Welding structure, light emitting diode and printing template

Abstract

The utility model provides a welding structure, a light emitting diode and a printing template, wherein the welding structure comprises a support, and two ends of the support are respectively provided with a positive electrode pad and a negative electrode pad. The positive electrode pad is provided with a first solder mask layer, and the negative electrode pad is provided with a second solder mask layer. Soldering paste needs to be used in the welding process, the first solder mask layer is arranged on the positive electrode bonding pad, the soldering paste on the surface of the positive electrode bonding pad can be prevented from permeating into the face, facing the negative electrode bonding pad, of the positive electrode bonding pad, and failure of the positive electrode bonding pad is avoided. The second solder mask layer is arranged on the negative pad, so that soldering paste on the surface of the negative pad can be prevented from permeating one surface, facing the positive pad, of the negative pad, and failure of the negative pad is avoided. In addition, under the combined action of the first solder mask layer and the second solder mask layer, the situation that the soldering paste falls on the support from the area between the positive electrode bonding pad and the negative electrode bonding pad, the soldering paste permeates into the support, and consequently the support cracks can be avoided, and the reliability of the welding structure is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of diodes, in particular to a welding structure, a light emitting diode and a printing template. Background Art

[0002] Light-emitting diodes are a common electronic component that has been widely used in various aspects of production and life. For example, light-emitting diodes are used in daily lighting, electrical display and traffic lights.

[0003] With the development of science and technology, small and light-weight LEDs have become the mainstream trend. The cathode of the LEDs currently used is covered with solder mask ink, while the anode is not. During reflow soldering, due to the different degrees of thermal shrinkage between the plastic shell and the substrate, cracks will appear at the junction of the two, causing the solder paste on the anode and cathode pads to fall onto the bracket, and the solder paste will penetrate into the bracket, causing the bracket to crack and fail.

[0004] Therefore, there is a need for a welding structure that can prevent solder paste from penetrating into the interior of a bracket during a reflow soldering process and has high reliability, and a light-emitting diode having the welding structure. Utility Model Content

[0005] In order to overcome the problems existing in the related art, one of the purposes of the utility model is to provide a welding structure, which can prevent solder paste from penetrating into the interior of the bracket during the reflow soldering process and has high reliability.

[0006] A welding structure comprises a bracket, wherein a positive electrode pad and a negative electrode pad are respectively arranged at two ends of the bracket; the positive electrode pad is provided with a first solder resist layer, and the negative electrode pad is provided with a second solder resist layer; the first solder resist layer and the second solder resist layer are used to prevent solder paste from penetrating into the bracket.

[0007] The first solder resist layer is provided to prevent the solder paste on the surface of the positive electrode pad from penetrating into the side of the positive electrode pad facing the negative electrode pad during welding. The second solder resist layer is provided to prevent the solder paste on the surface of the negative electrode pad from penetrating into the side of the negative electrode pad facing the positive electrode pad during welding. Under the joint action of the first solder resist layer and the second solder resist layer, the solder paste can be prevented from falling onto the bracket from the area between the positive electrode pad and the negative electrode pad, and the solder paste can be prevented from penetrating into the bracket to cause the bracket to crack, thereby improving the reliability of the welding structure.

[0008] In a preferred technical solution of the present invention, a resin layer is coated between the first solder resist layer and the second solder resist layer, and the resin layer is in contact with the bracket.

[0009] The resin layer can encapsulate the positive electrode pad, the negative electrode pad and the bracket, thereby isolating the air and protecting the positive electrode pad, the negative electrode pad and the bracket.

[0010] In a preferred technical solution of the present invention, a side of the first solder resist layer facing the second solder resist layer is in contact with the resin layer, and a side of the second solder resist layer facing the first solder resist layer is in contact with the resin layer.

[0011] It is difficult to accurately control the amount of solder paste used during the production process. When there is too much solder paste, the solder paste is easy to penetrate into the resin layer. The first solder mask layer and the second solder mask layer are close to the resin layer to prevent the solder paste from penetrating into the resin layer and causing the resin layer to separate from the bracket.

[0012] In a preferred technical solution of the present invention, there is a gap between the first solder resist layer facing the second solder resist layer and the resin layer, and there is a gap between the second solder resist layer facing the first solder resist layer and the resin layer.

[0013] Since the first solder resist layer and the second solder resist layer have a certain height, the solder paste on the surface of the positive electrode pad can be prevented from penetrating into the resin layer over the first solder resist layer, and the solder paste on the surface of the negative electrode pad can be prevented from penetrating into the resin layer over the second solder resist layer. There is a gap between the first solder resist layer and the resin layer, and there is a gap between the second solder resist layer and the resin layer, which can reduce the process requirements for generating the first solder resist layer and the second solder resist layer, and can also reduce the requirements for the packaging process of the resin layer.

