High-reliability RFID tag and processing device

Abstract

The utility model discloses a high-reliability RFID (Radio Frequency Identification) tag adopting flexible particles and a processing device. Relates to the technical field of RFID tags. Comprising a tag chip and a tag antenna, and the tag chip is connected with the tag antenna through a conductive adhesive layer; the conductive adhesive layer is a conductive adhesive layer containing flexible particles, and the flexible particles are spherical or sphere-like flexible particles distributed in the conductive adhesive layer. The flexible particles are liquid metal particles. The liquid metal particles are elemental gallium, gallium bismuth alloy or gallium indium alloy particles. The flexible particle comprises a metal inner core, the metal inner core is wrapped by a liquid metal layer, the metal inner core is a solid nickel, gold or copper particle, and the liquid metal layer is an elementary substance gallium, gallium bismuth alloy or gallium indium alloy layer. According to the utility model, the bonding strength between the tag chip and the tag antenna is enhanced, and deformation springback is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of RFID tags, in particular to a high-reliability RFID tag using flexible particles and a processing device. Background Art

[0002] RFID tags generally use conductive glue to bond the tag chip and the tag antenna through hot pressing and curing, so that the tag can achieve radio frequency characteristics. At present, RFID tag packaging faces the technical problem of increasing difficulty in binding due to the smaller and smaller chips. Among them, how to package the small-sized chip well with the tag antenna so that it can have excellent performance and reliability is one of the problems that need to be solved.

[0003] Conductive adhesive plays a vital role as a "bridge" connecting the chip and the tag antenna. Through market research, it is found that the M7 series and M8 series chips launched by existing mainstream chip manufacturers have poor compatibility with traditional conductive adhesives, which leads to problems such as poor consistency of tag sensitivity performance, low shear force, and poor reliability pass rate after chip binding, which directly affects the effective application of the product in the market.

[0004] The conductive glue on the market is generally composed of a polymer resin matrix, conductive fillers and other additives. It is used to bond the tag chip and the tag antenna, where the conductive fillers act as contacts to connect the tag chip and the tag antenna, and the polymer resin matrix plays a fixing role. As the chip size gradually decreases, and the conductive fillers of traditional conductive glues are mostly hard metals such as nickel, gold, and copper, the traditional conductive glue bonding process will cause the glue to fail to polymerize, resulting in poor shear strength, and the conductive filler rebounds and affects reliability. Utility Model Content

[0005] In view of the above problems, the utility model provides a high-reliability RFID tag and a processing device with a simple structure and stable connection.

[0006] The technical solution of the utility model is: a high-reliability RFID tag, comprising a tag chip and a tag antenna, wherein the tag chip is connected to the tag antenna through a conductive adhesive layer;

[0007] The conductive adhesive layer is a conductive adhesive layer containing flexible particles, and the flexible particles are spherical or quasi-spherical flexible particles distributed in the conductive adhesive layer.

[0008] The flexible particles are liquid metal particles.

[0009] The liquid metal particles are single-element gallium, gallium-bismuth alloy or gallium-indium alloy particles.

[0010] The flexible particle comprises a metal core, and the outside of the metal core is wrapped with a liquid metal layer.

[0011] The metal core is a solid nickel, gold or copper particle.

[0012] The liquid metal layer is a single-element gallium, gallium-bismuth alloy or gallium-indium alloy layer.

[0013] The diameter of the flexible particles is 2-8 μm.

[0014] A high-reliability RFID tag processing device includes an upper heat pressing head and a lower heat pressing head arranged up and down.

[0015] The RFID tag is located between the upper heat pressing head and the lower heat pressing head.

[0016] The conductive adhesive layer in the utility model has the characteristics of longitudinal conductivity and transverse non-conductivity. The flexible particles can be spherical or quasi-spherical. When external pressure is applied, they can be deformed or broken, thereby enhancing the bonding strength between the tag chip and the tag antenna and reducing deformation rebound. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the specific implementation of the utility model or the technical solution in the prior art, the following is a brief introduction to the drawings required for the specific implementation or the prior art description. In the drawings, each part is not necessarily drawn according to the actual scale.

[0018] Figure 1 It is a structural schematic diagram of the utility model.

