Wafer film sticking machine

Abstract

The utility model relates to a wafer film sticking machine which comprises a workbench and a box body, a dust removal assembly is arranged in the box body, the dust removal assembly comprises a brush roller rotationally connected in the box body, a brush on the brush roller abuts against the surface of a wafer, an air pump is arranged on the box body, the air suction end of the air pump is communicated with an air suction pipe, and the air suction pipe is communicated with the air suction end of the air pump. One end of the air suction pipe extends into the box body and is communicated with a dust collection cover, the dust collection cover is arranged in the dust removal area, the air suction direction of the dust collection cover faces the wafer and the brush roller, and the surface of the wafer is cleaned through the dust removal assembly before film pasting. And the possibility that particle impurities such as dust are attached to the surface of the wafer is reduced, so that the influence of the particle impurities such as dust on the flatness of the wafer after film pasting is reduced. The method and the device have the effect of improving the flatness degree of the wafer after film pasting.

Description

Technical Field

[0001] The present application relates to the field of wafer processing technology, and in particular to a wafer laminating machine. Background Art

[0002] A wafer refers to the silicon chip used to make silicon semiconductor integrated circuits. Various circuit component structures can be processed on the wafer. However, since the surface of the wafer is extremely susceptible to physical damage and chemical contamination, the wafer needs to be protected by a film before processing.

[0003] Currently, the wafer film lamination is mainly done manually. When laminating, the worker first pulls the blue film in the form of a strip to the upper surface of the wafer by hand, then presses the blue film onto the wafer through a film pressing roller, and finally uses a cutting tool to cut off the excess blue film, thereby completing the wafer film lamination work.

[0004] However, before the blue film is covered on the wafer surface, the wafer is always exposed to the air. At this time, the wafer surface is easily contaminated with dust and other particulate impurities. These dust and other particulate impurities will always remain in the gap between the wafer surface and the blue film as the blue film is covered, seriously affecting the flatness of the wafer after film pasting, which is obviously insufficient. Utility Model Content

[0005] In order to improve the flatness of the wafer after film bonding, the present application provides a wafer bonding machine.

[0006] The present application provides a wafer mounting machine that adopts the following technical solution:

[0007] A wafer laminating machine comprises a box body and a workbench, the box body cover is arranged on the workbench, a feed inlet is provided on one side of the box body, a discharge outlet is provided on the other side of the box body, a conveyor belt is arranged on the workbench, a placing table for placing wafers is arranged on the conveyor belt, a dust removal area is provided on the side of the box body close to the feed inlet, a film laminating area is provided on the side close to the discharge outlet, a dust removal assembly is arranged in the dust removal area, the dust removal assembly comprises a brush roller rotatably connected to the box body, a brush on the brush roller is in contact with the surface of the wafer, an air pump is arranged on the box body, a suction end of the air pump is connected with a suction pipe, one end of the suction pipe extends to the interior of the box body and is connected with a dust collecting hood, the dust collecting hood is arranged in the dust removal area, the suction direction of the dust collecting hood is arranged toward the wafer and the brush roller, and a film laminating assembly is arranged in the film laminating area.

[0008] By adopting the above technical scheme, in the process of conveying wafers by the conveyor belt, the wafer will first pass through the dust removal area, and the brush roller in the dust removal area will sweep the dust particles attached to the wafer surface off the wafer surface. At the same time, the air pump is started, and the air pump will suck the raised dust and other particles into the dust collecting hood, thereby preventing the dust from escaping everywhere. Then the cleaned wafer is conveyed to the film pasting area by the conveyor belt, and the film pasting component and the cutting component jointly process the film-pasted wafer. Such an arrangement makes the film pasting environment of the wafer in a closed space. At the same time, the dust removal component is used to clean the wafer surface before film pasting, thereby reducing the possibility of dust and other particulate impurities attached to the wafer surface, thereby reducing the influence of dust and other particulate impurities on the flatness of the wafer after film pasting, and improving the flatness of the wafer after film pasting.