[0014] In a preferred technical solution of the present invention, the first solder resist layer includes a first bending portion and a second bending portion, and the second solder resist layer includes a third bending portion and a fourth bending portion; the first bending portion and the third bending portion both extend along the connecting direction of the positive electrode pad and the negative electrode pad, the first bending portion extends to the edge of the positive electrode pad, the third bending portion extends to the edge of the negative electrode pad, and the second bending portion and the fourth bending portion both extend in a direction close to the bracket.

[0015] The first solder resist layer is composed of a first bending portion and a second bending portion, and the first solder resist layer extends from the positive electrode pad to the bracket to prevent solder paste from passing over the first solder resist layer and penetrating to the side of the positive electrode pad facing the negative electrode pad during welding. The second solder resist layer is composed of a third bending portion and a fourth bending portion, and the second solder resist layer extends from the negative electrode pad to the bracket to prevent solder paste from passing over the second solder resist layer and penetrating to the side of the negative electrode pad facing the positive electrode pad during welding.

[0016] In a preferred technical solution of the present invention, the first bending portion is located on the side of the positive electrode pad away from the bracket, the third bending portion is located on the side of the negative electrode pad away from the bracket, and the bottom ends of the second bending portion and the fourth bending portion are both in contact with the bracket.

[0017] The first bend is located on the side of the positive electrode pad away from the bracket, and the bottom end of the second bend contacts the bracket, so that the first bend and the second bend together wrap the welding surface of the positive electrode pad, that is, the side of the positive electrode pad facing the negative electrode pad. The third bend is located on the side of the negative electrode pad away from the bracket, and the bottom end of the fourth bend contacts the bracket, so that the third bend and the fourth bend together wrap the welding surface of the negative electrode pad, that is, the side of the negative electrode pad facing the positive electrode pad.

[0018] In a preferred technical solution of the present invention, the contact area between the first bending portion and the positive electrode pad is greater than or equal to the contact area between the second bending portion and the bracket; the contact area between the third bending portion and the negative electrode pad is greater than or equal to the contact area between the fourth bending portion and the bracket.

[0019] If the second bend and the fourth bend are set to be narrower, the contact area between the first bend and the positive electrode pad is greater than the contact area between the second bend and the bracket, and the contact area between the third bend and the negative electrode pad is greater than the contact area between the fourth bend and the bracket. The amount of solder resist ink used can be reduced in the process of generating the first solder resist layer and the second solder resist layer, thereby reducing production costs. If the second bend and the fourth bend are set to be wider, the contact area between the first bend and the positive electrode pad is equal to the contact area between the second bend and the bracket, and the contact area between the third bend and the negative electrode pad is equal to the contact area between the fourth bend and the bracket, which can better prevent the solder paste from penetrating over the first solder resist layer to the welding surface of the positive electrode pad during reflow soldering, and the solder paste from penetrating over the second solder resist layer to the welding surface of the negative electrode pad.

[0020] In a preferred technical solution of the present invention, the length of the first bent portion is smaller than the length of the positive electrode pad, and the length of the third bent portion is smaller than the length of the negative electrode pad.

[0021] The first bent portion partially covers the surface of the positive electrode pad, and the third bent portion partially covers the surface of the negative electrode pad.

[0022] In a preferred technical solution of the present invention, the second bent portion is located between the positive electrode pad and the resin layer, and the fourth bent portion is located between the negative electrode pad and the resin layer.

[0023] The second bending portion is provided so that there is no gap between the positive electrode pad and the resin layer, thereby preventing the solder paste from penetrating into the resin layer from the surface of the positive electrode pad during welding. The fourth bending portion is provided so that there is no gap between the negative electrode pad and the resin layer, thereby preventing the solder paste from penetrating into the resin layer from the surface of the negative electrode pad during welding.

[0024] In a preferred technical solution of the present invention, the material of the first solder resist layer and the second solder resist layer is solder resist ink.

[0025] After solder resist ink is applied on the surface of the positive electrode pad and the surface of the negative electrode pad, the solder resist ink is dried, and the temperature of the solder resist ink is increased, so that the solder resist ink is solidified to form a stable first solder resist layer and a second solder resist layer.

[0026] A second objective of the present utility model is to provide a light emitting diode, comprising any one of the above-mentioned welding structures.

[0027] The welding structure of the light-emitting diode is provided with a first solder resist layer and a second solder resist layer, which can prevent the solder paste from penetrating into the welding surface of the positive electrode pad and the welding surface of the negative electrode pad, and can also prevent the solder paste from penetrating into the bracket and the resin layer. The light-emitting diode has strong reliability.

[0028] The third object of the present utility model is to provide a printing template, including a fixed area and a printing area, wherein the printing area is connected to the positive electrode pad and the negative electrode pad of the above-mentioned light-emitting diode; the printing area is located on both sides of the fixed area, and the fixed area is connected to the bracket of the light-emitting diode.

