Automatic detection device for copper nail leakage of notebook computer built-in part

Abstract

The utility model discloses an automatic detection device for copper nail leakage of notebook computer built-in parts, which belongs to the technical field of detection equipment and comprises a detection block, a placement groove is formed in the detection block, and the two ends of the placement groove are arranged in a penetrating manner; the detection mechanism comprises a supporting frame, an extrusion air cylinder, an extrusion plate, a positioning plate and an inductor, the supporting frame is fixedly connected to the detection block, the extrusion air cylinder is installed on the supporting frame, the output end of the extrusion air cylinder is fixedly connected with the extrusion plate, one end of the extrusion plate is fixedly connected with the positioning plate, and the other end of the extrusion plate is fixedly connected with the inductor. According to the utility model, through the arrangement of the detection mechanism, the to-be-detected notebook computer is placed on the plurality of rotatable guide wheels in the placement groove and pushed into the placement groove until the to-be-detected notebook computer abuts against the positioning plate, and the positioning of the to-be-detected notebook computer is completed under the limitation of the placement groove and the positioning plate.

Description

Technical Field

[0001] The utility model belongs to the technical field of detection equipment, and in particular relates to an automatic detection device for the leakage of copper nails in built-in parts of a notebook. Background Art

[0002] When installing the internal components of existing laptop computers, multiple copper nails are usually required to complete the fixing operation of the internal components. Different specifications of the copper nails used for fixing different components are different. During the production process of the laptop computer, multiple copper nails need to be tested to avoid omissions.

[0003] The patent with application number CN202020680953.8 discloses a copper nail detection device, which fixes the positioned notebook through a rotatable imitation notebook cover. In this way, when the rotatable imitation notebook cover squeezes and fixes the notebook, uneven squeezing is likely to occur, which is likely to affect the subsequent sensor's detection effect on the copper nails. Utility Model Content

[0004] The utility model aims to provide an automatic detection device for missing copper nails in built-in parts of a notebook, so as to solve the problem in the traditional technology that when a rotatable imitation notebook cover is used to squeeze and fix the notebook, uneven squeezing effect is likely to occur, which may easily affect the subsequent sensor's detection effect on the copper nails.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] An automatic detection device for missing copper nails in notebook internal parts, comprising:

[0007] A detection block, wherein a placement slot is provided on the detection block, and both ends of the placement slot are penetrated;

[0008] The detection mechanism includes a support frame, an extrusion cylinder, an extrusion plate, a positioning plate and a sensor. The support frame is fixedly connected to the detection block, the support frame is equipped with an extrusion cylinder, the output end of the extrusion cylinder is fixedly connected to the extrusion plate, one end of the extrusion plate is fixedly connected to the positioning plate, the bottom of the placement groove is connected to the positioning groove, the positioning plate is slidably matched with the positioning groove, and a plurality of sensors are installed in the placement groove, and the plurality of sensors correspond one-to-one to a plurality of copper nail positions on the notebook to be detected.

[0009] Preferably, a buffer pad is fixedly connected to the bottom of the extrusion plate, and the buffer pad is made of rubber.

[0010] Preferably, the two sides of the placement groove and the extrusion plate are respectively against the side walls of the notebook to be tested, and the bottom of the extrusion plate is against the top of the notebook to be tested.

[0011] Preferably, the width of the extrusion plate is greater than the width of the placement groove, and the depth of the placement groove is equal to the thickness of the notebook to be tested.

[0012] Preferably, a guide assembly is connected in the placement groove, and the guide assembly includes a connecting block, a guide wheel and a supporting spring. A plurality of guide wheel grooves are connected in the placement groove, and a connecting block is slidably connected in each of the plurality of guide wheel grooves. A supporting spring is fixedly connected between the connecting block and the bottom of the guide wheel groove, and a guide wheel is rotatably connected to the top of the connecting block, and the tops of the plurality of guide wheels rest against the bottom of the notebook to be tested.

[0013] Preferably, the plurality of guide wheel grooves are distributed on both sides of the placement groove, wherein the guide wheel axis is perpendicular to the penetration direction of the placement groove.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] 1. In the utility model, a detection mechanism is provided, and the notebook to be detected is placed on a plurality of rotatable guide wheels in the placement slot and pushed into the placement slot until the notebook to be detected abuts against the positioning plate, and the positioning of the notebook to be detected is completed under the restriction of the placement slot and the positioning plate.

[0016] 2. In the utility model, a detection mechanism is provided, and the output end of the extrusion cylinder is extended when it works, pushing the extrusion plate to move downward, thereby forming an extrusion effect on the notebook to be detected, so that multiple copper nails on the notebook to be detected contact with multiple sensors, thereby completing the detection of multiple copper nails on the notebook. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of the utility model;

[0018] Figure 2 It is a structural schematic diagram of the other side of the utility model;

[0019] Figure 3 It is a vertical cross-sectional structural schematic diagram of the utility model;

[0020] Figure 4 for Figure 3 Enlarged schematic diagram of part A in the middle.

[0021] In the figure: 1 detection block, 2 placement groove, 3 support frame, 4 extrusion cylinder, 5 extrusion plate, 6 buffer pad, 7 positioning plate, 8 positioning groove, 9 guide wheel groove, 10 connection block, 11 guide wheel, 12 support spring, 13 sensor. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0023] Reference Figure 1-Figure 4 , an automatic detection device for missing copper nails in notebook internal parts, comprising:

[0024] The detection block 1 is provided with a placement groove 2, and both ends of the placement groove 2 are penetrated.