[0019] Figure 2 It is a structural schematic diagram of the processing device in the utility model;

[0020] In the figure, 1 is the tag chip, 2 is the tag antenna, 3 is the conductive adhesive layer, 4 is the flexible particles, 5 is the upper thermal pressing head, and 6 is the lower thermal pressing head. DETAILED DESCRIPTION

[0021] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0022] In the description of the present invention, it should be understood that the terms "upper", "lower", "left", "right", "vertical", "horizontal", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0023] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0024] The utility model Figure 1 As shown, a high-reliability RFID tag includes a tag chip 1 and a tag antenna 2, wherein the tag chip is connected to the tag antenna via a conductive adhesive layer 3;

[0025] The conductive adhesive layer is a conductive adhesive layer containing flexible particles 4, and the flexible particles are spherical or quasi-spherical flexible particles distributed in the conductive adhesive layer. When external pressure is applied, deformation or rupture may occur, thereby enhancing the bonding strength between the tag chip and the tag antenna and reducing deformation rebound.

[0026] The flexible particles are liquid metal particles.

[0027] The liquid metal particles are single-element gallium, gallium-bismuth alloy or gallium-indium alloy particles.

[0028] In applications, it may be an alloy containing one or more elements of gallium, bismuth, cadmium, tin, lead, dysprosium, and indium.

[0029] During operation, the utility model uses liquid metal as the conductive filler of the conductive adhesive layer, so that the conductive adhesive layer can realize the anisotropic characteristics of longitudinal conductivity and transverse non-conductivity and thermal curing characteristics. At the same time, during hot pressing, by applying pressure, the conductive filler made of liquid metal can be deformed or broken, so that it can be combined with and connected to the tag chip contact and the tag antenna connection point.

[0030] The flexible particle comprises a metal core, and the outside of the metal core is wrapped with a liquid metal layer.

[0031] The metal core is a solid nickel, gold or copper particle.

[0032] The liquid metal layer is a single-element gallium, gallium-bismuth alloy or gallium-indium alloy layer.

[0033] In applications, it may be an alloy containing one or more elements of gallium, bismuth, cadmium, tin, lead, dysprosium, and indium.

[0034] By outsourcing the liquid metal, the pressure and time required for curing are applied externally, and the liquid metal part is solidified by the force and temperature. In addition to the metal core, there is also a liquid metal layer in contact with the chip and the antenna. The original point-to-point contact after spherical force is transformed into surface-like contact, which improves reliability.

[0035] The diameter of the flexible particles is 2 to 8 μm. In the application, the viscosity of the polymer resin is 15000 to 38000 mPa·s, the thermal curing temperature can be controlled at 120°C to 230°C, and the curing time is 1s to 20s, wherein the higher the curing temperature, the shorter the curing time.

[0036] like Figure 2 As shown, a high-reliability RFID tag processing device includes an upper heat pressing head and a lower heat pressing head arranged up and down,

[0037] The RFID tag is located between the upper heat pressing head 5 and the lower heat pressing head 6 .

[0038] During the bonding process, the upper and lower heat press heads act on the label at the same time to achieve pressure curing. Figure 2 The middle arrow represents the movement direction of the upper and lower hot pressing heads.

[0039] Regarding the contents disclosed in this case, there are a few points that need to be explained:

[0040] (1) The drawings of the embodiments disclosed in this case only involve the structures involved in the embodiments disclosed in this case. Other structures can refer to the general design;

[0041] (2) In the absence of conflict, the embodiments and features of the embodiments disclosed in this case may be combined with each other to obtain new embodiments;

[0042] The above are only specific implementation methods disclosed in this case, but the protection scope of the present disclosure is not limited thereto. The protection scope disclosed in this case should be based on the protection scope of the claims.

Claims

1. A high-reliability RFID tag, comprising a tag chip and a tag antenna, wherein the tag chip is connected to the tag antenna via a conductive adhesive layer; It is characterized in that The conductive adhesive layer is a conductive adhesive layer containing flexible particles, and the flexible particles are spherical or quasi-spherical flexible particles distributed in the conductive adhesive layer.

2. A high reliability RFID tag according to claim 1, characterized in that: The flexible particles are liquid metal particles.

3. A high reliability RFID tag according to claim 2, characterized in that: The liquid metal particles are single-element gallium, gallium-bismuth alloy or gallium-indium alloy particles.

4. A high reliability RFID tag according to claim 1, characterized in that: The flexible particle comprises a metal core, and the outside of the metal core is wrapped with a liquid metal layer. The metal core is a solid nickel, gold or copper particle. The liquid metal layer is a single-element gallium, gallium-bismuth alloy or gallium-indium alloy layer.

5. A high reliability RFID tag according to claim 1, characterized in that: The diameter of the flexible particles is 2-8 μm.

6. A processing device for a high-reliability RFID tag as claimed in any one of claims 1 to 5, characterized in that: It includes an upper heat pressing head and a lower heat pressing head arranged up and down. The RFID tag is located between the upper heat pressing head and the lower heat pressing head.

Images