Electronic product packaging shell structure

Abstract

The utility model provides an electronic product packaging shell structure, which comprises a hard silica gel protective layer and a soft silica gel functional layer, electronic product components comprise a motor assembly, a control circuit board and a power supply assembly, the hard silica gel protective layer is wrapped outside the motor assembly, the control circuit board and the power supply assembly, and the soft silica gel functional layer is wrapped outside the control circuit board and the power supply assembly. A motor assembly mounting slot position and a power supply circuit board mounting slot position are arranged in the hard silica gel protection layer, the hard silica gel protection layer is externally wrapped with a soft silica gel functional layer, and the power supply assembly penetrates through the hard silica gel protection layer and the soft silica gel functional layer through a circuit connecting wire and is connected with an external power supply assembly. According to the utility model, the product is better in environmental protection property, the hard silica gel protection layer and the soft organic silicon rubber layer which are made of double-layer materials and have better elasticity are adopted for buffering, the falling protection property of the improved structure is obviously improved, the use stability of the structure is better, the production efficiency is higher, and the cost is lower.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic component packaging shell structure, in particular to an electronic product packaging shell structure. Background Art

[0002] The massage part of the existing massage therapy instrument is made of soft rubber material, and electronic components such as motors, power supplies, circuit boards and circuit connecting wires are installed inside. In traditional processes, ABS and plastic electronic component shells are usually used to fix the electronic components, and then soft rubber is injected on the outside. The existing process has a low yield rate when packaging the internal electronic components of electronic products, poor environmental protection, low softness, insufficient protection for electronic components, i.e. poor drop protection, a relatively complicated production process, low efficiency, and high production cost, poor temperature resistance and sealing, and poor sound insulation.

[0003] A new type of electronic product packaging shell structure is now needed to solve the above-mentioned problems. Utility Model Content

[0004] The utility model provides an electronic product packaging shell structure, which solves the problem of high cost and insufficient protection effect on electronic components of existing electronic components using hard plastic shells for packaging through technical transformation of the existing electronic product packaging structure.

[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0006] An electronic product packaging shell structure comprises a hard silicone protective layer and a soft silicone functional layer, wherein the electronic product components comprise a motor assembly, a control circuit board and a power supply assembly, wherein the motor assembly, the control circuit board and the power supply assembly are electrically connected, wherein the hard silicone protective layer is wrapped around the outside of the motor assembly, the control circuit board and the power supply assembly, wherein a motor assembly mounting slot and a power supply circuit board mounting slot are arranged inside the hard silicone protective layer, wherein the motor assembly mounting slot is used to fix the motor assembly, wherein the power supply circuit board mounting slot is used to fix the control circuit board and the power supply assembly, wherein a soft silicone functional layer is wrapped around the outside of the hard silicone protective layer, and wherein the power supply assembly is connected to an external power supply assembly via a circuit connecting line passing through the hard silicone protective layer and the soft silicone functional layer.

[0007] Preferably, the hard silicone protective layer is made of organic silicone material, and the hard silicone protective layer is provided with a wire installation hole and a control switch slot, the circuit connection line is arranged to pass through the wire installation hole, and a control switch is also installed on the control circuit board, and the control switch is arranged in the control switch slot.

[0008] Preferably, the motor mounting slot is provided with a notch, the hard silicone protective layer is semi-enclosed at the periphery of the motor assembly, and the exposed portion of the motor assembly is wrapped by the soft silicone functional layer.

[0009] Preferably, a buffer reinforcement rib structure is provided at the outer edge of the hard silicone protective layer.

[0010] The beneficial effects of the utility model are:

[0011] Compared with the existing massagers that use hard plastic ABS or plastic electronic component shells, the structure of the present application is more environmentally friendly. The overall structure uses a double-layer material with good elasticity, a hard silicone protective layer and a soft silicone rubber layer for buffering. The improved structure has significantly improved drop protection and better structural stability.

[0012] In terms of production technology, this structural process has also been improved, the production steps have been optimized, the production efficiency has been improved, and the product yield has been improved.

[0013] During specific production, the corresponding electronic component packaging shell is designed according to the placement of each electronic component, and the shell is processed through the organic silicone infusion process so that the electronic components are wrapped and protected by a hard silicone protective layer made of organic silicone rubber. Organic silicone is used, and the temperature resistance of organic silicone is between 200 and 600 degrees. Compared with the temperature resistance of traditional plastics, the temperature resistance is significantly improved. Then, through secondary injection molding, a layer of soft silicone is injected on the outside of the electronic components wrapped with the hard silicone protective layer, and the injection is performed using an integrated sealing method. Compared with the original upper and lower mold forming method, the existing integrated sealing method is improved, which optimizes the production steps and improves the product yield. The integrated sealing outer silicone layer eliminates the mold line of the product compared to the traditional mold wrapping of electronic products, significantly improves the sealing of the product, and significantly improves the sound insulation effect.