[0009] Optionally, the blowing end of the air pump is connected to a blowing pipe, the blowing pipe is arranged on a side of the brush roller close to the feed port, a plurality of blowing heads are evenly distributed on the blowing pipe, the blowing heads are inclined and the blowing direction is set toward the wafer.

[0010] By adopting the above technical solution, after the wafer enters the dust removal area, there are situations where dust and other granular impurities with strong adhesion on the wafer surface are difficult to be directly removed by the brush roller. At this time, a strong airflow is blown out from the air pump, and the airflow flows along the blowing pipe to the blowing head, and finally blows directly to the wafer surface from the blowing head. After the impurities with strong adhesion are concentratedly blown by the strong airflow, the adhesion of the impurities becomes worse. At this time, the impurities with strong adhesion are more easily removed by the brush roller, thereby further reducing the possibility of dust and other granular impurities adhering to the wafer surface.

[0011] Optionally, the air intake pipe is connected to a filter box, and a plurality of filter plates are arranged in the filter box.

[0012] By adopting the above technical solution, after the air pump is started, the air pressure in the filter box is reduced, and the dust and other particulate impurities sucked by the dust hood will first enter the inside of the filter box. Under the interception and purification of the filter plate, the air with dust and other particulate impurities sucked into the air pump is filtered, thereby ensuring the cleanliness of the air sent into the dust removal area by the air pump, thereby reducing the overall dust content in the air in the dust removal area, and further reducing the possibility of dust and other particulate impurities adhering to the surface of the wafer.

[0013] Optionally, the film laminating assembly includes a film winding roller and a film collecting roller rotatably connected to the box body, the film winding roller and the film collecting roller jointly retract and release blue film, the bottom surface of the blue film contacts the surface of the wafer, a film pressing roller is arranged between the film winding roller and the film collecting roller, the film pressing roller is slidably connected in the film laminating area, the bottom surface of the film pressing roller contacts the surface of the blue film, and the box body is provided with a driving assembly for driving the film pressing roller to move back and forth along the surface of the wafer.

[0014] By adopting the above technical solution, the conveyor belt is closed after the wafer enters the film laminating area, and the blue film is kept in a tensioned state by rotating the film winding roller and the film collecting roller. Then the worker starts the driving component, and the driving component drives the film pressing roller to reciprocate along the surface of the wafer. During the movement, the blue film is closely fitted to the surface of the wafer, thereby further improving the flatness of the wafer after film laminating.

[0015] Optionally, a groove is provided on the inner wall of the box body, and the driving assembly includes a motor arranged in the groove, the output shaft of the motor is fixedly connected to the film pressing roller, the end of the film pressing roller close to the groove is fixedly connected to a gear, a rack plate meshing with the gear is provided in the groove, the end of the pressing roller away from the motor is fixedly connected to a guide wheel, and the inner wall of the box body is provided with a guide groove that slides with the guide wheel.

[0016] By adopting the above technical solution, after closing the conveyor belt, the worker starts the motor, and the motor drives the lamination roller to rotate on the surface of the wafer. During the rotation, the lamination roller drives the gear to rotate. At this time, the gear will move on the meshing rack plate, and the moving gear drives the lamination roller to move along the surface of the wafer, thereby realizing the pressing effect of the lamination roller. At the same time, the rotating lamination roller can generate pressure in multiple directions on the surface of the wafer, thereby improving the pressing effect of the lamination roller on the surface of the wafer, thereby further improving the flatness of the wafer after film bonding.

[0017] Optionally, a partition is provided inside the box body, the dust removal area and the film sticking area are respectively arranged on both sides of the partition, a receiving groove is opened on the partition, a sliding plate is slidably connected in the receiving groove, a cylinder is provided on the box body, and the output shaft of the cylinder is fixedly connected to the sliding plate.

