Copper dissolving device and conductive metal film production equipment

Abstract

The utility model discloses a copper dissolving device and conductive metal film production equipment. The copper dissolving device comprises a copper dissolving tank, a storage bin, a feeding mechanism and a pumping assembly. A reaction cavity is formed in the copper dissolving tank, and a copper powder feeding opening is formed in the top of the reaction cavity; the feeding mechanism is communicated with the reaction cavity for adding dilute sulfuric acid into the reaction cavity; the pumping assembly comprises a connecting pipe assembly, a pump body and an atomizing nozzle, the inlet end of the connecting pipe assembly is communicated with the bottom of the reaction cavity, the outlet end of the connecting pipe assembly extends to the top of the reaction cavity, the pump body is arranged on the connecting pipe assembly, and a nozzle of the atomizing nozzle is arranged in the reaction cavity and communicated with the outlet end of the connecting pipe assembly. The problem that in the prior art, the reaction speed of metal copper and sulfuric acid in a copper dissolving device is low can be at least solved.

Description

Technical Field

[0001] The utility model relates to the technical field of conductive metal film production, in particular to a copper dissolving device and conductive metal film production equipment. Background Art

[0002] Conductive metal film is a kind of material with many good properties. It is now widely used in batteries as positive or negative current collectors. Copper dissolution is a process in the production of conductive metal film. It is a critical process to provide copper sulfate solution for copper foil production.

[0003] In the prior art, a copper dissolving tank is usually used to prepare a copper sulfate solution. During the preparation process, the solution at the bottom of the copper dissolving tank needs to be continuously pumped back into the copper dissolving tank through the top of the copper dissolving tank and mixed with air to react with metallic copper to generate copper sulfate. In the related art, a patent document with publication number CN219808016U discloses an immersion copper dissolving tank, including a sealed copper dissolving tank, the volume cavity of which is divided into an upper copper dissolving tank and a lower copper dissolving tank by two relatively arranged partition forks; the partition fork is an arc-shaped fork body structure, including an arc-shaped main pipe, the back side of which passes through the sealed copper dissolving tank through an air pipe and is assembled and connected with a gas supply device outside the sealed copper dissolving tank; the arc-shaped main pipe is formed with a plurality of parallel branch pipes as fork teeth on the inner side of the arc surface, the inner side of the branch pipe is connected with the arc-shaped main pipe, the outer end face is closed, and a plurality of air outlets are formed on the bottom side wall of the pipe body; the fork teeth on the two relatively arranged partition forks in the sealed copper dissolving tank are kept staggered; the sealed copper dissolving tank uses the hollow plane formed by the two partition forks as the placement plane of the copper material. The patent document can perform air replenishment on the copper dissolving tank in various ways, which can increase the gas flow rate near the copper material, thereby improving the reaction efficiency of the copper dissolving reaction in the copper dissolving tank.

[0004] However, the reaction rate of this immersion copper dissolving tank is relatively low, and concentrated sulfuric acid must be used for the reaction. Heating and other means are also required to increase the reaction rate, but the reaction efficiency is still unsatisfactory. Utility Model Content

[0005] The main purpose of the utility model is to provide a copper dissolving device and conductive metal film production equipment, so as to at least solve the problem that the reaction speed of metal copper and sulfuric acid in the copper dissolving device in the prior art is relatively slow.

[0006] According to one aspect of the utility model, a copper dissolving device is provided, comprising:

[0007] A copper dissolving tank, wherein a reaction chamber is provided in the copper dissolving tank, and a copper powder feeding port is provided at the top of the reaction chamber;

[0008] a feeding mechanism, the feeding mechanism being in communication with the reaction chamber and being used for adding dilute sulfuric acid to the reaction chamber;

[0009] A pumping assembly, the pumping assembly includes a connecting pipe assembly, a pump body and an atomizing nozzle, the inlet end of the connecting pipe assembly is connected to the bottom of the reaction chamber, the outlet end of the connecting pipe assembly extends to the top of the reaction chamber, the pump body is arranged on the connecting pipe assembly, and the nozzle of the atomizing nozzle is arranged in the reaction chamber and connected to the outlet end of the connecting pipe assembly.

[0010] Furthermore, there are a plurality of atomizing nozzles, and the plurality of atomizing nozzles are arranged at intervals along the same circumferential direction of the reaction chamber.