[0014] The organic siloxane material used in the hard silicone protective layer of the present application can be made of other soft materials (such as TPER, TPU, PVC, epoxy resin, etc.) according to the design and use requirements, and has excellent elasticity and temperature resistance (the temperature resistance range depends on the selected material). This layer can tightly wrap electronic components and provide effective buffering and protection. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the structure of components of the electronic product of the utility model;

[0016] Figure 2 It is a schematic diagram of the packaging product of the utility model;

[0017] Figure 3 This is a schematic diagram of the external structure of another embodiment 2 of the utility model;

[0018] Figure 4 It is a cross-sectional structural schematic diagram of another embodiment 2 of the utility model;

[0019] Figure 5 This is a schematic diagram of the external structure of another embodiment 3 of the utility model;

[0020] Figure 6 This is a schematic diagram of the assembly of internal electronic components and a hard silicone protective layer in another embodiment 3 of the present utility model;

[0021] Figure 7 This is a schematic diagram of the external structure of another embodiment 4 of the utility model;

[0022] Figure 8 It is a cross-sectional structural schematic diagram of another embodiment 4 of the utility model;

[0023] Fig. 9 This is a schematic diagram of the external structure of another embodiment 5 of the utility model;

[0024] Fig.10 It is a cross-sectional structural schematic diagram of another embodiment 5 of the utility model;

[0025] Fig.11 This is a schematic diagram of the production process of the utility model;

[0026] Fig.12 This is a schematic diagram of the secondary perfusion process of the utility model;

[0027] Fig.13 This is a schematic diagram of the packaging process flow of another embodiment 6 of the utility model;

[0028] Explanation of the accompanying drawings: hard silicone protective layer 1, motor assembly mounting slot 11, power circuit board mounting slot 12, soft silicone functional layer 2, motor assembly 3, control circuit board 4, control switch 41, power assembly 5, circuit connecting wire 6, finished product 7, rubber 8. DETAILED DESCRIPTION

[0029] The specific contents of the utility model are described in detail below with reference to the accompanying drawings and embodiments.

[0030] See also Figure 1-2As shown, the utility model provides an electronic product packaging shell structure, comprising a hard silicone protective layer 1 and a soft silicone functional layer 2, the electronic product components include a motor assembly 3, a control circuit board 4 and a power supply assembly 5, the motor assembly 3, the control circuit board 4 and the power supply assembly 5 are electrically connected, the hard silicone protective layer 1 is wrapped and arranged on the outside of the motor assembly 3, the control circuit board 4 and the power supply assembly 5, the hard silicone protective layer 1 is provided with a motor assembly mounting slot 11 and a power supply circuit board mounting slot 12, the motor assembly mounting slot 11 is used to fix the motor assembly 3, the power supply circuit board mounting slot 12 is used to fix the control circuit board 4 and the power supply assembly 5, the hard silicone protective layer 1 is wrapped with a soft silicone functional layer 2, the power supply assembly 5 is connected to an external power supply assembly through a circuit connecting line 6 passing through the hard silicone protective layer 1 and the soft silicone functional layer 2.

[0031] The circuit connection line 6 adopts a waterproof charging interface to ensure safety during the charging process. The charging part can be charged by a pin-type interface, a data line type, a magnetic suction type power connection or a wireless charging structure according to design needs, and can be set according to design needs.

[0032] The electronic product components include core components such as the motor assembly 3, the control circuit board 4 and the power supply assembly 5. These components are precisely installed in the fixed placement slots inside the hard silicone protective layer 1 shell according to the predetermined position and layout. The control circuit board 4 and the power supply assembly 5 are connected by wires, and the motor is connected to the circuit board through a specific interface. All connections are connected in a reliable way to ensure the stability and safety of the circuit.

[0033] Figure 3-Figure 9 The application scenarios of other specific embodiments 2 to 5 of the present application are provided. The various electronic components (and adapted electronic components) provided in each embodiment of the present application are all adapted to all the glue filling processes proposed in this specification, and are selected and set according to the design and use requirements.