[0025] The detection mechanism includes a support frame 3, an extrusion cylinder 4, an extrusion plate 5, a positioning plate 7 and a sensor 13. The support frame 3 is fixedly connected to the detection block 1, and the extrusion cylinder 4 is installed on the support frame 3. The output end of the extrusion cylinder 4 is fixedly connected to the extrusion plate 5, and one end of the extrusion plate 5 is fixedly connected to the positioning plate 7. The bottom of the placement groove 2 is connected to the positioning groove 8, and the positioning plate 7 is slidably matched with the positioning groove 8. A plurality of sensors 13 are installed in the placement groove 2, and the plurality of sensors 13 correspond one by one to the positions of a plurality of copper nails on the notebook to be detected.

[0026] A buffer pad 6 is fixedly connected to the bottom of the extrusion plate 5 , and the buffer pad 6 is made of rubber.

[0027] The two sides of the placement slot 2 and the pressing plate 5 are correspondingly pressed against the side walls of the notebook to be tested, and the bottom of the pressing plate 5 is pressed against the top of the notebook to be tested.

[0028] The width of the pressing plate 5 is greater than the width of the placement slot 2, and the depth of the placement slot 2 is equal to the thickness of the notebook to be tested.

[0029] A guide assembly is connected in the placement groove 2, and the guide assembly includes a connecting block 10, a guide wheel 11 and a support spring 12. A plurality of guide wheel grooves 9 are connected in the placement groove 2, and a connecting block 10 is slidably connected in each of the plurality of guide wheel grooves 9. A support spring 12 is fixedly connected between the connecting block 10 and the bottom of the guide wheel groove 9. The guide wheel 11 is rotatably connected to the top of the connecting block 10, and the tops of the plurality of guide wheels 11 rest against the bottom of the notebook to be tested.

[0030] A plurality of guide wheel grooves 9 are distributed on both sides of the placement groove 2 , wherein the guide wheel 11 is axially perpendicular to the penetrating direction of the placement groove 2 .

[0031] The operating principle of the utility model is now described as follows:

[0032] When working, the positioning plate 7 is initially located above the positioning slot 8, the notebook to be tested is placed on the multiple rotatable guide wheels 11 in the placement slot 2, and pushed into the placement slot 2 until the notebook to be tested abuts against the positioning plate 7, and the positioning of the notebook to be tested is completed under the restriction of the placement slot 2 and the positioning plate 7;

[0033] At this time, the squeezing cylinder 4 works, and its output end extends to push the squeezing plate 5 to move downward. The squeezing plate 5 forms a squeezing effect on the notebook to be tested through the buffer pad 6 until the squeezing plate 5 abuts against the surface of the detection block 1. The notebook to be tested is pushed to overcome the support spring 12 and move downward, so that the multiple copper nails on the notebook to be tested contact with the multiple sensors 13, thereby completing the detection of the multiple copper nails on the notebook;

[0034] After the inspection is completed, the output end of the extrusion cylinder 4 contracts, pulling the extrusion plate 5 and the positioning plate 7 to move upward, so that the inspected notebook can be directly taken out from the placement slot 2 close to the positioning slot 8. After taking out the notebook, the output end of the extrusion cylinder 4 extends and returns to its original position, which is convenient for the next work.

[0035] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An automatic detection device for missing copper nails in notebook internal parts, characterized in that: include: A detection block (1), wherein a placement groove (2) is provided on the detection block (1), and both ends of the placement groove (2) are penetrated; The detection mechanism comprises a support frame (3), an extrusion cylinder (4), an extrusion plate (5), a positioning plate (7) and a sensor (13); the support frame (3) is fixedly connected to the detection block (1); the extrusion cylinder (4) is installed on the support frame (3); the output end of the extrusion cylinder (4) is fixedly connected to the extrusion plate (5); one end of the extrusion plate (5) is fixedly connected to the positioning plate (7); the bottom of the placement groove (2) is connected to the positioning groove (8); the positioning plate (7) and the positioning groove (8) are slidably matched; a plurality of sensors (13) are installed in the placement groove (2); the plurality of sensors (13) correspond one to one to the positions of a plurality of copper nails on the notebook to be detected.

2. The automatic detection device for missing copper nails in notebook internal parts according to claim 1 is characterized in that: in: A buffer pad (6) is fixedly connected to the bottom of the extrusion plate (5), and the buffer pad (6) is made of rubber.

3. The automatic detection device for missing copper nails in notebook internal parts according to claim 1 is characterized in that: in: The two sides of the placement groove (2) and the pressing plate (5) are respectively pressed against the side walls of the notebook to be tested, and the bottom of the pressing plate (5) is pressed against the top of the notebook to be tested.

4. The automatic detection device for missing copper nails in notebook internal parts according to claim 1 is characterized in that: in: The width of the squeezing plate (5) is greater than the inner width of the placement groove (2), and the inner depth of the placement groove (2) is equal to the thickness of the notebook to be tested.

5. The automatic detection device for missing copper nails in notebook internal parts according to claim 1 is characterized in that: in: The placement groove (2) is connected with a guide assembly, and the guide assembly comprises a connection block (10), a guide wheel (11) and a support spring (12). The placement groove (2) is connected with a plurality of guide wheel grooves (9), and the plurality of guide wheel grooves (9) are all slidably connected with a connection block (10). A support spring (12) is fixedly connected between the connection block (10) and the bottom of the guide wheel groove (9). The top of the connection block (10) is rotatably connected with a guide wheel (11), and the tops of the plurality of guide wheels (11) are against the bottom of the notebook to be detected.

6. The automatic detection device for missing copper nails in notebook internal parts according to claim 5, characterized in that: in: The plurality of guide wheel grooves (9) are distributed on both sides of the placement groove (2), wherein the guide wheel (11) is axially perpendicular to the penetration direction of the placement groove (2).

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