated circuit board. The integrated circuit board of the utility model designs the circuit module into a form of SOP-like packaging, which can be mounted by reflow soldering.
[0005] The technical solution of the utility model is as follows:
[0006] An integrated circuit board of a module stacking design includes an integrated circuit board body, wherein the integrated circuit board body includes a first surface and a second surface, and the integrated circuit board further includes:
[0007] At least one independent component, the independent component comprising:
[0008] Circuit board, including TOP and BOTTOM surfaces;
[0009] The main components are soldered on the TOP surface of the circuit board;
[0010] Low-profile components are soldered on the BOTTOM side of the circuit board;
[0011] The bent pin header is inserted on at least two opposite sides of the circuit board, including a bottom pin and a top straight pin. The bottom pin is in the shape of a bent pin and is located on the BOTTOM surface of the circuit board, and the top straight pin is located on the TOP surface of the circuit board. The bottom pin and the top straight pin of the bent pin header are both exposed to the outside as a reserved external signal line interface; and
[0012] At least one of the independent components is stacked and welded on the first surface and / or the second surface of the integrated circuit board body through the reserved external signal line interface to achieve functional expansion.
[0013] In some embodiments, the top straight pin head protrudes into a metal disc for welding to a corresponding pad position.
[0014] In some embodiments, the maximum height of the low-profile device is Hb, the height of the bent pin header located at the BOTTOM surface of the circuit board is PB, and the following formula is satisfied:
[0015] PB>Hb.
[0016] In some embodiments, the maximum height of the main component is Ht, the thickness of the circuit board is T, the height of the bent pin header passing through the circuit board and located at the TOP surface of the circuit board is PA, and the following formula is satisfied:
[0017] PA>Ht+T.
[0018] In some embodiments, the at least one independent component includes at least two, wherein the bottom pin of the first independent component is welded on the first side and / or the second side of the integrated circuit board body, wherein the bottom pin of the second independent component is welded on the top straight pin position of the first independent component, and so on, at least two independent components are stacked and welded on the first side and / or the second side of the integrated circuit board body.
[0019] In some embodiments, the at least one independent component comprises at least two, wherein the bottom pin of the first independent component is soldered on the first side of the integrated circuit board body, and the top straight pin of the second independent component is soldered on the second side of the integrated circuit board body.
[0020] In some embodiments, the integrated circuit board further comprises: potting insulating glue for potting the circuit board as a whole for insulation.
[0021] In some embodiments, the integrated circuit board further includes: a PCB packaging library for packaging the encapsulated circuit board.
[0022] In some embodiments, the PCB package library includes: pads, silk screen layer frames, and package information.
[0023] The beneficial effects of the utility model compared with the prior art are as follows: the utility model proposes an integrated circuit board with a module stacking design, in which the core functional module is designed as a module separately, which is packaged into independent components and then stacked and welded to the integrated circuit board. The specific advantages include at least one or more of the following:
[0024] (1) The integrated circuit board proposed by the utility model can reduce repetitive design work and reduce the probability of circuit errors by designing the core functional module as a separate module.
[0025] (2) The integrated circuit board proposed by the utility model can reduce the number of layers and reduce the cost of the integrated circuit board.
[0026] (3) The integrated circuit board proposed in the present invention forms independent components, which are convenient for overall replacement and disassembly during use.
[0027] (4) The integrated circuit board proposed by the utility model has solder pads reserved on the top and bottom surfaces of the independent components after packaging, which can meet the needs of direct testing after welding without adding test points, making it convenient and faster to conduct circuit testing.
[0028] (5) In the integrated circuit board proposed by the utility model, the straight pins on the top can also be used as welding pads, which are distributed in a mirror image with the bottom pins, thereby avoiding pin problems caused by the mirror image of the package design.
[0029] (6) The integrated circuit board proposed by the utility model can correspond completely one to one with the design of pasting on the front and back surfaces of the integrated circuit board body.