[0011] Furthermore, the connecting pipe assembly comprises:

[0012] an inlet pipe, two ends of which are respectively connected to the bottom of the reaction chamber and the pump body;

[0013] The outlet pipe comprises a connecting pipe section and an annular pipe section, the annular pipe section is arranged around the outer circumference of the copper-melting tank and close to the top of the copper-melting tank, the two ends of the connecting pipe section are respectively connected with the pump body and the annular pipe section, a plurality of pipe joints are arranged on the circumference of the annular pipe section, and the plurality of atomizing nozzles are connected with the plurality of pipe joints in a one-to-one correspondence.

[0014] Furthermore, the inlet pipe includes a collecting pipe and at least two branch pipes, the first end of the collecting pipe is connected to the pump body, the first end of each branch pipe is connected to the second end of the collecting pipe, and the second ends of at least two branch pipes are arranged along the periphery of the reaction chamber and are connected to the reaction chamber, so that the liquid in the reaction chamber forms a vortex when the pump body is working.

[0015] Furthermore, each of the branch pipes has an extending section extending into the reaction chamber, and within the projection of the copper dissolving tank in the up-down direction, the extending section is arranged to extend in a clockwise or counterclockwise direction.

[0016] Furthermore, at least two of the extending sections are evenly spaced along the circumference of the first circle of the reaction chamber, and the distance from the port of each extending section to the center of the first circle is 2 / 3 to 5 / 6 of the radius of the first circle.

[0017] Furthermore, a flow guide cover and a filter plate are arranged in the reaction chamber, the flow guide cover is located at the bottom of the atomizing nozzle, and the filter plate is arranged at the bottom of the flow guide cover.

[0018] Furthermore, the guide cover is a conical cover, the cone tip of the conical cover is provided with a through hole, and the cross-sectional area of ​​the conical cover gradually decreases in the direction away from the copper powder feed port.

[0019] Furthermore, the copper dissolving device also includes a stirring paddle, which is arranged in the reaction chamber and located at the copper powder feed port.

[0020] On the other hand, the present application also provides a conductive metal film production device, which includes the above-mentioned copper dissolving device.

[0021] In the utility model, the reaction chamber of the copper dissolving tank is used to prepare the copper sulfate solution. During the actual preparation, dilute sulfuric acid is added to the reaction chamber from the feeding mechanism, and copper powder is put into the reaction chamber from the copper powder feed port at the top of the copper dissolving tank. After the dilute sulfuric acid, copper powder and air in the reaction chamber are mixed and reacted, the copper sulfate solution can be prepared. During the reaction process, the pump body of the pumping assembly can pump the sulfuric acid and copper sulfate solution at the bottom of the reaction chamber to the top of the copper dissolving tank as needed and spray them from the nozzle of the atomizing nozzle. At this time, the atomized sulfuric acid and copper sulfate solution can fully contact and react with the copper powder and air flowing out of the copper powder feed port, which can improve the preparation rate of the copper sulfate solution in the reaction chamber. Compared with the structure in the prior art, the method of spraying sulfuric acid and copper sulfate into the reaction chamber by the atomizing nozzle in the utility model can make sulfuric acid fully mixed and reacted with copper powder and air, and the pumping assembly is used to circulate the solution in the copper dissolving tank continuously. The whole process does not need to heat the copper dissolving tank, and only dilute sulfuric acid can be used to quickly prepare the copper sulfate solution, which has a simple structure and lower cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0023] Figure 1 It is a front view of the copper dissolving device disclosed in the embodiment of the utility model;

[0024] Figure 2 It is a front view of a copper dissolving device disclosed in an embodiment of the utility model after partial cut-away;

[0025] Figure 3 for Figure 2 AA section view in.

[0026] The above drawings include the following reference numerals:

[0027] 10. Copper dissolving tank; 11. Reaction chamber; 12. Copper powder feed port; 13. Overflow port; 20. Storage bin; 30. Feeding mechanism; 40. Pumping assembly; 41. Connecting pipe assembly; 411. Inlet pipe; 4111. Collecting pipe; 4112. Branch pipe; 4112a. Extension section; 4112b. Port; 412. Outlet pipe; 4121. Connecting pipe section; 4122. Ring pipe section; 4122a. Pipe joint; 42. Pump body; 43. Atomizing nozzle; 50. Flow guide cover; 51. Through hole; 60. Filter plate; 70. Delivery pipe. DETAILED DESCRIPTION

[0028] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0029] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the utility model. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0030] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps described in these embodiments do not limit the scope of the utility model. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be regarded as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once a certain item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0031] See also Figures 1 to 3 As shown, according to an embodiment of the present application, a copper dissolving device is provided, which includes a copper dissolving tank 10, a storage bin 20, a feeding mechanism 30 and a pumping assembly 40.