[0034] Furthermore, the hard silicone protective layer 1 is made of organic silicone material, and the hard silicone protective layer 1 is provided with a wire installation hole and a control switch slot, the circuit connection line 6 is arranged to pass through the wire installation hole, and a control switch 41 is also installed on the control circuit board 4, and the control switch 41 is arranged in the control switch 41 slot.

[0035] The hard silicone protective layer 1 is made of silicone rubber or other soft materials (such as TPER, TPU, PVC, epoxy resin, etc.), and has excellent elasticity and temperature resistance (the temperature resistance range depends on the selected material). This layer can tightly wrap the electronic components and provide effective buffering and protection.

[0036] The soft silicone functional layer 2 is arranged outside the hard silicone protective layer 1 and is also made of organic silicone rubber or other soft materials. This layer not only enhances the elasticity of the overall structure, but also provides good touch and anti-slip performance.

[0037] In order to obtain a better anti-slip effect, the outside of the soft silicone functional layer 2 is provided with an anti-slip texture to improve the holding stability.

[0038] An antibacterial protective layer may also be provided outside the soft silicone functional layer 2 to improve the hygienic performance of the product.

[0039] Furthermore, the motor mounting slot is provided with a notch, the hard silicone protective layer 1 is semi-enclosed at the periphery of the motor assembly 3, and the exposed portion of the motor assembly 3 is wrapped by the soft silicone functional layer 2. The motor mounting slot provided by the hard silicone protective layer 1 can ensure stable fixation and reduce vibration conduction.

[0040] The hard silicone protective layer 1 shell is the external protection structure of the electronic component module, and is made of high-strength, high-elasticity organic silicone material. The inside of the shell is designed with precise fixed placement slots and semi-enclosed slots according to the shape and size of the electronic components to ensure the stable installation of the electronic components.

[0041] The soft silicone functional layer 2 is a secondary injection layer on the outside of the hard silicone protective layer 1, and is made of soft silicone that is skin-friendly. The functional layer not only provides a comfortable user touch, but also enhances the product's sealing and sound insulation effects. In the motor output part, the soft silicone functional layer 2 wraps the motor to provide a better vibration effect.

[0042] Adding an insulating silicone layer around the power supply assembly 5 and the control circuit board 4 can avoid direct contact between the power supply and other components, thereby improving safety.

[0043] Furthermore, a buffer reinforcement rib structure is provided at the outer edge of the hard silicone protective layer 1. In order to improve the drop protection of the product, a reinforcement rib structure is designed at the corners of the hard silicone protective layer 1 to enhance the impact resistance of the shell. At the same time, key components such as the motor are also effectively fixed and protected inside the shell to reduce the impact and damage when falling.

[0044] The schematic diagram of the secondary infusion production process steps of this application is as follows Fig.12 As shown, the first step is to perform the first glue pouring on the outside of the electronic components, and the second step is the second pouring. The product obtained by the first pouring is placed in the mold, and then the second pouring is started to finally obtain the finished product 7.

[0045] like Fig.13As shown, the present application also discloses a packaging process flow of another embodiment 10, the first step is to perform the first glue pouring on the outside of the electronic component, the second step is to install and set a rubber sheet 8 on the upper end of the product based on the product obtained by the first pouring, and finally obtain a finished product 7.

[0046] Specifically, the present application discloses a production process for an electronic product packaging shell structure, comprising the following steps:

[0047] S1, pre-treatment of electronic components, functional testing of the motor assembly 3, power supply assembly 5 and control circuit board 4 to ensure normal performance, cleaning and drying of electronic components to remove surface stains and moisture;

[0048] S2, hard silicone protective layer 1 pouring, design and make silicone molds for electronic components, place the electronic components in the mold, ensure the position is accurate, mix the organic siloxane with other auxiliary materials evenly, and slowly inject it into the mold through professional pouring equipment to ensure that the electronic components are completely wrapped, and put the mold into a constant temperature oven for curing to make the silicone material form a hard protective layer;

[0049] S3, injection molding of the soft silicone functional layer 2, designing and making a mold for the soft silicone functional layer 2, placing the cured electronic components with the hard silicone protective layer 1 in the mold, injecting the soft silicone material into the mold, covering the outside of the hard silicone protective layer 1 to form the soft silicone functional layer 2, and also performing a curing process to ensure that the soft silicone functional layer 2 is stably formed.

[0050] S4, post-processing, removes the mold, obtains the electronic components with a double-layer silicone protective layer, checks the product appearance to ensure there are no defects and bubbles, performs performance tests to ensure that the product functions normally, and performs cleaning and packaging to prepare for shipment.

