Semiconductor wafer edge inspection device

Abstract

The utility model discloses a semiconductor wafer edge inspection device, which comprises a supporting base and supporting legs, a positioning locking mechanism is arranged above the supporting base, an observation adjusting mechanism is arranged on the side edge of a rotation adjusting mechanism, a displacement observation mechanism is arranged on the side edge of the observation adjusting mechanism, and the supporting legs are arranged on the supporting base. When the conductor wafer edge inspection device provided by the utility model is used, through the arrangement of the positioning motor, the driving gear, the driven gear, the supporting frame, the inspector and the limiting bolt, the device can realize the effect of adjusting the observation position of the inspector in all directions; therefore, the defect that the fixed position of the existing device is small in view field observation limitation is overcome, and the device can flexibly adjust the observation position for the special-shaped wafer, so that the problem that the observation process is tedious due to the fact that the wafer is manually and repeatedly adjusted is solved. And meanwhile, the phenomenon that the wafer is accidentally bumped due to manual adjustment of the position of the wafer body is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor wafers, in particular to a semiconductor wafer edge inspection device. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its original material is silicon. Wafers are made of high-purity polycrystalline silicon into large single crystals, given the correct orientation and appropriate amount of N-type or P-type doping, and then grown into silicon ingots. After grinding, polishing, and slicing, they form silicon wafers. Because of their round shape, they are called wafers. Various circuit components can be processed and manufactured on this high-purity silicon wafer, making it an IC product with specific electrical functions;

[0003] The patent number "CN213878041U" discloses "a new type of wafer edge inspection device". The device provides a new type of wafer edge inspection device. Compared with the existing technology, it has the characteristics of simple structure, easy operation, high efficiency and time-saving and labor-saving. It solves the problem that wafer manufacturing edge inspection cannot be fully inspected in large quantities. Since the existing devices are fixed in a fixed position to observe a certain specification of wafer, but due to the differences in shape and size of different models and specifications, the existing devices cannot make the device body adaptive to the wafer for adjustment, and the overall practical limitations are relatively small. However, the above-mentioned device has not made improvements to this problem, and the overall practical effect is poor. Utility Model Content

[0004] The purpose of the utility model is to provide a semiconductor wafer edge inspection device to solve the problem raised in the above background technology that the existing devices all observe a certain specification of wafer at a fixed position, but due to the differences in shapes and sizes of different models and specifications, the existing devices are unable to make the device body adaptively adjust to the wafer, and the overall practical limitations are relatively small.

[0005] In order to solve the above technical problems, the utility model provides the following technical solutions: a semiconductor wafer edge inspection device, comprising a support base and support feet, the bottom outer wall of the support base is symmetrically provided with two groups of support feet, a positioning locking mechanism is arranged above the support base, a rotation adjustment mechanism is arranged on the side of the positioning locking mechanism, an observation adjustment mechanism is arranged on the side of the rotation adjustment mechanism, and an observation displacement mechanism is arranged on the side of the observation adjustment mechanism; the positioning locking mechanism comprises a limit frame, a driving motor, a reciprocating screw and an auxiliary rod, a limit frame is arranged on the top outer wall of the support base, the limit frame is arranged in a "U"-shaped structure, a driving motor is arranged on the top outer wall of the limit frame, the driving motor is connected to one end of the reciprocating screw, an auxiliary rod is arranged at the bottom end of the reciprocating screw, and the bottom end of the auxiliary rod is rotatably connected to the top outer wall of the support base; a limit block is arranged on the outside of the reciprocating screw, and the side outer wall of the limit block is symmetrically provided with protrusions, the protrusions are slidably connected to the side inner wall of the limit frame, and the side outer wall of the limit block The wall is provided with a positioning plate, and the side outer wall of the positioning plate is provided with an annular adjustment seat; the rotation adjustment mechanism includes a limit ring, a rotating member and a positioning support column, the interior of the annular adjustment seat is provided with an annular groove, and the internal rotation connection of the annular groove is provided with the limit ring, the top outer wall of the limit ring is provided with a rotating member, and the rotating end of the rotating member is provided on the outside of the annular adjustment seat, and the bottom outer wall of the limit ring is provided with a positioning support column; the observation adjustment mechanism includes a mounting base, a positioning frame, a positioning motor and a driving gear, the top outer wall of the support base is slidably connected with the mounting base, the top outer wall of the mounting base is provided with a positioning frame, the positioning frame is arranged in a "Z" shape, and the top outer wall of the positioning frame is provided with a positioning motor, the positioning motor is connected with the rotating shaft, and the bottom end of the rotating shaft is connected with the driving gear; the observation displacement mechanism includes a sliding groove and a sliding block, the top outer wall of the support base located at the mounting base is provided with a sliding groove, the sliding groove is slidably connected with the sliding block, and the top outer wall of the sliding block is connected with the bottom outer wall of the mounting base.