[0018] By adopting the above technical solution, after the dust removal component is cleaned, the cylinder drives the sliding plate to move upward, the opening of the receiving groove gradually becomes larger, and the wafer enters the film pasting area through the opening. When the film is pasted, the cylinder drives the sliding plate to reset, and the receiving groove is closed by the sliding plate. At this time, the dust removal area and the film pasting area are separated by the partition and the sliding plate, thereby blocking the flow path of dust-carrying air from the dust removal area to the film pasting area, reducing the probability of dust particles adhering to the wafer surface.

[0019] Optionally, the discharge port is rotatably connected to a rotating shaft, the rotating shaft is fixedly connected to a baffle plate, a torsion spring is arranged on the rotating shaft, one end of the torsion spring is connected to the rotating shaft, and the other end is connected to the inner wall of the discharge port, when the torsion spring is in a natural state, the baffle plate closes the discharge port, and the thrust of the placement platform on the baffle plate is greater than the elastic force of the torsion spring.

[0020] By adopting the above technical solution, when the wafer is film-laminated and moved to the discharge port, the placement table drives the shielding plate to rotate, the discharge port opens, and the workers take out the processed wafers. The setting of the shielding plate further improves the sealing of the film-laminated area, blocking the flow path of dusty air from the outside into the film-laminated area, thereby further reducing the probability of dust particles adhering to the wafer surface.

[0021] Optionally, a plurality of adsorption holes are provided on the surface of the placement table, a negative pressure cavity connected to the plurality of adsorption holes is provided inside the placement table, a micro pump is arranged inside the placement table, and an air suction end of the micro pump is connected to the inside of the negative pressure cavity through a pipe.

[0022] By adopting the above technical solution, after the wafer is placed on the placement table, the micro pump is started, and the micro pump reduces the pressure in the negative pressure chamber. At this time, the wafer is fixed on the placement table by multiple adsorption holes, which reduces the possibility of the wafer detaching from the placement table when being blown and when the film is pasted, thereby improving the stability of the wafer in the dust removal area and the film pasting area.

[0023] In summary, the present application includes at least one of the following beneficial technical effects:

[0024] 1. The present application sets up a dust removal area and a dust removal component, and cleans the wafer surface through the dust removal component before film lamination, thereby reducing the possibility of dust and other particulate impurities adhering to the wafer surface, thereby reducing the influence of dust and other particulate impurities on the flatness of the wafer after film lamination, and improving the flatness of the wafer after film lamination;

[0025] 2. The present application sets a lamination roller and a driving assembly, and the driving assembly drives the lamination roller to reciprocate along the surface of the wafer, so that the blue film is closely attached to the surface of the wafer during the movement, thereby further improving the flatness of the wafer after film attachment. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the structure of this application.

[0027] Figure 2 It is a cross-sectional view of the dust removal area in the embodiment of the present application.

[0028] Figure 3 It is a cross-sectional view of the film-sticking area in the embodiment of the present application.

[0029] Figure 4 It is a cross-sectional view of the placement table in the embodiment of the present application.

[0030] Figure 5 yes Figure 3 Enlarged view of point A in the middle.

[0031] Figure 6 yes Figure 4 Enlarged view of point A in the middle.

[0032] Description of reference numerals: 1. box body; 101. feed port; 102. discharge port; 103. dust removal area; 104. film application area; 105. groove; 106. guide groove; 2. workbench; 3. conveyor belt; 31. limit strip; 4. placement table; 41. adsorption hole; 42. negative pressure chamber; 43. micro pump; 44. limit groove; 5. partition; 51. receiving groove; 6. dust removal assembly; 61. brush roller; 62. dust collecting cover; 7. Film sticking assembly; 71. Film winding roller; 72. Film collecting roller; 73. Blue film; 74. Film pressing roller; 8. Air pump; 81. Air suction pipe; 82. Air supply pipe; 83. Filter box; 9. Air blowing pipe; 91. Air blowing head; 10. Cylinder; 11. Sliding plate; 12. Driving assembly; 121. Motor; 122. Gear; 123. Guide wheel; 124. Rack plate; 13. Rotating shaft; 131. Shielding plate; 14. Torsion spring. DETAILED DESCRIPTION

[0033] The following is combined with Figure 1-6 This application is described in further detail.