[0032] Among them, a reaction chamber 11 is arranged in the copper dissolving tank 10, and a copper powder feed port 12 is arranged on the top of the reaction chamber 11; a storage bin 20 is arranged on the top of the copper dissolving tank 10 and is connected with the copper powder feed port 12, and the storage bin 20 is at least used to store copper powder; a feeding mechanism 30 is connected with the reaction chamber 11 for adding dilute sulfuric acid to the reaction chamber 11; a pumping assembly 40 includes a connecting pipe assembly 41, a pump body 42 and an atomizing nozzle 43, the inlet end of the connecting pipe assembly 41 is connected with the bottom of the reaction chamber 11, and the outlet end of the connecting pipe assembly 41 extends to the top of the reaction chamber 11, the pump body 42 is arranged on the connecting pipe assembly 41, and the nozzle of the atomizing nozzle 43 is arranged in the reaction chamber 11 and is connected with the outlet end of the connecting pipe assembly 41.

[0033] In the present application, the reaction chamber 11 of the copper dissolving tank 10 is used to prepare the copper sulfate solution. During the actual preparation, dilute sulfuric acid is added to the reaction chamber 11 from the feeding mechanism 30, and the copper powder in the storage bin 20 is put into the reaction chamber 11 from the copper powder feed port 12 at the top of the copper dissolving tank 10. The dilute sulfuric acid, copper powder and air in the reaction chamber 11 are mixed and reacted to prepare the copper sulfate solution. During the reaction process, the pump body 42 of the pumping assembly 40 can pump the sulfuric acid and copper sulfate solution at the bottom of the reaction chamber 11 to the top of the copper dissolving tank 10 as needed and spray them out from the nozzle of the atomizing nozzle 43. At this time, the atomized sulfuric acid and copper sulfate solution can fully contact and react with the copper powder and air flowing out from the copper powder feed port 12, which can increase the preparation rate of the copper sulfate solution in the reaction chamber 11.

[0034] Compared with the structure in the prior art, in this embodiment, the method of spraying sulfuric acid and copper sulfate into the reaction chamber 11 by using the atomizing nozzle 43 can make the sulfuric acid fully mixed with the copper powder and the air for reaction, and the pumping component 40 is used to circulate the solution in the copper dissolving tank 10 continuously. The whole process does not require heating the copper dissolving tank 10, and only dilute sulfuric acid can be used to quickly prepare the copper sulfate solution, which has a simple structure and lower cost.

[0035] In the present application, the copper dissolving tank 10 is arranged in a cylindrical shape as a whole. For example, the copper dissolving tank 10 can be arranged in a cylindrical shape, a prismatic shape, an elliptical shape or other special-shaped cylindrical shape. The reaction chamber 11 can be a cylindrical cavity, a prismatic cavity, an elliptical cavity or other special-shaped cylindrical cavity.

[0036] Optionally, the copper dissolving tank 10 in this embodiment is provided with an overflow port 13, which is connected to the reaction chamber 11. When the copper dissolving tank 10 is working, the copper sulfate solution inside the copper dissolving tank 10 can flow out from the overflow port 13; the copper dissolving tank 10 is also provided with a delivery pipe 70, which is arranged at the bottom of the reaction chamber 11, so as to facilitate the delivery of the copper sulfate solution to other equipment.

[0037] Further, in the present embodiment, there are multiple atomizing nozzles 43, and the multiple atomizing nozzles 43 are arranged at intervals along the same circumferential direction of the reaction chamber 11. Exemplarily, the atomizing nozzles 43 may be two, three, or more than three. In the present embodiment, by providing multiple atomizing nozzles 43, sulfuric acid and copper sulfate can be uniformly sprayed along the periphery of the reaction chamber 11, thereby facilitating the full contact and reaction of copper powder, air, sulfuric acid, and copper sulfate, and the preparation efficiency of the copper sulfate solution can be improved.