[0029] Place the printing template on the light-emitting diode to be printed with solder resist ink, connect the fixed area to the bracket of the light-emitting diode, brush the solder resist ink on the printing area, and then brush the solder resist ink on the positive electrode pad and the negative electrode pad. After brushing the solder resist ink, dry the solder resist ink, increase the temperature of the solder resist ink, and solidify the solder resist ink to form a stable first solder resist layer and a second solder resist layer.

[0030] The beneficial effects of the utility model are:

[0031] A welding structure provided by the utility model includes a bracket, and a positive electrode pad and a negative electrode pad are respectively arranged at both ends of the bracket; the positive electrode pad is provided with a first solder resist layer, and the negative electrode pad is provided with a second solder resist layer. Solder paste is required in the welding process, and the first solder resist layer is arranged on the positive electrode pad to prevent the solder paste on the surface of the positive electrode pad from penetrating into the side of the positive electrode pad facing the negative electrode pad, thereby avoiding failure of the positive electrode pad. The second solder resist layer is arranged on the negative electrode pad to prevent the solder paste on the surface of the negative electrode pad from penetrating into the side of the negative electrode pad facing the positive electrode pad, thereby avoiding failure of the negative electrode pad. Under the joint action of the first solder resist layer and the second solder resist layer, it is also possible to prevent the solder paste from falling onto the bracket from the area between the positive electrode pad and the negative electrode pad, and the solder paste from penetrating into the bracket to cause the bracket to crack, thereby improving the reliability of the welding structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 This is a first structural schematic diagram of the pre-packaging welding structure provided by the utility model;

[0033] Figure 2 This is a second structural schematic diagram of the pre-packaging welding structure provided by the utility model;

[0034] Figure 3 This is a first structural schematic diagram of the post-encapsulation welding structure provided by the utility model;

[0035] Figure 4 This is a second structural schematic diagram of the packaged welding structure provided by the utility model;

[0036] Figure 5 This is a third structural schematic diagram of the post-encapsulation welding structure provided by the utility model;

[0037] Figure 6 This is a fourth structural schematic diagram of the post-encapsulation welding structure provided by the utility model;

[0038] Figure 7 It is a schematic diagram of the structure of the existing welding structure before packaging;

[0039] Figure 8 It is a schematic diagram of the structure after encapsulation of the existing welding structure;

[0040] Fig. 9 It is a structural schematic diagram of a printing template provided by the utility model.

[0041] Figure markings: 1. bracket; 2. positive electrode pad; 3. negative electrode pad; 4. first solder resist layer; 41. first bending portion; 42. second bending portion; 5. second solder resist layer; 51. third bending portion; 52. fourth bending portion; 6. resin layer; 7. printing area; 8. fixing area; 81. first welding area; 82. second welding area. DETAILED DESCRIPTION

[0042] The preferred embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present invention more thorough and complete, and to fully convey the scope of the present invention to those skilled in the art.

[0043] Example 1

[0044] like Figure 1 As shown, this embodiment provides a welding structure, including a bracket 1, wherein a positive electrode pad 2 and a negative electrode pad 3 are respectively provided at both ends of the bracket 1; the positive electrode pad 2 is provided with a first solder resist layer 4, and the negative electrode pad 3 is provided with a second solder resist layer 5; the first solder resist layer 4 and the second solder resist layer 5 are used to prevent solder paste from penetrating into the bracket.

[0045] The welding structure is part of the light-emitting diode. This embodiment takes the light-emitting diode as an example. Commonly used sheet diodes are divided into cylindrical and rectangular types. The cylindrical sheet diode has no leads, and the two end faces of the cylindrical sheet diode are respectively the positive electrode and the negative electrode. The rectangular sheet diode has three short pins and is divided into single-tube and double-tube according to the number of diode chips contained inside.

[0046] The positive electrode pad 2 and the negative electrode pad 3 are used to connect the sheet light emitting diode to the circuit. The positive electrode pad 2 corresponds to the positive electrode of the sheet light emitting diode, and the negative electrode pad 3 corresponds to the negative electrode of the sheet light emitting diode.

[0047] Figure 7 This is a schematic diagram of the structure of the existing welding structure before packaging. Figure 8 It is a schematic diagram of the structure after the existing welding structure is packaged. Figure 7-Figure 8 As shown, the existing light-emitting diode welding structure has a solder resist layer on the negative electrode pad 3, but no solder resist layer on the positive electrode pad 2. The positive electrode pad 2 is a full pad structure, and the negative electrode pad 3 is a non-full pad structure. During the welding process, solder paste, such as tin paste, may penetrate into the bracket 1 through the side of the positive electrode pad 2, causing the bracket 1 to crack.