[0006] Furthermore, the bottom outer wall of the positioning support column is provided with a resistance tooth pad, and the resistance tooth pad is arranged outside the annular adjustment seat, the top outer wall of the support base is rotatably connected with a support shaft, and the top outer wall of the support shaft is provided with a placement base, and the placement base is located directly below the resistance tooth pad.

[0007] Furthermore, the side of the driving gear is meshedly connected with a driven gear, and the driving gear and the driven gear are both rotatably connected to the top outer wall of the mounting base. The top outer wall of the driven gear is provided with a limiting support column, the top outer wall of the limiting support column is provided with a support frame, and the top outer wall of the support frame is provided with an inspector.

[0008] Furthermore, threaded holes are formed through the outer side wall of the sliding groove at equal intervals, and threaded holes are formed through the outer side wall of the sliding block, and the internal threads of the threaded holes are connected with limiting bolts.

[0009] Compared with the prior art, the beneficial effects achieved by the utility model are:

[0010] When the conductor wafer edge inspection device of the utility model is in use, the device can achieve the effect of adjusting the inspection device's observation position in all directions through the arrangement of the installation base, the positioning frame, the positioning motor, the driving gear, the driven gear, the limiting support column, the supporting frame, the inspector, the sliding groove, the sliding block, the threaded hole and the limiting bolt, thereby changing the problem of the smaller limitation of the observation field of the fixed position of the existing device. At the same time, for special-shaped wafers, the device can flexibly adjust the observation position to avoid the problem of cumbersome observation process caused by manual repeated adjustment of the wafer. The overall practical effect is good, and at the same time, the phenomenon of accidental bumping of the wafer caused by manual adjustment of the position of the wafer body is avoided, which plays a certain protective role on the wafer body.

[0011] When the conductor wafer edge inspection device of the utility model is in use, through the arrangement of the limit frame, the driving motor, the reciprocating screw rod, the auxiliary rod, the limit block, the protrusion, the positioning plate, the annular adjustment seat, the placement base and the support shaft, the device can automatically achieve a good elastic clamping effect for wafers of different thickness specifications, and further with the arrangement of the limit ring, the rotating part, the positioning support column and the abutment tooth pad, the device can realize all-round position rotation adjustment of the wafer body through an external mechanism on the basis of stably clamping the wafer, so as to facilitate the device to realize all-round observation of the wafer edge, and at the same time, this design avoids the staff from manually touching and adjusting the wafer position for many times to cause contamination to the wafer body, and the overall safety performance is good and the observation effect is excellent. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0013] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the utility model;

[0014] Figure 2 It is a three-dimensional structural diagram of the positioning and locking mechanism of the utility model;

[0015] Figure 3 This is a schematic diagram of the three-dimensional structure of the limit ring installation of the utility model;

[0016] Figure 4 It is a three-dimensional structural schematic diagram of the observation and adjustment mechanism of the utility model;

[0017] Figure 5 It is a three-dimensional structural schematic diagram of the observation displacement mechanism of the utility model.

[0018] In the figure: 1. Support base; 2. Support foot; 3. Limiting frame; 4. Driving motor; 5. Reciprocating screw; 6. Auxiliary rod; 7. Limiting block; 8. Bump; 9. Positioning plate; 10. Annular adjustment seat; 11. Limiting ring; 12. Rotating part; 13. Positioning support column; 14. Interference tooth pad; 15. Placement base; 16. Support shaft; 17. Mounting base; 18. Positioning frame; 19. Positioning motor; 20. Driving gear; 21. Driven gear; 22. Limiting support column; 23. Support frame; 24. Inspector; 25. Sliding groove; 26. Sliding block; 27. Threaded hole; 28. Limiting bolt. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] See also Figure 1-Figure 5 The utility model provides a technical solution: a semiconductor wafer edge inspection device, including a support base 1 and support feet 2, two groups of support feet 2 are symmetrically arranged on the outer wall of the bottom end of the support base 1, a positioning locking mechanism is arranged above the support base 1, a rotation adjustment mechanism is arranged on the side of the positioning locking mechanism, an observation adjustment mechanism is arranged on the side of the rotation adjustment mechanism, and an observation displacement mechanism is arranged on the side of the observation adjustment mechanism.