[0038] Specifically, the connecting pipe assembly 41 in this embodiment includes an inlet pipe 411 and an outlet pipe 412. The two ends of the inlet pipe 411 are respectively connected to the bottom of the reaction chamber 11 and the pump body 42; the outlet pipe 412 includes a connecting pipe section 4121 and an annular pipe section 4122, the annular pipe section 4122 is arranged around the outer periphery of the copper dissolving tank 10 and is arranged close to the top of the copper dissolving tank 10, the two ends of the connecting pipe section 4121 are respectively connected to the pump body 42 and the annular pipe section 4122, and a plurality of pipe joints 4122a are arranged in the outer peripheral direction of the annular pipe section 4122, and a plurality of atomizing nozzles 43 are connected to the plurality of pipe joints 4122a in a one-to-one correspondence. In this embodiment, by setting the annular pipe section 4122 and setting a plurality of pipe joints 4122a on the annular pipe section 4122, a plurality of atomizing nozzles 43 can be connected and arranged, and the structure is simple and easy to implement.

[0039] Further, the inlet pipe 411 includes a collecting pipe 4111 and at least two branch pipes 4112, the first end of the collecting pipe 4111 is connected to the pump body 42, the first end of each branch pipe 4112 is connected to the second end of the collecting pipe 4111, and the second ends of at least two branch pipes 4112 are arranged along the periphery of the reaction chamber 11 and are connected to the reaction chamber 11, so that the liquid in the reaction chamber 11 forms a vortex when the liquid pump is working. In the present application, since the inlet pipe 411 has at least two branch pipes 4112, and the second ends of at least two branch pipes 4112 are arranged along the circumference of the reaction chamber 11 and are connected to the reaction chamber 11, when the pump body 42 is working, the liquid in the reaction chamber 11 can enter the branch pipe 4112 from the second end of each branch pipe 4112. During this process, the liquid in the reaction chamber 11 can form a vortex at the center of the reaction chamber 11. The bubble density in the vortex is relatively small, and the bubbles will flow toward the center of the vortex, and the bubbles are not easy to gather on the inner wall of the reaction chamber 11. In other words, when the pump body 42 is working, the bubble content in the liquid sucked by the branch pipe 4112 is relatively small, and it is not easy to cause cavitation to the blades of the pump body 42, which can improve the service life of the pump body 42 in this embodiment and is not easy to cause danger.

[0040] In the present application, each branch pipe 4112 has an extension section 4112a extending into the reaction chamber, and within the projection of the copper dissolving tank in the up-down direction, the extension section 4112a is arranged to extend in a clockwise or counterclockwise direction. Figure 3 The figure shows the arrangement of the insertion section 4112a extending in the counterclockwise direction. That is to say, the at least two insertion sections 4112a described in this embodiment are generally arranged in a spiral shape along the circumference of the reaction chamber 11 in the projection in the up-down direction. In this way, when the pump body 42 is working, the suction force of each insertion section 4112a on the liquid in the reaction chamber 11 forms a combined force, which can apply a force in the clockwise or counterclockwise direction to the liquid inside the reaction chamber 11, so that the liquid in the reaction chamber 11 can form a vortex in the center of the reaction chamber 11. At this time, the bubble density in the vortex is less than the density of the liquid, and the bubbles will gather to the center of the reaction chamber 11, while the bubble content in the liquid sucked by the insertion section 4112a located at the edge of the vortex is relatively small, so that the bubbles can be prevented from causing cavitation to the blades of the pump body 42. Optionally, the branch pipes 4112 in this embodiment can be two, three, four or more than four. The appendix of this application Figure 3 The situation when there are two branch pipes 4112 is shown in FIG.

[0041] Furthermore, the at least two sections of the extending sections 4112a are evenly arranged at circumferential intervals along the first circumference of the reaction chamber 11 (the contour of the first circumference is consistent with the outer circumferential contour of the reaction chamber 11), and the axes of the extending sections 4112a are in the same plane. That is to say, the at least two sections of the extending sections 4112a in this embodiment are located at the same height of the reaction chamber 11. When the pump body 42 is working, the extending sections 4112a that are evenly arranged at circumferential intervals along the first circumference and are in the same plane can apply suction force to the liquid at the same height in the reaction chamber 11, which can effectively make the liquid in the reaction chamber 11 form a vortex in the center of the reaction chamber 11, and the bubbles in the liquid will flow toward the center of the vortex. The bubbles are not easy to gather on the inner wall of the reaction chamber 11. The bubble content in the liquid sucked by the branch pipe 4112 is relatively small, and it is not easy to cause cavitation to the blades of the pump body 42, which can improve the service life of the pump body 42 in this embodiment. Of course, in other embodiments of the present application, the at least two extending sections 4112a mentioned above can also be set at a certain position staggered along the height direction of the copper dissolving tank 10, as long as it is ensured that the liquid in the reaction chamber 11 can form a vortex in the center of the reaction chamber 11 when the pump body 42 is working.