[0048] In this embodiment, solder resist ink is brushed on the positive electrode pad 2 and dried. The temperature of the solder resist ink increases, so that the solder resist ink is solidified, thereby forming a first solder resist layer 4.

[0049] The first solder resist layer 4 is arranged on the side of the positive electrode pad 2 away from the bracket 1, and the side is partially or completely covered with the first solder resist layer 4. The second solder resist layer 5 is arranged on the side of the negative electrode pad 3 away from the bracket 1, and the side is partially or completely covered with the second solder resist layer 5. When partial coverage can play a better solder resist role, the cost can be reduced; when partial coverage cannot play a better solder resist role, that is, when the solder paste may penetrate into the bracket 1 through the side of the positive electrode pad 2, the solder resist ink is printed on the entire area of ​​the positive electrode pad 2 and the negative electrode pad 3, so that the first solder resist layer 4 completely covers the positive electrode pad 2, and the second solder resist layer 5 completely covers the negative electrode pad 3.

[0050] The material of the bracket 1 is ceramic, common nylon plastic or epoxy resin layer. The bracket 1 supports the positive electrode pad 2, the negative electrode pad 3, the first solder resist layer 4 and the second solder resist layer 5.

[0051] The positive electrode pad 2 and the negative electrode pad 3 are symmetrically arranged at the two ends of the bracket 1. The positive electrode pad 2 is a bent structure. The structures of the positive electrode pad 2 and the negative electrode pad 3 can be the same or different. This embodiment takes the structure of the positive electrode pad 2 as the same as the structure of the negative electrode pad 3 as an example. The positive electrode pad 2 surrounds the first end of the bracket 1, and the negative electrode pad 3 surrounds the second end of the bracket 1.

[0052] The side of the positive electrode pad 2 facing the negative electrode pad 3 is the welding side of the positive electrode pad 2 , and the side of the negative electrode pad 3 facing the positive electrode pad 2 is the welding side of the negative electrode pad 3 .

[0053] A welding structure provided in this embodiment includes a bracket 1, and a positive electrode pad 2 and a negative electrode pad 3 are respectively arranged at both ends of the bracket 1; the positive electrode pad 2 is provided with a first solder resist layer 4, and the negative electrode pad 3 is provided with a second solder resist layer 5. Solder paste is required in the welding process. The first solder resist layer 4 is arranged on the positive electrode pad 2, which can prevent the solder paste on the surface of the positive electrode pad 2 from penetrating into the side of the positive electrode pad 2 facing the negative electrode pad 3, thereby preventing the positive electrode pad 2 from failing. The second solder resist layer 5 is arranged on the negative electrode pad 3, which can prevent the solder paste on the surface of the negative electrode pad 3 from penetrating into the side of the negative electrode pad 3 facing the positive electrode pad 2, thereby preventing the negative electrode pad 3 from failing. Under the joint action of the first solder resist layer 4 and the second solder resist layer 5, it is also possible to prevent the solder paste from falling onto the bracket 1 from the area between the positive electrode pad 2 and the negative electrode pad 3, and the solder paste from penetrating into the bracket 1 to cause the bracket 1 to crack, thereby improving the reliability of the welding structure.

[0054] Example 2

[0055] The present embodiment provides a welding structure, including a bracket 1, wherein a positive electrode pad 2 and a negative electrode pad 3 are respectively provided at both ends of the bracket 1; the positive electrode pad 2 is provided with a first solder resist layer 4, and the negative electrode pad 3 is provided with a second solder resist layer 5; the first solder resist layer 4 and the second solder resist layer 5 are used to prevent solder paste from penetrating into the bracket.

[0056] A resin layer 6 is coated between the first solder resist layer 4 and the second solder resist layer 5 , and the resin layer 6 is in contact with the bracket 1 .

[0057] If the light emitting diode is exposed to the air for a long time, the performance of the light emitting diode may be degraded or damaged due to changes in the external environment and accidental collisions. Therefore, the resin layer 6 is required to encapsulate the light emitting diode.

[0058] In this embodiment, the resin layer 6 is an epoxy resin layer as an example, and the two ends of the bracket 1 are in contact with the positive electrode pad 2 and the negative electrode pad 3 respectively, and the area of ​​the bracket 1 between the positive electrode pad 2 and the negative electrode pad 3 is in contact with the bottom of the resin layer 6. The two sides of the resin layer 6 are in contact with the first solder resist layer 4 and the second solder resist layer 5 respectively, or the two sides of the resin layer 6 are in contact with the positive electrode pad 2 and the negative electrode pad 3 respectively, or the first side of the resin layer 6 is in contact with the positive electrode pad 2 and the first solder resist layer 4, and the second side of the resin layer 6 is in contact with the negative electrode pad 3 and the second solder resist layer 5.

