Monocrystalline silicon wafer polishing device

Abstract

The utility model discloses a monocrystalline silicon wafer polishing device which comprises a device body, the device body comprises an installation box, a fixing platform, a polishing device and an adjusting device, the fixing platform is installed on the top of the installation box, the polishing device is installed on the top of the fixing platform, and the adjusting device is installed in the installation box; the fixed platform comprises a bottom plate, a group of side limiting plates and a baffle, the group of side limiting plates are located at the left end and the right end of the top of the bottom plate respectively, wear-resistant attaching gaskets are arranged at the bottoms of the side limiting plates, a mounting groove is formed in the bottom plate, the baffle is located at one end of the mounting groove, and the bottom plate, the side limiting plates and the baffle are all of a smooth transition and integrated machining forming structure; an operation opening is formed in the surface of the mounting groove and is of a through structure. According to the device, monocrystalline silicon can be effectively limited, so that the condition of displacement of the monocrystalline silicon during processing is prevented, and the processing precision of the monocrystalline silicon is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of single crystal silicon wafer processing, in particular to a single crystal silicon wafer polishing device. Background Art

[0002] Monocrystalline silicon wafers: Single crystals of silicon have a relatively complete lattice structure. Different orientations of the wafer exhibit different properties, making them an excellent semiconductor material. Monocrystalline silicon wafers, refined from ordinary silicon, are the most commonly used semiconductor material. They are available in sizes ranging from 4 inches, 5 inches, 6 inches, and 8 inches in diameter, with 12-inch and even larger sizes recently developed. The larger the wafer, the more ICs can be produced on it, reducing costs.

[0003] Existing single crystal silicon processing equipment has the following defects:

[0004] Existing single crystal silicon processing equipment cannot limit the position of single crystal silicon during processing, which causes the single crystal silicon to shift easily during processing, affecting the processing accuracy of the single crystal silicon. To this end, a solution is needed. Utility Model Content

[0005] (1) Technical problems solved

[0006] In view of the deficiencies in the prior art, the present invention provides a single crystal silicon wafer polishing device to solve the problems raised in the above background technology.

[0007] (2) Technical solution

[0008] To achieve the above objectives, the present invention is implemented through the following technical solutions: a single crystal silicon wafer polishing device, including a device body, the device body including an installation box, a fixed platform, a grinding device and an adjustment device, the fixed platform is installed on the top of the installation box, the grinding device is installed on the top of the fixed platform, and the adjustment device is installed in the installation box; the fixed platform includes a base plate, a side limit plate and a baffle, and the side limit plate is provided in a group, and a group of side limit plates are respectively located at the left and right ends of the top of the base plate, and a wear-resistant fitting gasket is provided at the bottom of the side limit plate, and a mounting groove is opened inside the base plate, and the baffle is located at one end of the mounting groove, and the base plate, side limit plate and baffle are all smooth transition and integrally processed and formed structures, and an operation port is opened on the surface of the mounting groove, and the operation port is a through structure.

[0009] Preferably, the adjusting device includes a driving motor and a rotating disk, and the rotating disk is installed at the top driving end of the driving motor and is located in the operating port.

[0010] Preferably, the grinding device includes a mounting frame and a slide rail type lifting grinder, the mounting frame is a concave-shaped structure, and the slide rail type lifting grinder is mounted on the mounting frame and is located above the mounting slot.

[0011] Preferably, a maintenance port is provided at the front end of the installation box, and a group of maintenance doors symmetrically distributed are installed in the maintenance port through hinges. Side fixing feet are provided on the left and right sides of the installation box. The side fixing feet are rectangular in structure, and fixing holes are provided on the surface of the side fixing feet.

[0012] (3) Beneficial effects

[0013] The utility model provides a single crystal silicon wafer polishing device. It has the following beneficial effects:

[0014] This type of single crystal silicon wafer polishing device can effectively limit the single crystal silicon, thereby preventing the single crystal silicon from shifting during processing, greatly improving the accuracy of single crystal silicon processing, and this type of device can also adjust the position of the single crystal silicon to improve the processing efficiency of the single crystal silicon. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the structure inside the installation box of the utility model.