[0021] The positioning and locking mechanism includes a limit frame 3, a driving motor 4, a reciprocating screw rod 5 and an auxiliary rod 6. The top outer wall of the supporting base 1 is provided with a limit frame 3, and the limit frame 3 is arranged in a "U"-shaped structure. The top outer wall of the limit frame 3 is provided with a driving motor 4, and the driving motor 4 is connected to one end of the reciprocating screw rod 5. The bottom end of the reciprocating screw rod 5 is provided with an auxiliary rod 6, and the bottom end of the auxiliary rod 6 is rotatably connected to the top outer wall of the supporting base 1. A limit block 7 is arranged on the outside of the reciprocating screw rod 5, and the side outer wall of the limit block 7 is symmetrically provided with protrusions 8, and the protrusions 8 are slidingly connected to the side inner wall of the limit frame 3. A positioning plate 9 is arranged on the side outer wall of the limit block 7, and an annular adjustment seat 10 is arranged on the side outer wall of the positioning plate 9; when the wafer needs to be positioned inside the device, it is first necessary to place the wafer on the upper surface of the placing base 15, adjust the wafer to a suitable position and then turn on the driving motor 4, and when the driving motor 4 is turned on, it will automatically drive The rotation of the reciprocating screw 5 drives the auxiliary rod 6 to rotate, and then the rotation of the reciprocating screw 5 will automatically drive the limit block 7 to move. At this time, since the protrusion 8 is slidably connected to the inner wall of the side of the limit frame 3, the reciprocating screw 5 will only drive the limit block 7 to realize the sliding trajectory movement in the vertical direction when it rotates. When the limit block 7 moves, it will automatically drive the positioning plate 9 to move and then drive the annular adjustment seat 10 to move. When the annular adjustment seat 10 moves to the point where the contact tooth pad 14 fits and contacts with the top outer wall of the wafer, the drive motor 4 can be turned off at this time. Since the drive motor 4 has a self-locking function, the contact tooth pad 14 can still maintain its position after movement after being turned off. At this point, the positioning effect of the wafer is completed. Since this device is a device for inspecting and observing the edge of the wafer, it is noted here that the selected wafer for observation should not be smaller than the lateral diameter of the annular adjustment seat 10, otherwise the wafer will be blocked by the annular adjustment seat 10 and the observation effect will be affected.

[0022] The rotation adjustment mechanism includes a limit ring 11, a rotating member 12 and a positioning support column 13. The annular adjustment seat 10 is provided with an annular groove inside, and the inner part of the annular groove is rotatably connected to the limit ring 11. The top outer wall of the limit ring 11 is provided with a rotating member 12, and the rotating end of the rotating member 12 is arranged outside the annular adjustment seat 10. The bottom outer wall of the limit ring 11 is provided with a positioning support column 13, and the bottom outer wall of the positioning support column 13 is provided with a resisting tooth pad 14, and the resisting tooth pad 14 is arranged outside the annular adjustment seat 10. The top outer wall of the support base 1 is rotatably connected to the support shaft 16, and the support shaft 16 is provided. 6 is provided with a placing base 15 on the top outer wall, and the placing base 15 is located directly below the abutting tooth pad 14; when the observation position of the wafer needs to be adjusted, the rotating member 12 needs to be rotated first, and when the rotating member 12 rotates, it will automatically drive the limit ring 11 to rotate inside the annular adjustment seat 10, and then the rotation of the limit ring 11 will automatically drive the positioning support column 13 to rotate and then drive the abutting tooth pad 14 to rotate, and when the abutting tooth pad 14 rotates, it will automatically abut the wafer and synchronously drive the wafer to rotate, and the placing base 15 and the support shaft 16 here will synchronously rotate with the crystal and provide auxiliary support for it.