[0059] like Figure 3As shown, the first solder resist layer 4 contacts the resin layer 6 on one side facing the second solder resist layer 5, and the second solder resist layer 5 contacts the resin layer 6 on one side facing the first solder resist layer 4, so that there is no gap between the first solder resist layer 4 and the resin layer 6, and between the second solder resist layer 5 and the resin layer 6, thereby preventing the solder paste from penetrating into the bracket 1 through the side of the positive electrode pad 2 and the side of the negative electrode pad 3 during welding, and preventing the resin layer 6 from separating from the bracket 1. The positive electrode pad 2 and the negative electrode pad 3 are arranged opposite to each other, and the upward side of the positive electrode pad 2 contacts the resin layer 6, and the upward side of the negative electrode pad 3 contacts the resin layer 6.

[0060] It has been verified that the welding structure provided in this embodiment, in which a first solder resist layer 4 is arranged on the positive electrode pad 2 and a second solder resist layer 5 is arranged on the negative electrode pad 3, has no obvious change in welding thrust compared to the welding structure in which a solder resist layer is only arranged on the negative electrode pad 3, that is, adding a solder resist layer on the positive electrode pad 2 does not affect the welding effect and improves the reliability of the welding structure.

[0061] A resin layer 6 is coated between the first solder resist layer 4 and the second solder resist layer 5 of the welding structure of this embodiment, and the resin layer 6 is in contact with the bracket 1. The first solder resist layer 4 is in contact with the resin layer 6 on one side facing the second solder resist layer 5, and the second solder resist layer 5 is in contact with the resin layer 6 on one side facing the first solder resist layer 4. Under the joint action of the first solder resist layer 4, the second solder resist layer 5 and the resin layer 6, the solder paste is isolated to prevent the solder paste from penetrating into the bracket 1 through the side of the positive electrode pad 2 and / or the side of the negative electrode pad 3.

[0062] Example 3

[0063] The present embodiment provides a welding structure, including a bracket 1, wherein a positive electrode pad 2 and a negative electrode pad 3 are respectively provided at both ends of the bracket 1; the positive electrode pad 2 is provided with a first solder resist layer 4, and the negative electrode pad 3 is provided with a second solder resist layer 5; the first solder resist layer 4 and the second solder resist layer 5 are used to prevent solder paste from penetrating into the bracket 1.

[0064] A resin layer 6 is coated between the first solder resist layer 4 and the second solder resist layer 5 . The resin layer 6 is in contact with the bracket 1 . In this embodiment, the resin layer 6 is an epoxy resin layer.

[0065] like Figure 4 As shown, there is a gap between the side of the first solder resist layer 4 facing the second solder resist layer 5 and the resin layer 6 , and there is a gap between the side of the second solder resist layer 5 facing the first solder resist layer 4 and the resin layer 6 . Figure 4The welding structure shown has low requirements for the process of printing solder resist ink and using resin layer 6 for packaging. The welding structure can prevent the solder paste on the side of the positive electrode pad 2 away from the bracket 1 from falling into the bracket 1 along the direction close to the negative electrode pad 3 during reflow soldering; it can also prevent the solder paste on the side of the negative electrode pad 3 away from the bracket 1 from falling into the bracket 1 along the direction close to the positive electrode pad 2, thereby preventing the solder paste from penetrating into the bracket 1, avoiding cracking of the bracket 1 and separation of the bracket 1 from the resin layer 6.

[0066] The material of the first solder resist layer 4 and the second solder resist layer 5 is solder resist ink, which is printed on the positive electrode pad 2 and the negative electrode pad 3, and the solder resist ink is dried. The temperature of the solder resist ink increases, so that the solder resist ink is solidified to form a stable first solder resist layer 4 and a second solder resist layer 5.

[0067] There is a gap between the side of the first solder resist layer 4 facing the second solder resist layer 5 and the resin layer 6 in the welding structure of this embodiment, and there is a gap between the side of the second solder resist layer 5 facing the first solder resist layer 4 and the resin layer 6. This welding structure has slightly lower process requirements for printing solder resist ink on the positive electrode pad 2 and the negative electrode pad 3, and using the resin layer 6 for packaging. During reflow soldering, the solder paste on the positive electrode pad 2 may fall into the bracket 1 in the direction close to the negative electrode pad 3, and the solder paste on the negative electrode pad 3 may fall into the bracket 1 in the direction close to the positive electrode pad 2. Therefore, the gap between the first solder resist layer 4 and the resin layer 6, and the gap between the second solder resist layer 5 and the resin layer 6 do not affect the use, and can still prevent the solder paste from penetrating into the bracket 1, and can also reduce the process requirements during application.

[0068] Example 4

[0069] The present embodiment provides a welding structure, including a bracket 1, wherein a positive electrode pad 2 and a negative electrode pad 3 are respectively provided at both ends of the bracket 1; the positive electrode pad 2 is provided with a first solder resist layer 4, and the negative electrode pad 3 is provided with a second solder resist layer 5; the first solder resist layer 4 and the second solder resist layer 5 are used to prevent solder paste from penetrating into the bracket 1.