[0030] It should be understood that the implementation of any embodiment of the present invention does not mean that multiple or all of the above-mentioned beneficial effects must be possessed or achieved at the same time. BRIEF DESCRIPTION OF THE DRAWINGS
[0031] In order to more clearly illustrate the implementation methods of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the implementation methods or the description of the prior art. Obviously, the drawings in the following description are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.
[0032] The structures, proportions, sizes, etc. illustrated in this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with the technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantial technical significance. Any structural modification, change in proportion or adjustment in size shall still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and purposes that can be achieved by the present invention.
[0033] Figure 1 This is a schematic diagram of the design of independent components stacked and welded to the integrated circuit board body according to an embodiment of the utility model;
[0034] Figure 2 This is a schematic rear cross-sectional view of a circuit board welding device according to an embodiment of the utility model;
[0035] Figure 3 This is a schematic cross-sectional view of a circuit board including bent pin headers according to an embodiment of the utility model;
[0036] Figure 4 This is a partial enlarged schematic diagram of a circuit board including bent header pins according to an embodiment of the utility model;
[0037] Figure 5 This is a schematic diagram of the dimensions of the bent pin header of an embodiment of the utility model;
[0038] Figure 6 A bottom view of a circuit board according to an embodiment of the utility model;
[0039] Figure 7 This is a schematic diagram of the design of welding independent components to the integrated circuit board body according to an embodiment of the utility model;
[0040] Figure 8 This is a schematic diagram of the design of independent components stacked and welded to the integrated circuit board body according to an embodiment of the utility model;
[0041] Fig. 9 This is a schematic diagram of the design of the independent components of the embodiment of the utility model being mirror-welded to the integrated circuit board body;
[0042] Fig.10 Schematic diagram of pin arrangement after PCB packaging according to an embodiment of the utility model, wherein (a) is a schematic diagram of counterclockwise arrangement, and (b) is a schematic diagram of clockwise arrangement;
[0043] Fig.11 A circuit test schematic diagram of an embodiment of the utility model;
[0044] Fig.12 This is a side view of a circuit board after filling according to an embodiment of the utility model;
[0045] Fig.13 This is a bottom view of the circuit board after filling according to the embodiment of the utility model;
[0046] Fig.14 A top view of a circuit board after filling according to an embodiment of the utility model;
[0047] Fig.15 This is a schematic diagram of PCB packaging of an embodiment of the utility model.
[0048] Markings in the figure:
[0049] 1. TOP surface; 10. Main components; 2. BOTTOM surface; 20. Low-profile components; 3. Circuit board; 4. Bent pin header; 41. Bottom pin; 42. Top straight pin; 5. Independent components; 6. Integrated circuit board body.
[0050] The same or corresponding symbols in the drawings indicate the same or corresponding parts. DETAILED DESCRIPTION
[0051] In order to make the purpose, technical solution and advantages of the embodiments of the present invention more clearly understood, the embodiments of the present invention are further described in detail below in conjunction with the embodiments and drawings. Here, the illustrative embodiments of the present invention and their description are used to explain the present invention, but are not intended to limit the present invention.
[0052] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0053] It should be understood that the terms "include / comprise", "consist of..." or any other variations are intended to cover non-exclusive inclusion, so that a product, device, process or method that includes a series of elements includes not only those elements, but also may include other elements not explicitly listed when necessary, or also includes elements inherent to such product, device, process or method. In the absence of more restrictions, the elements defined by the sentence "include / comprise...", "consist of..." do not exclude the presence of other identical elements in the product, device, process or method that includes the elements.
[0054] It is also necessary to understand that terms such as "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside" and "outside" to indicate directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device, component or structure must have a specific direction, be constructed or operate in a specific direction, and should not be understood as a limitation on the present invention.
[0055] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0056] The implementation of the present invention is described in detail below in conjunction with preferred implementation modes.
[0057] The utility model provides an integrated circuit board with a module stacking design, such as Figure 1 As shown, it includes an integrated circuit board body 6 and a plurality of independent components 5 stacked and welded thereon.
[0058] The integrated circuit board body 6 includes a first surface and a second surface. The so-called first surface corresponds to one surface of the integrated circuit board body 6, such as the top surface, and the second surface corresponds to the other surface of the integrated circuit board body 6, such as the bottom surface. The first surface and the second surface are referred to in the present invention, and it does not mean that there is a distinction between the first surface and the second surface.