[0017] In the figure, 1. device body; 2. installation box; 3. fixed platform; 4. grinding device; 5. adjustment device; 6. bottom plate; 7. side limit plate; 8. baffle; 9. wear-resistant fitting pad; 10. installation slot; 11. operation port; 12. drive motor; 13. rotating disk; 14. installation frame; 15. slide rail lifting grinder; 16. maintenance port; 17. maintenance door; 18. side fixing foot; 19. fixing hole. DETAILED DESCRIPTION

[0018] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0019] See also Figure 1-2The embodiment of the utility model provides a technical solution: a single crystal silicon wafer polishing device, comprising a device body 1, the device body 1 comprising an installation box 2, a fixed platform 3, a grinding device 4 and an adjustment device 5, the fixed platform 3 being mounted on the top of the installation box 2, the grinding device 4 being mounted on the top of the fixed platform 3, and the adjustment device 5 being mounted inside the installation box 2;

[0020] The problem is solved. The fixed platform 3 includes a base plate 6, a side limit plate 7 and a baffle 8. The side limit plate 7 is provided in a group. A group of side limit plates 7 are respectively located at the left and right ends of the top of the base plate 6. The bottom of the side limit plate 7 is provided with a wear-resistant fitting gasket 9. A mounting groove 10 is opened inside the base plate 6. The baffle 8 is located at one end of the mounting groove 10. The base plate 6, the side limit plate 7 and the baffle 8 are all smooth transition and integrally processed and formed structures. An operating port 11 is opened on the surface of the mounting groove 10. The operating port 11 is a through-type structure. When in use, the staff imports the monocrystalline silicon from the other end of the mounting groove 10, and then limits the monocrystalline silicon through a group of side limit plates 7 and baffles 8.

[0021] Furthermore, the adjusting device 5 includes a driving motor 12 and a rotating disk 13. The rotating disk 13 is installed at the top driving end of the driving motor 12 and is located in the operating port 11. When the monocrystalline silicon is adjusted, the driving motor 12 is driven and then drives the rotating disk 13 to rotate, and the monocrystalline silicon above can rotate, so as to achieve the purpose of leaking out the unpolished areas. If it is necessary to strengthen the fixation of the monocrystalline silicon, a lifting device can be added to the bottom of the motor 12, and the bottom of the monocrystalline silicon can be further pressed by the rotating disk 13, so that the two sides of the top of the monocrystalline silicon are attached to the bottom of the side limit plate 7, and then the firmness of the fixation of the monocrystalline silicon can be improved.

[0022] Differently, the grinding device 4 includes a mounting frame 14 and a sliding rail lifting grinder 15. The mounting frame 14 is a concave structure. The sliding rail lifting grinder 15 is installed on the mounting frame 14 and is located above the mounting slot 10. During grinding, the sliding rail lifting grinder 15 drives the grinding disc to rotate, and then the sliding rail lifting grinder 15 is lifted and lowered, and the grinding disc is used to grind the monocrystalline silicon. The sliding rail lifting grinder 15 can also be shifted to achieve a mobile grinding effect.

[0023] Effectively, a maintenance opening 16 is provided at the front end of the installation box 2, and a group of maintenance doors 17 symmetrically distributed are installed in the maintenance opening 16 through hinges. Side fixing feet 18 are provided on the left and right sides of the installation box 2. The side fixing feet 18 are rectangular in structure, and fixing holes 19 are provided on the surface of the side fixing feet 18. The staff can open the maintenance door 17 and then perform maintenance work on the components in the installation box 2 through the maintenance opening 16. The side fixing feet 18 on the left and right sides of the installation box 2 are for the convenience of fixing the installation box 2.