[0070] A resin layer 6 is coated between the first solder resist layer 4 and the second solder resist layer 5 . The resin layer 6 is in contact with the bracket 1 . In this embodiment, the resin layer 6 is an epoxy resin layer.

[0071] The first solder resist layer 4 contacts the resin layer 6 on one side facing the second solder resist layer 5 , and the second solder resist layer 5 contacts the resin layer 6 on one side facing the first solder resist layer 4 . In this embodiment, the resin layer 6 is an epoxy resin layer.

[0072] like Figure 5As shown, the first solder resist layer 4 includes a first bending portion 41 and a second bending portion 42, and the second solder resist layer 5 includes a third bending portion 51 and a fourth bending portion 52; the first bending portion 41 and the third bending portion 51 both extend along the connecting direction of the positive electrode pad 2 and the negative electrode pad 3, the first bending portion 41 extends to the edge of the positive electrode pad 2, the third bending portion 51 extends to the edge of the negative electrode pad 3, and the second bending portion 42 and the fourth bending portion 52 both extend in a direction close to the bracket 1.

[0073] The first bending portion 41 and the second bending portion 42 are integrally formed, the third bending portion 51 and the fourth bending portion 52 are integrally formed, the first bending portion 41 and the second bending portion 42 together form an L-shaped first solder resist layer 4, and the third bending portion 51 and the fourth bending portion 52 together form an L-shaped second solder resist layer 5. The first bending portion 41 and the third bending portion 51 are both parallel to the bracket 1, the first bending portion 41 contacts the side of the positive electrode pad 2 away from the bracket 1, and the third bending portion 51 contacts the side of the negative electrode pad 3 away from the bracket 1.

[0074] The first bend 41 and the second bend 42 are connected to the resin layer 6 , and the second bend 42 is in contact with the resin layer 6 . The third bend 51 and the fourth bend 52 are connected to the resin layer 6 , and the fourth bend 52 is in contact with the resin layer 6 .

[0075] The second bending portion 42 and the fourth bending portion 52 may be arranged close to the two side surfaces of the resin layer 6, or may be embedded in the resin layer 6. When the width of the second bending portion 42 and the fourth bending portion 52 is small, the second bending portion 42 and the fourth bending portion 52 are arranged close to the two side surfaces of the resin layer 6; when the width of the second bending portion 42 and the fourth bending portion 52 is large, the second bending portion 42 and the fourth bending portion 52 are arranged to be embedded in the resin layer 6.

[0076] The first bending portion 41 is located on the side of the positive electrode pad 2 away from the bracket 1, the third bending portion 51 is located on the side of the negative electrode pad 3 away from the bracket 1, the bottom ends of the second bending portion 42 and the fourth bending portion 52 are both in contact with the bracket 1, the second bending portion 42 is located between the positive electrode pad 2 and the resin layer 6, and the fourth bending portion 52 is located between the negative electrode pad 3 and the resin layer 6.

[0077] The second bent portion 42 can fill the gap between the positive electrode pad 2 and the resin layer 6, and the fourth bent portion 52 can fill the gap between the negative electrode pad 3 and the resin layer 6, thereby preventing the solder paste from penetrating into the side of the resin layer 6 from the positive electrode pad 2 and the negative electrode pad 3 during welding, avoiding the solder paste penetrating into the resin layer 6 from generating stress, causing the resin layer 6 and the bracket 1 to separate, thereby enhancing the reliability of the welding structure and the light-emitting diode having the welding structure.

[0078] The side of the positive electrode pad 2 facing the negative electrode pad 3 and the side of the negative electrode pad 3 facing the positive electrode pad 2 are welding surfaces. The first solder resist layer 4 extends from the positive electrode pad 2 to the bracket 1, and the second solder resist layer 5 extends from the negative electrode pad 3 to the bracket 1. The welding surface of the positive electrode pad 2 contacts the second bending portion 42, and the welding surface of the negative electrode pad 3 contacts the fourth bending portion 52, thereby preventing the solder paste from passing over the first solder resist layer 4 and the second solder resist layer 5 and penetrating into the welding surface of the positive electrode pad 2 and the welding surface of the negative electrode pad 3, thereby preventing the welding point from breaking.

[0079] The contact area between the first bending portion 41 and the positive electrode pad 2 is greater than or equal to the contact area between the second bending portion 42 and the bracket 1 ; the contact area between the third bending portion 51 and the negative electrode pad 3 is greater than or equal to the contact area between the fourth bending portion 52 and the bracket 1 .