[0034] The embodiment of the present application discloses a wafer laminating machine.

[0035] Reference Figure 1 and Figure 2 A wafer laminating machine includes a box body 1 and a workbench 2. The box body 1 is covered above the workbench 2. A conveyor belt 3 is installed on the surface of the workbench 2. A placement table 4 for placing wafers is arranged on the conveyor belt 3. A feed port 101 is opened at one end of the box body 1, and a discharge port 102 is opened at the other end. The conveyor belt 3 runs through the feed port 101 and the discharge port 102.

[0036] Reference Figure 2 and Figure 3 A partition 5 is fixedly installed at the center of the box body 1, and the side wall of one end of the partition 5 close to the feed port 101 and the inner wall of the box body 1 form a dust removal area 103. The dust removal area 103 is provided with a dust removal component 6 for cleaning dust and other particulate impurities on the surface of the wafer. The side wall of one end of the partition 5 close to the discharge port 102 and the inner wall of the box body 1 form a film pasting area 104. The film pasting area 104 is provided with a film pasting component 7 and a shearing component (not shown in the figure) for pasting films on wafers.

[0037] When the wafer needs to be filmed, the worker places the wafer on the placement table 4. As the conveyor belt 3 is transported, the wafer will enter the dust removal area through the feed port 101, and after being cleaned by the dust removal component 6, it will move to the film pasting area 104. After being processed by the film pasting component 7 and the shearing component, it will be transported out from the discharge port 102. Finally, the worker takes the wafer off the placement table 4.

[0038] Reference Figure 2 and Figure 3 The dust removal component 6 includes a brush roller 61 rotatably connected to the dust removal area 103, the brush on the brush roller 61 is in conflict with the surface of the wafer, an air pump 8 is fixedly installed on the box body 1, and the suction end of the air pump 8 is connected to a suction pipe 81, one end of the suction pipe 81 extends to the inside of the box body 1 and is connected to a dust collecting hood 62, the dust collecting hood 62 is arranged on the side of the brush roller 61 close to the discharge port 102, the suction port of the dust collecting hood is V-shaped, the suction direction of the dust collecting hood is arranged toward the wafer and the brush roller 61, and the air supply of the air pump 8 An air supply pipe 82 is connected to the end thereof, and a filter box 83 is connected to the air supply pipe 82. A plurality of filter plates are installed in sequence on the filter box 83 along the gas flow direction, and the filtering precision of the plurality of filter plates increases successively. One end of the air supply pipe 82 extends to the interior of the box body 1 and is connected to an air blowing pipe 9. The air blowing pipe 9 is arranged at one end of the brush roller 61 away from the dust collecting hood 62. The air blowing pipe 9 has a plurality of air blowing heads 91 evenly distributed at equal distances along the length direction. The air blowing heads 91 are arranged at an angle and the blowing direction of the air blowing heads 91 is arranged toward the wafer.

[0039] During the process of conveying wafers by the conveyor belt 3, the wafers will first pass through the dust removal area 103. The brush roller 61 in the dust removal area 103 will clean the dust particles with poor adhesion attached to the wafer surface. At the same time, the strong airflow blown out from the air pump 8 flows along the blowing pipe 9 to the blowing head 91, and finally blows directly from the blowing head 91 to the wafer surface. After the impurities with strong adhesion are blown by the strong airflow, the adhesion of the impurities becomes worse. At this time, the impurities with strong adhesion are more easily removed by the brush roller 61. The dust and other particulate impurities cleaned off the wafer surface are finally absorbed into the filter box 83 by the dust collecting hood 62. Multiple filter plates jointly intercept the dust and particulate impurities in the filter box 83, thereby ensuring the cleanliness of the gas blown out by the air pump 8.