[0042] Further, the distance from the port 4112b of each extension section 4112a to the center of the first circle is 2 / 3 to 5 / 6 of the radius of the first circle. In other words, when the radius of the first circle is r, the distance from the port 4112b of each extension section 4112a to the center of the first circle is 2*r / 3 to 5*r / 6, such as 2*r / 3, 3*r / 4, or 5*r / 6. When the distance from the port 4112b of the insertion section 4112a to the center of the first circle is greater than 5*r / 6, the port 4112b of the insertion section 4112a is relatively close to the center of the vortex, and the insertion section 4112a can easily suck the bubbles in the center of the vortex; when the distance from the port 4112b of the insertion section 4112a to the center of the first circle is less than 2*r / 3, it is not easy to apply suction force to the liquid in the reaction chamber 11 to form a vortex in the center of the reaction chamber 11, and it is not convenient to suck the liquid in the reaction chamber 11. That is to say, by making the distance from the port 4112b of each insertion section 4112a to the center of the first circle be 2 / 3 to 5 / 6 of the radius of the first circle, the present application can ensure the liquid circulation efficiency while fully avoiding bubbles from entering the pump body 42 and causing cavitation to the pump body 42.

[0043] Further, the insertion section 4112a extends along the inner wall of the reaction chamber 11. That is to say, from the position where the insertion section 4112a is connected to the reaction chamber 11 to the direction of the port 4112b of the insertion section 4112a, the distance from the axis of the insertion section 4112a to the center of the first circle is constant, and the insertion section 4112a is a circular arc section. With such a configuration, when the pump body 42 is working, the suction force of each insertion section 4112a on the liquid in the reaction chamber 11 makes it easier for the liquid in the reaction chamber 11 to form a vortex at the center of the reaction chamber 11.

[0044] In other embodiments not shown in the present application, the extension segment 4112a can also be a straight segment, and multiple extension segments 4112a are extended in a counterclockwise or clockwise direction within the projection of the copper dissolving tank 10 along the up and down directions. When the pump body 42 is working, the suction force of each extension segment 4112a on the liquid in the reaction chamber 11 makes it easier for the liquid in the reaction chamber 11 to form a vortex in the center of the reaction chamber 11.

[0045] Further, in the reaction chamber 11 of the present embodiment, a flow guide 50 and a filter plate 60 are provided in the reaction chamber 11, wherein the flow guide 50 is located at the bottom of the atomizing nozzle 43, and the filter plate 60 is provided at the bottom of the flow guide 50. Further, the flow guide 50 is a conical hood, and a through hole 51 is provided at the cone tip of the conical hood, and the cross-sectional area of ​​the conical hood gradually decreases in the direction away from the copper powder feed port 12. That is, a through hole 51 is provided in the middle of the flow guide hood 50 and the whole is in a cone shape with a large top and a small bottom, so that unreacted copper oxide powder, acid solution, etc. can be easily collected at the through hole 51, and the reaction can be sustained during the collection process, while the filter plate 60 only allows the solution to pass through, and the copper oxide powder cannot pass through, so that even if there is unreacted copper oxide powder, it will not enter the bottom of the pumping assembly 40 and the copper dissolving tank 10, thereby avoiding the mixing of the copper sulfate solution and the copper oxide powder, and at the same time, the acid solution will continuously react with the copper oxide powder on the filter plate 60, and also avoid the accumulation of a large amount of copper oxide powder.

[0046] Furthermore, the copper dissolving device further includes a stirring paddle (not shown in the figure), which is arranged in the reaction chamber 11 and located at the copper powder feed port 12. The stirring paddle can break up or evenly disperse the copper oxide powder transported to the tank body, so as to facilitate full contact and reaction with sulfuric acid and air, thereby improving the preparation efficiency of copper sulfate.