[0059] See also Figures 2 to 6 The independent components 5 include: a circuit board 3, a main component 10, a low-profile component 20, and a bent pin header 4.
[0060] Specifically, the circuit board 3 includes a TOP surface 1 and a BOTTOM surface 2; the TOP surface 1 can be understood as the top surface, and the BOTTOM surface 2 can be understood as the bottom surface. The main component 10 is soldered on the TOP surface 1 of the circuit board 3; the low-profile component 20 is soldered on the BOTTOM surface 2 of the circuit board 3; the bent plug pins 4 are inserted on at least two opposite sides of the circuit board 3, such as the left and right edges, such as Figure 6 As shown, of course, they can also be set on all four sides of the circuit board 3. The curved pin header 4 includes a bottom pin 41 and a top straight pin 42. The bottom pin 41 is in a curved pin shape and is located on the BOTTOM surface 2 of the circuit board 3. The top straight pin 42 is located on the TOP surface 1 of the circuit board 3. The bottom pin 41 and the top straight pin 42 of the curved pin header 4 are both exposed to the outside as a reserved external signal line interface.
[0061] The integrated circuit board provided by the utility model designs the core functional module separately as a module, which is packaged into independent components 5 and then stacked and welded to the integrated circuit board body 6. This can not only reduce repetitive design work and reduce the probability of errors, but also achieve functional expansion by stacking multiple independent components 5, making it convenient to disassemble and replace components.
[0062] See also Figure 2, the main components 10 are welded on the TOP surface 1 of the circuit board 3, and the main components 10 are relatively tall components. The low components 20, such as resistors, capacitors, etc., are welded on the BOTTOM surface 2 of the circuit board 3. All components are placed as compactly as possible to reduce the size of the overall module. The corresponding positions of the circuit board 3 are punched in advance for the subsequent insertion of the bent pin header 4.
[0063] It should be noted that the thickness of the circuit board 3 itself is T, the total height after the TOP surface 1 of the circuit board 3 is welded with the main components 10 is recorded as Ht, the total height after the BOTTOM surface 2 of the circuit board 3 is welded with the low components 20 is recorded as Hb, and the total height of the circuit board after the components are welded is recorded as Ht+Hb+T.
[0064] See also Figure 3 , Figure 4 The bent pin header 4 includes a bottom pin 41 and a top straight pin 42, and the bent pin header 4 is inserted into at least two opposite sides of the circuit board 3, the bottom pin 41 is located on the BOTTOM surface 2 of the circuit board 3, and the top straight pin 42 is located on the TOP surface 1 of the circuit board 3.
[0065] The bottom pin 41 of the curved pin header 4 is in the shape of a curved pin, which is used to be welded to the corresponding pad position. The protruding part of the head of the top straight pin 42 is a metal disc, which is used to be welded to the corresponding pad position. This design can ensure that when the bottom pin 41 and the top straight pin 42 are welded to each other, the technician can perform precise welding operations.
[0066] The bent pin header 4 is widely used in the connection of PCB boards. Its role is to bridge the blocked circuits or isolated circuits and to take on the task of current or signal transmission. The bent pin header 4 is also a reserved interface for external signal lines.
[0067] like Figure 4 , Figure 5 As shown, the height of the bent pin header 4 located on the BOTTOM surface 2 of the circuit board 3 is PB. To ensure that the bottom pin 41 of the bent pin header 4 can be exposed as a reserved external signal line interface after potting, PB>Hb must be ensured, that is, the height of the bent pin header 4 located on the BOTTOM surface 2 must be greater than the maximum height of the low-profile device 20 soldered on the BOTTOM surface 2. Similarly, the height of the bent pin header 4 passing through the circuit board 3 and located on the TOP surface 1 of the circuit board 3 is PA. To ensure that the top straight pin 42 of the bent pin header 4 can be exposed as a reserved external signal line interface after potting, PA>Ht+T must be ensured.