[0023] The observation and adjustment mechanism includes a mounting base 17, a positioning frame 18, a positioning motor 19 and a driving gear 20. The top outer wall of the support base 1 is slidably connected with the mounting base 17, and the top outer wall of the mounting base 17 is provided with a positioning frame 18. The positioning frame 18 is arranged in a "Z" shape, and the top outer wall of the positioning frame 18 is provided with a positioning motor 19. The positioning motor 19 is connected to the rotating shaft, and the bottom end of the rotating shaft is connected to the driving gear 20. The side of the driving gear 20 is meshed and connected with a driven gear 21. The driving gear 20 and the driven gear 21 are both rotatably connected to the top outer wall of the mounting base 17. The top outer wall of the driven gear 21 is provided with a limited support column 22, and the top outer wall of the limited support column 22 is provided There is a support frame 23, and an inspector 24 is arranged on the top outer wall of the support frame 23; when it is necessary to adjust the observation angle of the inspector 24, it is necessary to turn on the positioning motor 19 first. When the positioning motor 19 is turned on, it will automatically drive the rotating shaft to rotate and then drive the driving gear 20 to rotate. Then, the driving gear 20 will automatically drive the driven gear 21 to rotate and then drive the limiting support column 22 to rotate. When the limiting support column 22 rotates, it will automatically drive the support frame 23 to rotate and then drive the inspector 24 to rotate. Then, when the inspector 24 rotates to a suitable observation position, the positioning motor 19 can be turned off. Since the positioning motor 19 has a self-locking function, the inspector 24 can still maintain the unchanged position after the movement after being turned off.

[0024] The observation displacement mechanism includes a sliding groove 25 and a sliding block 26. The support base 1 is provided with a sliding groove 25 on the top outer wall of the mounting base 17. The sliding groove 25 is slidably connected to the sliding block 26 inside, and the top outer wall of the sliding block 26 is connected to the bottom outer wall of the mounting base 17. The support base 1 is provided with threaded holes 27 at equal intervals on the side outer wall of the sliding groove 25, and the side outer wall of the sliding block 26 is provided with threaded holes 27. The internal threads of the threaded holes 27 are connected with limiting bolts 28. When it is necessary to adjust the lateral observation position of the inspector 24, it is first necessary to unscrew the limiting bolts 28 from the inside of the threaded holes 27, and then change the sliding block 26 from a locked state to a movable state, and then slide the mounting base 17 to adjust the lateral position of the inspector 24. When the inspector 24 moves to a suitable position, the limiting bolts 28 are screwed back into the threaded holes 27 at the corresponding position.

[0025] The working principle of the utility model is as follows: when it is necessary to position the wafer inside the device, the wafer must first be placed on the upper surface of the placement base 15, and the drive motor 4 must be turned on after the wafer is adjusted to a suitable position. When the drive motor 4 is turned on, it will automatically drive the reciprocating screw 5 to rotate and then drive the auxiliary rod 6 to rotate. Subsequently, the rotation of the reciprocating screw 5 will automatically drive the limit block 7 to move. At this time, since the protrusion 8 is slidably connected to the inner wall of the side of the limit frame 3, the reciprocating screw 5 will only drive the limit block 7 to move along the sliding trajectory in the vertical direction when it rotates. When the limit block 7 moves, it will automatically drive the positioning plate 9 to move and then drive the annular adjustment seat 10 to move. When the annular adjustment seat 10 When the contact tooth pad 14 moves to fit and contact with the top outer wall of the wafer, the driving motor 4 can be turned off. Since the driving motor 4 has a self-locking function, the contact tooth pad 14 can still maintain the position after moving after being turned off, and the positioning effect of the wafer is completed. Since this device is a device for inspecting and observing the edge of the wafer, it is noted here that the selected wafer for observation should not be smaller than the lateral diameter of the annular adjustment seat 10, otherwise the wafer will be blocked by the annular adjustment seat 10 and the observation effect will be affected; when the observation position of the wafer needs to be adjusted, the rotating part 12 needs to be rotated first. When the rotating part 12 rotates, it will automatically drive the limit ring 11 to move in the annular adjustment seat 10 The internal rotation, and then the rotation of the limit ring 11 will automatically drive the positioning support column 13 to rotate and then drive the resistance tooth pad 14 to rotate. When the resistance tooth pad 14 rotates, it will automatically resist the wafer and synchronously drive the wafer to rotate. The base 15 and the support shaft 16 placed here will rotate synchronously with the crystal and provide auxiliary support for it. When the observation angle of the inspector 24 needs to be adjusted, the positioning motor 19 needs to be turned on first. When the positioning motor 19 is turned on, it will automatically drive the rotating shaft to rotate and then drive the driving gear 20 to rotate. Subsequently, the driving gear 20 will automatically drive the driven gear 21 to rotate and then drive the limit support column 22 to rotate. When the limit support column 22 rotates, It will automatically drive the support frame 23 to rotate and then drive the inspector 24 to rotate. Then, when the inspector 24 rotates to a suitable observation position, the positioning motor 19 can be turned off. Since the positioning motor 19 has a self-locking function, the inspector 24 can still maintain the moved position after being turned off; when the lateral observation position of the inspector 24 needs to be adjusted, the limiting bolt 28 needs to be unscrewed from the inside of the threaded hole 27, and then the sliding block 26 needs to be changed from a locked state to a movable state, and then the sliding mounting base 17 is adjusted to the lateral position of the inspector 24. When the inspector 24 moves to a suitable position, the limiting bolt 28 can be re-screwed into the threaded hole 27 at the corresponding position.