[0051] The potting process is to arrange, assemble, bond, connect, isolate and protect the components according to the requirements. Its function is to strengthen the integrity of the device, improve the resistance to external impact and vibration; improve the insulation between internal components and circuits; facilitate the miniaturization and lightness of the device; avoid direct exposure of components and circuits to the environment, and improve the waterproof and moisture-proof performance of the device.

[0052] Made of organic silicone material, it has good electrical insulation, heat resistance and waterproof properties.

[0053] Furthermore, in step S2, the following steps are included:

[0054] S201, material selection and proportioning, select high-purity, low-viscosity organic siloxane as the main raw material, and add auxiliary materials such as curing agent, catalyst and diluent to ensure that the silicone material has good fluidity and curing performance;

[0055] S202, mold preparation, clean and inspect the silicone mold of electronic components to ensure that there are no impurities and residues in the mold. The cleanliness and integrity of the mold are crucial to the formation of the silicone layer;

[0056] S203, pouring operation, slowly pour the mixed organic siloxane material into the mold through professional pouring equipment. During the pouring process, it is necessary to control the pouring speed and pouring volume to avoid bubbles or voids.

[0057] S204, curing treatment, after the infusion is completed, the mold is placed in a constant temperature oven for curing. According to the curing characteristics of the organic siloxane, the appropriate temperature and time are set to ensure that the silicone material is completely cured and forms a stable hard protective layer.

[0058] S205, demoulding and inspection, after curing is completed, remove the mold and carefully remove the electronic components with the hard silicone protective layer from the mold. Then check the quality of the silicone layer to ensure that there are no defects and flaws.

[0059] Further, in step S201, the mixture of organosiloxane, curing agent, catalyst and diluent includes:

[0060] 100 parts of organosiloxane;

[0061] 30 parts of curing agent;

[0062] 10 parts of catalyst;

[0063] 10 parts of diluent.

[0064] Furthermore, the curing agent is a high molecular weight polyether polyol, the catalyst includes one or more of diethanolamine, triethanolamine, dicyandiamide, imidazole, tetramethylguanidine and styrenated phenol, and the diluent includes one or more of monofunctional glycidyl ether, difunctional glycidyl ether, multifunctional glycidyl ether, low molecular weight polyethylene glycol and low molecular weight polypropylene glycol.

[0065] Furthermore, the step S3 includes the following steps:

[0066] S301, preparation work, before the second injection molding, ensure that the surface of the electronic components with hard silicone protective layer is clean and dry, and prepare the molds and materials required for soft silicone injection molding;

[0067] S302, mold installation, placing the electronic components with hard silicone protective layer in the injection mold to ensure accurate and stable position;

[0068] S303, injection operation, using professional injection molding equipment, injecting soft silicone material into the mold and covering the outside of the hard silicone protective layer. During the injection process, the injection pressure, speed and temperature need to be controlled to ensure that the silicone material evenly fills the mold and fits tightly to the hard silicone protective layer;

[0069] S304, curing and cooling. After the injection is completed, the mold is placed in a constant temperature environment for curing and cooling. By controlling the temperature and time, the soft silicone layer can reach the required hardness and stability.

[0070] S305, demoulding and post-processing, after curing and cooling, take out the mold, remove the electronic components with double-layer silicone protective layer from the mold, and then perform necessary post-processing operations, such as trimming excess silicone and cleaning the product surface.

[0071] Further, in step S301, the position of the second injection mold parting line is set at the bottom surface of the product.

[0072] Furthermore, in step S2 and step S3, the mold is produced by 3D printing. The mold of the present application can be produced by using the latest 3D printing technology, which significantly improves production efficiency.

[0073] This product is made of environmentally friendly materials. The hard silicone protective layer shell and the soft silicone functional layer can be recycled, reducing the impact on the environment.

[0074] In particular, the packaging and protection of electronic components, as well as the environmental performance of the shell. By adopting the organic siloxane infusion process and secondary injection molding technology, the stable packaging and protection of electronic components can be achieved, while improving the environmental performance and user experience of the product.

[0075] The utility model has the following features:

[0076] 1. Improved packaging and protection of electronic components

[0077] This application designs and manufactures special molds according to the specific positions and shapes of electronic components such as circuit boards, power supplies and motors. The mold organic silicone infusion process is used to encapsulate the outside of the electronic components in a hard silicone protective layer shell. This hard silicone protective layer shell not only has excellent stability and impact resistance, but also provides fixed placement slots for circuit boards and power modules, as well as semi-enclosed slots for fixing motors. The output part of the motor is exposed outside the hard silicone protective layer shell so that it can be wrapped by the functional layer of soft silicone in subsequent steps, thereby achieving a better vibration effect.