[0068] After the bent header pin 4 is installed, the bottom view of the circuit board 3 (ignoring components) is as follows Figure 6 As shown, two rows of bent header pins 4 are symmetrically distributed on two opposite sides of the circuit board 3, and are exposed to the outside as reserved external signal line interfaces.
[0069] See also Figure 7 At least one independent component 5 is stacked and welded on the first surface or the second surface of the integrated circuit board body 6 by reserving an external signal line interface to achieve functional expansion.
[0070] It should be understood that stacking and welding the independent components 5 onto the integrated circuit board body 6 includes the following two situations:
[0071] like Figure 8 As shown, the first case is to solder multiple independent components 5 to the integrated circuit board body 6 one by one, which specifically includes the following steps:
[0072] (1) Soldering the first independent component 5 to the corresponding pad position on the first surface or the second surface of the integrated circuit board body 6 through the bottom pin 41;
[0073] (2) Solder the second independent component 5 to the top straight pin 42 of the first independent component 5 through the bottom pin 41;
[0074] (3) Similarly, the next independent component 5 is welded to the top straight pin 42 of the previous independent component 5 through the bottom pin 41 until all independent components 5 are welded, thereby achieving stacking welding of multiple independent components 5.
[0075] like Fig. 9 As shown in FIG. 1 , in the second case, multiple independent components 5 are mirror-welded to two sides of the integrated circuit board body 6. Fig.10 As shown, the top straight pin 42 and the bottom pin 41 of the independent component 5 are distributed in a mirror image. Fig.10 (a) The pins are arranged counterclockwise. Fig.10 (b) Straight needles are clockwise sorting diagrams. Figure 1 , Fig. 9 , for the front and back mounting designs, they can be completely one-to-one corresponding. It is easy to understand that the front and back mounting designs are that at least one independent component 5 is welded on the first side of the integrated circuit board body 6, and at least another independent component 5 is welded on the second side of the integrated circuit board body 6, and the projection positions are consistent, specifically including the following steps:
[0076] (1) soldering at least one independent component 5 to the first surface of the integrated circuit board body 6 through the bottom pins 41;
[0077] (2) soldering at least one independent component 5 to the second surface of the integrated circuit board body 6 through the top straight pin 42;
[0078] (3) Through mirror welding, a one-to-one correspondence of the reserved external signal line interfaces is achieved.
[0079] like Figure 1 As shown, after the mirror welding, multiple independent components 5 can be stacked and welded on both sides according to needs.
[0080] Finally, it should be noted that the independent component 5 has reserved solder pads at the bottom and top (bottom pin 41 and top straight pin 42), which can meet the direct test after welding without adding test points. Fig.11 As shown, the test here is that after the independent component 5 is soldered on the integrated circuit board body 6, the probe of the multimeter ( Fig.11 Use the red and black test leads in the tester to touch the metal disk on the top to test its signal, including voltage, resistance, etc.
[0081] The integrated circuit board also includes potting insulation glue, which is used for performing overall insulation potting on the circuit board.
[0082] It should be noted that potting is the process of mechanically or manually pouring liquid compounds into devices containing electronic components and circuits, and curing them under room temperature, heating or ultraviolet irradiation conditions to become thermosetting polymer insulating materials with excellent performance.
[0083] The potting process specifically includes the following steps:
[0084] (1) Measure the maximum size of the entire circuit board after installing the main components 10, the low-profile components 20 and the bent pin headers 4.
[0085] (2) Designing a potting mold based on the maximum size of the entire circuit board 3;
[0086] (3) Placing the circuit board 3 in the potting mold;
[0087] (4) Injecting resin insulation glue into the potting mold;
[0088] (5) Leave it for a while or irradiate it with ultraviolet light to wait for the resin insulation glue to solidify;
[0089] (6) Polish the shape of the encapsulated circuit board.
[0090] The circuit board 3 is potted through the above steps. After potting, the bottom pins 41 and the top straight pins 42 of the bent pin header 4 are exposed to the outside as reserved external signal line interfaces. Fig.12 This is a side view of the circuit board after potting. Fig.13 This is a bottom view of the potted circuit board, where the bottom pins 41 of the bent pin header 4 are exposed. Fig.14 It is a top view of the circuit board after potting, and it can be seen that the top straight pins 42 of the bent pin header 4 are exposed.