[0080] like Figure 5 As shown, the contact area between the first bend portion 41 and the positive electrode pad 2 is greater than the contact area between the second bend portion 42 and the bracket 1, and the contact area between the third bend portion 51 and the negative electrode pad 3 is greater than the contact area between the fourth bend portion 52 and the bracket 1. By setting the width of the second bend portion 42 and the fourth bend portion 52 smaller, the amount of solder resist ink used when printing the first solder resist layer 4 and the second solder resist layer 5 can be saved.

[0081] like Figure 6 As shown, the contact area between the first bend 41 and the positive electrode pad 2 is equal to the contact area between the second bend 42 and the bracket 1, and the contact area between the third bend 51 and the negative electrode pad 3 is equal to the contact area between the fourth bend 52 and the bracket 1. The second bend 42 and the fourth bend 52 are embedded in the resin layer 6, and part of the resin layer 6 covers the first solder resist layer 4 and the second solder resist layer 5. The width of the second bend 42 and the fourth bend 52 is set larger, which can better prevent the solder paste from penetrating through the first solder resist layer 4 to the welding surface of the positive electrode pad 2 during reflow soldering, and the solder paste from penetrating through the second solder resist layer 5 to the welding surface of the negative electrode pad 3.

[0082] The length of the first bending portion 41 is smaller than the length of the positive electrode pad 2, and the length of the third bending portion 51 is smaller than the length of the negative electrode pad 3, so that the resin layer 6 partially covers the positive electrode pad 2 and the negative electrode pad 3, which can effectively isolate the solder paste and prevent the solder paste from penetrating into the welding surface of the positive electrode pad 2, the welding surface of the negative electrode pad 3 and the bracket 1, thereby avoiding the breakage of the solder joints and the cracking of the bracket 1.

[0083] The first solder resist layer 4 of the welding structure of this embodiment includes a first bend portion 41 and a second bend portion 42, and the second solder resist layer 5 includes a third bend portion 51 and a fourth bend portion 52; the first bend portion 41 and the third bend portion 51 both extend along the direction of the line connecting the positive electrode pad 2 and the negative electrode pad 3, and the second bend portion 42 and the fourth bend portion 52 both extend in the direction close to the bracket 1. The first bend portion 41 is located on the side of the positive electrode pad 2 away from the bracket 1, and the third bend portion 51 is located on the side of the negative electrode pad 3 away from the bracket 1. The bottom ends of the second bend portion 42 and the fourth bend portion 52 are both in contact with the bracket 1, and the first bend portion 41 partially covers the positive electrode pad 2, and the third bend portion 51 partially covers the negative electrode pad 3. The width of the second bending portion 42 and the fourth bending portion 52 is set as needed. The second bending portion 42 and the fourth bending portion 52 are set to be narrower, which can reduce the amount of solder resist ink used when printing the first solder resist layer 4 and the second solder resist layer 5, thereby reducing costs. The second bending portion 42 and the fourth bending portion 52 are set to be wider, which can better prevent the solder paste from passing over the first solder resist layer 4 and penetrating into the welding surface of the positive electrode pad 2 during reflow soldering, and the solder paste from passing over the second solder resist layer 5 and penetrating into the welding surface of the negative electrode pad 3.

[0084] Example 5

[0085] This embodiment provides a light emitting diode, which includes a welding structure of any one of embodiments 1 to 4. The light emitting diode includes a diode body, the positive electrode of the diode body is connected to the positive electrode pad 2, and the negative electrode of the diode body is connected to the negative electrode pad 3.

[0086] The light emitting diode is welded to the circuit using the positive electrode pad 2 and the negative electrode pad 3, a certain voltage is applied between the positive electrode and the negative electrode of the light emitting diode, and current flows through the light emitting diode, causing the light emitting diode to emit light.

[0087] The light-emitting diode provided in this embodiment includes a welding structure. The first solder resist layer 4 and the second solder resist layer 5 of the welding structure can prevent the solder paste from penetrating into the diode body, avoid the light-emitting diode short circuit, and increase the reliability of the light-emitting diode.

[0088] Example 6

[0089] like Fig. 9 As shown, this embodiment provides a printing template, which includes a fixing area 8 and a printing area 7, and the printing area 7 is connected to the positive electrode pad 2 and the negative electrode pad 3 of the light-emitting diode in Example 5. The printing area 7 is located on both sides of the fixing area 8, and the fixing area 8 is connected to the bracket 1 of the light-emitting diode.

[0090] The size of the printing template is the same as that of the light-emitting diode. A hole is opened on the printing template to form a printing area 7, which is used to print solder resist ink on the positive electrode pad 2 and the negative electrode pad 3 of the light-emitting diode. The printing template is placed on the light-emitting diode to be printed with solder resist ink, and the fixing area 8 is connected to the bracket 1 of the light-emitting diode.