[0078] After the hard silicone protective layer shell is manufactured, the present application adopts secondary injection molding technology to inject a layer of soft silicone functional layer of skin-friendly material on the outside of the hard silicone protective layer shell. This functional layer not only provides a comfortable user touch, but also further enhances the protection of electronic components.

[0079] 2. Improved sealing and sound insulation

[0080] In order to improve the sealing and sound insulation effect of the product, this application adopts an integrated sealing injection method to make the soft silicone functional layer, and sets the mold line position in a ring shape at the bottom of the product. This design not only eliminates the traditional mold line, significantly improves the sealing of the product, but also enhances the sound insulation effect of the product and improves the user experience.

[0081] 3. Improved environmental performance

[0082] The hard silicone protective layer shell replaces the traditional ABS and plastic electronic component shell, significantly improving the environmental friendliness of the product. The hard silicone material has excellent biocompatibility and degradability, is environmentally friendly, and meets current environmental protection requirements.

[0083] 4. Improved drop protection

[0084] The hard silicone protective layer shell design allows the electronic components to be better fixed and protected, allowing the product to effectively resist impact when it falls and protect the internal electronic components from damage. This design significantly improves the product's drop protection and extends the product's service life.

[0085] Compared with the existing massagers that use hard plastic ABS or plastic electronic component shells, the structure of the present application is more environmentally friendly. The overall structure uses a double-layer material with good elasticity, a hard silicone protective layer and a soft silicone rubber layer for buffering. The improved structure has significantly improved drop protection and better structural stability.

[0086] In terms of production technology, this structural process has also been improved, the production steps have been optimized, the production efficiency has been improved, and the product yield has been improved.

[0087] During specific production, the corresponding electronic component packaging shell is designed according to the placement of each electronic component, and the shell is processed through the organic silicone infusion process so that the electronic components are wrapped and protected by a hard silicone protective layer made of organic silicone rubber. Organic silicone is used, and the temperature resistance of organic silicone is between 200 and 600 degrees. Compared with the temperature resistance of traditional plastics, the temperature resistance is significantly improved. Then, through secondary injection molding, a layer of soft silicone is injected on the outside of the electronic components wrapped with the hard silicone protective layer, and the injection is performed using an integrated sealing method. Compared with the original upper and lower mold forming method, the existing integrated sealing method is improved, which optimizes the production steps and improves the product yield. The integrated sealing outer silicone layer eliminates the mold line of the product compared to the traditional mold wrapping of electronic products, significantly improves the sealing of the product, and significantly improves the sound insulation effect.

[0088] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in the field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the purpose and scope of the technical solution of the utility model, which should be included in the scope of the claims of the utility model.

[0089] The standard parts used in the utility model can all be purchased from the market, and special-shaped parts can be customized according to the instructions and the drawings. The specific connection methods of each part adopt the conventional means such as mature bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here.

[0090] In the description of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

Claims

1. An electronic product packaging shell structure, characterized in that: It comprises a hard silicone protective layer and a soft silicone functional layer, the electronic product components comprise a motor assembly, a control circuit board and a power supply assembly, the motor assembly, the control circuit board and the power supply assembly are electrically connected, the hard silicone protective layer is wrapped around the outside of the motor assembly, the control circuit board and the power supply assembly, a motor assembly mounting slot and a power supply circuit board mounting slot are arranged inside the hard silicone protective layer, the motor assembly mounting slot is used to fix the motor assembly, the power supply circuit board mounting slot is used to fix the control circuit board and the power supply assembly, a soft silicone functional layer is wrapped around the outside of the hard silicone protective layer, and the power supply assembly is connected to an external power supply assembly via a circuit connecting line passing through the hard silicone protective layer and the soft silicone functional layer.

2. The electronic product packaging shell structure according to claim 1, characterized in that: The hard silicone protective layer is made of organic silicone material, and is provided with a wire installation hole and a control switch slot. The circuit connection line is arranged to pass through the wire installation hole. A control switch is also installed on the control circuit board, and the control switch is arranged in the control switch slot.

3. The electronic product packaging shell structure according to claim 1, characterized in that: The motor assembly installation slot is provided with a notch, the hard silicone protective layer is semi-enclosed at the periphery of the motor assembly, and the exposed portion of the motor assembly is wrapped by the soft silicone functional layer.

4. The electronic product packaging shell structure according to claim 1, characterized in that: A buffer reinforcement rib structure is arranged at the outer edge of the hard silicone protective layer.

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