[0040] Reference Figure 2 and Figure 3 In order to improve the isolation effect between the dust removal area 103 and the film pasting area 104, a receiving groove 51 is opened on the partition 5, and a sliding plate 11 is slidably connected in the receiving groove 51. A cylinder 10 is fixedly installed on the box body 1, and the output shaft of the cylinder 10 passes through the side wall of the box body 1 and is fixedly connected to the sliding plate 11. When the wafer cleaned by the dust removal component 6 moves to the vicinity of the partition 5, the cylinder 10 drives the sliding plate 11 to move upward. At this time, the opening of the receiving groove 51 becomes larger, and the placement table 4 drives the wafer to move into the film pasting area 104. Then, the cylinder 10 drives the sliding plate 11 to reset downward. The film pasting area 104 and the dust removal area 103 are jointly closed by the partition 5 and the sliding plate 11, which reduces the possibility of dust and other particulate impurities remaining in the dust removal area 103 flowing to the film pasting area 104 with the airflow, thereby improving the sealing of the film pasting area 104.

[0041] Reference Figure 2 and Figure 3The film pasting component 7 includes a film winding roller 71 and a film receiving roller 72 which are arranged in sequence along the conveying direction of the placement table 4. The film winding roller 71 and the film receiving roller 72 are both rotatably connected inside the film pasting area 104. A blue film 73 for film pasting is rolled up on the film winding roller 71. One end of the blue film 73 extends along the length direction of the film pasting area 104 and is wound around the film receiving roller 72. When the placement table 4 moves between the film winding roller 71 and the film receiving roller 72, the bottom surface of the blue film 73 contacts the surface of the wafer. A film pressing roller 74 is arranged between the film winding roller 71 and the film receiving roller 72. The film pressing roller 74 is slidably connected in the film pasting area 104. The bottom surface of the film pressing roller 74 contacts the surface of the blue film 73. A driving component 12 for driving the film pressing roller 74 to move back and forth along the surface of the wafer is arranged on the box body 1.

[0042] Reference Figure 3 , Figure 4 and Figure 5 A groove 105 is provided on the inner wall of the box body 1, and the driving assembly 12 includes a motor 121 arranged in the groove 105. The output shaft of the motor 121 is fixedly connected to the film pressing roller 74. The film pressing roller 74 is fixedly connected to a gear 122 at one end close to the groove 105, and a guide wheel 123 is fixedly connected to the other end. The gear 122 is rotatably arranged in the groove 105, and a rack plate 124 meshing with the gear 122 is fixedly connected to the inner wall of the groove 105. The rack plate 124 is arranged along the length direction of the film laminating area 104. A guide groove 106 that slides with the guide wheel 123 is provided on the inner wall of the end of the box body 1 away from the groove 105. The guide groove 105 and the guide groove 106 are respectively arranged at both ends of the conveyor belt 3.

[0043] After the wafer enters the film pasting area 104, the conveyor belt 3 is closed, and the blue film 73 is put into a tensioned state by rotating the film winding roller 71 and the film collecting roller. Then the worker starts the motor 121, and the motor 121 drives the film pressing roller 74 to rotate on the surface of the wafer. During the rotation, the film pressing roller 74 drives the gear 122 to rotate. At this time, the gear 122 will move on the meshing rack plate 124, and the moving gear 122 drives the film pressing roller 74 to move along the surface of the wafer. During the movement, the blue film 73 is closely fitted to the surface of the wafer, thereby further improving the flatness of the wafer after film pasting.