[0091] The fixing area 8 includes a first welding area 81 and a second welding area 82. The first welding area 81 has a larger area, and the second welding area 82 has a smaller area. The wafer is welded in the first welding area 81, and the gold wire is welded in the second welding area 82, and one end of the gold wire is welded on the wafer.

[0092] Printing areas 7 are provided on both sides of the fixed area 8, and this embodiment takes the printing area 7 as a strip. After the fixed area 8 is connected to the bracket 1 of the light-emitting diode, the printing area 7 on one side of the fixed area 8 is aligned with the positive electrode pad 2, and the printing area 7 on the other side of the fixed area 8 is aligned with the negative electrode pad 3. Solder resist ink is brushed on the printed area 7, so that solder resist ink is brushed on the positive electrode pad 2 and the negative electrode pad 3. After the solder resist ink is brushed, the solder resist ink is dried, and the temperature of the solder resist ink is increased, so that the solder resist ink is solidified to form a stable first solder resist layer 4 and a second solder resist layer 5.

[0093] You can first apply solder resist ink to the printing area 7 where the printing template is aligned with the negative electrode pad 3, and then apply solder resist ink to the printing area 7 where the printing template is aligned with the positive electrode pad 2. You can also first apply solder resist ink to the printing area 7 where the printing template is aligned with the positive electrode pad 2, and then apply solder resist ink to the printing area 7 where the printing template is aligned with the negative electrode pad 3.

[0094] In this embodiment, a printing template includes three first welding areas 81 and three second welding areas 82. Solder resist ink is printed first, and then cut into individual light-emitting diodes after the solder resist ink is cured. A printing template can print three light-emitting diodes at one time. The printing template is used to print solder resist ink on light-emitting diodes on a production line, thereby mass-producing light-emitting diodes.

[0095] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the application. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a restriction. Therefore, other examples of exemplary embodiments can have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once a certain item is defined in an accompanying drawing, it does not need to be further discussed in the subsequent accompanying drawings.

[0096] It should be understood that spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is inverted, a device described as "above" or "above" other devices or structures would then be positioned "below" or "below" the other devices or structures. Thus, the exemplary term "above" can include both the orientations of "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used herein should be interpreted accordingly.

[0097] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0098] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A welding structure, characterized in that: A bracket is included, and a positive electrode pad and a negative electrode pad are respectively provided at two ends of the bracket; the positive electrode pad is provided with a first solder resist layer, and the negative electrode pad is provided with a second solder resist layer; the first solder resist layer and the second solder resist layer are used to prevent solder paste from penetrating into the bracket; A resin layer is coated between the first solder resist layer and the second solder resist layer, and the resin layer is in contact with the bracket; A side of the first solder resist layer facing the second solder resist layer is in contact with the resin layer, and a side of the second solder resist layer facing the first solder resist layer is in contact with the resin layer; There is a gap between the first solder resist layer and the resin layer on one side facing the second solder resist layer, and there is a gap between the second solder resist layer and the resin layer on one side facing the first solder resist layer.

2. The welding structure according to claim 1, characterized in that: The first solder resist layer includes a first bending portion and a second bending portion, and the second solder resist layer includes a third bending portion and a fourth bending portion; the first bending portion and the third bending portion both extend along the connecting direction of the positive electrode pad and the negative electrode pad, the first bending portion extends to the edge of the positive electrode pad, the third bending portion extends to the edge of the negative electrode pad, and the second bending portion and the fourth bending portion both extend in a direction close to the bracket.

3. The welding structure according to claim 2, characterized in that: The first bending portion is located on a side of the positive electrode pad away from the bracket, the third bending portion is located on a side of the negative electrode pad away from the bracket, and the bottom ends of the second bending portion and the fourth bending portion are both in contact with the bracket.

4. The welding structure according to claim 3, characterized in that: The contact area between the first bending portion and the positive electrode pad is greater than or equal to the contact area between the second bending portion and the bracket; the contact area between the third bending portion and the negative electrode pad is greater than or equal to the contact area between the fourth bending portion and the bracket.

5. The welding structure according to claim 2, characterized in that: The length of the first bent portion is smaller than the length of the positive electrode pad, and the length of the third bent portion is smaller than the length of the negative electrode pad.

6. The welding structure according to claim 2, characterized in that: The second bent portion is located between the positive electrode pad and the resin layer, and the fourth bent portion is located between the negative electrode pad and the resin layer.

7. The welding structure according to any one of claims 1 to 6, characterized in that: The materials of the first solder resist layer and the second solder resist layer are solder resist ink.

8. A light emitting diode, characterized in that: The welding structure comprises the welding structure described in any one of claims 1 to 7.

9. A printing template, characterized in that: It comprises a fixed area and a printed area, wherein the printed area is connected to the positive electrode pad and the negative electrode pad of the light-emitting diode according to claim 8; the printed area is located on both sides of the fixed area, and the fixed area is connected to the bracket of the light-emitting diode.

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