[0024] Working principle: During operation, the staff introduces the monocrystalline silicon from the other end of the installation groove 10, and then limits the monocrystalline silicon through a group of side limit plates 7 and baffles 8. If it is necessary to strengthen the fixation of the monocrystalline silicon, a lifting device can be added to the bottom of the motor 12, and the bottom of the monocrystalline silicon can be further pressed by the rotating disk 13, so that the two sides of the top of the monocrystalline silicon fit to the bottom of the side limit plates 7, and then the firmness of the fixation of the monocrystalline silicon can be improved. During grinding, the slide-type lifting grinder 15 drives the grinding disk to rotate, and then the slide-type lifting grinder 15 is lifted and lowered, and the grinding disk is used to grind the monocrystalline silicon, and the slide-type lifting grinder 15 can also be shifted, thereby achieving a mobile grinding effect. When adjusting the monocrystalline silicon, the drive motor 12 is driven, and then the rotating disk 13 is driven to rotate, and the monocrystalline silicon above can rotate, so that the ungrinded areas can leak out.

[0025] The present invention comprises: 1. device body; 2. installation box; 3. fixing platform; 4. grinding device; 5. adjustment device; 6. bottom plate; 7. side limit plate; 8. baffle; 9. wear-resistant fitting pad; 10. installation groove; 11. operation port; 12. drive motor; 13. rotating disk; 14. installation frame; 15. slide rail lifting grinder; 16. maintenance port; 17. maintenance door; 18. side fixing foot; 19. fixing hole. All components are universal standard parts or components known to technical personnel in this field, and their structures and principles can be known to technical personnel in this field through technical manuals or through conventional experimental methods. The problem solved by the present invention is that the existing single crystal silicon processing equipment cannot limit the single crystal silicon when processing the single crystal silicon, which causes the single crystal silicon to be easily shifted during processing, affecting the processing accuracy of the single crystal silicon. The present invention can effectively limit the single crystal silicon through the combination of the above components, thereby preventing the single crystal silicon from shifting during processing, thereby greatly improving the processing accuracy of the single crystal silicon.

[0026] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, from all perspectives, the embodiments should be regarded as illustrative and non-restrictive. The scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes that fall within the meaning and range of equivalents of the claims be included in the present invention. Any reference signs in the claims should not be construed as limiting the claim to which they relate.

[0027] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A single crystal silicon wafer polishing device, characterized in that: The device comprises a device body (1), wherein the device body (1) comprises an installation box (2), a fixed platform (3), a grinding device (4) and an adjustment device (5), wherein the fixed platform (3) is installed on the top of the installation box (2), the grinding device (4) is installed on the top of the fixed platform (3), and the adjustment device (5) is installed in the installation box (2); The fixed platform (3) comprises a bottom plate (6), a side limit plate (7) and a baffle plate (8); a group of the side limit plates (7) are provided, and the group of side limit plates (7) are respectively located at the left end and the right end of the top of the bottom plate (6); a wear-resistant fitting gasket (9) is provided at the bottom of the side limit plate (7); a mounting groove (10) is provided inside the bottom plate (6); the baffle plate (8) is located at one end of the mounting groove (10); the bottom plate (6), the side limit plate (7) and the baffle plate (8) are all smoothly transitioned and integrally processed structures; an operating port (11) is provided on the surface of the mounting groove (10); and the operating port (11) is a through-type structure.

2. A single crystal silicon wafer polishing device according to claim 1, characterized in that: The adjusting device (5) comprises a driving motor (12) and a rotating disk (13); the rotating disk (13) is mounted on the top driving end of the driving motor (12) and is located in the operating port (11).

3. A single crystal silicon wafer polishing device according to claim 1, characterized in that: The grinding device (4) comprises a mounting frame (14) and a slide rail type lifting grinder (15); the mounting frame (14) is a concave-shaped structure; the slide rail type lifting grinder (15) is mounted on the mounting frame (14) and is located above the mounting groove (10).

4. A single crystal silicon wafer polishing device according to claim 1, characterized in that: The front end of the installation box (2) is provided with a maintenance opening (16), a group of maintenance doors (17) symmetrically distributed are installed in the maintenance opening (16) through hinges, and side fixing feet (18) are provided on both left and right sides of the installation box (2), the side fixing feet (18) are rectangular in structure, and fixing holes (19) are provided on the surface of the side fixing feet (18).

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