[0047] On the other hand, the present application also discloses a conductive metal film production device, which includes the above-mentioned copper dissolving tank control device. Therefore, the conductive metal film production device includes all the technical effects of the above-mentioned pumping device. Since the technical effects of the copper dissolving tank control device have been described in detail above, they will not be repeated here.

[0048] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0049] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the utility model.

[0050] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may be subject to various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A copper dissolving device, characterized in that: include: A copper dissolving tank (10), wherein a reaction chamber (11) is arranged in the copper dissolving tank (10), and a copper powder feed port (12) is arranged at the top of the reaction chamber (11); a feeding mechanism (30), the feeding mechanism (30) being in communication with the reaction chamber (11) and being used for adding dilute sulfuric acid to the reaction chamber (11); A pumping assembly (40), the pumping assembly (40) comprising a connecting pipe assembly (41), a pump body (42) and an atomizing nozzle (43), the inlet end of the connecting pipe assembly (41) being in communication with the bottom of the reaction chamber (11), the outlet end of the connecting pipe assembly (41) extending to the top of the reaction chamber (11), the pump body (42) being arranged on the connecting pipe assembly (41), and the nozzle of the atomizing nozzle (43) being arranged in the reaction chamber (11) and in communication with the outlet end of the connecting pipe assembly (41).

2. The copper dissolving device according to claim 1, characterized in that: There are a plurality of atomizing nozzles (43), and the plurality of atomizing nozzles (43) are arranged at intervals along the same circumferential direction of the reaction chamber (11).

3. The copper dissolving device according to claim 2, characterized in that: The connecting pipe assembly (41) comprises: an inlet pipe (411), wherein two ends of the inlet pipe (411) are respectively connected to the bottom of the reaction chamber (11) and the pump body (42); An outlet pipe (412), the outlet pipe (412) comprising a connecting pipe section (4121) and an annular pipe section (4122), the annular pipe section (4122) being arranged around the outer circumference of the copper dissolving tank (10) and close to the top of the copper dissolving tank (10), the two ends of the connecting pipe section (4121) being respectively connected to the pump body (42) and the annular pipe section (4122), a plurality of pipe joints (4122a) being arranged on the circumference of the annular pipe section (4122), and the plurality of atomizing nozzles (43) being connected to the plurality of pipe joints (4122a) in a one-to-one correspondence.

4. The copper dissolving device according to claim 3, characterized in that: The inlet pipe (411) comprises a collecting pipe (4111) and at least two branch pipes (4112); the first end of the collecting pipe (4111) is connected to the pump body (42); the first end of each branch pipe (4112) is connected to the second end of the collecting pipe (4111); the second ends of at least two branch pipes (4112) are arranged along the periphery of the reaction chamber (11) and are connected to the reaction chamber (11), so that the liquid in the reaction chamber (11) forms a vortex when the pump body (42) is working.

5. The copper dissolving device according to claim 4, characterized in that: Each of the branch pipes (4112) has an extension section (4112a) extending into the reaction chamber (11), and within the projection of the copper dissolving tank (10) in the up and down directions, the extension section (4112a) is arranged to extend in a clockwise or counterclockwise direction.

6. The copper dissolving device according to claim 5, characterized in that: At least two of the extending sections (4112a) are evenly spaced along the circumference of the first circle of the reaction chamber (11), and the distance from the port (4112b) of each of the extending sections (4112a) to the center of the first circle is 2 / 3 to 5 / 6 of the radius of the first circle.

7. The copper dissolving device according to any one of claims 1 to 6, characterized in that: A flow guide cover (50) and a filter plate (60) are arranged in the reaction chamber (11); the flow guide cover (50) is located at the bottom of the atomizing nozzle (43); and the filter plate (60) is arranged at the bottom of the flow guide cover (50).

8. The copper dissolving device according to claim 7, characterized in that: The guide cover (50) is a conical cover, the tip of which is provided with a through hole (51), and the cross-sectional area of ​​the conical cover gradually decreases in a direction away from the copper powder feed port (12).

9. The copper dissolving device according to any one of claims 1 to 6 and 8, characterized in that: The copper dissolving device further comprises a stirring paddle, which is arranged in the reaction chamber (11) and located at the copper powder feed port (12).

10. A conductive metal film production device, characterized in that: The conductive metal film production equipment comprises the copper dissolving device according to any one of claims 1 to 9.

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