[0026] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0027] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A semiconductor wafer edge inspection device, comprising a support base (1) and a support foot (2), characterized in that: Two groups of supporting feet (2) are symmetrically arranged on the outer wall of the bottom end of the support base (1); a positioning locking mechanism is arranged above the support base (1); a rotation adjustment mechanism is arranged on the side of the positioning locking mechanism; an observation adjustment mechanism is arranged on the side of the rotation adjustment mechanism; and an observation displacement mechanism is arranged on the side of the observation adjustment mechanism; The positioning locking mechanism comprises a limit frame (3), a drive motor (4), a reciprocating screw rod (5) and an auxiliary rod (6); the limit frame (3) is arranged on the top outer wall of the support base (1); the limit frame (3) is arranged in a "U"-shaped structure; the drive motor (4) is arranged on the top outer wall of the limit frame (3); the drive motor (4) is connected to one end of the reciprocating screw rod (5); the bottom end of the reciprocating screw rod (5) is arranged with an auxiliary rod (6); the bottom end of the auxiliary rod (6) is rotatably connected to the top outer wall of the support base (1); A limit block (7) is arranged outside the reciprocating screw rod (5), a side outer wall of the limit block (7) is symmetrically provided with a protrusion (8), the protrusion (8) is slidably connected to the side inner wall of the limit frame (3), a positioning plate (9) is arranged on the side outer wall of the limit block (7), and a ring-shaped adjustment seat (10) is arranged on the side outer wall of the positioning plate (9); The rotation adjustment mechanism comprises a limit ring (11), a rotating member (12) and a positioning support column (13); an annular groove is provided inside the annular adjustment seat (10), and the inside of the annular groove is rotatably connected to the limit ring (11); the top outer wall of the limit ring (11) is provided with a rotating member (12), and the rotating end of the rotating member (12) is arranged outside the annular adjustment seat (10); and the bottom outer wall of the limit ring (11) is provided with a positioning support column (13); The observation and adjustment mechanism comprises a mounting base (17), a positioning frame (18), a positioning motor (19) and a driving gear (20); the top outer wall of the support base (1) is slidably connected to the mounting base (17); the top outer wall of the mounting base (17) is provided with a positioning frame (18); the positioning frame (18) is arranged in a "Z" shape; the top outer wall of the positioning frame (18) is provided with a positioning motor (19); the positioning motor (19) is connected to a rotating shaft, and the bottom end of the rotating shaft is connected to the driving gear (20); The observation displacement mechanism comprises a sliding groove (25) and a sliding block (26); the support base (1) is provided with a sliding groove (25) on the top outer wall of the mounting base (17); the sliding block (26) is slidably connected inside the sliding groove (25); and the top outer wall of the sliding block (26) is connected to the bottom outer wall of the mounting base (17).

2. A semiconductor wafer edge inspection device according to claim 1, characterized in that: The outer wall of the bottom end of the positioning support column (13) is provided with a resisting tooth pad (14), and the resisting tooth pad (14) is arranged outside the annular adjustment seat (10); the outer wall of the top end of the support base (1) is rotatably connected to a support shaft (16); the outer wall of the top end of the support shaft (16) is provided with a placement base (15), and the placement base (15) is located directly below the resisting tooth pad (14).

3. The semiconductor wafer edge inspection device according to claim 1, characterized in that: The side edge of the driving gear (20) is meshingly connected with a driven gear (21); the driving gear (20) and the driven gear (21) are both rotatably connected to the top outer wall of the mounting base (17); a limit support column (22) is provided on the top outer wall of the driven gear (21); a support frame (23) is provided on the top outer wall of the limit support column (22); and an inspector (24) is provided on the top outer wall of the support frame (23).

4. The semiconductor wafer edge inspection device according to claim 3, characterized in that: The support base (1) has threaded holes (27) formed at equal intervals on the side outer wall of the sliding groove (25), and the sliding block (26) has threaded holes (27) formed on the side outer wall. The inner threads of the threaded holes (27) are connected to limit bolts (28).

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