[0044] Reference Figure 3 and Figure 6In order to further improve the sealing performance of the film-sticking area 104, the end of the discharge port 102 away from the conveyor belt 3 is rotatably connected to a rotating shaft 13, and a shielding plate 131 for shielding the discharge port 102 is fixedly connected to the rotating shaft 13. A torsion spring 14 is arranged on the rotating shaft 13, and one end of the torsion spring 14 is fixedly connected to the outer surface of the rotating shaft 13, and the other end is connected to the inner wall of the discharge port 102. Under the action of the torsion spring 14, the shielding plate 131 always tends to close the discharge port 102. When the placement table 4 contacts the end face of the shielding plate 131, the thrust of the placement table 4 on the shielding plate 131 is greater than the elastic force of the torsion spring 14.

[0045] When the wafer is film-laminated and moved to the discharge port 102, the placement table 4 applies sufficient thrust to the baffle plate 131, the torsion spring 14 drives the rotating shaft 13 to rotate, and the rotating shaft 13 drives the baffle plate 131 to rotate, thereby realizing the opening of the discharge port 102. At this time, the worker can take out the processed wafer. When the wafer is processed in the film-laminated area 104, the film-laminated area 104 is in a sealed state under the joint closure of the partition 5 and the baffle plate 131, thereby blocking the flow path of dusty air from the outside into the film-laminated area 104, and further reducing the probability of dust particles adhering to the wafer surface.

[0046] Reference Figure 4 In order to provide stability for the wafer on the placement table 4, a plurality of adsorption holes 41 are provided on the surface of the placement table 4, a negative pressure chamber 42 connected to the plurality of adsorption holes 41 is provided inside the placement table 4, a receiving chamber (not shown in the figure) is provided inside the placement table 4, a micro pump 43 is fixedly installed in the receiving chamber, and the suction end of the micro pump 43 is connected to the inside of the negative pressure chamber 42 through a pipeline. When the wafer is placed on the placement table 4, the micro pump 43 is started to generate negative pressure in the negative pressure chamber 42, and the wafer is stably adsorbed on the placement table 4 through the adsorption holes 41.

[0047] Reference Figure 3 and Figure 4 Two relatively arranged limit strips 31 are arranged on the conveyor belt 3, and the limit strips 31 extend along the length direction of the conveyor belt 3. Two limit grooves 44 corresponding to the limit strips 31 are arranged on the lower surface of the placement table 4, and the limit grooves 44 are slidably matched with the limit strips 31. The setting of the limit grooves 44 and the limit strips 31 ensures the stability of the placement table 4 during the transmission process, and prevents it from affecting the dust removal and film sticking effects due to deviation.

[0048] The implementation principle of a wafer laminating machine in an embodiment of the present application is as follows: when laminating is required, the wafer is placed on the placement table 4 on the conveyor belt 3. In the process of the conveyor belt 3 driving the wafer to be transported, the wafer will first pass through the dust removal area 103. The brush roller 61 in the dust removal area 103 will clean the dust particles attached to the surface of the wafer from the surface of the wafer. At the same time, the air pump 8 is started, and the air pump 8 will suck the raised dust and other particles into the dust collecting hood 62, thereby preventing the dust from escaping everywhere. The cleaned wafer is moved to the laminating area 104 along with the conveyor belt 3 for laminating. The setting of the box body 1 and the dust removal component 6 provides a closed condition for the wafer laminating process. At the same time, the dust removal component 6 cleans the surface of the wafer before laminating, thereby reducing the possibility of dust and other particulate impurities attached to the surface of the wafer, thereby reducing the influence of dust and other particulate impurities on the flatness of the wafer after laminating, thereby improving the flatness of the wafer after laminating.