[0091] The integrated circuit board also includes a PCB package library, which is used to package the encapsulated circuit board.
[0092] The PCB package library includes: pads, silk screen layer frames, and package information. PCB packaging refers to packaging electronic components into components that meet standard shapes and pin layouts, which are convenient for insertion or welding on PCB boards. Fig.15 As shown, the package library is a device model made when designing a circuit board. When soldering, the actual device is soldered to the device package position of the circuit board. The red box represents the body range of the module device, and the brown-yellow color represents the corresponding soldering pad. The bottom pin 41 can be soldered to the pad position, and the top straight pin 42 can also be soldered to this position.
[0093] Continue to see Figure 12 to Figure 14 The circuit board packaged by PCB forms an independent component 5, and there are reserved pads at the bottom and top (bottom pin 41 and top straight pin 42). Designing it as an independent component 5 can also reduce repetitive design work and reduce the probability of error.
[0094] Although several specific implementation details are included in the above discussion, these should not be construed as limiting the scope of the present invention. Certain features described in the context of separate embodiments may also be implemented in a single implementation in combination. On the contrary, the various features described in the context of a single implementation may also be implemented in multiple implementations individually or in any suitable sub-combination.
[0095] The embodiments of the present invention have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or technical improvements in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.
Claims
1. An integrated circuit board of a modular stacking design, comprising an integrated circuit board body, wherein the integrated circuit board body comprises a first surface and a second surface, wherein: The integrated circuit board also includes: At least one independent component, the independent component comprising: Circuit board, including TOP and BOTTOM surfaces; The main components are soldered on the TOP surface of the circuit board; Low-profile components are soldered on the BOTTOM side of the circuit board; The bent pin header is inserted on at least two opposite sides of the circuit board, including a bottom pin and a top straight pin. The bottom pin is in the shape of a bent pin and is located on the BOTTOM surface of the circuit board, and the top straight pin is located on the TOP surface of the circuit board. The bottom pin and the top straight pin of the bent pin header are both exposed to the outside as a reserved external signal line interface; and At least one of the independent components is stacked and welded on the first surface and / or the second surface of the integrated circuit board body through the reserved external signal line interface to achieve functional expansion.
2. The integrated circuit board according to claim 1, characterized in that: The top straight pin head protrudes into a metal disc for welding to a corresponding pad position.
3. The integrated circuit board according to claim 1, characterized in that: The maximum height of the low-profile device is Hb, and the height of the bent pin header located on the BOTTOM surface of the circuit board is PB, and the following formula is satisfied: PB>Hb.
4. The integrated circuit board according to claim 1, characterized in that: The maximum height of the main component is Ht, the thickness of the circuit board is T, the height of the bent pin header passing through the circuit board and located at the top surface of the circuit board is PA, and the following formula is satisfied: PA>Ht+T.
5. The integrated circuit board according to claim 1, characterized in that: The at least one independent component includes at least two, wherein the bottom pin of the first independent component is welded on the first side and / or the second side of the integrated circuit board body, wherein the bottom pin of the second independent component is welded on the top straight pin position of the first independent component, and so on, at least two independent components are stacked and welded on the first side and / or the second side of the integrated circuit board body.
6. The integrated circuit board according to claim 1, characterized in that: The at least one independent component comprises at least two, wherein the bottom pin of the first independent component is welded on the first side of the integrated circuit board body, and the top straight pin of the second independent component is welded on the second side of the integrated circuit board body in a mirror image.
7. The integrated circuit board according to claim 1, characterized in that: The integrated circuit board also includes: Potting insulation glue is used for overall insulation potting of circuit boards.
8. The integrated circuit board according to claim 1, characterized in that: The integrated circuit board also includes: PCB package library, used to package the encapsulated circuit board.
9. The integrated circuit board according to claim 8, characterized in that: The PCB package library includes: pads, silk screen layer frames, and package information.