[0049] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A wafer laminating machine, comprising a box (1) and a workbench (2), wherein the box (1) is covered on the workbench (2), a feed inlet (101) is provided on one side of the box (1), and a discharge outlet (102) is provided on the other side of the box (1), characterized in that: A conveyor belt (3) is arranged on the workbench (2), and a placement table (4) for placing wafers is arranged on the conveyor belt (3). A dust removal area (103) is arranged on the side of the box body (1) close to the feed port (101), and a film pasting area (104) is arranged on the side close to the discharge port (102). A dust removal component (6) is arranged in the dust removal area (103), and the dust removal component (6) comprises a brush roller (61) rotatably connected to the box body (1), and the brush roller (61) The brush on the roller contacts the surface of the wafer, an air pump (8) is arranged on the box (1), an air suction end of the air pump (8) is connected to an air suction pipe (81), one end of the air suction pipe (81) extends to the inside of the box (1) and is connected to a dust collecting hood (62), the dust collecting hood (62) is arranged in the dust removal area (103), the air suction direction of the dust collecting hood (62) is arranged towards the wafer and the brush roller (61), and a film pasting assembly (7) is arranged in the film pasting area (104).

2. The wafer mounting machine according to claim 1, characterized in that: The blowing end of the air pump (8) is connected to a blowing pipe (9), which is arranged on a side of the brush roller (61) close to the feed port (101), and a plurality of blowing heads (91) are evenly distributed on the blowing pipe (9), wherein the blowing heads (91) are arranged at an angle and the blowing direction is arranged toward the wafer.

3. A wafer mounting machine according to claim 2, characterized in that: The air intake pipe (81) is connected to a filter box (83), and a plurality of filter plates are arranged in the filter box (83).

4. The wafer mounting machine according to claim 1, characterized in that: The film laminating component (7) comprises a film rolling roller (71) and a film collecting roller (72) which are rotatably connected to the housing (1); the film rolling roller (71) and the film collecting roller (72) both retract and release a blue film (73); the bottom surface of the blue film (73) contacts the surface of the wafer; a film pressing roller (74) is arranged between the film rolling roller (71) and the film collecting roller (72); the film pressing roller (74) is slidably connected to the film laminating area (104); the bottom surface of the film pressing roller (74) contacts the surface of the blue film (73); and a driving component (12) is arranged on the housing (1) for driving the film pressing roller (74) to move back and forth along the surface of the wafer.

5. The wafer mounting machine according to claim 4, characterized in that: The inner wall of the box body (1) is provided with a groove (105), the driving assembly (12) comprises a motor (121) arranged in the groove (105), the output shaft of the motor (121) is fixedly connected to the film pressing roller (74), the end of the film pressing roller (74) close to the groove (105) is fixedly connected to a gear (122), the groove (105) is provided with a rack plate (124) meshing with the gear (122), the end of the film pressing roller (74) away from the motor (121) is fixedly connected to a guide wheel (123), and the inner wall of the box body (1) is provided with a guide groove (106) slidably matched with the guide wheel (123).

6. The wafer mounting machine according to claim 1, characterized in that: A partition (5) is arranged inside the box body (1), the dust removal area (103) and the film sticking area (104) are arranged on both sides of the partition (5), respectively, a receiving groove (51) is opened on the partition (5), a sliding plate (11) is slidably connected in the receiving groove (51), and a cylinder (10) is arranged on the box body (1), and an output shaft of the cylinder (10) is fixedly connected to the sliding plate (11).

7. The wafer mounting machine according to claim 1, characterized in that: The discharge port (102) is rotatably connected to a rotating shaft (13), and a shielding plate (131) is fixedly connected to the rotating shaft (13). A torsion spring (14) is provided on the rotating shaft (13), and one end of the torsion spring (14) is connected to the rotating shaft (13), and the other end is connected to the inner wall of the discharge port (102). When the torsion spring (14) is in a natural state, the shielding plate (131) closes the discharge port (102), and the thrust of the placement platform (4) on the shielding plate (131) is greater than the elastic force of the torsion spring (14).

8. The wafer mounting machine according to claim 1, characterized in that: A plurality of adsorption holes (41) are provided on the surface of the placement platform (4), a negative pressure chamber (42) connected to the plurality of adsorption holes (41) is provided inside the placement platform (4), a micro pump (43) is provided inside the placement platform (4), and an air suction end of the micro pump (43) is connected to the inside of the negative pressure chamber (42) through a pipeline.

Images